TW201715600A - 切割裝置 - Google Patents

切割裝置 Download PDF

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Publication number
TW201715600A
TW201715600A TW105127515A TW105127515A TW201715600A TW 201715600 A TW201715600 A TW 201715600A TW 105127515 A TW105127515 A TW 105127515A TW 105127515 A TW105127515 A TW 105127515A TW 201715600 A TW201715600 A TW 201715600A
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cutting
dressing
dressing grindstone
grindstone
cutting blade
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TW105127515A
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TWI685890B (zh
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Soichiro Akita
Satoshi Kiyokawa
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Disco Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0608—Grinders for cutting-off using a saw movable on slideways
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
    • B24B3/368—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades installed as an accessory on another machine
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
    • B24B3/46—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/04—Devices or means for dressing or conditioning abrasive surfaces of cylindrical or conical surfaces on abrasive tools or wheels
    • B24B53/053—Devices or means for dressing or conditioning abrasive surfaces of cylindrical or conical surfaces on abrasive tools or wheels using a rotary dressing tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
    • B24B53/062—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels using rotary dressing tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
    • B24B53/08—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels controlled by information means, e.g. patterns, templets, punched tapes or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

本發明提供一種隨時都能夠將切割刀以要求的切入量定位於修整用磨石的外周。本發明是一種具備保持被加工物之吸盤工作台，和一邊對裝設在主軸上之切割刀供給切割液，一邊對被保持在該吸盤工作台之被加工物進行切割之切割機構的切割裝置；特徵在於其具有，使該主軸移動以定位該切割刀之移動機構、使修整用磨石以和該主軸平行的旋轉軸旋轉之旋轉修整機構，和，檢測該修整用磨石之外周位置的光感測器，並依據用該光感測器檢測出之該修整用磨石的外周位置，將該切割刀定位於該旋轉修整機構，且以要求的切入量用該切割刀切割該修整用磨石，對該切割刀進行修整。

