KR890001186A - 반도체 집적회로 장치 및 그 제조방법 - Google Patents

반도체 집적회로 장치 및 그 제조방법 Download PDF

Info

Publication number
KR890001186A
KR890001186A KR1019880007112A KR880007112A KR890001186A KR 890001186 A KR890001186 A KR 890001186A KR 1019880007112 A KR1019880007112 A KR 1019880007112A KR 880007112 A KR880007112 A KR 880007112A KR 890001186 A KR890001186 A KR 890001186A
Authority
KR
South Korea
Prior art keywords
semiconductor
chip
lead
chips
integrated circuit
Prior art date
Application number
KR1019880007112A
Other languages
English (en)
Other versions
KR970003915B1 (ko
Inventor
마사유끼 와다나베
도시오 스가노
세이이찌로우 쯔구이
다까시 오노
요시아끼 와까시마
Original Assignee
미다 가쓰시게
가부시기가이샤 히다찌세이사꾸쇼
스즈끼진이찌로
히다찌도부세미콘닥터 가부시기가이샤
사또 고고
아끼다덴시 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62155478A external-priority patent/JP2603636B2/ja
Priority claimed from JP62226307A external-priority patent/JP2642359B2/ja
Application filed by 미다 가쓰시게, 가부시기가이샤 히다찌세이사꾸쇼, 스즈끼진이찌로, 히다찌도부세미콘닥터 가부시기가이샤, 사또 고고, 아끼다덴시 가부시기가이샤 filed Critical 미다 가쓰시게
Publication of KR890001186A publication Critical patent/KR890001186A/ko
Application granted granted Critical
Publication of KR970003915B1 publication Critical patent/KR970003915B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/1147—Manufacturing methods using a lift-off mask
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06517—Bump or bump-like direct electrical connections from device to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06551—Conductive connections on the side of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06572—Auxiliary carrier between devices, the carrier having an electrical connection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06579—TAB carriers; beam leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06582—Housing for the assembly, e.g. chip scale package [CSP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
    • H01L2225/1029—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being a lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1047—Details of electrical connections between containers
    • H01L2225/107—Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01055—Cesium [Cs]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Wire Bonding (AREA)
  • Dram (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

내용 없음

Description

반도체 직접회로 장치 및 그 제조방법.
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는, 본 발명의 실시예 1의 1의 반도체 장치의 개략 구성을 도시한 평면도.
재2도는 상기 반도체 장치의 개략 구성을 도시한 측면도.
제3도는 상기 반도체 장치의 개략 구성을 도시한 정면도.

Claims (15)

  1. 반도체칩의 범프 전국을 리이드에 접속하고, 상기 리이드를 갖는 반도체칩을 여러개 모듈기판의 배선에 접속하여 구성한 반도체 장치.
  2. 특허청구의 범위 제1항에 있어서, 상기 반도체칩은 패키지로 봉하여 막지 않는 것을 특징으로 하는 반도체 장치.
  3. 특허청구위 범위 제1항에 있어서, 상기 반도체칩은 상기 모듈기판의 표면과 이면의 양면에 탐재되어 있는 것을 특징으로 하는 반도체 장치.
  4. 특허청구위 범위 제1항에 있어서, 상기 반도체 장치는 제1의 반도체칩상에 제2의 반도체칩을 겹치는 것에 의해 동리 신호 또는 동일 전위를 입력 또는 출력하는 리이드끼리 접속해서 반도체칩의 조를 구성하고, 상기 반도체칩의 조를 상기 모듈기판에 여러개 탑재해서 구성한 것을 특징으로 하는 반도체 장치.
  5. 특허청구의 범위 제1항에 있어서, 상기 모듈기판 표면에 탑재되어 있는 반도체칩은 범프 전국이 마련되어 있는 쪽의 면과 반대측의 면이 탑재 기판과 대면하고, 모듈기판 이면에 탑재되어 있는 반도체칩은 범프 전국이 마련되어 있는 쪽의 면이 모듈기판과 대면하고 있는 것을 특징으로 하는 반도체 장치.
  6. 특허청구위 범위 제1항에 있어서, 상기 반도체칩의 범프 전국의 배치를 제1의 반도체칩과 제2의 반도체 칩사이를 대칭으로 하고, 범프 전국기리 접속하도록 제2의 반도체칩을 뒤집게 하여 제1의 반도체칩에 적층되며, 이들 제1의 반도체칩과 제2의 반도체칩사이에 리이드를 개재시킨 것을 특징으로 하는 반도체장치.
  7. 각 리이드 패턴의 일부를 테이프 캐리어 패키지의 적층 내장이 가능하도록 변경한2이상의 상기 테이프캐리어 패키지를 내장용 기판상에 적층 내장해서 되는 것을 특징으로 하는 반도체 장치.
  8. 특허청구의 범위 제7항에 있어서, 변경한 상기 리이드 패턴의 일부가 상기 테이프 캐리어 패키지내의 칩 선택 신호용 리이드인 반도체 장치.
  9. (a)정사각형 또는 직사각형의 판자 형상이고, 각각 제1 및 제2의 주면을 가지며, 상기 제1의 주면에 각각 SRAM 집접회로의 주요부가 형성되어 있는 제1 및 제2의 SRAM 반도체칩, (b)상기 각각의 칩의 상기 제1주면의 1쌍이 대항하는 변의근방에 마련된 다수의 전국 패드, (c)상기 각각의 칩의 상기 제1주면의 상기1쌍의 변 근방의 어느 것인가에 마련된 각각의 칩 선택 전국 패드, (d)상기 각각의 칩의 상기 다수의 패드와 그 안쪽 끝이 접속된 금속 시트로 되는 다수의 리이드, (e)상기 각각의 칩의 상기 칩 선택 패드와 그 안쪽끝이 접속된 금속 시트로 되는 제1 및 제2라이드, (f)상기 제1칩의 제2주면과 그것에 평행으로 근접하는 상기 제2칩의 제1주면사이에 마련된 절연부재와, (g)상기 각각의 다수의 리이드의 동일 기능을 갖는 패드에 대응하는 바깥쪽 끝부분 밑 그 근방에 서 그 연장 방향이 일치하도록 중첩 접속된 중첩 접속부를 포함하는 반도체 집적회 메모리 장치.
  10. 특허 청구의 범위 제9항에 있어서, 상기 리이드는 SOP(스몰 아우트 라인 패키지)로 형성되어 있는 반도체 집적회로 메모리 장치.
  11. 특허청구의 범위 제9항에 있어서, 상기 리이드는 리이드의 선단이 납땜면과 직가으로 맞닿을 수 있도록 버트 라이드로 형성된 반도체 집적회로 메모리 장치.
  12. 캐리어 테이프 중앙에 따라서 다수 마련된 반도체칩 탑재용 열림구멍부에 각각 메모리 칩을 범프 전국을 거쳐서 접속하는 반도체집적 회로의 제조방법에 있어서, (a)제, 제2의 캐리어 테이프는 각각의 제1주면 및 탑재용 열 림구멍내에 금속 시트로 되는 다수의 리이드를 가지며, 상기 제1 및 제2캐리어 테이프의 리이드 패턴은 각각의 칩 선택 단자 또는 그것과 동기의 단자와 접속되어야할 링이드이외는 동일한 패턴을 갖고, 제1, 제2의 캐리어 테이프에 동일한 패턴을 갖는 메모리칩을 각각 범프 전극을 거쳐서 연동 본딩하는 공정, (b)상기 제1 및 제2의 캐리어 테이프의 각 상기 열림구멍부에 동일한 패턴을 갖는 메모리 칩을 각각 범프 전극을 거쳐서 연동 본딩하는 공정, (c)상기 제1 및 제2의 캐리어 테이프를 일치하는 패턴이 겹치도록 중첩해서 중첩하여 연장하는 상기 각 열림 구멍부의 리이드를 압착하고, 상기 여러개의 메모리칩과 다수의 리이드로 되는 다중 칩 리이드 복합체를 형성하는 공정과, (d)상기 각 캐리어 테이프에서 상기 복합체를 분리하는 공정으로 되는 반도체 집적회로의 제조방법.
  13. 특허 청구의 범위 제12항에 있어서, 상기 공정(b)와 (c)사이에 상기 제1 및 제2의 메모리 칩의 디바이스 형성 주면에 각각의 상기 주면 및 같은 주면상의 각 리이드 및 범프 전극을 덮도록 수지 몰드제를 포팅하는 공정(e)를 갖는 반도체 집적회로의 제조방법.
  14. 특허청구위 범위 제12항에 있어서, 상기 공정(b)와 상기(c)사이에 각 캐리어 테이프 상태에서 각 칩의 전기적 테스트를 행하는 반도체 집적회로의 제조방법.
  15. 특허청구의 범위 제12항에 있어서, 상기 공정(d)후에 상기 복합체를 상기 리이드를 거쳐서 기판에면 내장법에 의해 땜납 리플로우 내장하는 반도체 집적회로의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880007112A 1987-06-24 1988-06-14 반도체 기억장치 및 그것을 사용한 반도체 메모리 모듈 KR970003915B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP62-155478 1987-06-24
JP62155478A JP2603636B2 (ja) 1987-06-24 1987-06-24 半導体装置
JP62226307A JP2642359B2 (ja) 1987-09-11 1987-09-11 半導体装置
JP62-226307 1987-09-11

