JP7277935B2 - 樹脂モールド装置 - Google Patents
樹脂モールド装置 Download PDFInfo
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- JP7277935B2 JP7277935B2 JP2020079456A JP2020079456A JP7277935B2 JP 7277935 B2 JP7277935 B2 JP 7277935B2 JP 2020079456 A JP2020079456 A JP 2020079456A JP 2020079456 A JP2020079456 A JP 2020079456A JP 7277935 B2 JP7277935 B2 JP 7277935B2
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- 238000000465 moulding Methods 0.000 title claims description 76
- 229920005989 resin Polymers 0.000 title claims description 71
- 239000011347 resin Substances 0.000 title claims description 71
- 238000003825 pressing Methods 0.000 claims description 33
- 210000000078 claw Anatomy 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 description 13
- 230000007246 mechanism Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000001816 cooling Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 230000002950 deficient Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000032258 transport Effects 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 238000000748 compression moulding Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 230000003068 static effect Effects 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000008185 minitablet Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/52—Heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
- B29C2043/3405—Feeding the material to the mould or the compression means using carrying means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5808—Measuring, controlling or regulating pressure or compressing force
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5833—Measuring, controlling or regulating movement of moulds or mould parts, e.g. opening or closing, actuating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Fish Paste Products (AREA)
Description
2 ワーク搬送部
4 ローダ
5 ホルダープレート
6 ディスペンサ
8 クリーニング装置
9 プリヒート部
10 プリヒータ
11 プレス部
12 モールド金型
13 フィルム搬送機構
22 枠体
32 チャック
A ワーク供給ユニット
B 樹脂供給ユニット
C ワーク受渡しユニット
D プレスユニット
E 冷却ユニット
F リリースフィルム
R モールド樹脂
W ワーク
Claims (9)
- キャリアの内側に電子部品が搭載されたワークの樹脂モールドを行うモールド金型と、
前記ワークの搬送を行うローダと、を備え、
前記ローダは、前記ワークの上面における外縁部に接離する枠体と、前記枠体を上下移動させる移動装置と、前記ワークの下面における外縁部に接する複数のチャック爪と、を有し、
前記枠体は、前記ワークの上面における前記外縁部の全周に亘って設けられる当接部を有し、
前記当接部は、平面視において連続する環状形状に形成されており、
前記チャック爪は、一辺に複数の前記チャック爪が後端側において一体に構成され、前記ワークの平面視投影面内に入る位置で且つ前記ワークの側方外周部に当接しないように所定隙間で近接する位置と、前記ワークの平面視投影面内から外れる位置と、に移動すること
を特徴とする樹脂モールド装置。 - 前記移動装置の移動の制御を行う制御部をさらに備え、
前記制御部は、前記枠体が前記ワークに当接する際の押圧力および押圧速度の少なくとも一方の制御を行うこと
を特徴とする請求項1記載の樹脂モールド装置。 - 前記ワークのプリヒートを行うプリヒートステージをさらに備え、
前記制御部は、前記ワークを前記ローダが所定位置から前記プリヒートステージ上へ移動させる間、前記枠体を前記ワークに当接させる制御を行うこと
を特徴とする請求項2記載の樹脂モールド装置。 - 前記ワーク上にモールド樹脂を供給するディスペンサをさらに備え、
前記制御部は、前記ディスペンサによって前記モールド樹脂が供給された状態の前記ワークを前記ローダが所定位置からプリヒートステージ上へ移動させる間、前記枠体と前記チャック爪とで前記ワークを挟持させる制御を行うこと
を特徴とする請求項2記載の樹脂モールド装置。 - 前記チャック爪は、前記ワークが前記モールド金型に載置された状態および前記プリヒートステージに載置された状態の両方の場合において前記枠体が前記ワークを押圧する際に、前記ワークの平面視投影面内に入る位置から、前記ワークの平面視投影面内から外れる位置へ移動して退避可能に構成されていること
を特徴とする請求項3記載の樹脂モールド装置。 - 前記制御部は、前記ワークが前記モールド金型に載置された状態で、前記枠体が前記ワークを押圧する際の押圧力および押圧速度の少なくとも一方の制御を行うこと
を特徴とする請求項5記載の樹脂モールド装置。 - 前記制御部は、前記ワークが前記プリヒートステージに載置された状態で、前記枠体が前記ワークを押圧する際の押圧力および押圧速度の少なくとも一方の制御を行うこと
を特徴とする請求項5記載の樹脂モールド装置。 - 前記枠体は、少なくとも前記当接部がESD材料を用いて形成されていること
を特徴とする請求項1~7のいずれか一項に記載の樹脂モールド装置。 - 前記移動装置は、前記枠体の上下移動のガイドを行うガイドポストおよび上下移動の駆動を行うシリンダを有すること
