KR101278456B1 - 경화성 오가노폴리실록산 조성물, 이의 경화방법, 반도체장치 및 접착 촉진제 - Google Patents

경화성 오가노폴리실록산 조성물, 이의 경화방법, 반도체장치 및 접착 촉진제 Download PDF

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KR101278456B1
KR101278456B1 KR1020077005020A KR20077005020A KR101278456B1 KR 101278456 B1 KR101278456 B1 KR 101278456B1 KR 1020077005020 A KR1020077005020 A KR 1020077005020A KR 20077005020 A KR20077005020 A KR 20077005020A KR 101278456 B1 KR101278456 B1 KR 101278456B1
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curable organopolysiloxane
component
molecule
weight
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KR20070039977A (ko
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요시쓰구 모리타
도모코 가토
히로시 우에키
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다우 코닝 도레이 캄파니 리미티드
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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    • H01L23/296—Organo-silicon compounds
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    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L43/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium or a metal; Compositions of derivatives of such polymers
    • C08L43/04—Homopolymers or copolymers of monomers containing silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Sealing Material Composition (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Led Device Packages (AREA)
  • Die Bonding (AREA)
KR1020077005020A 2004-07-29 2005-07-28 경화성 오가노폴리실록산 조성물, 이의 경화방법, 반도체장치 및 접착 촉진제 Expired - Fee Related KR101278456B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2004222072 2004-07-29
JPJP-P-2004-00222072 2004-07-29
JP2004237719A JP2006063092A (ja) 2004-07-29 2004-08-17 硬化性オルガノポリシロキサン組成物、その硬化方法、光半導体装置および接着促進剤
JPJP-P-2004-00237719 2004-08-17
PCT/JP2005/014354 WO2006011676A1 (en) 2004-07-29 2005-07-28 Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promoter

Publications (2)

Publication Number Publication Date
KR20070039977A KR20070039977A (ko) 2007-04-13
KR101278456B1 true KR101278456B1 (ko) 2013-07-01

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US (2) US7842755B2 (enExample)
EP (1) EP1781741B1 (enExample)
JP (1) JP2006063092A (enExample)
KR (1) KR101278456B1 (enExample)
CN (1) CN1993427B (enExample)
AT (1) ATE406414T1 (enExample)
DE (1) DE602005009373D1 (enExample)
TW (1) TWI388628B (enExample)
WO (1) WO2006011676A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160092216A (ko) 2015-01-27 2016-08-04 주식회사 케이씨씨 접착 촉진제, 이를 포함하는 조성물 및 상기 조성물을 이용한 광학 소자
KR101695316B1 (ko) 2015-08-13 2017-01-11 주식회사 케이씨씨 경화성 오르가노폴리실록산 조성물 및 이를 이용한 광반도체 장치

