TW371780B - Apparatus for spreading resist on substrate and method for spreading the same - Google Patents

Apparatus for spreading resist on substrate and method for spreading the same

Info

Publication number
TW371780B
TW371780B TW086113523A TW86113523A TW371780B TW 371780 B TW371780 B TW 371780B TW 086113523 A TW086113523 A TW 086113523A TW 86113523 A TW86113523 A TW 86113523A TW 371780 B TW371780 B TW 371780B
Authority
TW
Taiwan
Prior art keywords
resist
wafer
spreading
nozzle
dripped
Prior art date
Application number
TW086113523A
Other languages
English (en)
Inventor
Shinji Nunotani
Hiroshi Uchida
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of TW371780B publication Critical patent/TW371780B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
TW086113523A 1996-09-18 1997-09-18 Apparatus for spreading resist on substrate and method for spreading the same TW371780B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8246586A JPH1092726A (ja) 1996-09-18 1996-09-18 レジスト塗布装置及びレジスト塗布方法

Publications (1)

Publication Number Publication Date
TW371780B true TW371780B (en) 1999-10-11

Family

ID=17150628

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086113523A TW371780B (en) 1996-09-18 1997-09-18 Apparatus for spreading resist on substrate and method for spreading the same

Country Status (4)

Country Link
US (1) US6001417A (zh)
JP (1) JPH1092726A (zh)
KR (1) KR100283835B1 (zh)
TW (1) TW371780B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3616732B2 (ja) * 1999-07-07 2005-02-02 東京エレクトロン株式会社 基板の処理方法及び処理装置
US6461983B1 (en) 1999-08-11 2002-10-08 Micron Technology, Inc. Method for pretreating a substrate prior to application of a polymeric coat
JP3667222B2 (ja) * 1999-10-19 2005-07-06 東京エレクトロン株式会社 塗布処理装置
US6391800B1 (en) * 1999-11-12 2002-05-21 Motorola, Inc. Method for patterning a substrate with photoresist
JP4771083B2 (ja) * 2005-11-29 2011-09-14 信越化学工業株式会社 レジスト保護膜材料及びパターン形成方法
JP4562040B2 (ja) * 2006-02-17 2010-10-13 東京エレクトロン株式会社 基板処理方法、基板処理装置、その制御プログラム及びコンピュータ読取可能な記憶媒体
US20090011612A1 (en) * 2007-07-05 2009-01-08 United Microelectronics Corp. Method of shortening photoresist coating process
JP5263284B2 (ja) * 2010-12-28 2013-08-14 東京エレクトロン株式会社 塗布方法、塗布装置及び記憶媒体
EP2573784B1 (de) 2011-09-21 2016-08-03 Siemens Aktiengesellschaft Leistungsschalter mit optimierter Gehäusestabilisierung durch klemmend wirkende Festschaltstücke
NL2014597B1 (en) * 2015-04-08 2017-01-20 Suss Microtec Lithography Gmbh Method and device for applying a coating to a substrate.
WO2021145175A1 (ja) * 2020-01-16 2021-07-22 東京エレクトロン株式会社 基板処理方法、記憶媒体、及び基板処理装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4510176A (en) * 1983-09-26 1985-04-09 At&T Bell Laboratories Removal of coating from periphery of a semiconductor wafer
JPS6196155A (ja) * 1984-10-15 1986-05-14 Mazda Motor Corp エンジンのアイドル回転数制御装置
US4886728A (en) * 1988-01-06 1989-12-12 Olin Hunt Specialty Products Inc. Use of particular mixtures of ethyl lactate and methyl ethyl ketone to remove undesirable peripheral material (e.g. edge beads) from photoresist-coated substrates
TW285779B (zh) * 1994-08-08 1996-09-11 Tokyo Electron Co Ltd

Also Published As

Publication number Publication date
KR100283835B1 (ko) 2001-04-02
JPH1092726A (ja) 1998-04-10
KR19980024660A (ko) 1998-07-06
US6001417A (en) 1999-12-14

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees