TW201943498A - 切削刀的整形方法 - Google Patents
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Abstract
[課題]若切削刀的前端形狀成為複數種時,可減輕預先準備修整用構件的負擔。
[解決手段]將對修整用構件(B)具透過性的波長的雷射束的聚光點定位在修整用構件的內部,從其中一面照射複數次雷射束。藉由照射該雷射束,在修整用構件的內部改變高度而形成複數改質層(R)。之後,以切削刀(10)切削修整用構件至改質層,將切削刀的形狀整形為藉由複數改質層所形成的預定形狀。
[解決手段]將對修整用構件(B)具透過性的波長的雷射束的聚光點定位在修整用構件的內部,從其中一面照射複數次雷射束。藉由照射該雷射束,在修整用構件的內部改變高度而形成複數改質層(R)。之後,以切削刀(10)切削修整用構件至改質層,將切削刀的形狀整形為藉由複數改質層所形成的預定形狀。
Description
本發明係關於藉由高速旋轉來切削被加工物的切削刀的整形方法。
例如,當切削Quad Flat Non-Leaded Package (QFN封裝體)等半導體封裝體時,切削刀係以前端形狀為平坦形狀為佳,定期在平坦修整用的修整器板進行切削刀前端的整形(參照例如專利文獻1)。此外,另一方面,為了抑制表面膜剝離,在以前端為V形狀的切削刀來去除表面膜的加工的情形下,亦由於切削刀的前端形狀經時性變形,因此必須定期進行整形作業。
[先前技術文獻]
[專利文獻]
[先前技術文獻]
[專利文獻]
[專利文獻1]日本特開2010-588號公報
(發明所欲解決之課題)
但是,習知之切削刀的整形中,必須預先準備用以整形為平坦的前端形狀的修整器板、及用以整形為V形的前端形狀的修整器板之雙方。如上所示,以往若所整形的前端形狀的變化成為多數時,會有據此而準備修整器板的負擔增大的問題。
因此,本發明之目的在提供一種若切削刀的前端形狀成為複數種時,可減輕預先準備修整用構件的負擔的切削刀的整形方法。
(解決課題之手段)
(解決課題之手段)
藉由本發明,提供一種切削刀的整形方法,其係具備:改質層形成步驟,其係將對修整用構件具透過性的波長的雷射束的聚光點定位在修整用構件的內部,從其中一面對該修整用構件照射複數次雷射束,在修整用構件的內部改變高度而形成複數改質層;及刀整形步驟,其係在實施改質層形成步驟之後,以切削刀切削修整用構件至改質層,將該切削刀的形狀整形為藉由複數改質層所形成的預定形狀。
藉由該方法,可對修整用構件,按照切削刀的所希望的前端形狀形成改質層,且藉由該改質層,將切削刀的形狀進行整形。藉此,若切削刀的前端形狀成為複數種時,無須按每個各個形狀預先準備修整用構件,可減輕準備修整用構件的負擔,且可對複數種切削刀輕易進行整形。
(發明之效果)
(發明之效果)
藉由本發明,若切削刀的前端形狀成為複數種時,可減輕預先準備修整用構件的負擔。
以下參照所附圖示,參照圖1~圖4B,說明實施形態之切削刀的整形方法。本實施形態之切削刀的整形方法係以在修整用構件的內部形成改質層的改質層形成步驟、使用修整用構件來對切削刀的形狀進行整形的刀整形步驟的順序實施。以下說明的各步驟僅為一例,並非為限定於該構成者。
圖1係實施形態之改質層形成步驟所使用的雷射加工裝置的斜視圖。首先,藉由圖1所示之雷射加工裝置100,實施改質層形成步驟。其中,本實施形態之雷射加工裝置並非限定於圖1所示之構成。雷射加工裝置若可對修整用構件形成改質層,亦可為任何構成。
雷射加工裝置100係構成為使照射雷射束的雷射加工單元102與保持修整用構件B的吸盤平台(保持手段)103相對移動,來對修整用構件(修整器板)B進行加工。其中,修整用構件B並非為特別限定者,例如藉由玻璃板或成為擋片(dummy)的矽晶圓等所構成。
雷射加工裝置100係具有長方體狀的基台101。在基台101的上面係設有將吸盤平台103以X軸方向進行加工進給且以Y軸方向進行分級進給的吸盤平台移動機構104。在吸盤平台移動機構104的後方係立設有立壁部111。從立壁部111的前面突出臂部112,在臂部112係以與吸盤平台103相對向的方式支持有雷射加工單元102。