Related Child Applications (2)

Application Number Title Priority Date Filing Date
KR1019930010377A Division KR970003913B1 (ko) 1987-06-24 1993-06-09 반도체 기억 장치의 실장 방법
KR1019930010378A Division KR970003914B1 (ko) 1987-06-24 1993-06-09 반도체 메모리 모듈

Publications (2)

Publication Number Publication Date
KR890001186A true KR890001186A (ko) 1989-03-18
KR970003915B1 KR970003915B1 (ko) 1997-03-22

Family

ID=26483473

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1019880007112A KR970003915B1 (ko) 1987-06-24 1988-06-14 반도체 기억장치 및 그것을 사용한 반도체 메모리 모듈
KR1019930010377A KR970003913B1 (ko) 1987-06-24 1993-06-09 반도체 기억 장치의 실장 방법
KR1019930010378A KR970003914B1 (ko) 1987-06-24 1993-06-09 반도체 메모리 모듈

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1019930010377A KR970003913B1 (ko) 1987-06-24 1993-06-09 반도체 기억 장치의 실장 방법
KR1019930010378A KR970003914B1 (ko) 1987-06-24 1993-06-09 반도체 메모리 모듈

Country Status (2)

Country Link
US (1) US4982265A (ko)
KR (3) KR970003915B1 (ko)

