JP7045841B2 - 切削装置 - Google Patents
切削装置 Download PDFInfo
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- JP7045841B2 JP7045841B2 JP2017236307A JP2017236307A JP7045841B2 JP 7045841 B2 JP7045841 B2 JP 7045841B2 JP 2017236307 A JP2017236307 A JP 2017236307A JP 2017236307 A JP2017236307 A JP 2017236307A JP 7045841 B2 JP7045841 B2 JP 7045841B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0683—Accessories therefor
- B24B27/0691—Accessories therefor for controlling the feeding or return movement of the saw
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0608—Grinders for cutting-off using a saw movable on slideways
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/16—Bushings; Mountings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
- B24B41/047—Grinding heads for working on plane surfaces
- B24B41/053—Grinding heads for working on plane surfaces for grinding or polishing glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/04—Protective covers for the grinding wheel
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Jigs For Machine Tools (AREA)
- Confectionery (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Milling Processes (AREA)
Description
本発明の切削装置は、被加工物を保持するチャックテーブルと、該チャックテーブルをX方向に加工送りする加工送りユニットと、該X方向と直交するY方向に設定された2つのスピンドルの回転軸心が一致し、中央に装着穴が形成された円板状の基台の一方の面側の外周縁に切り刃が固定されかつ各スピンドルに装着された切削ブレードが対峙する第1の切削ユニットと第2の切削ユニットと、を備える切削装置であって、該第1の切削ユニット及び該第2の切削ユニットは、該スピンドルの先端に固定され、該切削ブレードの該基台の他方の面側を吸引し、該基台の一方の面側を該スピンドルの先端側で露出させた状態で該切削ブレードを該スピンドルに固定するフランジ機構と、該フランジ機構の円筒部を内側に挿入した支持筒部を備え、該スピンドルを収容するスピンドルハウジング側の部材であるロータリジョイントと、該切削ブレードを該フランジ機構に吸引保持する吸引保持機構と、を備え、該吸引保持機構は、一端が該フランジ機構の該切削ブレードの該基台の該他方の面に対向する一方の表面に開口し、他端が該支持筒部内に挿入される該円筒部の外周面に開口したフランジ側吸引通路と、一端が該ロータリジョイントの該支持筒部の内周面に開口して該フランジ側吸引通路の他端と相対し、他端が吸引源に接続したジョイント側吸引通路とを備え、該第1の切削ユニットと該第2の切削ユニットに固定されたそれぞれの該切削ブレードは、該外周縁に切り刃が固定された該一方の面が互いに対面することを特徴とする。
実施形態1に係る切削装置を図面に基いて説明する。図1は、実施形態1に係る切削装置の構成例を示す斜視図である。図2は、実施形態1に係る切削装置の切削ユニットの要部を示す斜視図である。図3は、実施形態1に係る切削装置の切削ユニットの要部の断面図である。図4は、実施形態1に係る切削装置の切削ユニットの要部を分解して示す斜視図である。
10 チャックテーブル
20 切削ユニット
20-1 一方の切削ユニット(第1の切削ユニット)
20-2 他方の切削ユニット(第2の切削ユニット)
21 スピンドル
24 フランジ機構
28 フランジ部
30 切削ブレード
31 基台
32 切り刃
51 加工送りユニット
201 被加工物
272 ボス部
274 先端面(先端)
311 装着穴
312 一方の外側面(一方の面)
313 他方の外側面(他方の面)
Claims (3)
- 被加工物を保持するチャックテーブルと、該チャックテーブルをX方向に加工送りする加工送りユニットと、該X方向と直交するY方向に設定された2つのスピンドルの回転軸心が一致し、中央に装着穴が形成された円板状の基台の一方の面側の外周縁に切り刃が固定されかつ各スピンドルに装着された切削ブレードが対峙する第1の切削ユニットと第2の切削ユニットと、を備える切削装置であって、
該第1の切削ユニット及び該第2の切削ユニットは、
該スピンドルの先端に固定され、該切削ブレードの該基台の他方の面側を吸引し、該基台の一方の面側を該スピンドルの先端側で露出させた状態で該切削ブレードを該スピンドルに固定するフランジ機構と、
該切削ブレードを覆って切削水を該切削ブレードに供給するとともに、他の切削ユニットに対向する外表面が該切削ブレードの切り刃と同一平面上又は略同一平面上に位置するブレードカバーと、を備え、
該ブレードカバーは、該外表面に平板状のブレード側ノズル部材を取り付け、該ブレード側ノズル部材との間に該切り刃に切削水を供給するブレード側噴射口を形成し、
該第1の切削ユニットと該第2の切削ユニットに固定されたそれぞれの該切削ブレードは、該外周縁に切り刃が固定された該一方の面が互いに対面することを特徴とする切削装置。 - 被加工物を保持するチャックテーブルと、該チャックテーブルをX方向に加工送りする加工送りユニットと、該X方向と直交するY方向に設定された2つのスピンドルの回転軸心が一致し、中央に装着穴が形成された円板状の基台の一方の面側の外周縁に切り刃が固定されかつ各スピンドルに装着された切削ブレードが対峙する第1の切削ユニットと第2の切削ユニットと、を備える切削装置であって、
該第1の切削ユニット及び該第2の切削ユニットは、
該スピンドルの先端に固定され、該切削ブレードの該基台の他方の面側を吸引し、該基台の一方の面側を該スピンドルの先端側で露出させた状態で該切削ブレードを該スピンドルに固定するフランジ機構と、
該フランジ機構の円筒部を内側に挿入した支持筒部を備え、該スピンドルを収容するスピンドルハウジング側の部材であるロータリジョイントと、
該切削ブレードを該フランジ機構に吸引保持する吸引保持機構と、を備え、
該吸引保持機構は、
一端が該フランジ機構の該切削ブレードの該基台の該他方の面に対向する一方の表面に開口し、他端が該支持筒部内に挿入される該円筒部の外周面に開口したフランジ側吸引通路と、
