JPS5275981A - Multichip device - Google Patents

Multichip device

Info

Publication number
JPS5275981A
JPS5275981A JP50151820A JP15182075A JPS5275981A JP S5275981 A JPS5275981 A JP S5275981A JP 50151820 A JP50151820 A JP 50151820A JP 15182075 A JP15182075 A JP 15182075A JP S5275981 A JPS5275981 A JP S5275981A
Authority
JP
Japan
Prior art keywords
multichip device
multichip
memory elements
film carrier
elements packaged
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50151820A
Other languages
Japanese (ja)
Inventor
Zenzo Tajima
Kunio Hatano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50151820A priority Critical patent/JPS5275981A/en
Publication of JPS5275981A publication Critical patent/JPS5275981A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: A multichip device is obtained by three-dimensionally stacking of the memory elements packaged to a film carrier.
COPYRIGHT: (C)1977,JPO&Japio
JP50151820A 1975-12-22 1975-12-22 Multichip device Pending JPS5275981A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50151820A JPS5275981A (en) 1975-12-22 1975-12-22 Multichip device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50151820A JPS5275981A (en) 1975-12-22 1975-12-22 Multichip device

Publications (1)

Publication Number Publication Date
JPS5275981A true JPS5275981A (en) 1977-06-25

Family

ID=15527017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50151820A Pending JPS5275981A (en) 1975-12-22 1975-12-22 Multichip device

Country Status (1)

Country Link
JP (1) JPS5275981A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4862322A (en) * 1988-05-02 1989-08-29 Bickford Harry R Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween
US4982265A (en) * 1987-06-24 1991-01-01 Hitachi, Ltd. Semiconductor integrated circuit device and method of manufacturing the same
US5028986A (en) * 1987-12-28 1991-07-02 Hitachi, Ltd. Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices
US5138438A (en) * 1987-06-24 1992-08-11 Akita Electronics Co. Ltd. Lead connections means for stacked tab packaged IC chips
US5198888A (en) * 1987-12-28 1993-03-30 Hitachi, Ltd. Semiconductor stacked device
US5602420A (en) * 1992-09-07 1997-02-11 Hitachi, Ltd. Stacked high mounting density semiconductor devices
JPH0955399A (en) * 1995-08-10 1997-02-25 Nec Corp Semiconductor package and mounting method thereof
JPH09199537A (en) * 1996-01-17 1997-07-31 Nec Corp Mounting structure of integrated circuit
US6555399B1 (en) * 1991-03-26 2003-04-29 Micron Technology, Inc. Double-packaged multichip semiconductor module
US6885106B1 (en) 2001-01-11 2005-04-26 Tessera, Inc. Stacked microelectronic assemblies and methods of making same
US6913949B2 (en) 2001-10-09 2005-07-05 Tessera, Inc. Stacked packages
US7053485B2 (en) 2002-08-16 2006-05-30 Tessera, Inc. Microelectronic packages with self-aligning features
US7964947B2 (en) 2006-12-21 2011-06-21 Tessera, Inc. Stacking packages with alignment elements
USRE45463E1 (en) 2003-11-12 2015-04-14 Tessera, Inc. Stacked microelectronic assemblies with central contacts

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4982265A (en) * 1987-06-24 1991-01-01 Hitachi, Ltd. Semiconductor integrated circuit device and method of manufacturing the same
US5138438A (en) * 1987-06-24 1992-08-11 Akita Electronics Co. Ltd. Lead connections means for stacked tab packaged IC chips
US5028986A (en) * 1987-12-28 1991-07-02 Hitachi, Ltd. Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices
US5198888A (en) * 1987-12-28 1993-03-30 Hitachi, Ltd. Semiconductor stacked device
US5334875A (en) * 1987-12-28 1994-08-02 Hitachi, Ltd. Stacked semiconductor memory device and semiconductor memory module containing the same
US4862322A (en) * 1988-05-02 1989-08-29 Bickford Harry R Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween
US7259450B2 (en) 1991-03-26 2007-08-21 Micron Technology, Inc. Double-packaged multi-chip semiconductor module
US6555399B1 (en) * 1991-03-26 2003-04-29 Micron Technology, Inc. Double-packaged multichip semiconductor module
US5602420A (en) * 1992-09-07 1997-02-11 Hitachi, Ltd. Stacked high mounting density semiconductor devices
JPH0955399A (en) * 1995-08-10 1997-02-25 Nec Corp Semiconductor package and mounting method thereof
JPH09199537A (en) * 1996-01-17 1997-07-31 Nec Corp Mounting structure of integrated circuit
US6885106B1 (en) 2001-01-11 2005-04-26 Tessera, Inc. Stacked microelectronic assemblies and methods of making same
US6913949B2 (en) 2001-10-09 2005-07-05 Tessera, Inc. Stacked packages
US7053485B2 (en) 2002-08-16 2006-05-30 Tessera, Inc. Microelectronic packages with self-aligning features
USRE45463E1 (en) 2003-11-12 2015-04-14 Tessera, Inc. Stacked microelectronic assemblies with central contacts
US7964947B2 (en) 2006-12-21 2011-06-21 Tessera, Inc. Stacking packages with alignment elements

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