Families Citing this family (300)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5138438A (en) 1987-06-24 1992-08-11 Akita Electronics Co. Ltd. Lead connections means for stacked tab packaged IC chips
US5198888A (en) * 1987-12-28 1993-03-30 Hitachi, Ltd. Semiconductor stacked device
US5028986A (en) * 1987-12-28 1991-07-02 Hitachi, Ltd. Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices
US5227664A (en) * 1988-02-26 1993-07-13 Hitachi, Ltd. Semiconductor device having particular mounting arrangement
EP0408779B1 (en) * 1989-07-18 1993-03-17 International Business Machines Corporation High density semiconductor memory module
US5399898A (en) * 1992-07-17 1995-03-21 Lsi Logic Corporation Multi-chip semiconductor arrangements using flip chip dies
US5399903A (en) * 1990-08-15 1995-03-21 Lsi Logic Corporation Semiconductor device having an universal die size inner lead layout
US20010030370A1 (en) * 1990-09-24 2001-10-18 Khandros Igor Y. Microelectronic assembly having encapsulated wire bonding leads
US5148265A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US7198969B1 (en) * 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
JP2756184B2 (ja) * 1990-11-27 1998-05-25 株式会社日立製作所 電子部品の表面実装構造
US5155067A (en) * 1991-03-26 1992-10-13 Micron Technology, Inc. Packaging for a semiconductor die
KR940003560B1 (ko) * 1991-05-11 1994-04-23 금성일렉트론 주식회사 적층형 반도체 패키지 및 그 제조방법.
US5331235A (en) * 1991-06-01 1994-07-19 Goldstar Electron Co., Ltd. Multi-chip semiconductor package
US5434750A (en) * 1992-02-07 1995-07-18 Lsi Logic Corporation Partially-molded, PCB chip carrier package for certain non-square die shapes
US5262927A (en) * 1992-02-07 1993-11-16 Lsi Logic Corporation Partially-molded, PCB chip carrier package
JP2745933B2 (ja) * 1992-02-17 1998-04-28 日本電気株式会社 Ｔａｂ−集積回路
JPH061095A (ja) * 1992-06-19 1994-01-11 Toshiba Corp メモリカード
US5432999A (en) * 1992-08-20 1995-07-18 Capps; David F. Integrated circuit lamination process
US5484959A (en) * 1992-12-11 1996-01-16 Staktek Corporation High density lead-on-package fabrication method and apparatus
EP0608440A1 (en) * 1992-12-18 1994-08-03 Fujitsu Limited Semiconductor device having a plurality of chips having identical circuit arrangements sealed in package
US5557148A (en) * 1993-03-30 1996-09-17 Tribotech Hermetically sealed semiconductor device
US5652462A (en) * 1993-04-05 1997-07-29 Matsushita Electric Industrial Co., Ltd. Multilevel semiconductor integrated circuit device
US5323060A (en) * 1993-06-02 1994-06-21 Micron Semiconductor, Inc. Multichip module having a stacked chip arrangement
JP3299342B2 (ja) * 1993-06-11 2002-07-08 株式会社日立製作所 半導体メモリモジュール
US5438477A (en) * 1993-08-12 1995-08-01 Lsi Logic Corporation Die-attach technique for flip-chip style mounting of semiconductor dies
US5362986A (en) * 1993-08-19 1994-11-08 International Business Machines Corporation Vertical chip mount memory package with packaging substrate and memory chip pairs
US5388327A (en) * 1993-09-15 1995-02-14 Lsi Logic Corporation Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
JPH07142673A (ja) * 1993-11-15 1995-06-02 Matsushita Electric Ind Co Ltd 集積回路装置
JPH0823160A (ja) * 1994-05-06 1996-01-23 Seiko Epson Corp プリント配線板と電子部品の接続方法
US5838603A (en) * 1994-10-11 1998-11-17 Matsushita Electric Industrial Co., Ltd. Semiconductor device and method for fabricating the same, memory core chip and memory peripheral circuit chip
US5861666A (en) * 1995-08-30 1999-01-19 Tessera, Inc. Stacked chip assembly
JPH09214097A (ja) * 1996-02-06 1997-08-15 Toshiba Corp プリント回路基板
JP3718008B2 (ja) * 1996-02-26 2005-11-16 株式会社日立製作所 メモリモジュールおよびその製造方法
JP3584470B2 (ja) * 1996-10-22 2004-11-04 セイコーエプソン株式会社 フィルムキャリアテープの製造方法及び半導体装置の製造方法
US6121676A (en) * 1996-12-13 2000-09-19 Tessera, Inc. Stacked microelectronic assembly and method therefor
US6225688B1 (en) 1997-12-11 2001-05-01 Tessera, Inc. Stacked microelectronic assembly and method therefor
US7149095B2 (en) * 1996-12-13 2006-12-12 Tessera, Inc. Stacked microelectronic assemblies
US5770477A (en) * 1997-02-10 1998-06-23 Delco Electronics Corporation Flip chip-on-flip chip multi-chip module
US6117299A (en) * 1997-05-09 2000-09-12 Mcnc Methods of electroplating solder bumps of uniform height on integrated circuit substrates
US6372624B1 (en) 1997-08-04 2002-04-16 Micron Technology, Inc. Method for fabricating solder bumps by wave soldering
US6096576A (en) * 1997-09-02 2000-08-01 Silicon Light Machines Method of producing an electrical interface to an integrated circuit device having high density I/O count
US6222739B1 (en) 1998-01-20 2001-04-24 Viking Components High-density computer module with stacked parallel-plane packaging
US6303986B1 (en) 1998-07-29 2001-10-16 Silicon Light Machines Method of and apparatus for sealing an hermetic lid to a semiconductor die
JP2000299438A (ja) * 1999-04-15 2000-10-24 Hitachi Ltd 半導体集積回路
JP3575001B2 (ja) * 1999-05-07 2004-10-06 アムコー テクノロジー コリア インコーポレーティド 半導体パッケージ及びその製造方法
USRE40112E1 (en) 1999-05-20 2008-02-26 Amkor Technology, Inc. Semiconductor package and method for fabricating the same
JP3398721B2 (ja) * 1999-05-20 2003-04-21 アムコー テクノロジー コリア インコーポレーティド 半導体パッケージ及びその製造方法
TW548757B (en) 1999-07-22 2003-08-21 Seiko Epson Corp Semiconductor device, its manufacturing method, circuit substrate and electronic machine
JP4051531B2 (ja) 1999-07-22 2008-02-27 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
JP2001077301A (ja) * 1999-08-24 2001-03-23 Amkor Technology Korea Inc 半導体パッケージ及びその製造方法
KR20010064907A (ko) * 1999-12-20 2001-07-11 마이클 디. 오브라이언 와이어본딩 방법 및 이를 이용한 반도체패키지
US6414396B1 (en) 2000-01-24 2002-07-02 Amkor Technology, Inc. Package for stacked integrated circuits
US7102892B2 (en) * 2000-03-13 2006-09-05 Legacy Electronics, Inc. Modular integrated circuit chip carrier
US6713854B1 (en) 2000-10-16 2004-03-30 Legacy Electronics, Inc Electronic circuit module with a carrier having a mounting pad array
KR100559664B1 (ko) 2000-03-25 2006-03-10 앰코 테크놀로지 코리아 주식회사 반도체패키지
US6531784B1 (en) 2000-06-02 2003-03-11 Amkor Technology, Inc. Semiconductor package with spacer strips
US6452278B1 (en) 2000-06-30 2002-09-17 Amkor Technology, Inc. Low profile package for plural semiconductor dies
US6472758B1 (en) 2000-07-20 2002-10-29 Amkor Technology, Inc. Semiconductor package including stacked semiconductor dies and bond wires
US6577013B1 (en) 2000-09-05 2003-06-10 Amkor Technology, Inc. Chip size semiconductor packages with stacked dies
DE10044148A1 (de) * 2000-09-06 2002-03-21 Infineon Technologies Ag Elektronisches Bauteil mit gestapelten Bausteinen und Verfahren zu seiner Herstellung
US6552416B1 (en) 2000-09-08 2003-04-22 Amkor Technology, Inc. Multiple die lead frame package with enhanced die-to-die interconnect routing using internal lead trace wiring
