ATE406414T1 - Härtbare organopolysiloxanzusammensetzung, härtungsverfahren dafür, halbleitervorrichtung und haftvermittler - Google Patents

Härtbare organopolysiloxanzusammensetzung, härtungsverfahren dafür, halbleitervorrichtung und haftvermittler

Info

Publication number
ATE406414T1
ATE406414T1 AT05768714T AT05768714T ATE406414T1 AT E406414 T1 ATE406414 T1 AT E406414T1 AT 05768714 T AT05768714 T AT 05768714T AT 05768714 T AT05768714 T AT 05768714T AT E406414 T1 ATE406414 T1 AT E406414T1
Authority
AT
Austria
Prior art keywords
semiconductor device
vinyl monomer
curable organopolysiloxane
organopolysiloxane composition
curing method
Prior art date
Application number
AT05768714T
Other languages
English (en)
Inventor
Yoshitsugu Morita
Tomoko Kato
Hiroshi Ueki
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Application granted granted Critical
Publication of ATE406414T1 publication Critical patent/ATE406414T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L43/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium or a metal; Compositions of derivatives of such polymers
    • C08L43/04—Homopolymers or copolymers of monomers containing silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Led Device Packages (AREA)
  • Sealing Material Composition (AREA)
AT05768714T 2004-07-29 2005-07-28 Härtbare organopolysiloxanzusammensetzung, härtungsverfahren dafür, halbleitervorrichtung und haftvermittler ATE406414T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004222072 2004-07-29
JP2004237719A JP2006063092A (ja) 2004-07-29 2004-08-17 硬化性オルガノポリシロキサン組成物、その硬化方法、光半導体装置および接着促進剤

Publications (1)

Publication Number Publication Date
ATE406414T1 true ATE406414T1 (de) 2008-09-15

Family

ID=35149469

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05768714T ATE406414T1 (de) 2004-07-29 2005-07-28 Härtbare organopolysiloxanzusammensetzung, härtungsverfahren dafür, halbleitervorrichtung und haftvermittler

Country Status (9)

Country Link
US (2) US7842755B2 (de)
EP (1) EP1781741B1 (de)
JP (1) JP2006063092A (de)
KR (1) KR101278456B1 (de)
CN (1) CN1993427B (de)
AT (1) ATE406414T1 (de)
DE (1) DE602005009373D1 (de)
TW (1) TWI388628B (de)
WO (1) WO2006011676A1 (de)