一端が該ロータリジョイントの該支持筒部の内周面に開口して該フランジ側吸引通路の他端と相対し、他端が吸引源に接続したジョイント側吸引通路とを備え、
該第1の切削ユニットと該第2の切削ユニットに固定されたそれぞれの該切削ブレードは、該外周縁に切り刃が固定された該一方の面が互いに対面することを特徴とする切削装置。 - 該フランジ機構は、該切削ブレードの該装着穴に挿通するボス部と、該ボス部の後方で径方向に張り出し該切削ブレードの該基台の該他方の面を吸引保持するフランジ部と、を備え、該ボス部の先端は吸引保持した該切削ブレードの該基台から突出しない請求項1又は請求項2に記載の切削装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017236307A JP7045841B2 (ja) | 2017-12-08 | 2017-12-08 | 切削装置 |
KR1020180145093A KR102549280B1 (ko) | 2017-12-08 | 2018-11-22 | 절삭 장치 |
US16/206,431 US11103969B2 (en) | 2017-12-08 | 2018-11-30 | Cutting apparatus |
CN201811464171.4A CN110027124B (zh) | 2017-12-08 | 2018-12-03 | 切削装置 |
TW107144058A TWI770322B (zh) | 2017-12-08 | 2018-12-07 | 切割裝置 |
Applications Claiming Priority (1)
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---|---|---|---|
JP2017236307A JP7045841B2 (ja) | 2017-12-08 | 2017-12-08 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
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JP2019104068A JP2019104068A (ja) | 2019-06-27 |
JP7045841B2 true JP7045841B2 (ja) | 2022-04-01 |
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JP2017236307A Active JP7045841B2 (ja) | 2017-12-08 | 2017-12-08 | 切削装置 |
Country Status (5)
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US (1) | US11103969B2 (ja) |
JP (1) | JP7045841B2 (ja) |
KR (1) | KR102549280B1 (ja) |
CN (1) | CN110027124B (ja) |
TW (1) | TWI770322B (ja) |
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JP7373936B2 (ja) * | 2019-07-22 | 2023-11-06 | 株式会社ディスコ | フランジ機構と切削装置 |
JP7341608B2 (ja) * | 2019-10-07 | 2023-09-11 | 株式会社ディスコ | フランジ機構及び切削装置 |
CN110732933B (zh) * | 2019-10-23 | 2021-07-16 | 中国科学院光电技术研究所 | 适用于大口径光学元件的抛光液供给回收抛光工具头装置 |
JP7461132B2 (ja) * | 2019-11-27 | 2024-04-03 | 株式会社ディスコ | 切削装置 |
JP2022125669A (ja) * | 2021-02-17 | 2022-08-29 | 株式会社ディスコ | 切削装置 |
Citations (3)
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JP2016132046A (ja) | 2015-01-16 | 2016-07-25 | 株式会社ディスコ | マウントフランジ |
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JP2002331464A (ja) * | 2001-05-09 | 2002-11-19 | Disco Abrasive Syst Ltd | 切削ブレード |
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JP6101140B2 (ja) * | 2013-04-18 | 2017-03-22 | 株式会社ディスコ | 切削装置 |
JP6108999B2 (ja) * | 2013-07-18 | 2017-04-05 | 株式会社ディスコ | 切削装置 |
JP6069122B2 (ja) * | 2013-07-22 | 2017-02-01 | 株式会社ディスコ | 切削装置 |
JP6562670B2 (ja) * | 2015-03-23 | 2019-08-21 | 株式会社ディスコ | 被加工物の切削方法 |
JP6541546B2 (ja) * | 2015-10-21 | 2019-07-10 | 株式会社ディスコ | 切削装置 |
JP6560110B2 (ja) * | 2015-11-30 | 2019-08-14 | 株式会社ディスコ | 切削装置 |
JP7019241B2 (ja) * | 2017-09-21 | 2022-02-15 | 株式会社ディスコ | 切削ブレードの装着機構 |
JP7045178B2 (ja) * | 2017-12-13 | 2022-03-31 | 株式会社ディスコ | 切削装置 |
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JP2002217135A (ja) | 2001-01-19 | 2002-08-02 | Disco Abrasive Syst Ltd | 切削装置 |
KR100774388B1 (ko) | 2001-07-26 | 2007-11-08 | 디스코 하이테크 유럽 게엠베하 | 웨이퍼 커팅 머신 |
JP2016132046A (ja) | 2015-01-16 | 2016-07-25 | 株式会社ディスコ | マウントフランジ |
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TWI770322B (zh) | 2022-07-11 |
TW201924846A (zh) | 2019-07-01 |
CN110027124B (zh) | 2021-10-12 |
CN110027124A (zh) | 2019-07-19 |
KR20190068423A (ko) | 2019-06-18 |
JP2019104068A (ja) | 2019-06-27 |
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KR102549280B1 (ko) | 2023-06-28 |
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