TW371780B - Apparatus for spreading resist on substrate and method for spreading the same - Google Patents

Apparatus for spreading resist on substrate and method for spreading the same

Info

Publication number
TW371780B
TW371780B TW086113523A TW86113523A TW371780B TW 371780 B TW371780 B TW 371780B TW 086113523 A TW086113523 A TW 086113523A TW 86113523 A TW86113523 A TW 86113523A TW 371780 B TW371780 B TW 371780B
Authority
TW
Taiwan
Prior art keywords
resist
wafer
spreading
nozzle
dripped
Prior art date
Application number
TW086113523A
Other languages
Chinese (zh)
Inventor
Shinji Nunotani
Hiroshi Uchida
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of TW371780B publication Critical patent/TW371780B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor

Abstract

The present invention provides an apparatus and method of resist coating capable of maintaining a uniformity of thickness of the resist film and reducing volume of the resist dropped. A resist coater is formed by a wafer mount 18 mounting and rotating a wafer 11, a nozzle 12 dripping resist 16 on the wafer, resist supplying mechanism 14 for the nozzle 12, the second nozzle 26 dripping a solvent 23, major ingredient of the resist, on the wafer, and a mechanism controlling a temperature of resist. As for how to coat, firstly the solvent for the resist is dripped on the surface of the wafer, the wafer is rotated around its axis, and a resist is dripped on the surface of the wafer and the wafer is rotated around its axis again, to clean up the backside of the wafer and wipe off the resist staying on its periphery; to continue rotating the wafer.
TW086113523A 1996-09-18 1997-09-18 Apparatus for spreading resist on substrate and method for spreading the same TW371780B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8246586A JPH1092726A (en) 1996-09-18 1996-09-18 Resist coater and method of resist coating

Publications (1)

Publication Number Publication Date
TW371780B true TW371780B (en) 1999-10-11

Family

ID=17150628

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086113523A TW371780B (en) 1996-09-18 1997-09-18 Apparatus for spreading resist on substrate and method for spreading the same

Country Status (4)

Country Link
US (1) US6001417A (en)
JP (1) JPH1092726A (en)
KR (1) KR100283835B1 (en)
TW (1) TW371780B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3616732B2 (en) * 1999-07-07 2005-02-02 東京エレクトロン株式会社 Substrate processing method and processing apparatus
US6461983B1 (en) * 1999-08-11 2002-10-08 Micron Technology, Inc. Method for pretreating a substrate prior to application of a polymeric coat
JP3667222B2 (en) * 1999-10-19 2005-07-06 東京エレクトロン株式会社 Application processing equipment
US6391800B1 (en) * 1999-11-12 2002-05-21 Motorola, Inc. Method for patterning a substrate with photoresist
JP4771083B2 (en) * 2005-11-29 2011-09-14 信越化学工業株式会社 Resist protective film material and pattern forming method
JP4562040B2 (en) * 2006-02-17 2010-10-13 東京エレクトロン株式会社 Substrate processing method, substrate processing apparatus, control program thereof, and computer-readable storage medium
US20090011612A1 (en) * 2007-07-05 2009-01-08 United Microelectronics Corp. Method of shortening photoresist coating process
JP5263284B2 (en) * 2010-12-28 2013-08-14 東京エレクトロン株式会社 Coating method, coating apparatus and storage medium
EP2573784B1 (en) 2011-09-21 2016-08-03 Siemens Aktiengesellschaft Circuit breaker with optimised housing stabilisation through clamping pieces
NL2014597B1 (en) * 2015-04-08 2017-01-20 Suss Microtec Lithography Gmbh Method and device for applying a coating to a substrate.
WO2021145175A1 (en) * 2020-01-16 2021-07-22 東京エレクトロン株式会社 Substrate processing method, storage medium, and substrate processing apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4510176A (en) * 1983-09-26 1985-04-09 At&T Bell Laboratories Removal of coating from periphery of a semiconductor wafer
JPS6196155A (en) * 1984-10-15 1986-05-14 Mazda Motor Corp Idling speed controller for engine
US4886728A (en) * 1988-01-06 1989-12-12 Olin Hunt Specialty Products Inc. Use of particular mixtures of ethyl lactate and methyl ethyl ketone to remove undesirable peripheral material (e.g. edge beads) from photoresist-coated substrates
TW285779B (en) * 1994-08-08 1996-09-11 Tokyo Electron Co Ltd

Also Published As

Publication number Publication date
US6001417A (en) 1999-12-14
JPH1092726A (en) 1998-04-10
KR19980024660A (en) 1998-07-06
KR100283835B1 (en) 2001-04-02

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees