CN106903810A - 切削装置 - Google Patents

切削装置 Download PDF

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CN106903810A
CN106903810A CN201610920580.5A CN201610920580A CN106903810A CN 106903810 A CN106903810 A CN 106903810A CN 201610920580 A CN201610920580 A CN 201610920580A CN 106903810 A CN106903810 A CN 106903810A
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cutting
finishing
grinding tool
tool
topping machanism
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CN106903810B (zh
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秋田壮郎
秋田壮一郎
清川聪
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Disco Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0608—Grinders for cutting-off using a saw movable on slideways
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
    • B24B3/368—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades installed as an accessory on another machine
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
    • B24B3/46—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/04—Devices or means for dressing or conditioning abrasive surfaces of cylindrical or conical surfaces on abrasive tools or wheels
    • B24B53/053—Devices or means for dressing or conditioning abrasive surfaces of cylindrical or conical surfaces on abrasive tools or wheels using a rotary dressing tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
    • B24B53/062—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels using rotary dressing tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
    • B24B53/08—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels controlled by information means, e.g. patterns, templets, punched tapes or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

提供切削装置，能够始终按照期望的切入量将切削刀具定位于修整用磨具的外周。切削装置具有卡盘工作台和切削构件，该卡盘工作台对被加工物进行保持，该切削构件一边对安装于主轴的切削刀具提供切削液一边对该卡盘工作台上所保持的被加工物进行切削，该切削装置具有：移动构件，其使主轴移动并定位该切削刀具；旋转修整构件，其使修整用磨具按照与主轴平行的旋转轴旋转；以及光传感器，其对修整用磨具的外周位置进行检测，并根据由光传感器检测出的修整用磨具的外周位置将切削刀具相对于旋转修整构件进行定位，并使切削刀具按照期望的切入量对修整用磨具进行切削而对切削刀具进行修整。