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009111196A1 (en) * 2008-03-04 2009-09-11 Dow Corning Corporation Silicone composition, silicone adhesive, coated and laminated substrates
DE102005036520A1 (de) * 2005-04-26 2006-11-09 Osram Opto Semiconductors Gmbh Optisches Bauteil, optoelektronisches Bauelement mit dem Bauteil und dessen Herstellung
JP4931366B2 (ja) 2005-04-27 2012-05-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5247979B2 (ja) * 2005-06-01 2013-07-24 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 透明な硬化物を与えるポリオルガノシロキサン組成物
JP4628270B2 (ja) * 2006-01-20 2011-02-09 信越化学工業株式会社 熱硬化性組成物
JP4820184B2 (ja) * 2006-02-20 2011-11-24 シチズン電子株式会社 発光装置とその製造方法
JP5207591B2 (ja) * 2006-02-23 2013-06-12 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
US20070212556A1 (en) 2006-03-07 2007-09-13 Musa Osama M Curable materials containing siloxane
JP4789663B2 (ja) * 2006-03-17 2011-10-12 信越化学工業株式会社 熱硬化性組成物及び該組成物から得られる層を備えたフィルム
JP5060074B2 (ja) 2006-05-11 2012-10-31 東レ・ダウコーニング株式会社 接着促進剤、硬化性オルガノポリシロキサン組成物、および半導体装置
JP5202822B2 (ja) * 2006-06-23 2013-06-05 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5148088B2 (ja) 2006-08-25 2013-02-20 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5285846B2 (ja) 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP2008201971A (ja) * 2007-02-22 2008-09-04 Shin Etsu Chem Co Ltd 繊維強化複合材料用液状付加硬化性シリコーン組成物、繊維強化シリコーン複合材料およびその製造方法
JP2008222828A (ja) * 2007-03-12 2008-09-25 Momentive Performance Materials Japan Kk 凸レンズ形成用シリコーンゴム組成物及びそれを用いた光半導体装置
JP5000566B2 (ja) * 2008-03-27 2012-08-15 信越化学工業株式会社 硬化性シリコーンゴム組成物、およびそれを封止材料として用いた光半導体装置
JP5579371B2 (ja) * 2008-04-23 2014-08-27 東レ・ダウコーニング株式会社 含ケイ素ポリマー、及び硬化性ポリマー組成物
JP5469874B2 (ja) * 2008-09-05 2014-04-16 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置
US8946353B2 (en) 2008-10-31 2015-02-03 Dow Corning Toray Co. Ltd. Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device
JP5732187B2 (ja) * 2009-01-22 2015-06-10 新日鉄住金化学株式会社 硬化物の製造方法
WO2010098285A1 (ja) * 2009-02-24 2010-09-02 積水化学工業株式会社 光半導体装置用封止剤及びそれを用いた光半導体装置
US8828806B2 (en) * 2009-06-01 2014-09-09 Shin-Etsu Chemical Co., Ltd. Dam composition for use with multilayer semiconductor package underfill material, and fabrication of multilayer semiconductor package using the same
JP5231472B2 (ja) * 2010-03-15 2013-07-10 信越化学工業株式会社 発光ダイオード用付加硬化型シリコーン樹脂組成物
US8519429B2 (en) * 2010-06-24 2013-08-27 Sekisui Chemical Co., Ltd. Encapsulant for optical semiconductor device and optical semiconductor device using same
WO2012014560A1 (ja) * 2010-07-27 2012-02-02 株式会社Adeka 半導体封止用硬化性組成物
JP2012121950A (ja) * 2010-12-07 2012-06-28 Shin-Etsu Chemical Co Ltd 硬化性シリコーン組成物及びシリコーン樹脂硬化物
JP5553018B2 (ja) * 2010-12-16 2014-07-16 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物、光学素子封止材及び光学素子
JP5522111B2 (ja) 2011-04-08 2014-06-18 信越化学工業株式会社 シリコーン樹脂組成物及び当該組成物を使用した光半導体装置
JP5893874B2 (ja) * 2011-09-02 2016-03-23 信越化学工業株式会社 光半導体装置
KR101927979B1 (ko) * 2011-10-25 2018-12-11 가부시키가이샤 아데카 광경화성 수지조성물 및 신규 실록산 화합물
JP2013095805A (ja) * 2011-10-28 2013-05-20 Shin-Etsu Chemical Co Ltd 放射線硬化性シリコーンゴム組成物
EP2784126B1 (de) 2011-11-25 2019-03-13 LG Chem, Ltd. Härtbare zusammensetzung
JP6435260B2 (ja) 2012-05-14 2018-12-05 モーメンティブ・パフォーマンス・マテリアルズ・インク 高屈折率材料
EP2878634B1 (de) * 2012-07-27 2017-10-04 LG Chem, Ltd. Härtbare zusammensetzung
KR20150103707A (ko) * 2012-12-28 2015-09-11 다우 코닝 도레이 캄파니 리미티드 경화성 실리콘 조성물, 이의 경화물 및 광반도체 장치
EP2945994B1 (de) 2013-01-18 2018-07-11 Basf Se Beschichtungszusammensetzungen auf basis von acryldispersionen
JP6213257B2 (ja) * 2013-01-25 2017-10-18 セントラル硝子株式会社 シリコーンを含む硬化性組成物およびその硬化物
JP5977711B2 (ja) * 2013-05-13 2016-08-24 アオイ電子株式会社 半導体装置およびその製造方法
JP6163009B2 (ja) * 2013-05-13 2017-07-12 アオイ電子株式会社 半導体装置の製造方法
CN105492539B (zh) * 2013-08-29 2019-05-07 美国陶氏有机硅公司 可固化有机硅组合物、其固化产物及光学半导体器件
KR20160049539A (ko) * 2013-08-30 2016-05-09 다우 코닝 도레이 캄파니 리미티드 1액형 경화성 실리콘 조성물 및 광반도체 장치
WO2015093329A1 (ja) * 2013-12-19 2015-06-25 東レ・ダウコーニング株式会社 シリコーン接着性フィルム、および半導体装置
CN105018022B (zh) * 2014-04-28 2017-08-11 天津德高化成新材料股份有限公司 一种快速固化发光二极管灯丝封装胶及制备方法
CN106462056A (zh) * 2014-06-04 2017-02-22 道康宁公司 用于光学器件的热熔型可固化有机硅组合物的压印工艺
CN105199397B (zh) * 2014-06-17 2018-05-08 广州慧谷化学有限公司 一种可固化的有机聚硅氧烷组合物及半导体器件
CN104403627A (zh) * 2014-11-12 2015-03-11 北京化工大学常州先进材料研究院 一种高折光率紫外光/湿气双固化有机硅粘合剂
CN105802238B (zh) * 2014-12-31 2019-06-25 埃肯有机硅（上海）有限公司 可固化的聚硅氧烷组合物
KR101980935B1 (ko) 2015-01-27 2019-05-21 주식회사 케이씨씨 접착 촉진제, 이를 포함하는 조성물 및 상기 조성물을 이용한 광학 소자
TWI688629B (zh) * 2015-03-05 2020-03-21 日商陶氏東麗股份有限公司 聚矽氧系感壓接著劑及具有聚矽氧系感壓接著層之積層體
JP6519305B2 (ja) * 2015-05-11 2019-05-29 富士電機株式会社 封止材用シリコーン樹脂組成物及び該組成物を用いたパワー半導体モジュール
US9777203B2 (en) * 2015-06-08 2017-10-03 Momentive Performance Materials Silicone pressure sensitive adhesive compositions and protective films containing the same
KR101695316B1 (ko) 2015-08-13 2017-01-11 주식회사 케이씨씨 경화성 오르가노폴리실록산 조성물 및 이를 이용한 광반도체 장치
CN105199051A (zh) * 2015-11-02 2015-12-30 宋介珍 透明有机硅材料及其制备方法
KR102337694B1 (ko) * 2015-11-20 2021-12-09 동우 화인켐 주식회사 플렉서블 터치스크린 패널 모듈 및 이를 포함하는 플렉서블 디스플레이 장치
TWI738684B (zh) * 2015-12-09 2021-09-11 德商漢高智慧財產控股公司 可脫黏組合物
US10892397B2 (en) * 2015-12-17 2021-01-12 North Carolina State University Self-monitoring superconducting tape via integrated optical fibers
JP6799067B2 (ja) * 2016-09-26 2020-12-09 ダウ・東レ株式会社 硬化反応性シリコーンゲルおよびその用途
TWI763735B (zh) * 2016-12-09 2022-05-11 美商道康寧公司 組成物、光漫散器和由其所形成之裝置、及相關方法
WO2018186165A1 (ja) 2017-04-06 2018-10-11 東レ・ダウコーニング株式会社 液状硬化性シリコーン接着剤組成物、その硬化物およびその用途
JP7237931B2 (ja) * 2017-04-24 2023-03-13 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 重付加シリコーン配合物用接着促進剤
JP7125434B2 (ja) * 2017-06-30 2022-08-24 ダウ シリコーンズ コーポレーション 二重硬化オルガノポリシロキサン組成物
JP7130316B2 (ja) * 2017-07-05 2022-09-05 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 硬化性ポリオルガノシロキサン組成物
JP6966381B2 (ja) * 2018-05-09 2021-11-17 信越化学工業株式会社 プライマー組成物及びこれを用いた光半導体装置
US20210246337A1 (en) 2018-06-29 2021-08-12 Dow Silicones Corporation Solventless silicone pressure sensitive adhesive and methods for making and using same
EP3851502A4 (de) * 2018-09-11 2022-06-08 Shin-Etsu Chemical Co., Ltd. Grundierzusammensetzung zum verbinden von silikonharz und polyolefinharz, und verfahren zum verbinden von silikonharz und polyolefinharz
KR102832294B1 (ko) * 2018-09-19 2025-07-10 다우 실리콘즈 코포레이션 아릴-작용화된 폴리실록산에서의 아릴 절단 억제
JP7176469B2 (ja) * 2018-11-28 2022-11-22 信越化学工業株式会社 イソシアヌル酸骨格及びポリエーテル骨格を含むシロキサンポリマー、感光性樹脂組成物、パターン形成方法、及び光半導体素子の製造方法
WO2020241369A1 (ja) * 2019-05-31 2020-12-03 ダウ・東レ株式会社 硬化性オルガノポリシロキサン組成物、及びその硬化物からなる光学部材
EP4093785A1 (de) * 2020-01-22 2022-11-30 Dow Silicones Corporation Härtbare silikonacrylatzusammensetzungen, damit hergestellte leitfähige materialien und zugehörige verfahren
CN112011309A (zh) * 2020-09-04 2020-12-01 忍嘉有机硅新材料(东莞)有限公司 一种粘接pc、pa的自粘型液态硅橡胶及其制备方法
WO2024247071A1 (ja) * 2023-05-29 2024-12-05 信越化学工業株式会社 シリコーン粘着剤組成物および粘着性物品、密着向上剤
CN119119382B (zh) * 2024-11-12 2025-03-14 江苏科琪高分子材料研究院有限公司 一种uv固化有机硅改性双螺环磷酸酯丙烯酸酯及其制备方法和应用