Description

切割裝置 發明領域
本發明涉及一種切割裝置，特別是具備旋轉修整機構的切割裝置。
發明背景
在使切割刀高速旋轉以切割晶圓等之被加工物的切割裝置中，如果持續實施被加工物的切割，切割刀的前端會變成細頭錐狀，在此狀態下如果繼續進行切割，會出現元件晶片側面的形狀精度惡化的問題。
為防止此問題，必須定期讓切割刀切入修整用磨石使其磨耗以進行修整。此修整作業是為了在裝設於主軸的狀態下將已經偏芯的切割刀修成正圓，也是為了利用切割加工對已經變平滑或堵塞的切割刀片進行銼磨。
切割刀的修整作業有時是在切割加工的途中適當地實施，但是通常是將被加工物從吸盤工作台卸除，再以吸盤工作台吸引保持專用的修刀板以實施修整。
然而，修刀板既要用吸盤工作台吸引保持，又要從吸盤工作台卸除的工序非常煩雜，因此採取了在吸盤工 作台旁邊設置修刀板專用之副吸盤工作台的對策(參照特開2010-87122號公報)。
但是，在切割裝置配備非常硬質之切割刀的情形中，如果用修刀板專用的副吸盤工作台上所保持之修刀板來實施修整作業，會有切割量不足的情形。於是，為提高修整時的切割抵抗，採用了以旋轉的修整磨石來實施修整操作之旋轉修整裝置。
【先前技術文獻】
【專利文獻1】特開2010-871225號公報
發明概要
旋轉修整裝置因為是以切割刀切割旋轉的修整磨石，所以即使是硬質的切割刀也能夠令其磨耗。然而，因為修整用磨石也發生磨耗，直徑縮小，故而有難以調整切割刀之切入量的問題。
本發明即是有鑑於這樣的問題點而完成的，目的在於提供一種隨時都能夠以要求的切入量將切割刀定位在修整用磨石的外周之切割裝置。
依據本發明，所提供的是一種具備保持被加工物之吸盤工作台，和一邊對裝設在主軸上之切割刀供給切割液，一邊對被保持在該吸盤工作台之被加工物進行切割之切割機構的切割裝置；特徵在於其具有，使該主軸移動以 定位該切割刀之移動機構、使修整用磨石以和該主軸平行的旋轉軸旋轉之旋轉修整機構，和，檢測該修整用磨石之外周位置的光感測器，並依據用該光感測器檢測出之該修整用磨石的外周位置，將該切割刀定位於該旋轉修整機構，且以要求的切入量用該切割刀切割該修整用磨石，對該切割刀進行修整。
較佳的是，該光感測器被定位成，朝該修整用磨石之旋轉軸將從該光感測器射出之檢查光照射在該修整用磨石的外周面，且另外配備依據該檢查光之來自該修整用磨石的外周面之反射光，計算出該修整用磨石的直徑之運算機構，再以由該運算機構計算出之該修整用磨石的直徑為基礎來定位該切割刀，並以該指定之切入量用該切割刀切割該修整用磨石。
較佳的是，進一步配備具有容許從該光感測器射出之檢查光通過的開口之收容該光感測器的筐體，和設置在該開口附近的氣簾形成機構；利用由該氣簾形式機構所形成之氣簾，防止切割屑及切割液從該開口侵入該筐體內並附著在該光感測器。
利用本發明之切割裝置，因為是以光感測器檢測修整用磨石之外周位置並算出修整用磨石的直徑，故可隨時以要求的切入量將切割刀定位在修整用磨石的外周。
2‧‧‧切割裝置
4‧‧‧基座
4a‧‧‧開口
6‧‧‧吸盤工作台
6a‧‧‧吸引保持部
8‧‧‧夾具
10‧‧‧防水罩
11‧‧‧被加工物
12‧‧‧波紋構造
14‧‧‧切割單元
16‧‧‧支持構造
18‧‧‧切割單元移動機構
20‧‧‧Y軸導軌
22‧‧‧Y軸移動板
24‧‧‧Y軸滾珠螺桿
26‧‧‧Z軸導軌
28‧‧‧Z軸移動板
30‧‧‧Z軸滾珠螺桿
32‧‧‧Z軸脈衝馬達
34‧‧‧主軸
35‧‧‧主軸套
36‧‧‧切割刀
38‧‧‧刀罩
40‧‧‧切割液供給噴嘴
42‧‧‧攝像單元
44‧‧‧旋轉修整裝置
46‧‧‧旋轉修整磨石
48‧‧‧馬達
50‧‧‧旋轉軸(輸出軸)
50a‧‧‧旋轉軸50的中心
52‧‧‧外罩
54‧‧‧感測器盒
54a‧‧‧開口
55‧‧‧氣體導入口
56‧‧‧光感測器
58‧‧‧電磁切換閥
60‧‧‧壓縮氣體源
62‧‧‧檢查光
64‧‧‧反射光
66‧‧‧氣簾形成機構
67‧‧‧氣簾
A‧‧‧箭頭
T‧‧‧切割膠帶
【圖1】本實施態樣之切割裝置的斜視圖。
【圖2】切割被加工物時之切割裝置主要部分的部分斷面側面圖。
【圖3】以旋轉修整磨石對切割刀進行修整的狀態下之切割裝置主要部分的部分斷面側面圖。
【圖4】對旋轉修整磨石之外周位置進行檢測的狀態下之切割裝置主要部分的部分斷面側面圖。
【圖5】對旋轉修整磨石之外周位置進行檢測的狀態下之切割單元部分的部分斷面正面圖。
較佳實施例之詳細說明 用以實施發明之形態
以下，將參照圖式詳細地說明本發明之實施態樣。參照圖1，所示為本發明實施態樣之切割裝置2的斜視圖。4為切割裝置2的基座，基座4上形成有沿X軸方向延伸之長矩形的開口4a。
具有由多孔性陶瓷等所形成之吸引保持部6a的吸盤工作台6，可旋轉，且能夠藉著未圖示出之X軸移動機構在X軸方向上往復移動地被配設在此開口4a內。
在吸盤工作台6的外周部分配設著將支持被加工物的框架單元夾緊之複數個夾具8。吸盤工作台6的周圍則配設著防水罩10，此防水罩10並連結著橫過基座4的波紋構造12。
在基座4的上面，支持切割單元14的門型支持構造16被配置成跨過開口4a。於支持構造16的前面上部，設 置了使切割單元14沿Y軸方向及Z軸方向移動之切割單元移動機構18。
切割單元移動機構18具備固定於支持構造16的前面之平行於Y軸方向的一對Y軸導軌20。構成切割單元移動機構18之Y軸移動板22可滑動地配設於Y軸導軌20。
在Y軸移動板22的背面側設有未圖示出之螺帽部，與Y軸導軌20平行之Y軸方向滾珠螺桿24被螺合於此螺帽部。在Y軸滾珠螺桿24的一端部連結著未圖示出之Y軸脈衝馬達。如果用Y軸脈衝馬達使Y軸滾珠螺桿24旋轉，Y軸移動板22就會沿著Y軸導軌20在Y軸方向移動。
沿Z軸方向伸展的一對Z軸導軌20固定在Y軸移動板22的前面。Z軸移動板28則可滑動地配設於Z軸導軌26。
在Z軸移動板28的背面側設有未圖示出的螺帽部，與Z軸導軌26平行之Z軸方向滾珠螺桿30被螺合於此螺帽部。在Z軸滾珠螺桿30的一端部連結著未圖示出之Z軸脈衝馬達32。如果用Z軸脈衝馬達32使Z軸滾珠螺桿30旋轉，Z軸移動板28就會沿著Z軸導軌26在Z軸方向移動。
切割被保持於吸盤工作台6之被加工物的切割單元14安裝在Z軸移動板28的下部。而且，在與切割單元14相鄰的位置配設著具有對被保持於吸盤工作台6之被加工物的上面進行攝像之顯微鏡及相機的攝像單元42。