Description

切削装置
技术领域
本发明涉及切削装置，尤其涉及具有旋转修整构件的切削装置。
背景技术
在使切削刀具高速旋转而对晶片等被加工物进行切削的切削装置中，存在如下的问题：当持续进行被加工物的切削时切削刀具的前端变得尖细，当在该状态下继续进行切削时会使器件芯片侧面的形状精度恶化。
为了防止该情况，需要定期性地使切削刀具切入修整用磨具而使其磨耗从而进行修整。该修整是为了使在安装于主轴的状态下发生了偏芯的切削刀具成为正圆形，并且为了进行因切削加工导致的磨平和堵塞的切削刀具的修锐。
关于切削刀具的修整，有时在切削加工的中途适当实施，但通常从卡盘工作台取下被加工物并利用卡盘工作台对专用的修整板进行吸引保持而实施修整。
然而，由于利用卡盘工作台对修整板进行吸引保持以及从卡盘工作台取下的工序非常繁杂，因此提出在卡盘工作台的附近设置修整板专用的子卡盘工作台等对策(参照日本特开2010-87122号公报)。
但是，在切削装置是具有非常硬质的切削刀具的切削装置的情况下，当利用修整板专用的子卡盘工作台上所保持的修整板进行修整时，存在切削量不充分的情况。因此，为了提高修整时的切削阻力，而使用借助旋转的修整磨具来进行修整的旋转修整(rotarydressing)装置。
专利文献1：日本特开2010-871225号公报
在旋转修整装置中，由于利用切削刀具对旋转的修整磨具进行切削，因此即使是硬质的切削刀具也能够磨耗。然而，存在如下的课题：由于修整用磨具也会磨耗并且直径变小，因此切削刀具的切入量的调整很困难。
发明内容
本发明是鉴于这点而完成的，其目的在于提供一种切削装置，能够始终按照期望的切入量将切削刀具定位在修整用磨具的外周。
根据本发明，提供一种切削装置，其具有卡盘工作台和切削构件，该卡盘工作台对被加工物进行保持，该切削构件一边对安装于主轴的切削刀具提供切削液一边对该卡盘工作台上所保持的被加工物进行切削，该切削装置的特征在于，该切削装置具有：移动构件，其使该主轴移动并对该切削刀具进行定位；旋转修整构件，其使修整用磨具按照平行于该主轴的旋转轴旋转；以及光传感器，其对该修整用磨具的外周位置进行检测，根据由该光传感器检测出的该修整用磨具的外周位置而将该切削刀具相对于该旋转修整构件进行定位，并使该切削刀具按照期望的切入量对该修整用磨具进行切削而对该切削刀具进行修整。
优选该光传感器被定位为从该光传感器朝向该修整用磨具的旋转轴射出的检查光被照射到该修整用磨具的外周面上，该切削装置还具有运算单元，该运算单元根据该检查光的来自该修整用磨具的外周面的反射光而对该修整用磨具的直径进行运算，根据由该运算单元所运算的该修整用磨具的直径而对该切削刀具进行定位，并使该切削刀具按照该期望的切入量对该修整用磨具进行切削。
优选该切削装置还具有：壳体，其对该光传感器进行收纳，并且该壳体具有开口，该开口允许从该光传感器射出的检查光通过；以及气帘形成构件，其设置在该开口附近，利用由该气帘形成构件所形成的气帘而防止切削屑和切削液从该开口侵入该壳体内并且附着于该光传感器。
在本发明的切削装置中，由于利用光传感器对修整用磨具的外周位置进行检测而计算修整用磨具的直径，因此能够始终按照期望的切入量将切削刀具定位在修整用磨具的外周。
附图说明
图1是本发明实施方式的切削装置的立体图。
图2是被加工物切削时的切削装置主要部位的局部剖视侧视图。
图3是利用旋转修整磨具对切削刀具进行修整的状态下的切削装置主要部位的局部剖视侧视图。
图4是对旋转修整磨具的外周位置进行检测的状态下的切削装置主要部位的局部剖视侧视图。
图5是对旋转修整磨具的外周位置进行检测的状态下的切削单元部分的局部剖视主视图。
标号说明
6：卡盘工作台；11：被加工物；14：切削单元；16：支承构造；18：切削单元移动机构；34：主轴；35：主轴机壳；36：切削刀具；38：刀具罩；40：切削液提供喷嘴；44：旋转修整装置；46：旋转修整磨具；54：传感器外壳；54a：开口；56：光传感器；62：检查光；64：反射光；67：气帘。
具体实施方式
以下，参照附图对本发明的实施方式详细地进行说明。参照图1，示出本发明实施方式的切削装置2的立体图。4是切削装置2的基座，在基座4上形成有沿X轴方向延伸的较长的矩形状的开口4a。
在该开口4a内，卡盘工作台6被配设为能够旋转且能够通过未图示的X轴移动机构而在X轴方向上往复运动，该卡盘工作台6具有由多孔性陶瓷等形成的吸引保持部6a。
在卡盘工作台6的外周部分，配设有多个夹具8，该夹具8对支承着被加工物的框架单元的环状框架进行夹持。在卡盘工作台6的周围配设有防水罩10，折皱12连结在该防水罩10与基座4的之间。
对切削单元14进行支承的门型的支承构造16以跨越开口4a的方式配置于基座4的上表面上。在支承构造16的前表面上部，设置有使切削单元14在Y轴方向和Z轴方向上移动的切削单元移动机构18。
切削单元移动机构18具有固定于支承构造16的前表面上的与Y轴方向平行的一对Y轴导轨20。构成切削单元移动机构18的Y轴移动板22以能够滑动的方式配设于Y轴导轨20。
在Y轴移动板22的背面侧设置有未图示的螺母部，与Y轴导轨20平行的Y轴方向滚珠丝杠24与该螺母部螺合。未图示的Y轴脉冲电动机与Y轴滚珠丝杠24的一端部连结。如果利用Y轴脉冲电动机使Y轴滚珠丝杠24旋转，则Y轴移动板22沿着Y轴导轨20在Y轴方向上移动。
在Y轴移动板22的前表面上固定有在Z轴方向上伸长的一对Z轴导轨20。Z轴移动板28以能够滑动的方式配设于Z轴导轨26。
在Z轴移动板28的背面侧设置有未图示的螺母部，与Z轴导轨26平行的Z轴滚珠丝杠30与该螺母部螺合。Z轴脉冲电动机32与Z轴滚珠丝杠30的一端部连结。如果利用Z轴脉冲电动机32使Z轴滚珠丝杠30旋转，则Z轴移动板28沿着Z轴导轨26在Z轴方向上移动。
在Z轴移动板28的下部安装有切削单元14，该切削单元14对卡盘工作台6上所保持的被加工物进行切削。并且，在与切削单元14相邻的位置上配设有拍摄单元42，该拍摄单元42具有对卡盘工作台6上所保持的被加工物的上表面进行拍摄的显微镜和照相机。