TW528948B (en) * 2000-09-14 2003-04-21 Intel Corp Memory module having buffer for isolating stacked memory devices
US6487102B1 (en) 2000-09-18 2002-11-26 Intel Corporation Memory module having buffer for isolating stacked memory devices
US7337522B2 (en) * 2000-10-16 2008-03-04 Legacy Electronics, Inc. Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
US6340846B1 (en) 2000-12-06 2002-01-22 Amkor Technology, Inc. Making semiconductor packages with stacked dies and reinforced wire bonds
US6885106B1 (en) 2001-01-11 2005-04-26 Tessera, Inc. Stacked microelectronic assemblies and methods of making same
EP1378152A4 (en) * 2001-03-14 2006-02-01 Legacy Electronics Inc METHOD AND DEVICE FOR PREPARING A PCB WITH A THREE-DIMENSIONAL ARRAY OF SEMICONDUCTOR CHIPS USED ON THE SURFACE
US6707591B2 (en) 2001-04-10 2004-03-16 Silicon Light Machines Angled illumination for a single order light modulator based projection system
US6782205B2 (en) 2001-06-25 2004-08-24 Silicon Light Machines Method and apparatus for dynamic equalization in wavelength division multiplexing
US6747781B2 (en) 2001-06-25 2004-06-08 Silicon Light Machines, Inc. Method, apparatus, and diffuser for reducing laser speckle
US6829092B2 (en) 2001-08-15 2004-12-07 Silicon Light Machines, Inc. Blazed grating light valve
US6785001B2 (en) * 2001-08-21 2004-08-31 Silicon Light Machines, Inc. Method and apparatus for measuring wavelength jitter of light signal
US20050156322A1 (en) * 2001-08-31 2005-07-21 Smith Lee J. Thin semiconductor package including stacked dies
US6930364B2 (en) * 2001-09-13 2005-08-16 Silicon Light Machines Corporation Microelectronic mechanical system and methods
US6977440B2 (en) * 2001-10-09 2005-12-20 Tessera, Inc. Stacked packages
JP2005506690A (ja) * 2001-10-09 2005-03-03 テッセラ，インコーポレイテッド 積層パッケージ
US7335995B2 (en) * 2001-10-09 2008-02-26 Tessera, Inc. Microelectronic assembly having array including passive elements and interconnects
US20060255446A1 (en) * 2001-10-26 2006-11-16 Staktek Group, L.P. Stacked modules and method
US6956284B2 (en) * 2001-10-26 2005-10-18 Staktek Group L.P. Integrated circuit stacking system and method
US7202555B2 (en) * 2001-10-26 2007-04-10 Staktek Group L.P. Pitch change and chip scale stacking system and method
US7026708B2 (en) * 2001-10-26 2006-04-11 Staktek Group L.P. Low profile chip scale stacking system and method
US7485951B2 (en) * 2001-10-26 2009-02-03 Entorian Technologies, Lp Modularized die stacking system and method
US7656678B2 (en) * 2001-10-26 2010-02-02 Entorian Technologies, Lp Stacked module systems
US6576992B1 (en) * 2001-10-26 2003-06-10 Staktek Group L.P. Chip scale stacking system and method
US7371609B2 (en) * 2001-10-26 2008-05-13 Staktek Group L.P. Stacked module systems and methods
US7081373B2 (en) 2001-12-14 2006-07-25 Staktek Group, L.P. CSP chip stack with flex circuit
US6800238B1 (en) 2002-01-15 2004-10-05 Silicon Light Machines, Inc. Method for domain patterning in low coercive field ferroelectrics
US6767751B2 (en) 2002-05-28 2004-07-27 Silicon Light Machines, Inc. Integrated driver process flow
US6728023B1 (en) 2002-05-28 2004-04-27 Silicon Light Machines Optical device arrays with optimized image resolution
US6822797B1 (en) 2002-05-31 2004-11-23 Silicon Light Machines, Inc. Light modulator structure for producing high-contrast operation using zero-order light
US6829258B1 (en) 2002-06-26 2004-12-07 Silicon Light Machines, Inc. Rapidly tunable external cavity laser
US6813059B2 (en) 2002-06-28 2004-11-02 Silicon Light Machines, Inc. Reduced formation of asperities in contact micro-structures
US6714337B1 (en) 2002-06-28 2004-03-30 Silicon Light Machines Method and device for modulating a light beam and having an improved gamma response
US6952047B2 (en) * 2002-07-01 2005-10-04 Tessera, Inc. Assemblies having stacked semiconductor chips and methods of making same
US20050167817A1 (en) * 2002-08-05 2005-08-04 Tessera, Inc. Microelectronic adaptors, assemblies and methods
US6765288B2 (en) 2002-08-05 2004-07-20 Tessera, Inc. Microelectronic adaptors, assemblies and methods
US20040105244A1 (en) * 2002-08-06 2004-06-03 Ilyas Mohammed Lead assemblies with offset portions and microelectronic assemblies with leads having offset portions
AU2003265417A1 (en) * 2002-08-16 2004-03-03 Tessera, Inc. Microelectronic packages with self-aligning features
US6801354B1 (en) 2002-08-20 2004-10-05 Silicon Light Machines, Inc. 2-D diffraction grating for substantially eliminating polarization dependent losses
US7246431B2 (en) * 2002-09-06 2007-07-24 Tessera, Inc. Methods of making microelectronic packages including folded substrates
US7294928B2 (en) * 2002-09-06 2007-11-13 Tessera, Inc. Components, methods and assemblies for stacked packages
US7071547B2 (en) * 2002-09-11 2006-07-04 Tessera, Inc. Assemblies having stacked semiconductor chips and methods of making same
US6712480B1 (en) 2002-09-27 2004-03-30 Silicon Light Machines Controlled curvature of stressed micro-structures
US7034387B2 (en) * 2003-04-04 2006-04-25 Chippac, Inc. Semiconductor multipackage module including processor and memory package assemblies
KR20050074961A (ko) * 2002-10-08 2005-07-19 치팩, 인코포레이티드 역전된 제 2 패키지를 구비한 반도체 적층형 멀티-패키지모듈
EP1579477A2 (en) * 2002-10-11 2005-09-28 Tessera, Inc. Components, methods and assemblies for multi-chip packages
KR100618812B1 (ko) * 2002-11-18 2006-09-05 삼성전자주식회사 향상된 신뢰성을 가지는 적층형 멀티 칩 패키지
US20040102022A1 (en) * 2002-11-22 2004-05-27 Tongbi Jiang Methods of fabricating integrated circuitry
WO2004070792A2 (en) * 2003-02-04 2004-08-19 Advanced Interconnect Technologies Limited Thin multiple semiconductor die package
CN100380639C (zh) * 2003-02-04 2008-04-09 先进互连技术有限公司 薄的多半导体单元片封装
US6829077B1 (en) 2003-02-28 2004-12-07 Silicon Light Machines, Inc. Diffractive light modulator with dynamically rotatable diffraction plane
US6806997B1 (en) 2003-02-28 2004-10-19 Silicon Light Machines, Inc. Patterned diffractive light modulator ribbon for PDL reduction
JP3846437B2 (ja) * 2003-03-17 2006-11-15 株式会社日立製作所 自動車用コントロールユニット
US20040245617A1 (en) * 2003-05-06 2004-12-09 Tessera, Inc. Dense multichip module
US7462936B2 (en) 2003-10-06 2008-12-09 Tessera, Inc. Formation of circuitry with modification of feature height
US7495179B2 (en) 2003-10-06 2009-02-24 Tessera, Inc. Components with posts and pads
US8641913B2 (en) * 2003-10-06 2014-02-04 Tessera, Inc. Fine pitch microcontacts and method for forming thereof
US7183643B2 (en) * 2003-11-04 2007-02-27 Tessera, Inc. Stacked packages and systems incorporating the same
US7061121B2 (en) 2003-11-12 2006-06-13 Tessera, Inc. Stacked microelectronic assemblies with central contacts