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1235245A (en) * 1984-12-26 1988-04-12 Toshifumi Hirose Curable resinous composition comprising epoxy resin and silicon-containing elastomeric polymer
JPH0641563A (ja) 1992-07-21 1994-02-15 Kao Corp 潤滑剤及びこれを用いた磁気記録媒体
JPH06145525A (ja) 1992-11-05 1994-05-24 Toray Dow Corning Silicone Co Ltd 硬化性オルガノポリシロキサン組成物
EP0635553B1 (de) * 1993-07-22 2000-01-26 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Härtbare Zusammensetzung
US5506302A (en) * 1993-09-10 1996-04-09 Shin-Etsu Chemical Co., Inc. Organopolysiloxane composition and rubber substrate having a coating thereof
JPH07283441A (ja) 1994-04-15 1995-10-27 Toshiba Corp 光半導体装置及びその製造方法
JP3174713B2 (ja) * 1995-04-21 2001-06-11 信越化学工業株式会社 シリコーン接着性組成物
AUPN585595A0 (en) * 1995-10-06 1995-11-02 Commonwealth Scientific And Industrial Research Organisation Control of molecular weight and end-group functionality in polymers
US5595826A (en) * 1995-10-11 1997-01-21 Dow Corning Corporation Curable organopolysiloxane compositions with improved adhesion
JP2000191914A (ja) * 1998-12-28 2000-07-11 Dow Corning Toray Silicone Co Ltd 硬化性組成物
JP2001168398A (ja) 1999-12-13 2001-06-22 Nichia Chem Ind Ltd 発光ダイオード及び製造方法
JP4394238B2 (ja) * 2000-02-28 2010-01-06 東レ・ダウコーニング株式会社 硬化性有機樹脂組成物および硬化樹脂
US6234857B1 (en) * 2000-05-04 2001-05-22 Kevin M. Suellentrop Pet recreation flotation device
JP3924154B2 (ja) * 2001-11-12 2007-06-06 東レ・ダウコーニング株式会社 有機樹脂用添加剤、それを含有する硬化性有機樹脂組成物、およびその硬化物
JP4409160B2 (ja) * 2002-10-28 2010-02-03 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置

