JP2017077611A - 切削装置 - Google Patents
切削装置 Download PDFInfo
- Publication number
- JP2017077611A JP2017077611A JP2015207468A JP2015207468A JP2017077611A JP 2017077611 A JP2017077611 A JP 2017077611A JP 2015207468 A JP2015207468 A JP 2015207468A JP 2015207468 A JP2015207468 A JP 2015207468A JP 2017077611 A JP2017077611 A JP 2017077611A
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- JP
- Japan
- Prior art keywords
- cutting
- dressing
- cutting blade
- optical sensor
- dressing grindstone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005520 cutting process Methods 0.000 title claims abstract description 135
- 230000003287 optical effect Effects 0.000 claims abstract description 32
- 230000002093 peripheral effect Effects 0.000 claims abstract description 18
- 238000007689 inspection Methods 0.000 claims description 11
- 239000002173 cutting fluid Substances 0.000 claims description 9
- 239000002699 waste material Substances 0.000 claims description 5
- 239000004575 stone Substances 0.000 abstract 5
- 239000007788 liquid Substances 0.000 abstract 1
- 238000003384 imaging method Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0608—Grinders for cutting-off using a saw movable on slideways
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
- B24B3/368—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades installed as an accessory on another machine
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
- B24B3/46—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/04—Devices or means for dressing or conditioning abrasive surfaces of cylindrical or conical surfaces on abrasive tools or wheels
- B24B53/053—Devices or means for dressing or conditioning abrasive surfaces of cylindrical or conical surfaces on abrasive tools or wheels using a rotary dressing tool
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
- B24B53/062—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels using rotary dressing tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
- B24B53/08—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels controlled by information means, e.g. patterns, templets, punched tapes or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
11 被加工物
14 切削ユニット
16 支持構造
18 切削ユニット移動機構
34 スピンドル
35 スピンドルハウジング
36 切削ブレード
38 ブレードカバー
40 切削液供給ノズル
44 ロータリードレッシング装置
46 ロータリードレッシング砥石
54 センサケース
54a 開口
56 光センサ
62 検査光
64 反射光
67 エアカーテン
Claims (3)
- 被加工物を保持するチャックテーブルと、スピンドルに装着した切削ブレードに切削液を供給しつつ該チャックテーブルに保持された被加工物を切削する切削手段と、を備えた切削装置であって、
該スピンドルを移動させ該切削ブレードを位置付ける移動手段と、
ドレッシング用砥石を該スピンドルと平行な回転軸で回転させるロータリードレッシング手段と、
該ドレッシング用砥石の外周位置を検出する光センサと、を備え、
該光センサで検出した該ドレッシング用砥石の外周位置に応じて該切削ブレードを該ロータリードレッシング手段に位置付け、所望の切り込み量で該ドレッシング用砥石を該切削ブレードで切削して該切削ブレードをドレッシングすることを特徴とする切削装置。 - 該光センサは、該ドレッシング用砥石の回転軸に向かって該光センサから出射された検査光が該ドレッシング用砥石の外周面に照射されるように位置づけられており、
該検査光の該ドレッシング用砥石の外周面からの反射光に基づいて該ドレッシング用砥石の直径を演算する演算手段を更に備え、
該演算手段で演算された該ドレッシング用砥石の直径に基づいて該切削ブレードを位置付け、該所定の切り込み量で該ドレッシング用砥石を該切削ブレードで切削する請求項1記載の切削装置。 - 該光センサから出射された検査光の通過を許容する開口を有する該光センサを収容する筐体と、
