ES2187441T3 - Procedimiento y dispositivo para el tratamiento de substratos. - Google Patents

Procedimiento y dispositivo para el tratamiento de substratos.

Info

Publication number
ES2187441T3
ES2187441T3 ES00903586T ES00903586T ES2187441T3 ES 2187441 T3 ES2187441 T3 ES 2187441T3 ES 00903586 T ES00903586 T ES 00903586T ES 00903586 T ES00903586 T ES 00903586T ES 2187441 T3 ES2187441 T3 ES 2187441T3
Authority
ES
Spain
Prior art keywords
substrate
substrates
procedure
treatment
substrate holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES00903586T
Other languages
English (en)
Inventor
Peter Dress
Karl Appich
Peter Krauss
Jakob Szekeresch
Robert Weihing
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Steag Hamatech AG
Original Assignee
Steag Hamatech AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Steag Hamatech AG filed Critical Steag Hamatech AG
Application granted granted Critical
Publication of ES2187441T3 publication Critical patent/ES2187441T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Physical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

Dispositivo (1) para el recubrimiento de substratos (13), con un porta-substrato (5), en el que está retenido el substrato de tal forma que una superficie (15) de substrato a recubrir está libre y apunta hacia abajo, y con un dispositivo para la rotación del porta-substrato (5), caracterizado por una cubierta (20) que se puede fijar en el porta-substrato (5), que forma junto con el porta-substrato (5) una cámara (36) cerrada herméticamente, que recibe al substrato (13).
ES00903586T 1999-02-16 2000-01-19 Procedimiento y dispositivo para el tratamiento de substratos. Expired - Lifetime ES2187441T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19906398A DE19906398B4 (de) 1999-02-16 1999-02-16 Verfahren und Vorrichtung zum Behandeln von Substraten

Publications (1)

Publication Number Publication Date
ES2187441T3 true ES2187441T3 (es) 2003-06-16

Family

ID=7897639

Family Applications (1)

Application Number Title Priority Date Filing Date
ES00903586T Expired - Lifetime ES2187441T3 (es) 1999-02-16 2000-01-19 Procedimiento y dispositivo para el tratamiento de substratos.

Country Status (14)

Country Link
US (1) US6858088B1 (es)
EP (1) EP1152839B1 (es)
JP (1) JP3574790B2 (es)
KR (1) KR100446808B1 (es)
CN (1) CN1134310C (es)
AT (1) ATE227611T1 (es)
CA (1) CA2362798C (es)
DE (2) DE19906398B4 (es)
DK (1) DK1152839T3 (es)
ES (1) ES2187441T3 (es)
HK (1) HK1044307B (es)
IL (1) IL144569A0 (es)
TW (1) TW538320B (es)
WO (1) WO2000048744A1 (es)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7217325B2 (en) * 1999-01-22 2007-05-15 Semitool, Inc. System for processing a workpiece
JP4685022B2 (ja) * 2003-10-21 2011-05-18 セミトゥール・インコーポレイテッド ワークピースを処理するためのシステム
KR101337368B1 (ko) * 2010-10-27 2013-12-05 엘지디스플레이 주식회사 코팅장치 및 이를 이용한 코팅막 형성방법
CN108435000B (zh) * 2017-02-16 2023-12-08 上海硅苑膜科技有限公司 一种平板陶瓷膜的自动涂膜装置及平板陶瓷膜的制备方法
CN107326340B (zh) * 2017-08-29 2023-06-13 京东方科技集团股份有限公司 成膜设备
JP7145648B2 (ja) * 2018-05-22 2022-10-03 東京エレクトロン株式会社 基板処理方法及び基板処理装置
CN108816528B (zh) * 2018-08-08 2024-04-30 江苏同泽过滤科技有限公司 一种抽吸卸料离心机
DE102018219469A1 (de) 2018-11-14 2020-05-14 Asys Automatisierungssysteme Gmbh Transportsystem für flache Substrate
JP7548620B1 (ja) 2023-06-06 2024-09-10 全智新系統科技股▲分▼有限公司 回転塗布装置
DE102023129975A1 (de) * 2023-10-30 2025-05-15 PAPACKS SALES GmbH Titel der Erfindung: VERFAHREN UND SYSTEM ZUR BESCHICHTUNG VON PRODUKTEN
US20250205729A1 (en) 2023-10-30 2025-06-26 PAPACKS SALES GmbH Machine and system for coating products
US12246340B1 (en) 2024-07-08 2025-03-11 PAPACKS SALES GmbH Machine and system for coating molded fiber products