切割單元14包含，由馬達驅動旋轉之示於圖2的主軸34、裝設在主軸35的前端部之切割刀36、覆蓋切割刀 36的上半部分之刀罩38，和，安裝於刀罩38，在切割刀36兩側沿X軸方向伸展的一對(圖僅示出1支)切割液供給噴嘴40。
如果藉切割單元移動機構18使Y軸移動板22在Y軸方向移動，切割單元14及攝像單元42就會在Y軸方向被分度傳送；如果使Z軸移動板28在Z軸方向移動，切割單元14及攝像單元42就會沿上下方向移動。
在本實施態樣的切割裝置2中，旋轉修整裝置(旋轉修整機構)44是以突出於開口4a內的狀態安裝在基台4的側面。圖2至圖4最清楚地顯示出，旋轉修整裝置44是由馬達48、固定於馬達48之輸出軸50的旋轉修整磨石(修整用磨石)46，和覆蓋修整磨石46的外罩52所構成。
旋轉修整磨石46是將，例如，由碳化矽(SiC)形成之綠色金剛砂(GC,Green Carborundum)磨粒，混練於添加填料的酚樹脂所形成之樹脂黏結劑並形成圓筒狀之後，在600℃~700℃左右的溫度燒結而形成的。較佳的是，旋轉修整磨石46具有，由質量比50~60%的超磨粒，和質量比45~35%之含填料的酚樹脂所構成的組成。
在本實施態樣中所使用的旋轉修整磨石46之直徑3吋，寬度1吋，內徑0.5吋，但是旋轉修整磨石46並不限定於這些數值。
圖5最清楚地顯示出，感測盒54安裝於切割單元14之主軸套35，在這個感測盒54內則配設著光感測器56。
感測盒54具有開口54a，從光感測器56射出的檢 查光62通過這個開口54a，從與旋轉修整磨石46之旋轉軸(馬達48的輸出軸)50直交的方向照射於旋轉修整磨石46的外周面。
此外，從光感測器56射出的檢查光62朝旋轉軸50的中心(軸心)50a照射。在旋轉修整磨石46的外周面發生漫反射的反射光64由光感測器56的光接收元件接收。
如圖2至圖4所示，感測器盒54以電磁切換閥58為中介而連接到壓縮氣體源60，透過將電磁切換閥58切換成示於圖2之連通位置的操作，將如圖5所示地，壓縮氣體會從設於感測器盒54的氣體導入口55被導入感測器盒54內，並從開口54a被排出。
開口54a近旁配設著氣簾形成機構66，利用此氣簾形成機構66在開口54a內形成氣簾67，防止切割屑及切割液侵入感測器盒54。
參照圖2，示意的是，以沿著箭頭A的方向高速旋轉之切割刀36切割被保持於吸盤工作台6之被加工物11時的實施態樣之切割裝置主要部分的部分斷面側面圖。
在此切割步驟係，將沿著箭頭A的方向高速旋轉(例如，30000rpm)之切割刀36切進去直到切割膠帶T為止，並沿X軸方向對吸盤工作台6實施加工進給，藉以切割被加工物11。
切割被加工物11時，將電磁切換閥58切換到連通位置，從壓縮氣體源60將壓縮氣體導入感測器盒54內，並從感測器盒54的開口54a排出壓縮氣體。與此同時，用氣簾 形成機構66在開口54a內形成氣簾67，藉以防止切割屑及切割液侵入感測器盒54內，從而防止光感測器56受到切割屑或切割液的污染。
如果持續進行被加工物的切割，切割刀36的會變成細頭錐狀，在此狀態下，如果繼續進行切割，會有晶片的形狀精度惡化的問題。為防止此情事，必須定期實施修正切割刀36之外周的外徑修正修整作業。另外，因為切割刀36如果持續進行切割，會出現變平滑的情形且切割能力下降，所以要定期實施銼磨修整。
但是，在實施切割刀36的修整時，因為是以切割刀36對旋轉修整磨石46切入指定深度，所以必須正確認知旋轉修整磨石46最外周的高度。
因此，較佳的是，在實施切割刀36的修整之前，先測定旋轉修整磨石46的直徑。因為旋轉修整磨石46的旋轉軸(馬達48的輸出軸)50被配設在指定高度，所以要事先弄清楚新品旋轉修整磨石46最外周的高度，並將這個高度位置保存於切割裝置2之控制器的記憶體。另外，設定旋轉修整磨石46的可使用量，即極限直徑，並將此極限直徑同樣地保存於控制器的記憶體。
定期實施旋轉修整磨石46的直徑測定時，如圖4及圖5所示，是從光感測器56將檢查光64照射到旋轉修整磨石46的外周面，並以光感測器56之光接收元件接收來自外周面的漫反射光64。
藉由測定從光感測器56射出檢查光62起，直到在 光感測器56的光接收元件接收到反射光64為止的時間和受光位置，可以正確地測定從光感測器56起到旋轉修整磨石46之外周面為止的距離。
在旋轉修整磨石46之外周位置的檢測中，是一邊使旋轉修整磨石46以例如，10000rpm旋轉，一邊使光感測器46在磨石46的寬度方向(Y軸方向)移動，在多個地方檢測旋轉修整磨石46之外周位置。
例如，將在多個地方測定到的最大值當作旋轉修整磨石46的直徑檢測出來。並且根據這個直徑，以控制器的運算機構算出旋轉修整磨石46的高度位置，再將那個高度位置保存於記憶體。
如此地操作，待檢測出旋轉修整磨石46之最外周目前的高度位置後，再實施切割刀36的修整。修整切割刀36時，以所測定到的切割刀36之最外周的高度位置為基礎，設定切割刀36之切入高度。
接著，如圖3所示地，一邊使切割刀36沿箭頭A方向以高速(例如，30000rpm)旋轉，一邊以設定於沿著箭頭A方向以例如10000rpm旋轉之旋轉修整磨石46的切入高度切入，並使切割刀36沿Y軸移動，實施切割刀36的修整。
更進一步，因為切割刀36及旋轉修整磨石46是一起沿A方向旋轉，所以切割刀36是以所謂的向上切割來切割旋轉修整磨石，因此切割抵抗提高，同時因為是沿Y軸方向前後相繼進行切割，所以和沿X軸方向進行加工進給的情形相比，切割抵抗更為提高，可以非常有效率地實施切割刀 36之修整。
在圖4所示之旋轉修整磨石46的直徑測定時，將電磁切換閥58切換到遮斷位置，壓縮氣體停止從感測器盒54的開口54a噴出。此時，由氣簾形成機構66所執行之氣簾67的形成可以繼續進行，但是，也可以中止氣簾67的噴出。
在上述的實施態樣中，所說明的雖然是關於將光感測器56安裝在主軸套35的例子，但是，光感測器56的安裝位置並不限於此，也可以安裝在其他的位置。另外，在旋轉修整磨石46的測定中所使用之檢查光64的反射光，也可以使用正反射光。
6‧‧‧吸盤工作台
11‧‧‧被加工物
14‧‧‧切割單元
34‧‧‧主軸
35‧‧‧主軸套
36‧‧‧切割刀
38‧‧‧刀罩
44‧‧‧旋轉修整裝置
46‧‧‧旋轉修整磨石
48‧‧‧馬達
50‧‧‧旋轉軸(輸出軸)
52‧‧‧外罩
54‧‧‧感測器盒
56‧‧‧光感測器
58‧‧‧電磁切換閥
60‧‧‧壓縮氣體源
62‧‧‧檢查光
64‧‧‧反射光
A‧‧‧箭頭