US20070145548A1 (en) * 2003-12-22 2007-06-28 Amkor Technology, Inc. Stack-type semiconductor package and manufacturing method thereof
US8207604B2 (en) * 2003-12-30 2012-06-26 Tessera, Inc. Microelectronic package comprising offset conductive posts on compliant layer
US7709968B2 (en) * 2003-12-30 2010-05-04 Tessera, Inc. Micro pin grid array with pin motion isolation
WO2005065207A2 (en) 2003-12-30 2005-07-21 Tessera, Inc. Microelectronic packages and methods therefor
US7009296B1 (en) 2004-01-15 2006-03-07 Amkor Technology, Inc. Semiconductor package with substrate coupled to a peripheral side surface of a semiconductor die
US7368695B2 (en) * 2004-05-03 2008-05-06 Tessera, Inc. Image sensor package and fabrication method
US7202106B2 (en) 2004-06-28 2007-04-10 Semiconductor Components Industries, L.L.C. Multi-chip semiconductor connector and method
US7606050B2 (en) * 2004-09-03 2009-10-20 Entorian Technologies, Lp Compact module system and method
US7511968B2 (en) * 2004-09-03 2009-03-31 Entorian Technologies, Lp Buffered thin module system and method
US20060050492A1 (en) * 2004-09-03 2006-03-09 Staktek Group, L.P. Thin module system and method
US7616452B2 (en) 2004-09-03 2009-11-10 Entorian Technologies, Lp Flex circuit constructions for high capacity circuit module systems and methods
US7579687B2 (en) 2004-09-03 2009-08-25 Entorian Technologies, Lp Circuit module turbulence enhancement systems and methods
US7443023B2 (en) 2004-09-03 2008-10-28 Entorian Technologies, Lp High capacity thin module system
US7522421B2 (en) 2004-09-03 2009-04-21 Entorian Technologies, Lp Split core circuit module
US7606049B2 (en) * 2004-09-03 2009-10-20 Entorian Technologies, Lp Module thermal management system and method
US20060261449A1 (en) * 2005-05-18 2006-11-23 Staktek Group L.P. Memory module system and method
US20060049513A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Thin module system and method with thermal management
US7423885B2 (en) * 2004-09-03 2008-09-09 Entorian Technologies, Lp Die module system
US7760513B2 (en) * 2004-09-03 2010-07-20 Entorian Technologies Lp Modified core for circuit module system and method
US7468893B2 (en) * 2004-09-03 2008-12-23 Entorian Technologies, Lp Thin module system and method
US7289327B2 (en) * 2006-02-27 2007-10-30 Stakick Group L.P. Active cooling methods and apparatus for modules
US7324352B2 (en) * 2004-09-03 2008-01-29 Staktek Group L.P. High capacity thin module system and method
US7606040B2 (en) * 2004-09-03 2009-10-20 Entorian Technologies, Lp Memory module system and method
US20060055024A1 (en) * 2004-09-14 2006-03-16 Staktek Group, L.P. Adapted leaded integrated circuit module
US20060072297A1 (en) * 2004-10-01 2006-04-06 Staktek Group L.P. Circuit Module Access System and Method
JP5592055B2 (ja) * 2004-11-03 2014-09-17 テッセラ，インコーポレイテッド 積層パッケージングの改良
US20060118936A1 (en) * 2004-12-03 2006-06-08 Staktek Group L.P. Circuit module component mounting system and method
US7435097B2 (en) * 2005-01-12 2008-10-14 Legacy Electronics, Inc. Radial circuit board, system, and methods
US20060175693A1 (en) * 2005-02-04 2006-08-10 Staktek Group, L.P. Systems, methods, and apparatus for generating ball-out matrix configuration output for a flex circuit
US7939934B2 (en) * 2005-03-16 2011-05-10 Tessera, Inc. Microelectronic packages and methods therefor
US20060244114A1 (en) * 2005-04-28 2006-11-02 Staktek Group L.P. Systems, methods, and apparatus for connecting a set of contacts on an integrated circuit to a flex circuit via a contact beam
US20060250780A1 (en) * 2005-05-06 2006-11-09 Staktek Group L.P. System component interposer
US7033861B1 (en) 2005-05-18 2006-04-25 Staktek Group L.P. Stacked module systems and method
US8077535B2 (en) 2006-07-31 2011-12-13 Google Inc. Memory refresh apparatus and method
US8081474B1 (en) 2007-12-18 2011-12-20 Google Inc. Embossed heat spreader
US8397013B1 (en) 2006-10-05 2013-03-12 Google Inc. Hybrid memory module
US7580312B2 (en) * 2006-07-31 2009-08-25 Metaram, Inc. Power saving system and method for use with a plurality of memory circuits
US8796830B1 (en) 2006-09-01 2014-08-05 Google Inc. Stackable low-profile lead frame package
US8244971B2 (en) 2006-07-31 2012-08-14 Google Inc. Memory circuit system and method
US8055833B2 (en) 2006-10-05 2011-11-08 Google Inc. System and method for increasing capacity, performance, and flexibility of flash storage
US8041881B2 (en) 2006-07-31 2011-10-18 Google Inc. Memory device with emulated characteristics
US10013371B2 (en) 2005-06-24 2018-07-03 Google Llc Configurable memory circuit system and method
US8060774B2 (en) 2005-06-24 2011-11-15 Google Inc. Memory systems and memory modules
US20080126690A1 (en) * 2006-02-09 2008-05-29 Rajan Suresh N Memory module with memory stack
US8130560B1 (en) 2006-11-13 2012-03-06 Google Inc. Multi-rank partial width memory modules
US8386722B1 (en) 2008-06-23 2013-02-26 Google Inc. Stacked DIMM memory interface
US8111566B1 (en) 2007-11-16 2012-02-07 Google, Inc. Optimal channel design for memory devices for providing a high-speed memory interface
US8327104B2 (en) * 2006-07-31 2012-12-04 Google Inc. Adjusting the timing of signals associated with a memory system
US8090897B2 (en) 2006-07-31 2012-01-03 Google Inc. System and method for simulating an aspect of a memory circuit
US9171585B2 (en) 2005-06-24 2015-10-27 Google Inc. Configurable memory circuit system and method
KR101377305B1 (ko) * 2005-06-24 2014-03-25 구글 인코포레이티드 집적 메모리 코어 및 메모리 인터페이스 회로
US8335894B1 (en) 2008-07-25 2012-12-18 Google Inc. Configurable memory system with interface circuit
US8438328B2 (en) 2008-02-21 2013-05-07 Google Inc. Emulation of abstracted DIMMs using abstracted DRAMs
US9507739B2 (en) 2005-06-24 2016-11-29 Google Inc. Configurable memory circuit system and method
US20080082763A1 (en) * 2006-10-02 2008-04-03 Metaram, Inc. Apparatus and method for power management of memory circuits by a system or component thereof
US8089795B2 (en) * 2006-02-09 2012-01-03 Google Inc. Memory module with memory stack and interface with enhanced capabilities
US7590796B2 (en) * 2006-07-31 2009-09-15 Metaram, Inc. System and method for power management in memory systems
US20080028136A1 (en) * 2006-07-31 2008-01-31 Schakel Keith R Method and apparatus for refresh management of memory modules
US7386656B2 (en) * 2006-07-31 2008-06-10 Metaram, Inc. Interface circuit system and method for performing power management operations in conjunction with only a portion of a memory circuit
US8359187B2 (en) * 2005-06-24 2013-01-22 Google Inc. Simulating a different number of memory circuit devices
US8169233B2 (en) * 2009-06-09 2012-05-01 Google Inc. Programming of DIMM termination resistance values