を特徴とする請求項1~8のいずれか一項に記載の樹脂モールド装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020079456A JP7277935B2 (ja) | 2020-04-28 | 2020-04-28 | 樹脂モールド装置 |
CN202110431624.9A CN113571432B (zh) | 2020-04-28 | 2021-04-21 | 树脂模塑装置 |
TW110114788A TWI768846B (zh) | 2020-04-28 | 2021-04-23 | 樹脂模塑裝置 |
US17/242,318 US11784069B2 (en) | 2020-04-28 | 2021-04-28 | Resin molding apparatus |
Applications Claiming Priority (1)
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JP2020079456A JP7277935B2 (ja) | 2020-04-28 | 2020-04-28 | 樹脂モールド装置 |
Publications (2)
Publication Number | Publication Date |
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JP2021172051A JP2021172051A (ja) | 2021-11-01 |
JP7277935B2 true JP7277935B2 (ja) | 2023-05-19 |
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JP2020079456A Active JP7277935B2 (ja) | 2020-04-28 | 2020-04-28 | 樹脂モールド装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US11784069B2 (ja) |
JP (1) | JP7277935B2 (ja) |
CN (1) | CN113571432B (ja) |
TW (1) | TWI768846B (ja) |
Families Citing this family (1)
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JP2023176518A (ja) * | 2022-05-31 | 2023-12-13 | アピックヤマダ株式会社 | 樹脂封止装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002100645A (ja) | 2000-09-26 | 2002-04-05 | Nec Kansai Ltd | リードフレーム供給装置 |
JP2007320222A (ja) | 2006-06-02 | 2007-12-13 | Apic Yamada Corp | 樹脂モールド装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3776174B2 (ja) | 1996-09-12 | 2006-05-17 | アピックヤマダ株式会社 | 半導体部品の搬送装置 |
JP2897204B2 (ja) | 1997-02-28 | 1999-05-31 | 日本電気株式会社 | リードフレーム加熱装置 |
US6656671B1 (en) | 1998-11-20 | 2003-12-02 | Eastman Kodak Company | Photographic element with voided cushioning layer |
JP2003133345A (ja) | 2001-10-26 | 2003-05-09 | Sainekkusu:Kk | 半導体樹脂封止装置及び樹脂封止方法 |
JP4081397B2 (ja) * | 2002-07-31 | 2008-04-23 | 第一精工株式会社 | フィルム貼着装置およびフィルム貼着方法 |
JP5043534B2 (ja) | 2007-06-27 | 2012-10-10 | 住友重機械工業株式会社 | 樹脂封止装置 |
JP6541546B2 (ja) * | 2015-10-21 | 2019-07-10 | 株式会社ディスコ | 切削装置 |
JP6672103B2 (ja) * | 2016-08-01 | 2020-03-25 | Towa株式会社 | 樹脂成形装置及び樹脂成形品製造方法 |
JP6094781B1 (ja) * | 2016-08-02 | 2017-03-15 | 第一精工株式会社 | リードフレーム搬送装置及びリードフレームの搬送方法 |
US10861714B2 (en) * | 2019-01-15 | 2020-12-08 | Asm Technology Singapore Pte Ltd | Heating of a substrate for epoxy deposition |
JP7277936B2 (ja) * | 2020-04-28 | 2023-05-19 | アピックヤマダ株式会社 | 樹脂モールド装置 |
JP7406247B2 (ja) * | 2020-05-22 | 2023-12-27 | アピックヤマダ株式会社 | 樹脂モールド装置 |
-
2020
- 2020-04-28 JP JP2020079456A patent/JP7277935B2/ja active Active
-
2021
- 2021-04-21 CN CN202110431624.9A patent/CN113571432B/zh active Active
- 2021-04-23 TW TW110114788A patent/TWI768846B/zh active
- 2021-04-28 US US17/242,318 patent/US11784069B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002100645A (ja) | 2000-09-26 | 2002-04-05 | Nec Kansai Ltd | リードフレーム供給装置 |
JP2007320222A (ja) | 2006-06-02 | 2007-12-13 | Apic Yamada Corp | 樹脂モールド装置 |
Also Published As
Publication number | Publication date |
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CN113571432B (zh) | 2024-05-03 |
TW202140242A (zh) | 2021-11-01 |
TWI768846B (zh) | 2022-06-21 |
US11784069B2 (en) | 2023-10-10 |
US20210335632A1 (en) | 2021-10-28 |
CN113571432A (zh) | 2021-10-29 |
JP2021172051A (ja) | 2021-11-01 |
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