吸盤平台移動機構104係具有:被配置在基台101的上面之與Y軸方向呈平行的一對導軌115;及可在一對導軌115滑動而設置的馬達驅動的Y軸平台116。此外,吸盤平台移動機構104係具有:被配置在Y軸平台116上面之與X軸方向呈平行的一對導軌117;及可在一對導軌117滑動而設置的馬達驅動的X軸平台118。
在X軸平台118的上部設有吸盤平台103。其中,在Y軸平台116、X軸平台118的背面側係分別形成有未圖示的螺帽部,在該等螺帽部螺合滾珠螺桿121、122。接著,被連結在滾珠螺桿121、122的一端部的驅動馬達123、124被旋轉驅動,藉此吸盤平台103沿著導軌115、117而以X軸方向及Y軸方向移動。
吸盤平台103係形成為圓板狀,透過θ平台125,可旋轉地設在X軸平台118的上面。在吸盤平台103的上面,係藉由多孔陶瓷材形成有吸附面。在吸盤平台103的周圍設有4個夾具部126。4個夾具部126藉由空氣致動器(未圖示)被驅動,藉此由四方夾持固定修整用構件B的周圍的環狀框架F。
雷射加工單元102係具有設在臂部112的前端的加工頭127。在臂部112及加工頭127內係設有雷射加工單元102的光學系。加工頭127係將由未圖示的雷射振盪器被出射的雷射束,藉由聚光透鏡進行聚光,對被保持在吸盤平台103上的修整用構件B進行雷射加工。此時,雷射束係對修整用構件B具透過性的波長,以在光學系中將聚光點定位在修整用構件B的內部來進行聚光的方式予以調整。
藉由照射該雷射束,在修整用構件B的內部形成改質層R(參照圖2)。改質層R係指藉由照射雷射束,形成為修整用構件B的內部的密度、折射率、機械強度或其他物理特性與周圍不同的狀態,強度比周圍更為降低的區域。改質層R係例如熔融處理區域、裂痕區域、絕緣破壞區域、折射率變化區域,亦可為該等混合存在的區域。
在本實施形態之改質層形成步驟中,被支持在環狀框架F及黏著帶T的修整用構件B被搬送至雷射加工裝置100。透過黏著帶T,修整用構件B被保持在雷射加工裝置100的吸盤平台103上,修整用構件B的周圍的環狀框架F以夾具部126予以保持。
相對被保持在吸盤平台103上的狀態的修整用構件B,雷射加工單元102的加工頭127的出射口被定位在形成改質層R(參照圖2)的預定位置的正上方。之後,由加工頭127朝向修整用構件B的上面(其中一面)照射雷射束。
接著,一邊雷射束的聚光點的高度位置被維持為一定,一邊加工頭127相對吸盤平台103以X軸方向相對移動,藉此在修整用構件B的內部與X軸方向呈平行地形成改質層R。此時的雷射束的重複頻率、輸出、加工進給速度係依修整用構件B的材質等條件來作設定。
如圖2中放大顯示,在改質層R中,係在修整用構件B的內部,按根據雷射束的波長的每個脈衝間距,形成複數雷射光點。換言之,藉由連續照射雷射束,沿著X軸方向,在複數雷射光點相鄰接的狀態下形成改質層R。在圖式中,係將雷射光點的形狀形成為橢圓狀,但是並非為侷限於此者,可形成為圓形、方形、角圓四角形狀、長孔狀等作各種變更。
在預定位置形成以X軸方向延伸的改質層R之後,停止照射雷射束,吸盤平台103與加工頭127以Y軸方向作相對移動(分級進給)。此時的分級進給量係按照雷射光點的大小或Y軸方向的間隔來決定。接著,沿著以Y軸方向相鄰接之先形成的改質層R,同樣地形成複數雷射光點,新形成以X軸方向延伸的改質層R。此時,雷射束的聚光點的高度位置亦被維持為一定。反覆如上所示之動作而照射複數次雷射束,在上面視下在修整用構件B的全部區域或部分範圍中的厚度內的一定的高度位置,形成改質層R。
該改質層R的形成係變更雷射束的聚光點的位置而進行複數次。具體而言,在與在修整用構件B的厚度內已形成的改質層R為不同的高度位置形成新的改質層R,在修整用構件B的內部形成複數層(圖2中為2層)的改質層R。圖2的2層改質層R係形成為以修整用構件B的厚度方向相鄰接,但是非為妨礙該等分離形成者。
如上所述實施改質層形成步驟之後,實施刀整形步驟。如圖2所示,切削刀10係設在可旋轉的心軸桿11的前端。切削刀10係例如以樹脂結合使鑽石砥粒堅固而成形為圓板狀。修整用構件B係被保持在藉由移動機構(未圖示)而以X軸及Y軸方向移動的保持平台12。接著,切削刀10被定位在成為修整用構件B的正上方的預定位置。之後,如圖3A及圖3B所示,切削刀10下降,修整用構件B從修整用構件B的上方被切削至高速旋轉的切削刀10的下端至改質層R為止。如此一來,如圖3C所示,實施切削刀10的前端面10a被逐漸切削,前端面10a接近平坦,切削刀10的角部被整形為直角的平坦修整。