US9542352B2 (en) * 2006-02-09 2017-01-10 Google Inc. System and method for reducing command scheduling constraints of memory circuits
US7609567B2 (en) * 2005-06-24 2009-10-27 Metaram, Inc. System and method for simulating an aspect of a memory circuit
US7392338B2 (en) * 2006-07-31 2008-06-24 Metaram, Inc. Interface circuit system and method for autonomously performing power management operations in conjunction with a plurality of memory circuits
US7472220B2 (en) * 2006-07-31 2008-12-30 Metaram, Inc. Interface circuit system and method for performing power management operations utilizing power management signals
JP4269173B2 (ja) * 2005-07-06 2009-05-27 セイコーエプソン株式会社 半導体装置及びその製造方法
GB2444663B (en) * 2005-09-02 2011-12-07 Metaram Inc Methods and apparatus of stacking drams
US7663216B2 (en) * 2005-11-02 2010-02-16 Sandisk Corporation High density three dimensional semiconductor die package
US7576995B2 (en) * 2005-11-04 2009-08-18 Entorian Technologies, Lp Flex circuit apparatus and method for adding capacitance while conserving circuit board surface area
JP4466552B2 (ja) * 2005-12-09 2010-05-26 ソニー株式会社 固体撮像装置の製造方法
US8067267B2 (en) * 2005-12-23 2011-11-29 Tessera, Inc. Microelectronic assemblies having very fine pitch stacking
US8058101B2 (en) * 2005-12-23 2011-11-15 Tessera, Inc. Microelectronic packages and methods therefor
US7304382B2 (en) 2006-01-11 2007-12-04 Staktek Group L.P. Managed memory component
US20070158821A1 (en) * 2006-01-11 2007-07-12 Leland Szewerenko Managed memory component
US7605454B2 (en) 2006-01-11 2009-10-20 Entorian Technologies, Lp Memory card and method for devising
US7508058B2 (en) * 2006-01-11 2009-03-24 Entorian Technologies, Lp Stacked integrated circuit module
US7608920B2 (en) * 2006-01-11 2009-10-27 Entorian Technologies, Lp Memory card and method for devising
US7508069B2 (en) 2006-01-11 2009-03-24 Entorian Technologies, Lp Managed memory component
US20070164416A1 (en) * 2006-01-17 2007-07-19 James Douglas Wehrly Managed memory component
TWI293499B (en) * 2006-01-25 2008-02-11 Advanced Semiconductor Eng Three dimensional package and method of making the same
TWI287273B (en) * 2006-01-25 2007-09-21 Advanced Semiconductor Eng Three dimensional package and method of making the same
US7511969B2 (en) * 2006-02-02 2009-03-31 Entorian Technologies, Lp Composite core circuit module system and method
US9632929B2 (en) 2006-02-09 2017-04-25 Google Inc. Translating an address associated with a command communicated between a system and memory circuits
US20070262429A1 (en) * 2006-05-15 2007-11-15 Staktek Group, L.P. Perimeter stacking system and method
US20080028137A1 (en) * 2006-07-31 2008-01-31 Schakel Keith R Method and Apparatus For Refresh Management of Memory Modules
US20080025136A1 (en) * 2006-07-31 2008-01-31 Metaram, Inc. System and method for storing at least a portion of information received in association with a first operation for use in performing a second operation
US7724589B2 (en) * 2006-07-31 2010-05-25 Google Inc. System and method for delaying a signal communicated from a system to at least one of a plurality of memory circuits
US7545029B2 (en) * 2006-08-18 2009-06-09 Tessera, Inc. Stack microelectronic assemblies
US7468553B2 (en) * 2006-10-20 2008-12-23 Entorian Technologies, Lp Stackable micropackages and stacked modules
US9466545B1 (en) 2007-02-21 2016-10-11 Amkor Technology, Inc. Semiconductor package in package
US7884457B2 (en) * 2007-06-26 2011-02-08 Stats Chippac Ltd. Integrated circuit package system with dual side connection
US8078339B2 (en) * 2007-07-13 2011-12-13 Cummins Inc. Circuit board with integrated connector
US8078324B2 (en) 2007-07-13 2011-12-13 Cummins Inc. Method for controlling fixed and removable vehicle HVAC devices
US8209479B2 (en) * 2007-07-18 2012-06-26 Google Inc. Memory circuit system and method
US8129225B2 (en) * 2007-08-10 2012-03-06 Infineon Technologies Ag Method of manufacturing an integrated circuit module
US7710754B2 (en) * 2007-08-22 2010-05-04 Qimonda North America Corp. Method of simple chip select for memory subsystems
US7822910B2 (en) * 2007-08-22 2010-10-26 Qimonda North America Corp. Method of flexible memory segment assignment using a single chip select
US8080874B1 (en) 2007-09-14 2011-12-20 Google Inc. Providing additional space between an integrated circuit and a circuit board for positioning a component therebetween
TWI378547B (en) * 2007-09-14 2012-12-01 Chipmos Technologies Inc Multi-chip stacked package structure
TWI364802B (en) * 2007-09-14 2012-05-21 Chipmos Technologies Inc Method for fabricating multi-chip stacked package
CN101874296B (zh) 2007-09-28 2015-08-26 泰塞拉公司 利用成对凸柱进行倒装芯片互连
US7829379B2 (en) * 2007-10-17 2010-11-09 Analog Devices, Inc. Wafer level stacked die packaging
US20100044860A1 (en) * 2008-08-21 2010-02-25 Tessera Interconnect Materials, Inc. Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layer
TWI392069B (zh) * 2009-11-24 2013-04-01 Advanced Semiconductor Eng 封裝結構及其封裝製程
US8330272B2 (en) 2010-07-08 2012-12-11 Tessera, Inc. Microelectronic packages with dual or multiple-etched flip-chip connectors
US8482111B2 (en) 2010-07-19 2013-07-09 Tessera, Inc. Stackable molded microelectronic packages
US9159708B2 (en) 2010-07-19 2015-10-13 Tessera, Inc. Stackable molded microelectronic packages with area array unit connectors
US8580607B2 (en) 2010-07-27 2013-11-12 Tessera, Inc. Microelectronic packages with nanoparticle joining
TWI446420B (zh) 2010-08-27 2014-07-21 Advanced Semiconductor Eng 用於半導體製程之載體分離方法
TWI445152B (zh) 2010-08-30 2014-07-11 Advanced Semiconductor Eng 半導體結構及其製作方法
US9007273B2 (en) 2010-09-09 2015-04-14 Advances Semiconductor Engineering, Inc. Semiconductor package integrated with conformal shield and antenna
TWI434387B (zh) 2010-10-11 2014-04-11 Advanced Semiconductor Eng 具有穿導孔之半導體裝置及具有穿導孔之半導體裝置之封裝結構及其製造方法
KR101075241B1 (ko) 2010-11-15 2011-11-01 테세라, 인코포레이티드 유전체 부재에 단자를 구비하는 마이크로전자 패키지
TWI527174B (zh) 2010-11-19 2016-03-21 日月光半導體製造股份有限公司 具有半導體元件之封裝結構
US8853558B2 (en) 2010-12-10 2014-10-07 Tessera, Inc. Interconnect structure
US20120146206A1 (en) 2010-12-13 2012-06-14 Tessera Research Llc Pin attachment
TWI445155B (zh) 2011-01-06 2014-07-11 Advanced Semiconductor Eng 堆疊式封裝結構及其製造方法
US8853819B2 (en) 2011-01-07 2014-10-07 Advanced Semiconductor Engineering, Inc. Semiconductor structure with passive element network and manufacturing method thereof
JP5647014B2 (ja) * 2011-01-17 2014-12-24 ピーエスフォー ルクスコ エスエイアールエルＰＳ４ Ｌｕｘｃｏ Ｓ．ａ．ｒ．ｌ． 半導体装置
US8618659B2 (en) 2011-05-03 2013-12-31 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
KR101128063B1 (ko) 2011-05-03 2012-04-23 테세라, 인코포레이티드 캡슐화 층의 표면에 와이어 본드를 구비하는 패키지 적층형 어셈블리
