KR102270823B1 - 반도체 장치와 그 제작 방법 - Google Patents
반도체 장치와 그 제작 방법 Download PDFInfo
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- KR102270823B1 KR102270823B1 KR1020167009051A KR20167009051A KR102270823B1 KR 102270823 B1 KR102270823 B1 KR 102270823B1 KR 1020167009051 A KR1020167009051 A KR 1020167009051A KR 20167009051 A KR20167009051 A KR 20167009051A KR 102270823 B1 KR102270823 B1 KR 102270823B1
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- Prior art keywords
- film
- transistor
- oxide semiconductor
- insulating film
- potential
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- RNWHGQJWIACOKP-UHFFFAOYSA-N zinc;oxygen(2-) Chemical group [O-2].[Zn+2] RNWHGQJWIACOKP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
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- C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
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PCT/JP2014/078006 WO2015060318A1 (en) | 2013-10-22 | 2014-10-15 | Semiconductor device and manufacturing method of the same |
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US10186604B2 (en) | 2019-01-22 |
CN110571278A (zh) | 2019-12-13 |
TWI679707B (zh) | 2019-12-11 |
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US20150108475A1 (en) | 2015-04-23 |
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JP2015109425A (ja) | 2015-06-11 |
US9780201B2 (en) | 2017-10-03 |
JP6441021B2 (ja) | 2018-12-19 |
JP2019068079A (ja) | 2019-04-25 |
TW201901814A (zh) | 2019-01-01 |
CN105659369B (zh) | 2019-10-22 |
US9431435B2 (en) | 2016-08-30 |
TW201523885A (zh) | 2015-06-16 |
CN105659369A (zh) | 2016-06-08 |
US20180102420A1 (en) | 2018-04-12 |
TW202029357A (zh) | 2020-08-01 |
KR102436895B1 (ko) | 2022-08-26 |
KR20160073374A (ko) | 2016-06-24 |
WO2015060318A1 (en) | 2015-04-30 |
TWI795613B (zh) | 2023-03-11 |
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