DE602005009373D1 - Härtbare organopolysiloxanzusammensetzung, härtungsverfahren dafür, halbleitervorrichtung und haftvermittler - Google Patents
Härtbare organopolysiloxanzusammensetzung, härtungsverfahren dafür, halbleitervorrichtung und haftvermittlerInfo
- Publication number
- DE602005009373D1 DE602005009373D1 DE602005009373T DE602005009373T DE602005009373D1 DE 602005009373 D1 DE602005009373 D1 DE 602005009373D1 DE 602005009373 T DE602005009373 T DE 602005009373T DE 602005009373 T DE602005009373 T DE 602005009373T DE 602005009373 D1 DE602005009373 D1 DE 602005009373D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- vinyl monomer
- organopolysiloxane composition
- adhesive agent
- hardening method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229920001296 polysiloxane Polymers 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 239000000853 adhesive Substances 0.000 title 1
- 239000000178 monomer Substances 0.000 abstract 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 abstract 4
- 229920002554 vinyl polymer Polymers 0.000 abstract 4
- 229920001577 copolymer Polymers 0.000 abstract 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract 2
- 239000002318 adhesion promoter Substances 0.000 abstract 1
- 125000003342 alkenyl group Chemical group 0.000 abstract 1
- 239000003054 catalyst Substances 0.000 abstract 1
- 238000001723 curing Methods 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 abstract 1
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 abstract 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 abstract 1
- 238000001029 thermal curing Methods 0.000 abstract 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L43/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium or a metal; Compositions of derivatives of such polymers
- C08L43/04—Homopolymers or copolymers of monomers containing silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Led Device Packages (AREA)
- Sealing Material Composition (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004222072 | 2004-07-29 | ||
JP2004237719A JP2006063092A (ja) | 2004-07-29 | 2004-08-17 | 硬化性オルガノポリシロキサン組成物、その硬化方法、光半導体装置および接着促進剤 |
PCT/JP2005/014354 WO2006011676A1 (en) | 2004-07-29 | 2005-07-28 | Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promoter |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602005009373D1 true DE602005009373D1 (de) | 2008-10-09 |
Family
ID=35149469
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005009373T Active DE602005009373D1 (de) | 2004-07-29 | 2005-07-28 | Härtbare organopolysiloxanzusammensetzung, härtungsverfahren dafür, halbleitervorrichtung und haftvermittler |
Country Status (9)
Country | Link |
---|---|
US (2) | US7842755B2 (de) |
EP (1) | EP1781741B1 (de) |
JP (1) | JP2006063092A (de) |
KR (1) | KR101278456B1 (de) |
CN (1) | CN1993427B (de) |
AT (1) | ATE406414T1 (de) |
DE (1) | DE602005009373D1 (de) |
TW (1) | TWI388628B (de) |
WO (1) | WO2006011676A1 (de) |
Families Citing this family (69)
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DE102005036520A1 (de) * | 2005-04-26 | 2006-11-09 | Osram Opto Semiconductors Gmbh | Optisches Bauteil, optoelektronisches Bauelement mit dem Bauteil und dessen Herstellung |