該開口近傍に設けられたエアカーテン形成手段とを更に備え、
該エアカーテン形成手段により形成されたエアカーテンにより、該開口から切削屑及び切削液が該筐体内に侵入し該光センサに付着するのを防止する請求項1又は2記載の切削装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015207468A JP6541546B2 (ja) | 2015-10-21 | 2015-10-21 | 切削装置 |
TW105127515A TWI685890B (zh) | 2015-10-21 | 2016-08-26 | 切割裝置 |
KR1020160121516A KR102413812B1 (ko) | 2015-10-21 | 2016-09-22 | 절삭 장치 |
US15/331,450 US10022838B2 (en) | 2015-10-21 | 2016-10-21 | Cutting apparatus |
CN201610920580.5A CN106903810B (zh) | 2015-10-21 | 2016-10-21 | 切削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015207468A JP6541546B2 (ja) | 2015-10-21 | 2015-10-21 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017077611A true JP2017077611A (ja) | 2017-04-27 |
JP6541546B2 JP6541546B2 (ja) | 2019-07-10 |
Family
ID=58562215
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015207468A Active JP6541546B2 (ja) | 2015-10-21 | 2015-10-21 | 切削装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10022838B2 (ja) |
JP (1) | JP6541546B2 (ja) |
KR (1) | KR102413812B1 (ja) |
CN (1) | CN106903810B (ja) |
TW (1) | TWI685890B (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019181655A (ja) * | 2018-04-17 | 2019-10-24 | 株式会社ディスコ | 切削装置 |
JP2020116655A (ja) * | 2019-01-21 | 2020-08-06 | 株式会社ディスコ | 切削装置及び切削ブレードのドレッシング方法 |
TWI808351B (zh) * | 2019-10-24 | 2023-07-11 | 日商Towa股份有限公司 | 刀片更換裝置、切斷裝置及切斷物的製造方法 |
JP7493348B2 (ja) | 2020-02-25 | 2024-05-31 | 株式会社ディスコ | 切削装置 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6873712B2 (ja) * | 2017-01-17 | 2021-05-19 | 株式会社ディスコ | ドレッシングボード、切削ブレードのドレッシング方法及び切削装置 |
JP7045841B2 (ja) * | 2017-12-08 | 2022-04-01 | 株式会社ディスコ | 切削装置 |
JP7033485B2 (ja) * | 2018-04-17 | 2022-03-10 | 株式会社ディスコ | 切削ブレードの整形方法 |
CN108818053A (zh) * | 2018-08-02 | 2018-11-16 | 苏州谊佳润机电制造有限公司 | 一种可稳定装夹的电梯配件加工用切割装置 |
JP7222636B2 (ja) * | 2018-09-12 | 2023-02-15 | 株式会社ディスコ | エッジトリミング装置 |
DE102018133083A1 (de) * | 2018-12-20 | 2020-06-25 | Carl Zeiss Jena Gmbh | Vorrichtung und Verfahren zum geregelten Bearbeiten eines Werkstückes mit einer Bearbeitungsstrahlung |
US11565371B2 (en) * | 2018-12-31 | 2023-01-31 | Micron Technology, Inc. | Systems and methods for forming semiconductor cutting/trimming blades |
CN110744731B (zh) * | 2019-10-30 | 2021-07-27 | 许昌学院 | 一种基于光电控制的晶片切片设备 |
JP7277936B2 (ja) * | 2020-04-28 | 2023-05-19 | アピックヤマダ株式会社 | 樹脂モールド装置 |
JP7277935B2 (ja) * | 2020-04-28 | 2023-05-19 | アピックヤマダ株式会社 | 樹脂モールド装置 |
JP7354069B2 (ja) * | 2020-08-26 | 2023-10-02 | Towa株式会社 | 切断装置、及び、切断品の製造方法 |
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JP6541546B2 (ja) | 2019-07-10 |
CN106903810A (zh) | 2017-06-30 |
US20170113322A1 (en) | 2017-04-27 |
TWI685890B (zh) | 2020-02-21 |
CN106903810B (zh) | 2020-02-21 |
US10022838B2 (en) | 2018-07-17 |
KR102413812B1 (ko) | 2022-06-29 |
TW201715600A (zh) | 2017-05-01 |
KR20170046572A (ko) | 2017-05-02 |
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