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005036520A1 (de) * 2005-04-26 2006-11-09 Osram Opto Semiconductors Gmbh Optisches Bauteil, optoelektronisches Bauelement mit dem Bauteil und dessen Herstellung
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JP4628270B2 (ja) * 2006-01-20 2011-02-09 信越化学工業株式会社 熱硬化性組成物
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US20070212556A1 (en) 2006-03-07 2007-09-13 Musa Osama M Curable materials containing siloxane
JP4789663B2 (ja) * 2006-03-17 2011-10-12 信越化学工業株式会社 熱硬化性組成物及び該組成物から得られる層を備えたフィルム
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JP2008201971A (ja) * 2007-02-22 2008-09-04 Shin Etsu Chem Co Ltd 繊維強化複合材料用液状付加硬化性シリコーン組成物、繊維強化シリコーン複合材料およびその製造方法
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JP5732187B2 (ja) * 2009-01-22 2015-06-10 新日鉄住金化学株式会社 硬化物の製造方法
WO2010098285A1 (ja) * 2009-02-24 2010-09-02 積水化学工業株式会社 光半導体装置用封止剤及びそれを用いた光半導体装置
JP2011014885A (ja) * 2009-06-01 2011-01-20 Shin-Etsu Chemical Co Ltd 多層半導体装置用アンダーフィル材のダム材組成物、及び該ダム材組成物を用いた多層半導体装置の製造方法
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JP2012121950A (ja) * 2010-12-07 2012-06-28 Shin-Etsu Chemical Co Ltd 硬化性シリコーン組成物及びシリコーン樹脂硬化物
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CN110446766A (zh) 2017-04-06 2019-11-12 陶氏东丽株式会社 液态固化性有机硅粘接剂组合物、其固化物和其用途
KR102537899B1 (ko) 2017-04-24 2023-05-31 헨켈 아게 운트 코. 카게아아 중부가 실리콘 제제를 위한 접착 촉진제
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EP4093785A1 (en) * 2020-01-22 2022-11-30 Dow Silicones Corporation Curable silicone-acrylate compositions, conductive materials prepared therewith, and related methods
CN112011309A (zh) * 2020-09-04 2020-12-01 忍嘉有机硅新材料(东莞)有限公司 一种粘接pc、pa的自粘型液态硅橡胶及其制备方法
WO2024247071A1 (ja) * 2023-05-29 2024-12-05 信越化学工業株式会社 シリコーン粘着剤組成物および粘着性物品、密着向上剤
CN119119382B (zh) * 2024-11-12 2025-03-14 江苏科琪高分子材料研究院有限公司 一种uv固化有机硅改性双螺环磷酸酯丙烯酸酯及其制备方法和应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08291254A (ja) * 1995-04-21 1996-11-05 Shin Etsu Chem Co Ltd シリコーン接着性組成物
JP2003147214A (ja) 2001-11-12 2003-05-21 Dow Corning Toray Silicone Co Ltd 有機樹脂用添加剤、それを含有する硬化性有機樹脂組成物、およびその硬化物

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1235245A (en) * 1984-12-26 1988-04-12 Toshifumi Hirose Curable resinous composition comprising epoxy resin and silicon-containing elastomeric polymer
JPH0641563A (ja) 1992-07-21 1994-02-15 Kao Corp 潤滑剤及びこれを用いた磁気記録媒体
JPH06145525A (ja) 1992-11-05 1994-05-24 Toray Dow Corning Silicone Co Ltd 硬化性オルガノポリシロキサン組成物
EP0635553B1 (en) * 1993-07-22 2000-01-26 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Curable composition
US5506302A (en) * 1993-09-10 1996-04-09 Shin-Etsu Chemical Co., Inc. Organopolysiloxane composition and rubber substrate having a coating thereof
JPH07283441A (ja) 1994-04-15 1995-10-27 Toshiba Corp 光半導体装置及びその製造方法
AUPN585595A0 (en) * 1995-10-06 1995-11-02 Commonwealth Scientific And Industrial Research Organisation Control of molecular weight and end-group functionality in polymers
US5595826A (en) * 1995-10-11 1997-01-21 Dow Corning Corporation Curable organopolysiloxane compositions with improved adhesion
JP2000191914A (ja) * 1998-12-28 2000-07-11 Dow Corning Toray Silicone Co Ltd 硬化性組成物
JP2001168398A (ja) 1999-12-13 2001-06-22 Nichia Chem Ind Ltd 発光ダイオード及び製造方法
JP4394238B2 (ja) * 2000-02-28 2010-01-06 東レ・ダウコーニング株式会社 硬化性有機樹脂組成物および硬化樹脂
US6234857B1 (en) * 2000-05-04 2001-05-22 Kevin M. Suellentrop Pet recreation flotation device
JP4409160B2 (ja) * 2002-10-28 2010-02-03 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08291254A (ja) * 1995-04-21 1996-11-05 Shin Etsu Chem Co Ltd シリコーン接着性組成物
JP2003147214A (ja) 2001-11-12 2003-05-21 Dow Corning Toray Silicone Co Ltd 有機樹脂用添加剤、それを含有する硬化性有機樹脂組成物、およびその硬化物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160092216A (ko) 2015-01-27 2016-08-04 주식회사 케이씨씨 접착 촉진제, 이를 포함하는 조성물 및 상기 조성물을 이용한 광학 소자
KR101980935B1 (ko) 2015-01-27 2019-05-21 주식회사 케이씨씨 접착 촉진제, 이를 포함하는 조성물 및 상기 조성물을 이용한 광학 소자
KR101695316B1 (ko) 2015-08-13 2017-01-11 주식회사 케이씨씨 경화성 오르가노폴리실록산 조성물 및 이를 이용한 광반도체 장치

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