JP4931366B2 (ja) | 2005-04-27 | 2012-05-16 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
JP5247979B2 (ja) * | 2005-06-01 | 2013-07-24 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 透明な硬化物を与えるポリオルガノシロキサン組成物 |
JP4628270B2 (ja) * | 2006-01-20 | 2011-02-09 | 信越化学工業株式会社 | 熱硬化性組成物 |
JP4820184B2 (ja) * | 2006-02-20 | 2011-11-24 | シチズン電子株式会社 | 発光装置とその製造方法 |
JP5207591B2 (ja) | 2006-02-23 | 2013-06-12 | 東レ・ダウコーニング株式会社 | 半導体装置の製造方法および半導体装置 |
US20070212556A1 (en) | 2006-03-07 | 2007-09-13 | Musa Osama M | Curable materials containing siloxane |
JP4789663B2 (ja) * | 2006-03-17 | 2011-10-12 | 信越化学工業株式会社 | 熱硬化性組成物及び該組成物から得られる層を備えたフィルム |
JP5060074B2 (ja) * | 2006-05-11 | 2012-10-31 | 東レ・ダウコーニング株式会社 | 接着促進剤、硬化性オルガノポリシロキサン組成物、および半導体装置 |
JP5202822B2 (ja) * | 2006-06-23 | 2013-06-05 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
JP5148088B2 (ja) | 2006-08-25 | 2013-02-20 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
JP5285846B2 (ja) | 2006-09-11 | 2013-09-11 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
JP2008201971A (ja) * | 2007-02-22 | 2008-09-04 | Shin Etsu Chem Co Ltd | 繊維強化複合材料用液状付加硬化性シリコーン組成物、繊維強化シリコーン複合材料およびその製造方法 |
JP2008222828A (ja) * | 2007-03-12 | 2008-09-25 | Momentive Performance Materials Japan Kk | 凸レンズ形成用シリコーンゴム組成物及びそれを用いた光半導体装置 |
WO2009111199A1 (en) * | 2008-03-04 | 2009-09-11 | Dow Corning Corporation | Silicone composition, silicone adhesive, coated and laminated substrates |
JP5000566B2 (ja) * | 2008-03-27 | 2012-08-15 | 信越化学工業株式会社 | 硬化性シリコーンゴム組成物、およびそれを封止材料として用いた光半導体装置 |
JP5579371B2 (ja) * | 2008-04-23 | 2014-08-27 | 東レ・ダウコーニング株式会社 | 含ケイ素ポリマー、及び硬化性ポリマー組成物 |
JP5469874B2 (ja) | 2008-09-05 | 2014-04-16 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置 |
KR101632593B1 (ko) | 2008-10-31 | 2016-06-22 | 다우 코닝 도레이 캄파니 리미티드 | 경화성 오가노폴리실록산 조성물, 광 반도체 소자 밀봉제 및 광 반도체 장치 |
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KR102478213B1 (ko) | 2017-04-06 | 2022-12-19 | 다우 도레이 캄파니 리미티드 | 액상 경화성 실리콘 접착제 조성물, 그 경화물 및 그 용도 |
KR102537899B1 (ko) | 2017-04-24 | 2023-05-31 | 헨켈 아게 운트 코. 카게아아 | 중부가 실리콘 제제를 위한 접착 촉진제 |
EP3645643B1 (de) * | 2017-06-30 | 2023-11-15 | Dow Silicones Corporation | Zweifach gehärtete polysiloxanzusammensetzungen |
JP7130316B2 (ja) * | 2017-07-05 | 2022-09-05 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 硬化性ポリオルガノシロキサン組成物 |
JP6966381B2 (ja) * | 2018-05-09 | 2021-11-17 | 信越化学工業株式会社 | プライマー組成物及びこれを用いた光半導体装置 |
US20210246337A1 (en) | 2018-06-29 | 2021-08-12 | Dow Silicones Corporation | Solventless silicone pressure sensitive adhesive and methods for making and using same |
EP3851502A4 (de) * | 2018-09-11 | 2022-06-08 | Shin-Etsu Chemical Co., Ltd. | Grundierzusammensetzung zum verbinden von silikonharz und polyolefinharz, und verfahren zum verbinden von silikonharz und polyolefinharz |
KR20210061375A (ko) * | 2018-09-19 | 2021-05-27 | 다우 실리콘즈 코포레이션 | 아릴-작용화된 폴리실록산에서의 아릴 절단 억제 |
JP7176469B2 (ja) * | 2018-11-28 | 2022-11-22 | 信越化学工業株式会社 | イソシアヌル酸骨格及びポリエーテル骨格を含むシロキサンポリマー、感光性樹脂組成物、パターン形成方法、及び光半導体素子の製造方法 |
CN114008140B (zh) * | 2019-05-31 | 2023-11-07 | 陶氏东丽株式会社 | 固化性聚有机硅氧烷组合物以及由该固化性聚有机硅氧烷组合物的固化物形成的光学构件 |
CN112011309A (zh) * | 2020-09-04 | 2020-12-01 | 忍嘉有机硅新材料(东莞)有限公司 | 一种粘接pc、pa的自粘型液态硅橡胶及其制备方法 |
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CA1235245A (en) * | 1984-12-26 | 1988-04-12 | Toshifumi Hirose | Curable resinous composition comprising epoxy resin and silicon-containing elastomeric polymer |
JPH0641563A (ja) | 1992-07-21 | 1994-02-15 | Kao Corp | 潤滑剤及びこれを用いた磁気記録媒体 |
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EP0635553B1 (de) * | 1993-07-22 | 2000-01-26 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Härtbare Zusammensetzung |
US5506302A (en) * | 1993-09-10 | 1996-04-09 | Shin-Etsu Chemical Co., Inc. | Organopolysiloxane composition and rubber substrate having a coating thereof |
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JP3174713B2 (ja) * | 1995-04-21 | 2001-06-11 | 信越化学工業株式会社 | シリコーン接着性組成物 |
AUPN585595A0 (en) * | 1995-10-06 | 1995-11-02 | Commonwealth Scientific And Industrial Research Organisation | Control of molecular weight and end-group functionality in polymers |
US5595826A (en) * | 1995-10-11 | 1997-01-21 | Dow Corning Corporation | Curable organopolysiloxane compositions with improved adhesion |
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JP2001168398A (ja) | 1999-12-13 | 2001-06-22 | Nichia Chem Ind Ltd | 発光ダイオード及び製造方法 |
JP4394238B2 (ja) * | 2000-02-28 | 2010-01-06 | 東レ・ダウコーニング株式会社 | 硬化性有機樹脂組成物および硬化樹脂 |
US6234857B1 (en) * | 2000-05-04 | 2001-05-22 | Kevin M. Suellentrop | Pet recreation flotation device |
JP3924154B2 (ja) * | 2001-11-12 | 2007-06-06 | 東レ・ダウコーニング株式会社 | 有機樹脂用添加剤、それを含有する硬化性有機樹脂組成物、およびその硬化物 |
JP4409160B2 (ja) | 2002-10-28 | 2010-02-03 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
-
2004
- 2004-08-17 JP JP2004237719A patent/JP2006063092A/ja active Pending
-
2005
- 2005-07-28 KR KR1020077005020A patent/KR101278456B1/ko not_active IP Right Cessation
- 2005-07-28 EP EP05768714A patent/EP1781741B1/de not_active Not-in-force
- 2005-07-28 CN CN2005800256553A patent/CN1993427B/zh not_active Expired - Fee Related
- 2005-07-28 US US11/572,660 patent/US7842755B2/en not_active Expired - Fee Related
- 2005-07-28 WO PCT/JP2005/014354 patent/WO2006011676A1/en active IP Right Grant
- 2005-07-28 DE DE602005009373T patent/DE602005009373D1/de active Active
- 2005-07-28 AT AT05768714T patent/ATE406414T1/de not_active IP Right Cessation
- 2005-07-29 TW TW094125996A patent/TWI388628B/zh not_active IP Right Cessation
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- 2010-09-22 US US12/888,050 patent/US8063143B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1993427A (zh) | 2007-07-04 |
US20080262158A1 (en) | 2008-10-23 |
EP1781741A1 (de) | 2007-05-09 |
KR101278456B1 (ko) | 2013-07-01 |
TW200621891A (en) | 2006-07-01 |
US20110071266A1 (en) | 2011-03-24 |
US7842755B2 (en) | 2010-11-30 |
CN1993427B (zh) | 2011-06-22 |
WO2006011676A1 (en) | 2006-02-02 |
TWI388628B (zh) | 2013-03-11 |
EP1781741B1 (de) | 2008-08-27 |
ATE406414T1 (de) | 2008-09-15 |
US8063143B2 (en) | 2011-11-22 |
JP2006063092A (ja) | 2006-03-09 |
KR20070039977A (ko) | 2007-04-13 |
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