SG54260A1 - Resin sealing type semiconductor device and method of making the same - Google Patents
Resin sealing type semiconductor device and method of making the sameInfo
- Publication number
- SG54260A1 SG54260A1 SG1996006521A SG1996006521A SG54260A1 SG 54260 A1 SG54260 A1 SG 54260A1 SG 1996006521 A SG1996006521 A SG 1996006521A SG 1996006521 A SG1996006521 A SG 1996006521A SG 54260 A1 SG54260 A1 SG 54260A1
- Authority
- SG
- Singapore
- Prior art keywords
- making
- semiconductor device
- same
- type semiconductor
- resin sealing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000011347 resin Substances 0.000 title 1
- 229920005989 resin Polymers 0.000 title 1
- 238000007789 sealing Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45139—Silver (Ag) as principal constituent
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48253—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a potential ring of the item
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/01046—Palladium [Pd]
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- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H01L2924/14—Integrated circuits
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8651695 | 1995-03-17 | ||
JP34532895A JP3309686B2 (ja) | 1995-03-17 | 1995-12-07 | 樹脂封止型半導体装置及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG54260A1 true SG54260A1 (en) | 1998-11-16 |
Family
ID=26427621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1996006521A SG54260A1 (en) | 1995-03-17 | 1996-03-15 | Resin sealing type semiconductor device and method of making the same |
Country Status (9)
Country | Link |
---|---|
US (1) | US5777380A (fr) |
EP (1) | EP0732744B1 (fr) |
JP (1) | JP3309686B2 (fr) |
KR (1) | KR100359399B1 (fr) |
CN (2) | CN1288748C (fr) |
DE (1) | DE69628964T2 (fr) |
HK (1) | HK1013734A1 (fr) |
SG (1) | SG54260A1 (fr) |
TW (1) | TW309649B (fr) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2915892B2 (ja) * | 1997-06-27 | 1999-07-05 | 松下電子工業株式会社 | 樹脂封止型半導体装置およびその製造方法 |
US6861735B2 (en) * | 1997-06-27 | 2005-03-01 | Matsushita Electric Industrial Co., Ltd. | Resin molded type semiconductor device and a method of manufacturing the same |
US5981987A (en) | 1997-12-02 | 1999-11-09 | Nurlogic Design, Inc. | Power ground metallization routing in a semiconductor device |
US6570247B1 (en) * | 1997-12-30 | 2003-05-27 | Intel Corporation | Integrated circuit device having an embedded heat slug |
US6278175B1 (en) * | 2000-01-21 | 2001-08-21 | Micron Technology, Inc. | Leadframe alteration to direct compound flow into package |
JP2001320007A (ja) * | 2000-05-09 | 2001-11-16 | Dainippon Printing Co Ltd | 樹脂封止型半導体装置用フレーム |
JP3664045B2 (ja) * | 2000-06-01 | 2005-06-22 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
JP2002043496A (ja) * | 2000-07-21 | 2002-02-08 | Hitachi Ltd | 半導体装置 |
TW508774B (en) * | 2000-09-15 | 2002-11-01 | Samsung Techwin Co Ltd | Lead frame, semiconductor package having the same, method of manufacturing semiconductor package, molding plates and molding machine for manufacturing semiconductor package |
JP3849978B2 (ja) * | 2002-06-10 | 2006-11-22 | 日東電工株式会社 | 半導体装置の製造方法及びこれに用いる耐熱性粘着テープ |
JP2006066008A (ja) * | 2004-08-30 | 2006-03-09 | Hitachi Global Storage Technologies Netherlands Bv | 磁気ディスクおよび磁気ディスクの製造方法 |
US9041202B2 (en) | 2008-05-16 | 2015-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method of the same |
KR20100104590A (ko) * | 2009-03-18 | 2010-09-29 | 삼성전자주식회사 | 리드 프레임 및 이를 갖는 반도체 패키지 |
CN104025292B (zh) | 2011-12-22 | 2018-03-09 | 松下知识产权经营株式会社 | 半导体封装、其制造方法及模具、半导体封装的输入输出端子 |
WO2014020470A1 (fr) * | 2012-07-30 | 2014-02-06 | Koninklijke Philips N.V. | Encapsulation de del renforcée et procédé correspondant |
CN104992934B (zh) * | 2015-05-29 | 2018-01-09 | 株洲南车时代电气股份有限公司 | 功率半导体器件子模组 |
JP2017199803A (ja) * | 2016-04-27 | 2017-11-02 | 日立マクセル株式会社 | 三次元成形回路部品 |
JP6745442B2 (ja) * | 2016-10-28 | 2020-08-26 | パナソニックIpマネジメント株式会社 | 配線一体型樹脂パイプの製造方法 |
US10431526B2 (en) * | 2017-10-09 | 2019-10-01 | Cree, Inc. | Rivetless lead fastening for a semiconductor package |
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JPS52124865A (en) * | 1976-04-13 | 1977-10-20 | Sharp Corp | Semiconductor device |
JPS54124678A (en) * | 1978-03-20 | 1979-09-27 | Nec Corp | Lead frame |
JPS56122134A (en) * | 1980-02-29 | 1981-09-25 | Toshiba Corp | Resin-sealed type semiconductor device |
JPS5812341A (ja) * | 1981-07-16 | 1983-01-24 | Toshiba Corp | 半導体装置 |
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JPH02307251A (ja) * | 1989-05-22 | 1990-12-20 | Nec Corp | 樹脂封止型半導体装置 |
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-
1995
- 1995-12-07 JP JP34532895A patent/JP3309686B2/ja not_active Expired - Fee Related
- 1995-12-27 TW TW084113958A patent/TW309649B/zh not_active IP Right Cessation
-
1996
- 1996-02-16 KR KR1019960004260A patent/KR100359399B1/ko not_active IP Right Cessation
- 1996-03-14 US US08/615,869 patent/US5777380A/en not_active Expired - Lifetime
- 1996-03-15 EP EP96104158A patent/EP0732744B1/fr not_active Expired - Lifetime
- 1996-03-15 CN CNB2003101245898A patent/CN1288748C/zh not_active Expired - Fee Related
- 1996-03-15 CN CNB961036176A patent/CN1138303C/zh not_active Expired - Fee Related
- 1996-03-15 DE DE69628964T patent/DE69628964T2/de not_active Expired - Fee Related
- 1996-03-15 SG SG1996006521A patent/SG54260A1/en unknown
-
1998
- 1998-12-23 HK HK98115077A patent/HK1013734A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0732744A2 (fr) | 1996-09-18 |
DE69628964D1 (de) | 2003-08-14 |
CN1140901A (zh) | 1997-01-22 |
HK1013734A1 (en) | 1999-09-03 |
JP3309686B2 (ja) | 2002-07-29 |
US5777380A (en) | 1998-07-07 |
CN1574312A (zh) | 2005-02-02 |
CN1288748C (zh) | 2006-12-06 |
DE69628964T2 (de) | 2004-05-27 |
EP0732744A3 (fr) | 1997-08-27 |
KR960036007A (ko) | 1996-10-28 |
TW309649B (fr) | 1997-07-01 |
CN1138303C (zh) | 2004-02-11 |
JPH08321521A (ja) | 1996-12-03 |
KR100359399B1 (ko) | 2003-01-10 |
EP0732744B1 (fr) | 2003-07-09 |
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