Claims (3)

  1. 一種切割裝置，係具備保持被加工物之吸盤工作台，及一邊對裝設在主軸上之切割刀供給切割液，一邊對被保持在該吸盤工作台之被加工物進行切割之切割機構的切割裝置；其特徵在於具有：使該主軸移動以定位該切割刀之移動機構，使修整用磨石以和該主軸平行的旋轉軸旋轉之旋轉修整機構，及檢測該修整用磨石之外周位置的光感測器，並且依據用該光感測器檢測出之該修整用磨石的外周位置，將該切割刀定位於該旋轉修整機構，且以要求的切入量用該切割刀切割該修整用磨石，對該切割刀進行修整。
  2. 如請求項1記載之切割裝置，其中，該光感測器被定位成，朝該修整用磨石之旋轉軸將從該光感測器射出之檢查光照射在該修整用磨石的外周面，且另外配備依據該檢查光之來自該修整用磨石的外周面之反射光，計算出該修整用磨石的直徑之運算機構，以由該運算機構計算出之該修整用磨石的直徑為基礎來定位該切割刀，並以該指定之切入量用該切割刀切割該修整用磨石。
  3. 如請求項1或2記載之切割裝置，其中進一步配備，具有容許從該光感測器射出之檢查光通過的開口之收容該光感測器的筐體，和，設置在該開口附近的氣簾形成機構；利用由該氣簾形成機構所形成之氣簾，防止切割屑及切割液從該開口侵入該筐體內並附著在該光感測器的情形。
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TWI827967B (zh) * 2020-08-26 2024-01-01 日商Ｔｏｗａ股份有限公司 切斷裝置及切斷品的製造方法

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