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5914890B2 (ja) * 1979-11-15 1984-04-06 松下電器産業株式会社 回転塗布方法
US4476162A (en) * 1982-04-30 1984-10-09 Ireland Jack W Method for coating lenses
JPS59208832A (ja) 1983-05-13 1984-11-27 Hitachi Tokyo Electronics Co Ltd 塗布装置
JPS59222922A (ja) * 1983-06-01 1984-12-14 Nippon Telegr & Teleph Corp <Ntt> 気相成長装置
JPH0669019B2 (ja) * 1984-03-12 1994-08-31 株式会社ニコン 半導体製造装置
EP0264957A3 (en) * 1986-10-23 1990-01-31 Mitsubishi Materials Corporation Method and apparatus for application of wax on wafers
US5042421A (en) * 1989-07-25 1991-08-27 Manhattan R&D, Inc. Rotatable vacuum chuck with magnetic means
JPH0410529A (ja) * 1990-04-27 1992-01-14 Shin Etsu Handotai Co Ltd サセプタ及びウエーハ自動脱着装置
DE4024642A1 (de) * 1990-08-03 1992-02-06 Ibm Schleuderteller fuer substrate
JPH04146615A (ja) * 1990-10-08 1992-05-20 Tatsumo Kk 半導体生成工程の回転カツプ式薬液処理装置
JP3077114B2 (ja) * 1991-05-20 2000-08-14 東京応化工業株式会社 塗布装置
DE9218974U1 (de) * 1992-02-11 1996-08-22 FAIRCHILD CONVAC GmbH Geräte zur Halbleitertechnologie, 71665 Vaihingen Vorrichtung zum Aufbringen und/oder zum partiellen Entfernen einer dünnen Schicht auf ein bzw. von einem Substrat
US5650196A (en) 1993-05-05 1997-07-22 Steag Microtech Gmbh Device for coating substrates in semiconductor production
JP2934565B2 (ja) * 1993-05-21 1999-08-16 三菱電機株式会社 半導体製造装置及び半導体製造方法
DE4397539D2 (de) * 1993-08-26 1996-09-26 Steag Micro Tech Gmbh Vorrichtung zur Belackung von Substraten in der Halbleiterfertigung
US5643366A (en) * 1994-01-31 1997-07-01 Applied Materials, Inc. Wafer handling within a vacuum chamber using vacuum
US5656082A (en) * 1994-04-04 1997-08-12 Tatsumo Kabushiki Kaisha Liquid applying apparatus utilizing centrifugal force
US6004622A (en) * 1994-11-07 1999-12-21 Macronix International Co., Ltd. Spin-on-glass process with controlled environment
KR0177981B1 (ko) * 1995-06-29 1999-05-15 이대원 대구경 줌렌즈
DE19545573A1 (de) * 1995-12-07 1997-06-12 Leybold Ag Vorrichtung zum gleichmäßigen Aufbringen einer Lackschicht auf ein Substrat
JP3707849B2 (ja) * 1996-01-16 2005-10-19 東京応化工業株式会社 回転カップ式液体塗布装置
JP3462657B2 (ja) * 1996-02-29 2003-11-05 大日本スクリーン製造株式会社 薄膜形成装置および薄膜形成方法
JPH09253561A (ja) 1996-03-21 1997-09-30 Dainippon Screen Mfg Co Ltd 回転式基板処理装置
TW344097B (en) * 1996-04-09 1998-11-01 Tokyo Electron Co Ltd Photoresist treating device of substrate and photoresist treating method
US5980706A (en) * 1996-07-15 1999-11-09 Semitool, Inc. Electrode semiconductor workpiece holder
JPH1092713A (ja) 1996-09-11 1998-04-10 Hitachi Ltd 塗布方法および装置
US6027602A (en) * 1997-08-29 2000-02-22 Techpoint Pacific Singapore Pte. Ltd. Wet processing apparatus
KR100271764B1 (ko) * 1997-12-24 2000-12-01 윤종용 반도체장치 제조용 현상 장치 및 그의 제어방법
JP3323797B2 (ja) * 1998-01-21 2002-09-09 東京エレクトロン株式会社 疎水化処理装置
US6419751B1 (en) * 1999-07-26 2002-07-16 Tokyo Electron Limited Substrate processing method and substrate processing apparatus
TW399743U (en) * 1999-09-15 2000-07-21 Ind Tech Res Inst Wafer back protection device

Also Published As

Publication number Publication date
EP1152839B1 (de) 2002-11-13
CA2362798A1 (en) 2000-08-24
DK1152839T3 (da) 2003-03-10
KR100446808B1 (ko) 2004-09-01
DE19906398B4 (de) 2004-04-29
CA2362798C (en) 2006-11-28
KR20010104707A (ko) 2001-11-26
JP3574790B2 (ja) 2004-10-06
TW538320B (en) 2003-06-21
HK1044307A1 (en) 2002-10-18
JP2002537097A (ja) 2002-11-05
HK1044307B (zh) 2004-12-03
CN1134310C (zh) 2004-01-14
DE50000751D1 (de) 2002-12-19
WO2000048744A1 (de) 2000-08-24
US6858088B1 (en) 2005-02-22
ATE227611T1 (de) 2002-11-15
IL144569A0 (en) 2002-05-23
EP1152839A1 (de) 2001-11-14
CN1339988A (zh) 2002-03-13
DE19906398A1 (de) 2000-08-31

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