JP5987221B2 - 硬化性組成物 - Google Patents
硬化性組成物 Download PDFInfo
- Publication number
- JP5987221B2 JP5987221B2 JP2015523023A JP2015523023A JP5987221B2 JP 5987221 B2 JP5987221 B2 JP 5987221B2 JP 2015523023 A JP2015523023 A JP 2015523023A JP 2015523023 A JP2015523023 A JP 2015523023A JP 5987221 B2 JP5987221 B2 JP 5987221B2
- Authority
- JP
- Japan
- Prior art keywords
- polyorganosiloxane
- curable composition
- moles
- sio
- chemical formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000203 mixture Substances 0.000 title claims description 116
- 239000000126 substance Substances 0.000 claims description 87
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 40
- 125000003118 aryl group Chemical group 0.000 claims description 40
- 150000001875 compounds Chemical class 0.000 claims description 38
- 125000003700 epoxy group Chemical group 0.000 claims description 24
- 125000003342 alkenyl group Chemical group 0.000 claims description 23
- 229910052710 silicon Inorganic materials 0.000 claims description 20
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 18
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 15
- 150000003377 silicon compounds Chemical class 0.000 claims description 13
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 6
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 5
- 239000004973 liquid crystal related substance Substances 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 4
- 125000004432 carbon atom Chemical group C* 0.000 description 35
- 238000000034 method Methods 0.000 description 24
- 239000003054 catalyst Substances 0.000 description 19
- 239000002245 particle Substances 0.000 description 19
- 238000001723 curing Methods 0.000 description 17
- 239000000047 product Substances 0.000 description 16
- 150000002430 hydrocarbons Chemical group 0.000 description 15
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical group [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 12
- -1 3,4-epoxycyclohexylethyl group Chemical group 0.000 description 11
- 125000000217 alkyl group Chemical group 0.000 description 11
- 239000003566 sealing material Substances 0.000 description 10
- 125000004122 cyclic group Chemical group 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 9
- 230000035939 shock Effects 0.000 description 9
- 238000002834 transmittance Methods 0.000 description 9
- 125000000524 functional group Chemical group 0.000 description 8
- 150000001923 cyclic compounds Chemical class 0.000 description 6
- 229910052697 platinum Inorganic materials 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 125000002723 alicyclic group Chemical group 0.000 description 5
- 125000001931 aliphatic group Chemical group 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 238000006459 hydrosilylation reaction Methods 0.000 description 5
- 230000007774 longterm Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000035699 permeability Effects 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- KWYUFKZDYYNOTN-UHFFFAOYSA-M potassium hydroxide Inorganic materials [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 125000000304 alkynyl group Chemical group 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 239000002954 polymerization reaction product Substances 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- 125000001424 substituent group Chemical group 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000004954 Polyphthalamide Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001338 aliphatic hydrocarbons Chemical group 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920006375 polyphtalamide Polymers 0.000 description 3
