TWI402893B - 曝光方法 - Google Patents

曝光方法 Download PDF

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Publication number
TWI402893B
TWI402893B TW097127865A TW97127865A TWI402893B TW I402893 B TWI402893 B TW I402893B TW 097127865 A TW097127865 A TW 097127865A TW 97127865 A TW97127865 A TW 97127865A TW I402893 B TWI402893 B TW I402893B
Authority
TW
Taiwan
Prior art keywords
substrate
nozzle member
liquid
exposure
exposure apparatus
Prior art date
Application number
TW097127865A
Other languages
English (en)
Chinese (zh)
Other versions
TW200921762A (en
Inventor
原英明
Original Assignee
尼康股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 尼康股份有限公司 filed Critical 尼康股份有限公司
Publication of TW200921762A publication Critical patent/TW200921762A/zh
Application granted granted Critical
Publication of TWI402893B publication Critical patent/TWI402893B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/42—Projection printing apparatus, e.g. enlarger, copying camera for automatic sequential copying of the same original
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70325—Resolution enhancement techniques not otherwise provided for, e.g. darkfield imaging, interfering beams, spatial frequency multiplication, nearfield lenses or solid immersion lenses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Microscoopes, Condenser (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW097127865A 2004-03-25 2005-03-23 曝光方法 TWI402893B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004089348 2004-03-25

Publications (2)

Publication Number Publication Date
TW200921762A TW200921762A (en) 2009-05-16
TWI402893B true TWI402893B (zh) 2013-07-21

Family

ID=35056454

Family Applications (7)

Application Number Title Priority Date Filing Date
TW097127865A TWI402893B (zh) 2004-03-25 2005-03-23 曝光方法
TW100139028A TWI486719B (zh) 2004-03-25 2005-03-23 曝光方法
TW106145839A TW201816844A (zh) 2004-03-25 2005-03-23 曝光裝置、曝光方法、及元件製造方法
TW104127306A TWI606485B (zh) 2004-03-25 2005-03-23 曝光裝置、曝光方法、及元件製造方法
TW101149735A TWI518744B (zh) 2004-03-25 2005-03-23 曝光裝置、曝光方法、及元件製造方法
TW094108912A TWI358746B (en) 2004-03-25 2005-03-23 Exposure apparatus and device manufacturing method
TW106109736A TWI628697B (zh) 2004-03-25 2005-03-23 曝光裝置、及元件製造方法

Family Applications After (6)

Application Number Title Priority Date Filing Date
TW100139028A TWI486719B (zh) 2004-03-25 2005-03-23 曝光方法
TW106145839A TW201816844A (zh) 2004-03-25 2005-03-23 曝光裝置、曝光方法、及元件製造方法
TW104127306A TWI606485B (zh) 2004-03-25 2005-03-23 曝光裝置、曝光方法、及元件製造方法
TW101149735A TWI518744B (zh) 2004-03-25 2005-03-23 曝光裝置、曝光方法、及元件製造方法
TW094108912A TWI358746B (en) 2004-03-25 2005-03-23 Exposure apparatus and device manufacturing method
TW106109736A TWI628697B (zh) 2004-03-25 2005-03-23 曝光裝置、及元件製造方法

Country Status (5)

Country Link
US (7) US8111373B2 (cg-RX-API-DMAC7.html)
JP (13) JP4525676B2 (cg-RX-API-DMAC7.html)
KR (8) KR101851511B1 (cg-RX-API-DMAC7.html)
TW (7) TWI402893B (cg-RX-API-DMAC7.html)
WO (1) WO2005093791A1 (cg-RX-API-DMAC7.html)

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US7486381B2 (en) 2004-05-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
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US7426014B2 (en) 2004-07-01 2008-09-16 Nikon Corporation Dynamic fluid control system for immersion lithography
KR101264939B1 (ko) 2004-09-17 2013-05-15 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
US7180571B2 (en) 2004-12-08 2007-02-20 Asml Netherlands B.V. Lithographic projection apparatus and actuator
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US7804577B2 (en) 2005-11-16 2010-09-28 Asml Netherlands B.V. Lithographic apparatus
US7864292B2 (en) 2005-11-16 2011-01-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
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KR101408783B1 (ko) 2007-12-07 2014-06-17 삼성전자주식회사 반도체 소자의 제조장치 및 이를 이용한 반도체 소자의제조방법
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US9494870B2 (en) * 2012-10-12 2016-11-15 Nikon Corporation Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
JP6466333B2 (ja) * 2012-10-15 2019-02-06 エーエスエムエル ネザーランズ ビー．ブイ． 作動機構、光学装置、リソグラフィ装置及びデバイス製造方法
JP6119242B2 (ja) * 2012-12-27 2017-04-26 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
JPWO2015147039A1 (ja) * 2014-03-26 2017-04-13 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
US11300769B2 (en) 2014-05-29 2022-04-12 Rarecyte, Inc. Automated substrate loading
US9857580B2 (en) 2014-05-29 2018-01-02 Rarecyte, Inc. Apparatus for holding a substrate within a secondary device
US11422352B2 (en) 2014-05-29 2022-08-23 Rarecyte, Inc. Automated substrate loading
US10890748B2 (en) 2014-05-29 2021-01-12 Rarecyte, Inc. Automated substrate loading
US10802260B2 (en) 2014-05-29 2020-10-13 Rarecyte, Inc. Automated substrate loading
JP7069177B2 (ja) 2016-09-21 2022-05-17 ネクストキュア インコーポレイテッド シグレック－１５に対する抗体及びその使用方法
JP6506785B2 (ja) * 2017-02-02 2019-04-24 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ リソグラフィ用テンプレートの製造方法、プログラム及び基板処理装置
CN110291157B (zh) 2017-02-08 2022-05-13 昭和电工材料株式会社 电荷传输性材料及其用途
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CN112684665B (zh) * 2020-12-25 2024-06-25 浙江启尔机电技术有限公司 一种浸液供给回收装置
CN114690577B (zh) * 2020-12-31 2024-10-25 上海微电子装备（集团）股份有限公司 一种管路柔性适应装置及浸没式光刻机
KR102584513B1 (ko) * 2020-12-31 2023-10-06 세메스 주식회사 온도 변화가 수반되는 분위기에 제공되는 기판 지지 부재의 수평 측정용 기판형 센서, 이를 이용한 수평 측정 방법 및 비일시적 컴퓨터 판독가능 매체

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JP2010153931A (ja) 2010-07-08
US8169590B2 (en) 2012-05-01
KR20120115594A (ko) 2012-10-18
TWI606485B (zh) 2017-11-21
JP5673747B2 (ja) 2015-02-18
WO2005093791A1 (ja) 2005-10-06
JP6315052B2 (ja) 2018-04-25
US20090180090A1 (en) 2009-07-16
JPWO2005093791A1 (ja) 2008-02-14
US10126661B2 (en) 2018-11-13
TWI358746B (en) 2012-02-21
JP2017004026A (ja) 2017-01-05
TWI518744B (zh) 2016-01-21
JP5971358B2 (ja) 2016-08-17
US20160327874A1 (en) 2016-11-10
JP2014132666A (ja) 2014-07-17
KR101851511B1 (ko) 2018-04-23
JP5545270B2 (ja) 2014-07-09
JP6304335B2 (ja) 2018-04-04
KR20110136886A (ko) 2011-12-21

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