US8872318B2 (en) 2011-08-24 2014-10-28 Tessera, Inc. Through interposer wire bond using low CTE interposer with coarse slot apertures
US8836136B2 (en) 2011-10-17 2014-09-16 Invensas Corporation Package-on-package assembly with wire bond vias
US8541883B2 (en) 2011-11-29 2013-09-24 Advanced Semiconductor Engineering, Inc. Semiconductor device having shielded conductive vias
US8975157B2 (en) 2012-02-08 2015-03-10 Advanced Semiconductor Engineering, Inc. Carrier bonding and detaching processes for a semiconductor wafer
US8963316B2 (en) 2012-02-15 2015-02-24 Advanced Semiconductor Engineering, Inc. Semiconductor device and method for manufacturing the same
US8946757B2 (en) 2012-02-17 2015-02-03 Invensas Corporation Heat spreading substrate with embedded interconnects
US9349706B2 (en) 2012-02-24 2016-05-24 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US8372741B1 (en) 2012-02-24 2013-02-12 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US8786060B2 (en) 2012-05-04 2014-07-22 Advanced Semiconductor Engineering, Inc. Semiconductor package integrated with conformal shield and antenna
US8835228B2 (en) 2012-05-22 2014-09-16 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US9391008B2 (en) 2012-07-31 2016-07-12 Invensas Corporation Reconstituted wafer-level package DRAM
US9153542B2 (en) 2012-08-01 2015-10-06 Advanced Semiconductor Engineering, Inc. Semiconductor package having an antenna and manufacturing method thereof
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
US8937387B2 (en) 2012-11-07 2015-01-20 Advanced Semiconductor Engineering, Inc. Semiconductor device with conductive vias
US8975738B2 (en) 2012-11-12 2015-03-10 Invensas Corporation Structure for microelectronic packaging with terminals on dielectric mass
US8952542B2 (en) 2012-11-14 2015-02-10 Advanced Semiconductor Engineering, Inc. Method for dicing a semiconductor wafer having through silicon vias and resultant structures
US8878353B2 (en) 2012-12-20 2014-11-04 Invensas Corporation Structure for microelectronic packaging with bond elements to encapsulation surface
US9406552B2 (en) 2012-12-20 2016-08-02 Advanced Semiconductor Engineering, Inc. Semiconductor device having conductive via and manufacturing process
US8841751B2 (en) 2013-01-23 2014-09-23 Advanced Semiconductor Engineering, Inc. Through silicon vias for semiconductor devices and manufacturing method thereof
US9136254B2 (en) 2013-02-01 2015-09-15 Invensas Corporation Microelectronic package having wire bond vias and stiffening layer
US9978688B2 (en) 2013-02-28 2018-05-22 Advanced Semiconductor Engineering, Inc. Semiconductor package having a waveguide antenna and manufacturing method thereof
US9089268B2 (en) 2013-03-13 2015-07-28 Advanced Semiconductor Engineering, Inc. Neural sensing device and method for making the same
US9173583B2 (en) 2013-03-15 2015-11-03 Advanced Semiconductor Engineering, Inc. Neural sensing device and method for making the same
US8987734B2 (en) 2013-03-15 2015-03-24 Advanced Semiconductor Engineering, Inc. Semiconductor wafer, semiconductor process and semiconductor package
US9034696B2 (en) 2013-07-15 2015-05-19 Invensas Corporation Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation
US9023691B2 (en) 2013-07-15 2015-05-05 Invensas Corporation Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation
US8883563B1 (en) 2013-07-15 2014-11-11 Invensas Corporation Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation
US9167710B2 (en) 2013-08-07 2015-10-20 Invensas Corporation Embedded packaging with preformed vias
US9685365B2 (en) 2013-08-08 2017-06-20 Invensas Corporation Method of forming a wire bond having a free end
US20150076714A1 (en) 2013-09-16 2015-03-19 Invensas Corporation Microelectronic element with bond elements to encapsulation surface
KR102144367B1 (ko) * 2013-10-22 2020-08-14 삼성전자주식회사 반도체 패키지 및 이의 제조 방법
US9087815B2 (en) 2013-11-12 2015-07-21 Invensas Corporation Off substrate kinking of bond wire
US9082753B2 (en) 2013-11-12 2015-07-14 Invensas Corporation Severing bond wire by kinking and twisting
US9583456B2 (en) 2013-11-22 2017-02-28 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9379074B2 (en) 2013-11-22 2016-06-28 Invensas Corporation Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
US9263394B2 (en) 2013-11-22 2016-02-16 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
WO2015123952A1 (zh) * 2014-02-24 2015-08-27 南通富士通微电子股份有限公司 半导体封装结构及其形成方法
US9214454B2 (en) 2014-03-31 2015-12-15 Invensas Corporation Batch process fabrication of package-on-package microelectronic assemblies
US10381326B2 (en) 2014-05-28 2019-08-13 Invensas Corporation Structure and method for integrated circuits packaging with increased density
US9646917B2 (en) 2014-05-29 2017-05-09 Invensas Corporation Low CTE component with wire bond interconnects
US9412714B2 (en) 2014-05-30 2016-08-09 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
US9735084B2 (en) 2014-12-11 2017-08-15 Invensas Corporation Bond via array for thermal conductivity
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
US9502372B1 (en) 2015-04-30 2016-11-22 Invensas Corporation Wafer-level packaging using wire bond wires in place of a redistribution layer
US9761554B2 (en) 2015-05-07 2017-09-12 Invensas Corporation Ball bonding metal wire bond wires to metal pads
US10886250B2 (en) 2015-07-10 2021-01-05 Invensas Corporation Structures and methods for low temperature bonding using nanoparticles
US9633971B2 (en) 2015-07-10 2017-04-25 Invensas Corporation Structures and methods for low temperature bonding using nanoparticles
US9490222B1 (en) 2015-10-12 2016-11-08 Invensas Corporation Wire bond wires for interference shielding
US10490528B2 (en) 2015-10-12 2019-11-26 Invensas Corporation Embedded wire bond wires
US10332854B2 (en) 2015-10-23 2019-06-25 Invensas Corporation Anchoring structure of fine pitch bva
US10181457B2 (en) 2015-10-26 2019-01-15 Invensas Corporation Microelectronic package for wafer-level chip scale packaging with fan-out
US10043779B2 (en) 2015-11-17 2018-08-07 Invensas Corporation Packaged microelectronic device for a package-on-package device
US9659848B1 (en) 2015-11-18 2017-05-23 Invensas Corporation Stiffened wires for offset BVA
US9984992B2 (en) 2015-12-30 2018-05-29 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
US9935075B2 (en) 2016-07-29 2018-04-03 Invensas Corporation Wire bonding method and apparatus for electromagnetic interference shielding
TW202414634A (zh) 2016-10-27 2024-04-01 美商艾德亞半導體科技有限責任公司 用於低溫接合的結構和方法
US10299368B2 (en) 2016-12-21 2019-05-21 Invensas Corporation Surface integrated waveguides and circuit structures therefor
US11088066B2 (en) * 2018-03-19 2021-08-10 Tactotek Oy Multilayer structure and related method of manufacture for electronics

