JP6855117B2 - フランジ機構 - Google Patents
フランジ機構 Download PDFInfo
- Publication number
- JP6855117B2 JP6855117B2 JP2017041317A JP2017041317A JP6855117B2 JP 6855117 B2 JP6855117 B2 JP 6855117B2 JP 2017041317 A JP2017041317 A JP 2017041317A JP 2017041317 A JP2017041317 A JP 2017041317A JP 6855117 B2 JP6855117 B2 JP 6855117B2
- Authority
- JP
- Japan
- Prior art keywords
- flange
- mounter
- fixed
- cutting blade
- support surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000007246 mechanism Effects 0.000 title claims description 35
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 description 6
- 239000012530 fluid Substances 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
- B26D7/2614—Means for mounting the cutting member
- B26D7/2621—Means for mounting the cutting member for circular cutters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
Description
46 スピンドルハウジング
48 スピンドル
50 ロータリージョイント
52 マウンター
54 円筒状ボス部
56 受けフランジ部
56a 第1支持面
56b 環状凸部
58 円筒部
58a 環状溝
58b 吸引穴
60 装着穴
64 吸引口
66 連通路
70 吸引源
72 切削ブレード
80 固定フランジ(前フランジ)
82 フランジ部
82a 第2支持面
84 キャップ部
86 円形凹部
Claims (2)
- スピンドルハウジングに回転可能に支持されるスピンドルの先端に固定され、環状の切削ブレードを支持するマウンターと、該切削ブレードを該マウンターに固定する固定フランジと、を備えたフランジ機構であって、
該マウンターは、該切削ブレードの内周を支持する円筒状のボス部と、
該円筒状のボス部の後方から径方向外側に突出し、外周縁の前面側に該切削ブレードを支持する第1支持面を有する受けフランジ部と、
該受けフランジ部の後方に該受けフランジ部と一体的に形成され、外周に環状溝を有する円筒部と、を含み、
該受けフランジ部は該固定フランジに対面する側に複数の吸引口を有し、
該マウンターの該受けフランジ部及び該円筒部には前記各吸引口と前記環状溝とを連通する複数の吸引路が形成されており、
該固定フランジは、
該受けフランジ部の該第1支持面と共に該切削ブレードを挟持する第2支持面を外周縁に有するフランジ部と、該フランジ部と一体的に形成された該マウンターの該ボス部を覆うキャップ部と、を含み、
該スピンドルハウジングに固定されたロータリージョイントを介して該環状溝に吸引源からの負圧を作用させることにより、該吸引口で該固定フランジを該マウンターに向かって吸引し、該マウンターの該第1支持面と該固定フランジの該第2支持面とで該切削ブレードを挟持して固定することを特徴とするフランジ機構。 - 前記固定フランジは、該マウンターの該ボス部の先端が嵌合する円形凹部を有することを特徴とする請求項1記載のフランジ機構。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017041317A JP6855117B2 (ja) | 2017-03-06 | 2017-03-06 | フランジ機構 |
TW107104142A TWI742239B (zh) | 2017-03-06 | 2018-02-06 | 凸緣機構 |
KR1020180019941A KR102330574B1 (ko) | 2017-03-06 | 2018-02-20 | 플랜지 기구 |
CN201810173668.4A CN108527700B (zh) | 2017-03-06 | 2018-03-02 | 凸缘机构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017041317A JP6855117B2 (ja) | 2017-03-06 | 2017-03-06 | フランジ機構 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018144168A JP2018144168A (ja) | 2018-09-20 |
JP6855117B2 true JP6855117B2 (ja) | 2021-04-07 |
Family
ID=63486471
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017041317A Active JP6855117B2 (ja) | 2017-03-06 | 2017-03-06 | フランジ機構 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6855117B2 (ja) |
KR (1) | KR102330574B1 (ja) |
CN (1) | CN108527700B (ja) |
TW (1) | TWI742239B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7224243B2 (ja) * | 2019-06-10 | 2023-02-17 | 株式会社ディスコ | フランジ機構 |
CN110170910A (zh) * | 2019-06-25 | 2019-08-27 | 张劲松 | 一种刀盘双定位的划片机气浮主轴结构 |
CN110253774B (zh) * | 2019-06-25 | 2021-04-23 | 江苏守航实业有限公司 | 一种用来减小半导体材料尺寸的新型装置 |
JP7446067B2 (ja) | 2019-08-22 | 2024-03-08 | 株式会社ディスコ | フランジ機構 |
JP7341608B2 (ja) | 2019-10-07 | 2023-09-11 | 株式会社ディスコ | フランジ機構及び切削装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02190260A (ja) * | 1989-01-20 | 1990-07-26 | Mitsubishi Heavy Ind Ltd | 砥石車の脱着装置 |
US5239783A (en) * | 1991-08-20 | 1993-08-31 | William Matechuk | Drywall sander |
ITRM950420A1 (it) * | 1995-06-23 | 1996-12-23 | Massimo Morini | Macchina e procedimento per la rifinitura in un automatico di sanitari e manufatti in ceramica, in ambiente chiuso con aspirazione chiuso con |
JPH10217117A (ja) * | 1997-02-05 | 1998-08-18 | Toyoda Mach Works Ltd | 砥石保持装置 |
JPH10277934A (ja) * | 1997-04-03 | 1998-10-20 | Honda Motor Co Ltd | 研削用砥石の着脱補助装置 |
JP3817025B2 (ja) * | 1997-06-20 | 2006-08-30 | 多摩川精機株式会社 | エンコーダ装置 |
JP2000061804A (ja) * | 1998-08-27 | 2000-02-29 | Disco Abrasive Syst Ltd | 切削装置 |
JP2006123117A (ja) * | 2004-10-29 | 2006-05-18 | Asahi Diamond Industrial Co Ltd | 回転砥石、回転軸部材、および回転砥石の装着方法 |
WO2008084636A1 (ja) * | 2007-01-09 | 2008-07-17 | Makita Corporation | 回転刃具の固定装置 |
JP5824367B2 (ja) * | 2012-01-17 | 2015-11-25 | 株式会社ディスコ | 切削装置 |
US20130217310A1 (en) * | 2012-02-21 | 2013-08-22 | Chih-hao Chen | Wafer Processing Equipment |
CN203239769U (zh) * | 2013-05-09 | 2013-10-16 | 郑州市鼎力干燥设备有限公司 | 一种轴承防尘密封装置 |
JP6069122B2 (ja) * | 2013-07-22 | 2017-02-01 | 株式会社ディスコ | 切削装置 |
JP6403595B2 (ja) * | 2015-02-06 | 2018-10-10 | 株式会社ディスコ | 位置調整治具及び位置調整方法 |
-
2017
- 2017-03-06 JP JP2017041317A patent/JP6855117B2/ja active Active
-
2018
- 2018-02-06 TW TW107104142A patent/TWI742239B/zh active
- 2018-02-20 KR KR1020180019941A patent/KR102330574B1/ko active IP Right Grant
- 2018-03-02 CN CN201810173668.4A patent/CN108527700B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
TWI742239B (zh) | 2021-10-11 |
KR20180102002A (ko) | 2018-09-14 |
JP2018144168A (ja) | 2018-09-20 |
CN108527700B (zh) | 2021-06-25 |
KR102330574B1 (ko) | 2021-11-25 |
CN108527700A (zh) | 2018-09-14 |
TW201843011A (zh) | 2018-12-16 |
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