切削单元14包含：图2所示的主轴34，其被电动机旋转驱动；切削刀具36，其安装于主轴35的前端部；刀具罩38，其罩盖切削刀具36的上半部分；以及一对(只图示1个)切削液提供喷嘴40，它们安装于刀具罩38，并在切削刀具36的两侧沿X轴方向延伸。
如果借助切削单元移动机构18使Y轴移动板22在Y轴方向上移动，则在Y轴方向上对切削单元14和拍摄单元42进行分度进给，如果使Z轴移动板28在Z轴方向上移动，则切削单元14和拍摄单元42在上下方向上移动。
在本实施方式的切削装置2中，旋转修整装置(旋转修整构件)44以向开口4a内突出的方式安装于基座4的侧面上。像图2至图4中最佳示出的那样，旋转修整装置44由电动机48、固定于电动机48的输出轴50的旋转修整磨具(修整用磨具)46以及罩盖修整磨具46的罩52构成。
关于旋转修整磨具46，例如在使由碳化硅(SiC)构成的绿色金刚砂(GC)磨粒与由包含填料的酚醛树脂构成的树脂结合剂混炼而成型为圆筒状之后，在600℃～700℃左右的温度下烧结而形成。优选旋转修整磨具46具有由酚醛树脂构成的组成成分，该酚醛树脂包含质量比为50～60％的超磨粒和质量比为45～35％的填料。
本实施方式中所使用的旋转修整磨具46为直径为3英寸、宽度为1英寸、内径为0.5英寸，但旋转修整磨具46不限于这些数值。
像图5中最佳示出的那样，在切削单元14的主轴机壳35上安装有传感器外壳54，在该传感器外壳54内配设有光传感器56。
传感器外壳54具有开口54a，从光传感器56射出的检查光62通过该开口54a，而从与旋转修整磨具46的旋转轴(电动机48的输出轴)50垂直的方向照射至旋转修整磨具46的外周面。
此外，从光传感器56射出的检查光62朝向旋转轴50的中心(轴心)50a照射。在旋转修整磨具46的外周面上发生了漫反射的反射光64由光传感器56的受光元件接受。
如图2至图4所示，传感器外壳54经由电磁切换阀58而与压缩空气源60连接，通过将电磁切换阀58切换到图2所示的连通位置，而如图5所示，压缩空气从设置于传感器外壳54的空气导入口55被导入传感器外壳54内，并从开口54a排出。
在开口54a附近配设有气帘形成构件66，通过该气帘形成构件66而在开口54a内形成有气帘67，防止切削屑和切削液侵入传感器外壳54内。
参照图2，示出了利用在箭头A方向上进行高速旋转的切削刀具36对卡盘工作台6上的所保持被加工物11进行切削时的实施方式的切削装置主要部位的局部剖视侧视图。
在该切削步骤中，将在箭头A方向上进行高速旋转(例如30000rpm)的切削刀具36切入划片带T，并通过在X轴方向上对卡盘工作台6进行加工进给而对被加工物11进行切削。
在进行被加工物的切削时，将电磁切换阀58切换到连通位置，而从压缩空气源60对传感器外壳54内导入压缩空气，并从传感器外壳54的开口54a排出压缩空气。与此同时，通过利用气帘形成构件66在开口54a内形成气帘67，而防止切削屑和切削液侵入传感器外壳54内，防止光传感器56被切削屑或者切削液污染。
当持续进行对被加工物的切削时，切削刀具36的前端变得尖细，当在该状态下持续切削时，存在使芯片的形状精度恶化这样的问题。为了防止该情况，需要定期地实施对切削刀具36的外周进行修正的外径修正修整。并且，当切削刀具36持续进行切削时，由于产生磨平而导致切削能力降低，因此定期地实施修锐修整。
但是，要想实施切削刀具36的修整，需要利用切削刀具36按照规定的深度切入旋转修整磨具46，因此需要准确地了解旋转修整磨具46的最外周的高度。
因此，优选在实施切削刀具36的修整之前对旋转修整磨具46的直径进行测定。由于旋转修整磨具46的旋转轴(电动机48的输出轴)50配设在规定的高度，因此预先判明新的旋转修整磨具46的最外周的高度，并将该高度位置保存在切削装置2的控制器的存储器中。并且，对旋转修整磨具46的能够使用量即界限直径进行设定，并同样将该界限直径保存在控制器的存储器中。
在定期性实施的旋转修整磨具46的直径测定时，如图4和图5所示，从光传感器56对旋转修整磨具46的外周面照射检查光64，并利用光传感器56的受光元件接受来自外周面的漫反射光64。
通过对从光传感器56射出检查光62起直到借助光传感器56的受光元件接受到反射光64为止的时间和受光位置进行测定，能够准确地测定从光传感器56到旋转修整磨具46的外周面的距离。
在旋转修整磨具46的外周位置的检测中，使旋转修整磨具46按照例如10000rpm旋转并且使光传感器46在磨具46的宽度方向(Y轴方向)上移动，并在多个部位对旋转修整磨具46的外周位置进行检测。
例如，作为旋转修整磨具46的直径检测出在多个部位测定得到的最大值。并且，利用控制器的运算单元根据该直径而运算出旋转修整磨具46的高度位置，将该高度位置保存在存储器中。
这样，在对旋转修整磨具46的最外周的当前的高度位置进行检测之后，实施切削刀具36的修整。在切削刀具36的修整时，根据所测定的切削刀具36的最外周的高度位置而对切削刀具36的切入高度进行设定。
并且，如图3所示，一边使切削刀具36在箭头A方向上高速(例如30000rpm)旋转，一边按照所设定的切入高度切入在箭头A方向上例如以10000rpm旋转的旋转修整磨具46，并且一边使切削刀具36在Y轴方向上移动一边实施切削刀具36的修整。
另外，由于切削刀具36和旋转修整磨具46都在A方向上旋转，因此切削刀具36按照所谓的上切(up cut)对旋转修整磨具进行切削，因此切削阻力升高，并且一边在Y轴方向上前后移动一边进行切削，因此与在X轴方向上进行加工进给的情况相比，切削阻力进一步升高，能够非常高效地实施切削刀具36的修整。
在图4所示的旋转修整磨具46的直径测定时，将电磁切换阀58切换到切断位置，而中止压缩空气从传感器外壳54的开口54a喷出。此时，气帘形成构件66所进行的气帘67的形成可以持续进行，但也可以中止气帘67的喷出。
在上述的实施方式中，对将光传感器56安装于主轴机壳35上的例子进行了说明，但光传感器56的安装位置不限于此，也可以安装于其他的位置。并且，关于旋转修整磨具46的测定所用的检查光64的反射光，也可以使用正反射光。

