JP6486752B2 - 乾式研磨装置 - Google Patents
乾式研磨装置 Download PDFInfo
- Publication number
- JP6486752B2 JP6486752B2 JP2015078838A JP2015078838A JP6486752B2 JP 6486752 B2 JP6486752 B2 JP 6486752B2 JP 2015078838 A JP2015078838 A JP 2015078838A JP 2015078838 A JP2015078838 A JP 2015078838A JP 6486752 B2 JP6486752 B2 JP 6486752B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- wafer
- hole
- air
- polishing pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000005498 polishing Methods 0.000 title claims description 216
- 238000012545 processing Methods 0.000 claims description 12
- 238000007517 polishing process Methods 0.000 claims description 7
- 238000000227 grinding Methods 0.000 description 12
- 238000005259 measurement Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 8
- 239000000843 powder Substances 0.000 description 7
- 239000000428 dust Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000006261 foam material Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Description
21 保持テーブル
31 研磨加工送り手段
40 回転軸
41 研磨手段
43 スピンドルユニット
46 研磨パッド
47 空孔
48 貫通孔
60、61 測定器
62 カバー部材
63 閉塞空間
64 エア供給手段
65 エア供給源
W ウエーハ
Claims (2)
- ウエーハを保持する保持テーブルと、該保持テーブルに保持されるウエーハを研磨する研磨パッドの中心と回転軸の中心とを一致させて装着するスピンドルユニットを有する研磨手段と、該研磨手段と該保持テーブルとを相対的に接近および離間させる方向に研磨送りする研磨加工送り手段と、を備える乾式研磨装置であって、
該研磨手段は、該研磨パッドの中心を中心とした円柱状の空孔と、該スピンドルユニットの該回転軸の中を延在方向に貫通させ一方の端を該空孔と連通させる貫通孔と、該貫通孔の他方の端と連通する閉塞空間を形成するカバー部材と、を備え、該閉塞空間内に研磨中のウエーハの状態を測定する測定器を配設させ、該研磨パッドの研磨面をウエーハの上面に接近させる方向に研磨送りする時に該研磨パッドとウエーハとの間で圧縮されたエアが該空孔及び該貫通孔内に進入する量を抑え、該空孔及び該貫通孔に対するエアの流れを抑え、該閉塞空間に配設される該測定器に加工屑が付着すること防止する乾式研磨装置。 - 該閉塞空間とエアを供給するエア供給源とを連通するエア供給手段を備え、少なくとも該研磨パッドの研磨面をウエーハの上面に接近させる研磨送り動作時に該エア供給手段によってエアを供給して該閉塞空間を陽圧にし、
該空孔及び該貫通孔に対するエアの流れを遮断する請求項1記載の乾式研磨装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015078838A JP6486752B2 (ja) | 2015-04-08 | 2015-04-08 | 乾式研磨装置 |
TW105105706A TWI681844B (zh) | 2015-04-08 | 2016-02-25 | 乾式硏磨裝置 |
KR1020160034618A KR102315293B1 (ko) | 2015-04-08 | 2016-03-23 | 건식 연마 장치 |
CN201610196336.9A CN106041716B (zh) | 2015-04-08 | 2016-03-31 | 干式磨削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015078838A JP6486752B2 (ja) | 2015-04-08 | 2015-04-08 | 乾式研磨装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016198830A JP2016198830A (ja) | 2016-12-01 |
JP6486752B2 true JP6486752B2 (ja) | 2019-03-20 |
Family
ID=57244497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015078838A Active JP6486752B2 (ja) | 2015-04-08 | 2015-04-08 | 乾式研磨装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6486752B2 (ja) |
KR (1) | KR102315293B1 (ja) |
CN (1) | CN106041716B (ja) |
TW (1) | TWI681844B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190085889A (ko) | 2019-06-28 | 2019-07-19 | 신원제 | 태양광 패널 청소기 |
CN112621553A (zh) * | 2020-12-15 | 2021-04-09 | 深圳市燃气集团股份有限公司 | 一种维修万向节的工具 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002187061A (ja) * | 2000-12-22 | 2002-07-02 | Matsushita Electric Ind Co Ltd | 研磨温度測定方法、研磨方法、ワーク保持機構および研磨装置 |
JP2006216895A (ja) * | 2005-02-07 | 2006-08-17 | Disco Abrasive Syst Ltd | 半導体ウエーハの研磨装置 |
JP4754870B2 (ja) | 2005-05-10 | 2011-08-24 | 株式会社ディスコ | 研磨装置 |
JP5464820B2 (ja) * | 2007-10-29 | 2014-04-09 | 株式会社荏原製作所 | 研磨装置 |
JP2013141738A (ja) * | 2012-01-12 | 2013-07-22 | Disco Corp | 加工装置 |
JP5890767B2 (ja) * | 2012-11-19 | 2016-03-22 | 株式会社東京精密 | 半導体ウエハの厚み測定方法及び半導体ウエハ加工装置 |
-
2015
- 2015-04-08 JP JP2015078838A patent/JP6486752B2/ja active Active
-
2016
- 2016-02-25 TW TW105105706A patent/TWI681844B/zh active
- 2016-03-23 KR KR1020160034618A patent/KR102315293B1/ko active IP Right Grant
- 2016-03-31 CN CN201610196336.9A patent/CN106041716B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP2016198830A (ja) | 2016-12-01 |
KR102315293B1 (ko) | 2021-10-19 |
CN106041716A (zh) | 2016-10-26 |
KR20160120656A (ko) | 2016-10-18 |
TW201641214A (zh) | 2016-12-01 |
TWI681844B (zh) | 2020-01-11 |
CN106041716B (zh) | 2019-06-14 |
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