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2299724A1 (fr) * 1975-01-29 1976-08-27 Honeywell Bull Soc Ind Perfectionnements aux supports de conditionnement de micro-plaquettes de circuits integres
JPS5275981A (en) * 1975-12-22 1977-06-25 Hitachi Ltd Multichip device
US4363076A (en) * 1980-12-29 1982-12-07 Honeywell Information Systems Inc. Integrated circuit package
JPS61255046A (ja) * 1985-05-08 1986-11-12 Seiko Epson Corp 複合半導体記憶装置
JPS6290958A (ja) * 1985-10-17 1987-04-25 Matsushita Electric Ind Co Ltd 半導体装置
US4763188A (en) * 1986-08-08 1988-08-09 Thomas Johnson Packaging system for multiple semiconductor devices

Also Published As

Publication number Publication date
KR930020654A (ko) 1993-10-20
KR970003914B1 (ko) 1997-03-22
KR970003915B1 (ko) 1997-03-22
US4982265A (en) 1991-01-01
KR970003913B1 (ko) 1997-03-22
KR930020653A (ko) 1993-10-20

Similar Documents

Publication Publication Date Title
KR890001186A (ko) 반도체 집적회로 장치 및 그 제조방법
US5872399A (en) Solder ball land metal structure of ball grid semiconductor package
KR960015868A (ko) 적층형 패키지 및 그 제조방법
US5061990A (en) Semiconductor device and the manufacture thereof
JPH11297889A (ja) 半導体パッケージおよび実装基板、ならびにこれらを用いた実装方法
KR970063688A (ko) 패턴닝된 리드프레임을 이용한 멀티 칩 패키지
KR980012324A (ko) 칩 스케일 패키지의 제조 방법
KR940008061A (ko) 기판상의 칩 어셈블리 및 이의 제조 방법
JPH04273451A (ja) 半導体装置
JPH0730059A (ja) マルチチップモジュール
JP2737318B2 (ja) 混成集積回路装置
JPH08264712A (ja) 半導体装置
JPH08279588A (ja) 半導体集積回路装置及び半導体集積回路装置の製造方法
JPS63136657A (ja) 両面実装電子回路ユニツト
KR20020028474A (ko) 멀티 칩 패키지에서의 칩들과 기판간의 전기적 연결방법
KR20010068513A (ko) 윈도우가 구비된 회로기판을 포함하는 적층 칩 패키지
JPH0677392A (ja) 半導体装置とその製造方法
JPH02229461A (ja) 半導体装置
KR0151898B1 (ko) 기판을 이용한 센터 패드형태의 칩이 적용된 멀티칩 패키지
JPS63136642A (ja) 二層式半導体集積回路
JPS59175150A (ja) 電子部品の取付構造
JP3466354B2 (ja) 半導体装置
KR20000076967A (ko) 적층화 칩 반도체 장치
JPS60138948A (ja) 半導体装置用パツケ−ジ
JPH0645763A (ja) 印刷配線板

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20110223

Year of fee payment: 15

EXPY Expiration of term