Claims (3)

1.一种切削装置，其具有卡盘工作台和切削构件，该卡盘工作台对被加工物进行保持，该切削构件一边对安装于主轴的切削刀具提供切削液一边对该卡盘工作台上所保持的被加工物进行切削，该切削装置的特征在于，
该切削装置具有：
移动构件，其使该主轴移动并对该切削刀具进行定位；
旋转修整构件，其使修整用磨具按照平行于该主轴的旋转轴旋转；以及
光传感器，其对该修整用磨具的外周位置进行检测，
根据由该光传感器检测出的该修整用磨具的外周位置而将该切削刀具相对于该旋转修整构件进行定位，并使该切削刀具按照期望的切入量对该修整用磨具进行切削而对该切削刀具进行修整。
2.根据权利要求1所述的切削装置，其中，
该光传感器被定位为从该光传感器朝向该修整用磨具的旋转轴射出的检查光被照射到该修整用磨具的外周面上，
该切削装置还具有运算单元，该运算单元根据该检查光的来自该修整用磨具的外周面的反射光而对该修整用磨具的直径进行运算，
根据由该运算单元所运算的该修整用磨具的直径而对该切削刀具进行定位，并使该切削刀具按照该期望的切入量对该修整用磨具进行切削。
3.根据权利要求1或2所述的切削装置，其中，
该切削装置还具有：
壳体，其对该光传感器进行收纳，并且该壳体具有开口，该开口允许从该光传感器射出的检查光通过；以及
气帘形成构件，其设置在该开口附近，
利用由该气帘形成构件所形成的气帘而防止切削屑和切削液从该开口侵入该壳体内并且附着于该光传感器。
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CN110744731A (zh) * 2019-10-30 2020-02-04 许昌学院 一种基于光电控制的晶片切片设备
CN110744731B (zh) * 2019-10-30 2021-07-27 许昌学院 一种基于光电控制的晶片切片设备
CN113571432A (zh) * 2020-04-28 2021-10-29 山田尖端科技株式会社 树脂模塑装置
CN113571432B (zh) * 2020-04-28 2024-05-03 山田尖端科技株式会社 树脂模塑装置
CN114102718A (zh) * 2020-08-26 2022-03-01 Ｔｏｗａ株式会社 切割装置以及切割品的制造方法
CN114102718B (zh) * 2020-08-26 2024-01-30 Ｔｏｗａ株式会社 切割装置以及切割品的制造方法

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