SG130022A1 - Method of forming coating film and apparatus therefor - Google Patents

Method of forming coating film and apparatus therefor

Info

Publication number
SG130022A1
SG130022A1 SG200400577-3A SG200400577A SG130022A1 SG 130022 A1 SG130022 A1 SG 130022A1 SG 200400577 A SG200400577 A SG 200400577A SG 130022 A1 SG130022 A1 SG 130022A1
Authority
SG
Singapore
Prior art keywords
substrate
coating film
coating solution
nozzle
forming coating
Prior art date
Application number
SG200400577-3A
Other languages
English (en)
Inventor
Akihiro Fujimoto
Hiroichi Inada
Hiroyuki Iino
Shinzi Kitamura
Masatoshi Deguchi
Mitsuhiro Nambu
Keizo Hasebe
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG130022A1 publication Critical patent/SG130022A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG200400577-3A 1993-03-25 1994-03-25 Method of forming coating film and apparatus therefor SG130022A1 (en)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP9257993 1993-03-25
JP13259493 1993-05-10
JP18344393 1993-06-30
JP18344293 1993-06-30
JP34372293 1993-12-16
JP34371793 1993-12-16
JP34734893 1993-12-24
JP34881293 1993-12-27
JP35405493 1993-12-28
JP35405293 1993-12-28

Publications (1)

Publication Number Publication Date
SG130022A1 true SG130022A1 (en) 2007-03-20

Family

ID=27580182

Family Applications (2)

Application Number Title Priority Date Filing Date
SG9904149A SG93216A1 (en) 1993-03-25 1994-03-25 Method of forming coating film and apparatus therefor
SG200400577-3A SG130022A1 (en) 1993-03-25 1994-03-25 Method of forming coating film and apparatus therefor

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG9904149A SG93216A1 (en) 1993-03-25 1994-03-25 Method of forming coating film and apparatus therefor

Country Status (6)

Country Link
US (3) US5658615A (fr)
EP (1) EP0618504B1 (fr)
KR (1) KR100284556B1 (fr)
CN (1) CN1059967C (fr)
DE (1) DE69428391T2 (fr)
SG (2) SG93216A1 (fr)

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KR940022743A (ko) 1994-10-21
US5942035A (en) 1999-08-24
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US5658615A (en) 1997-08-19
DE69428391T2 (de) 2002-07-04
SG93216A1 (en) 2002-12-17
EP0618504A3 (fr) 1996-04-10
DE69428391D1 (de) 2001-10-31
CN1102505A (zh) 1995-05-10
US6063190A (en) 2000-05-16
EP0618504B1 (fr) 2001-09-26
EP0618504A2 (fr) 1994-10-05

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