Also Published As

Publication number Publication date
TWI388628B (zh) 2013-03-11
EP1781741A1 (de) 2007-05-09
WO2006011676A1 (en) 2006-02-02
US20080262158A1 (en) 2008-10-23
US7842755B2 (en) 2010-11-30
KR101278456B1 (ko) 2013-07-01
CN1993427B (zh) 2011-06-22
US20110071266A1 (en) 2011-03-24
EP1781741B1 (de) 2008-08-27
US8063143B2 (en) 2011-11-22
TW200621891A (en) 2006-07-01
CN1993427A (zh) 2007-07-04
KR20070039977A (ko) 2007-04-13
JP2006063092A (ja) 2006-03-09
DE602005009373D1 (de) 2008-10-09

Similar Documents

Publication Publication Date Title
ATE406414T1 (de) Härtbare organopolysiloxanzusammensetzung, härtungsverfahren dafür, halbleitervorrichtung und haftvermittler
WO2007100445A3 (en) Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones
EP1988125A3 (de) Additionsvernetzende Silikonharzzusammensetzung und Silikonlinse damit
DE602007008295D1 (de) Siliconbasiertes haftklebemittel sowie klebeband
DE602006015973D1 (de) Härtbare verbindungen, verfahren und herstellung und verwendung davon und artikel daraus
DE602005019277D1 (de) Silicon Antihaftmittelbeschichtung und damit beschichteter Plastikfilm
DE602007004235D1 (de) Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung
BRPI0919627A8 (pt) materiais de silicone curados com feixe de elétrons
EP1832627A3 (de) Härtbare Zusammensetzung
JP2010519573A5 (de)
AR052986A1 (es) Agente de reticulacion para polimeros superabsorbentes
TW200714374A (en) UV cure equipment with combined light path
WO2009028638A3 (en) Silicone-based pressure-sensitive adhesive composition and pressure-sensitive tape or sheet
BR0317590A (pt) Composição, artigo curado, processo para a fabricação do mesmo, método para a fabricação de uma ligação adesiva, uma selagem, ou um revestimento, material resistente ao fogo, e uso de uma composição
ATE543846T1 (de) Fluorhaltiges polymer und harzzusammensetzung
WO2007121091A3 (en) Composition containing fluoroalkyl silicone and hydrosilicone
DE602004027177D1 (de) Papierlösungszusammensetzungen mit verbesserter Haftung an Papier und Polymerfilme
DE60020110D1 (de) Vernetzbare polymere zur herstellung von vernetzbaren polymeren
TW200621817A (en) Resin composition for optical material, resin film for optical material and optical waveguide using the same
TW200734403A (en) Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element
TW200732597A (en) Light redirecting films having an adhesion layer
MX2020012216A (es) Composiciones de silicon curables.
DE60308508D1 (de) Extrudierbare thermoplastische zusammensetzungen
DE50306688D1 (de) Hybrider Mikrofluidik-Chip und Verfahren zu seiner Herstellung
ATE503774T1 (de) Photohärtbare michaeladditionspolymere

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties