JP5717571B2 - 切削装置 - Google Patents
切削装置 Download PDFInfo
- Publication number
- JP5717571B2 JP5717571B2 JP2011162126A JP2011162126A JP5717571B2 JP 5717571 B2 JP5717571 B2 JP 5717571B2 JP 2011162126 A JP2011162126 A JP 2011162126A JP 2011162126 A JP2011162126 A JP 2011162126A JP 5717571 B2 JP5717571 B2 JP 5717571B2
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- dress
- cutting blade
- blade
- dressboard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000000630 rising effect Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 28
- 239000006061 abrasive grain Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000007723 transport mechanism Effects 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Images
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Dicing (AREA)
Description
18 チャックテーブル
24 切削ユニット
28 切削ブレード
80 ドレステーブル
82 第1ドレステーブル
84 第2ドレステーブル
82a,84a 吸着面
83,85 吸引溝
86,88 ドレスボード突き当て壁
Claims (1)
- 被加工物を保持するチャックテーブルと、高速回転する切削ブレードで該チャックテーブルに保持された被加工物を切削加工する切削手段と、該切削ブレードをドレッシングするドレスボードを着脱自在に保持するドレステーブルとを備えた切削装置であって、
該ドレステーブルは、同一方向に階段状に配設された高さの異なる複数の吸着面を有し、隣接する吸着面と吸着面の間には隣接する該吸着面の段差からなる第1ドレスボード突き当て壁が形成され、最上段の吸着面の端部には該吸着面から立ち上がった第2ドレスボード突き当て壁が形成されていることを特徴とする切削装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011162126A JP5717571B2 (ja) | 2011-07-25 | 2011-07-25 | 切削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011162126A JP5717571B2 (ja) | 2011-07-25 | 2011-07-25 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013022713A JP2013022713A (ja) | 2013-02-04 |
JP5717571B2 true JP5717571B2 (ja) | 2015-05-13 |
Family
ID=47781630
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011162126A Active JP5717571B2 (ja) | 2011-07-25 | 2011-07-25 | 切削装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5717571B2 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014160432A (ja) * | 2013-02-20 | 2014-09-04 | Disco Abrasive Syst Ltd | 加工装置 |
JP6075775B2 (ja) * | 2013-05-31 | 2017-02-08 | 株式会社ディスコ | 切削装置 |
JP2016078215A (ja) * | 2014-10-22 | 2016-05-16 | 株式会社ディスコ | サブチャックテーブル |
US9385268B2 (en) | 2014-11-10 | 2016-07-05 | Fuji Xerox Co., Ltd. | Method of manufacturing semiconductor chips |
JP5773049B1 (ja) * | 2014-11-10 | 2015-09-02 | 富士ゼロックス株式会社 | 半導体片の製造方法 |
TWI585836B (zh) * | 2014-11-10 | 2017-06-01 | 富士全錄股份有限公司 | 製造半導體晶片之方法 |
JP6486770B2 (ja) | 2015-05-20 | 2019-03-20 | 株式会社ディスコ | 切削装置 |
JP7458868B2 (ja) | 2020-04-08 | 2024-04-01 | 株式会社ディスコ | ドレッサーボードの保持治具及び保持治具の使用方法 |
JP7121846B1 (ja) * | 2021-10-12 | 2022-08-18 | Towa株式会社 | 切断装置、及び切断品の製造方法 |
-
2011
- 2011-07-25 JP JP2011162126A patent/JP5717571B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2013022713A (ja) | 2013-02-04 |
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