在此,在圖3A~圖3C所示之修整用構件B中,複數層的改質層R的各個形成在同一高度位置,最上位的改質層R的上面亦水平且平坦地形成。換言之,在改質層形成步驟中,複數改質層R被形成為供平坦修整之用,在之後的刀整形步驟中實施將切削刀10的前端面10a形成為平坦的整形者。因此,藉由以其他配置或形狀形成複數改質層R,可將切削刀10的前端面10a整形為其他所形成的形狀。例如,如圖4A及圖4B所示,採用在修整用構件B形成複數改質層R的變化。
在圖4A及圖4B中,複數改質層R各個形成為呈V字。具體而言,當一邊加工頭127相對吸盤平台103以X軸方向相對移動一邊照射雷射束時,該聚光點的高度位置按每個鄰接的雷射光點逐漸變低後,被設定為逐漸變高。接著,該改質層R以在高度方向重疊的方式遍及4層而形成在修整用構件B的內部。
對如上所示所形成的修整用構件B,與上述同樣地實施刀整形步驟,藉此如圖4B所示,按照改質層R的形狀,切削刀10的前端面10a被切削,前端面10a尖成V字狀而被整形。
如以上所示,藉由本實施形態,可按照整形後的切削刀10的前端面10a的形狀,簡單製作變更修整用構件B的改質層R的形態者。因此,即使切削刀10的前端面10a的形狀有複數變化,亦可消除預先準備形狀依每個各自形狀而異的修整用構件的必要性。藉此,當實施藉由切削刀10所為的切削加工時,可減輕準備形狀不同的修整用構件B的負擔,可提升作業效率。
此外,由於以修整用構件B的厚度方向在中間形成改質層R,因此不僅平坦的形狀,亦可輕易形成各種形狀的改質層R,此外,整形前可使改質層R不露出來加以保護。
但是,本發明人發現若藉由如上所述的切削刀10來對板狀的被加工物進行切削加工時,若在內部有如上所述之形成有改質層R的部分,因改質層R的切削,切削刀10的摩耗量會變多。著重在該摩耗量在經驗上變多的情形,構成為可將改質層R利用在切削刀10的整形(dressing),此外如上所述在修整用構件B形成改質層R而達成對多形狀的切削刀10的對應迅速化、容易化。
其中,在上述實施形態中,係在修整用構件B以平坦或V字狀形成有改質層R,但是並非為侷限於此者,可按照切削刀10的形狀作各種變更。例如,亦可以形成在切削刀10之雙面之中的至少一方形成段差的形狀的方式在修整用構件B形成改質層R。
此外,本發明之實施形態並非為限定於上述實施形態者,亦可在未脫離本發明之技術思想的主旨的範圍內作各種變更、置換、變形。此外,若藉由技術的進步或衍生的其他技術,可以其他作法來實現本發明之技術思想,亦可使用該方法來實施。因此,申請專利範圍係涵蓋本發明之技術思想範圍內所包含的全部實施形態。
如以上說明所示,本發明係有用於切削刀的前端形狀為複數種,且將各自的切削刀進行整形的情形。
10‧‧‧切削刀
10a‧‧‧前端面
11‧‧‧心軸桿
12‧‧‧保持平台
100‧‧‧雷射加工裝置
101‧‧‧基台
102‧‧‧雷射加工單元
103‧‧‧吸盤平台
104‧‧‧吸盤平台移動機構
111‧‧‧立壁部
112‧‧‧臂部
115‧‧‧導軌
116‧‧‧Y軸平台
117‧‧‧導軌
118‧‧‧X軸平台
121、122‧‧‧滾珠螺桿
123、124‧‧‧驅動馬達
125‧‧‧θ平台
126‧‧‧夾具部
127‧‧‧加工頭
B‧‧‧修整用構件
F‧‧‧環狀框架
R‧‧‧改質層
圖1係實施形態之改質層形成步驟所使用的雷射加工裝置的斜視圖。
圖2係形成改質層的修整用構件及切削刀的局部剖面側面圖。
圖3A~圖3C係顯示實施形態之刀整形步驟之一例的剖面圖。
圖4A及圖4B係顯示實施形態之刀整形步驟之其他一例的剖面圖。
Claims (1)
- 一種切削刀的整形方法,其係具備: 改質層形成步驟,其係將對修整用構件具透過性的波長的雷射束的聚光點定位在該修整用構件的內部,從其中一面對該修整用構件照射複數次雷射束,在該修整用構件的內部改變高度而形成複數改質層;及 刀整形步驟,其係在實施該改質層形成步驟之後,以該切削刀切削該修整用構件至該改質層,將該切削刀的形狀整形為藉由該複數改質層所形成的預定形狀。
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