JP7033485B2 - 切削ブレードの整形方法 - Google Patents
切削ブレードの整形方法 Download PDFInfo
- Publication number
- JP7033485B2 JP7033485B2 JP2018079167A JP2018079167A JP7033485B2 JP 7033485 B2 JP7033485 B2 JP 7033485B2 JP 2018079167 A JP2018079167 A JP 2018079167A JP 2018079167 A JP2018079167 A JP 2018079167A JP 7033485 B2 JP7033485 B2 JP 7033485B2
- Authority
- JP
- Japan
- Prior art keywords
- cutting blade
- modified layer
- shape
- shaping
- dress member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D63/00—Dressing the tools of sawing machines or sawing devices for use in cutting any kind of material, e.g. in the manufacture of sawing tools
- B23D63/18—Straightening damaged saw blades; Reconditioning the side surface of saw blades, e.g. by grinding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D63/00—Dressing the tools of sawing machines or sawing devices for use in cutting any kind of material, e.g. in the manufacture of sawing tools
- B23D63/08—Sharpening the cutting edges of saw teeth
- B23D63/12—Sharpening the cutting edges of saw teeth by grinding
- B23D63/14—Sharpening circular saw blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D63/00—Dressing the tools of sawing machines or sawing devices for use in cutting any kind of material, e.g. in the manufacture of sawing tools
- B23D63/20—Combined processes for dressing saw teeth, e.g. both hardening and setting
- B23D63/201—Combined setting and grinding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
- B24B3/46—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/04—Devices or means for dressing or conditioning abrasive surfaces of cylindrical or conical surfaces on abrasive tools or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
- B24B53/07—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels by means of forming tools having a shape complementary to that to be produced, e.g. blocks, profile rolls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
Description
B ドレス用部材
R 改質層
Claims (1)
- 切削ブレードの整形方法であって、
ドレス用部材に対して透過性を有する波長のレーザービームの集光点を該ドレス用部材の内部に位置づけて一方の面から複数回レーザービームを照射して、該ドレス用部材の内部に複数の改質層を形成する改質層形成ステップと、
該改質層形成ステップを実施後、該切削ブレードで該改質層に至るまで該ドレス用部材を切削して、該複数の改質層により形作られた所定の形状に該切削ブレードの形状を整形するブレード整形ステップと、
を備える切削ブレードの整形方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018079167A JP7033485B2 (ja) | 2018-04-17 | 2018-04-17 | 切削ブレードの整形方法 |
KR1020190036684A KR102660540B1 (ko) | 2018-04-17 | 2019-03-29 | 절삭 블레이드의 정형 방법 |
CN201910293273.2A CN110385607B (zh) | 2018-04-17 | 2019-04-12 | 切削刀具的整形方法 |
DE102019205492.7A DE102019205492B4 (de) | 2018-04-17 | 2019-04-16 | Formungsverfahren für schneidklinge |
TW108113189A TWI791816B (zh) | 2018-04-17 | 2019-04-16 | 切削刀的整形方法 |
US16/386,800 US11370084B2 (en) | 2018-04-17 | 2019-04-17 | Cutting blade shaping method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018079167A JP7033485B2 (ja) | 2018-04-17 | 2018-04-17 | 切削ブレードの整形方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019181656A JP2019181656A (ja) | 2019-10-24 |
JP7033485B2 true JP7033485B2 (ja) | 2022-03-10 |
Family
ID=68053040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018079167A Active JP7033485B2 (ja) | 2018-04-17 | 2018-04-17 | 切削ブレードの整形方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11370084B2 (ja) |
JP (1) | JP7033485B2 (ja) |
CN (1) | CN110385607B (ja) |
DE (1) | DE102019205492B4 (ja) |
TW (1) | TWI791816B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101943339B1 (ko) * | 2013-08-28 | 2019-01-29 | 후지필름 가부시키가이샤 | 착색 감광성 수지 조성물, 경화막, 컬러 필터, 컬러 필터의 제조 방법, 고체 촬상 소자, 및 화상 표시 장치 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11565371B2 (en) * | 2018-12-31 | 2023-01-31 | Micron Technology, Inc. | Systems and methods for forming semiconductor cutting/trimming blades |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2009018368A (ja) | 2007-07-11 | 2009-01-29 | Disco Abrasive Syst Ltd | 加工装置 |
US20150174731A1 (en) | 2013-12-20 | 2015-06-25 | United Technologies Corporation | Systems and methods for dressing grinding wheels |
JP2015199173A (ja) | 2014-04-09 | 2015-11-12 | 株式会社ディスコ | 研削装置 |
JP2017224826A (ja) | 2017-06-27 | 2017-12-21 | 株式会社東京精密 | 抗折強度の高い薄型チップの形成方法及び形成システム |
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JP5950502B2 (ja) * | 2011-03-23 | 2016-07-13 | 株式会社ディスコ | ウエーハの分割方法 |
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JP6732381B2 (ja) * | 2016-10-03 | 2020-07-29 | 株式会社ディスコ | 切削装置 |
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2018
- 2018-04-17 JP JP2018079167A patent/JP7033485B2/ja active Active
-
2019
- 2019-04-12 CN CN201910293273.2A patent/CN110385607B/zh active Active
- 2019-04-16 DE DE102019205492.7A patent/DE102019205492B4/de active Active
- 2019-04-16 TW TW108113189A patent/TWI791816B/zh active
- 2019-04-17 US US16/386,800 patent/US11370084B2/en active Active
Patent Citations (4)
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JP2009018368A (ja) | 2007-07-11 | 2009-01-29 | Disco Abrasive Syst Ltd | 加工装置 |
US20150174731A1 (en) | 2013-12-20 | 2015-06-25 | United Technologies Corporation | Systems and methods for dressing grinding wheels |
JP2015199173A (ja) | 2014-04-09 | 2015-11-12 | 株式会社ディスコ | 研削装置 |
JP2017224826A (ja) | 2017-06-27 | 2017-12-21 | 株式会社東京精密 | 抗折強度の高い薄型チップの形成方法及び形成システム |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101943339B1 (ko) * | 2013-08-28 | 2019-01-29 | 후지필름 가부시키가이샤 | 착색 감광성 수지 조성물, 경화막, 컬러 필터, 컬러 필터의 제조 방법, 고체 촬상 소자, 및 화상 표시 장치 |
Also Published As
Publication number | Publication date |
---|---|
DE102019205492A1 (de) | 2019-10-17 |
DE102019205492B4 (de) | 2024-01-11 |
US11370084B2 (en) | 2022-06-28 |
CN110385607A (zh) | 2019-10-29 |
US20190314953A1 (en) | 2019-10-17 |
TW201943498A (zh) | 2019-11-16 |
KR20190121241A (ko) | 2019-10-25 |
TWI791816B (zh) | 2023-02-11 |
CN110385607B (zh) | 2023-02-17 |
JP2019181656A (ja) | 2019-10-24 |
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