- 238000004062 sedimentation Methods 0.000 description 3
- FYGHSUNMUKGBRK-UHFFFAOYSA-N 1,2,3-trimethylbenzene Chemical compound CC1=CC=CC(C)=C1C FYGHSUNMUKGBRK-UHFFFAOYSA-N 0.000 description 2
- AFABGHUZZDYHJO-UHFFFAOYSA-N 2-Methylpentane Chemical compound CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 2
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- ATHHXGZTWNVVOU-UHFFFAOYSA-N N-methylformamide Chemical compound CNC=O ATHHXGZTWNVVOU-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- HUCVOHYBFXVBRW-UHFFFAOYSA-M caesium hydroxide Chemical compound [OH-].[Cs+] HUCVOHYBFXVBRW-UHFFFAOYSA-M 0.000 description 2
- 150000004292 cyclic ethers Chemical class 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000005417 glycidoxyalkyl group Chemical group 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 2
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- GRGVQLWQXHFRHO-AATRIKPKSA-N (e)-3-methylpent-3-en-1-yne Chemical compound C\C=C(/C)C#C GRGVQLWQXHFRHO-AATRIKPKSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- LEEANUDEDHYDTG-UHFFFAOYSA-N 1,2-dimethoxypropane Chemical compound COCC(C)OC LEEANUDEDHYDTG-UHFFFAOYSA-N 0.000 description 1
- HYFLWBNQFMXCPA-UHFFFAOYSA-N 1-ethyl-2-methylbenzene Chemical compound CCC1=CC=CC=C1C HYFLWBNQFMXCPA-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- HGUFODBRKLSHSI-UHFFFAOYSA-N 2,3,7,8-tetrachloro-dibenzo-p-dioxin Chemical compound O1C2=CC(Cl)=C(Cl)C=C2OC2=C1C=C(Cl)C(Cl)=C2 HGUFODBRKLSHSI-UHFFFAOYSA-N 0.000 description 1
- XWERKWVETTXNQX-UHFFFAOYSA-N 2,3-dimethyl-1,4-dioxine Chemical compound CC1=C(C)OC=CO1 XWERKWVETTXNQX-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- JWUJQDFVADABEY-UHFFFAOYSA-N 2-methyltetrahydrofuran Chemical compound CC1CCCO1 JWUJQDFVADABEY-UHFFFAOYSA-N 0.000 description 1
- KSLSOBUAIFEGLT-UHFFFAOYSA-N 2-phenylbut-3-yn-2-ol Chemical compound C#CC(O)(C)C1=CC=CC=C1 KSLSOBUAIFEGLT-UHFFFAOYSA-N 0.000 description 1
- VGVHNLRUAMRIEW-UHFFFAOYSA-N 4-methylcyclohexan-1-one Chemical compound CC1CCC(=O)CC1 VGVHNLRUAMRIEW-UHFFFAOYSA-N 0.000 description 1
- HTRVREURCYRGAX-UHFFFAOYSA-N 5,5-dimethylhex-3-en-1-yne Chemical compound CC(C)(C)C=CC#C HTRVREURCYRGAX-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- NHTMVDHEPJAVLT-UHFFFAOYSA-N Isooctane Chemical compound CC(C)CC(C)(C)C NHTMVDHEPJAVLT-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000005370 alkoxysilyl group Chemical group 0.000 description 1
- QQQCWVDPMPFUGF-ZDUSSCGKSA-N alpinetin Chemical compound C1([C@H]2OC=3C=C(O)C=C(C=3C(=O)C2)OC)=CC=CC=C1 QQQCWVDPMPFUGF-ZDUSSCGKSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 238000001444 catalytic combustion detection Methods 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 125000000068 chlorophenyl group Chemical group 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 125000004188 dichlorophenyl group Chemical group 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- RCNRJBWHLARWRP-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane;platinum Chemical compound [Pt].C=C[Si](C)(C)O[Si](C)(C)C=C RCNRJBWHLARWRP-UHFFFAOYSA-N 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- QWTDNUCVQCZILF-UHFFFAOYSA-N iso-pentane Natural products CCC(C)C QWTDNUCVQCZILF-UHFFFAOYSA-N 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 description 1
- KERBAAIBDHEFDD-UHFFFAOYSA-N n-ethylformamide Chemical compound CCNC=O KERBAAIBDHEFDD-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Inorganic materials O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004344 phenylpropyl group Chemical group 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 150000003856 quaternary ammonium compounds Chemical class 0.000 description 1
- 239000002683 reaction inhibitor Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- FBEIPJNQGITEBL-UHFFFAOYSA-J tetrachloroplatinum Chemical compound Cl[Pt](Cl)(Cl)Cl FBEIPJNQGITEBL-UHFFFAOYSA-J 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Silicon Polymers (AREA)
- Led Device Packages (AREA)
Description
(R1 3SiO1/2)a(R1 2SiO2/2)b(R1SiO3/2)c(SiO4/2)d
[化学式2]
(R2 3SiO1/2)e(R2 2SiO2/2)f(R2SiO3/2)g(SiO4/2)h
(R1R2SiO2/2)
(R3 2SiO2/2)
ポリオルガノシロキサン(A)は、25℃での粘度が500cP以上、1、000cP以上、2、000cP以上、3、000cP以上、4、000cP以上、5、000cP以上、7、000cP以上、9、000cP以上または9、500cP以上とすることができる。このような範囲で硬化性組成物の加工性と硬化後の硬度特性などを適切に維持することができる。前記粘度の上限は特に制限されないが、例えば、前記粘度は、300、000cP以下、200、000cP以下、100、000cP以下、90、000cP以下、80、000cP以下、70、000cP以下または65、000cP以下とすることができる。
[RgSiO3/2]
[RhRi 2SiO1/2]p[RgSiO3/2]q
(RhRi 2Si)2O
硬化性組成物は、またケイ素原子に結合している水素原子を含むケイ素化合物(ケイ素化合物(C))を含むことができる。ケイ素化合物(C)は、水素原子を1つ以上または2つ以上有することができる。
R4 3SiO(R4 2SiO)nSiR4 3
(R5 3SiO1/2)a(R5 2SiO2/2)b(R5SiO3/2)c(SiO2)d
|P−Q|≦0.1
硬化性組成物を1mmの間隔に離隔されている2枚のガラス板との間に注入し、150℃で1時間の間維持することで硬化させて厚さが1mmの板状の試験片を製造し、常温でUV−VISスペクトロメータ(spectrometer)を用いて450nm波長に対する前記試験片の厚さ方向の光透過率を測定し、下記基準に従って評価を行う。
○:光透過度が98%以上である場合
×:光透過度が98%未満である場合
ポリフタルアミド(PPA)で製造された6020LEDパッケージを用いて素子特性の評価を行う。ポリフタルアミドカップ内に硬化性組成物をディスフェンシングし、70℃で30分間維持した後、さらに150℃で1時間の間維持して硬化させて表面実装型LEDを製造する。
LEDを−40℃で30分間維持し、さらに100℃で30分間維持することを1サイクルとし、前記を10回、すなわち10サイクル繰り返した後に室温に維持し、剥離状態を調査して耐熱衝撃性を評価する。評価時には同一硬化性組成物で製造されたLED10個に対してそれぞれ前記のような試験を行い、剥離したLEDの数を下記の表1に記載した。
LEDを85℃および85%の相対湿度の条件下で維持した状態で30mAの電流を流しながら200時間の間動作させる。続いて、動作前の初期輝度に対する前記動作後の後期輝度の減少率を測定し、下記基準で評価する。
○:初期輝度に対する輝度減少率が10%以下
×:初期輝度に対する輝度減少率が10%超過
(ViMe2SiO1/2)2(MePhSiO2/2)40
[化学式B]
(ViMe2SiO1/2)2(EpMeSiO2/2)0.4(PhSiO3/2)8
[化学式C]
(HMe2SiO1/2)2(HMeSiO2/2)0.5(Ph2SiO2/2)1.5
[ViMe2SiO1/2]2[Me2SiO2/2]23[Ph2SiO2/2]20
[化学式E]
[ViMe2SiO1/2]2[MePhSiO2/2][EPMeSiO2/2]0.4[PhSiO3/2]8
[化学式F]
(HMe2SiO1/2)2(Ph2SiO2/2)1.5
[化学式G]
[HMe2SiO1/2]3[PhSiO3/2]3
化学式Aのポリオルガノシロキサンの使用を除いて実施例1と同様に硬化性組成物を製造した。
化学式Dのポリオルガノシロキサンの使用を除いて実施例2と同様に硬化性組成物を製造した。
化学式Bのポリオルガノシロキサンは使用せず、下記化学式Hのポリオルガノシロキサンの使用を除いて実施例1と同様に硬化性組成物を製造した。
(ViMe2SiO1/2)2(PhSiO3/2)8
化学式Bのポリオルガノシロキサンは使用せず、下記化学式Iのポリオルガノシロキサンの使用を除いて実施例1と同様に硬化性組成物を製造した。
(ViMe2SiO1/2)2(EpMeSiO2/2)3(PhSiO3/2)6
Claims (20)
- (A)下記化学式1の平均組成式を有するポリオルガノシロキサンと、
(B)下記化学式2の平均組成式を有し、ケイ素原子のモル数(Si)およびエポキシ基のモル数(Ep)の割合(Ep/Si)が0.15以下のポリオルガノシロキサンと、
(C)ケイ素原子結合水素原子を有する化合物と、
を含むことを特徴とする硬化性組成物:
[化学式1]
(R1 3SiO1/2)a(R1 2SiO2/2)b(R1SiO3/2)c(SiO4/2)d
[化学式2]
(R2 3SiO1/2)e(R2 2SiO2/2)f(R2SiO3/2)g(SiO4/2)h
(前記化学式1及び2において、R1は一価炭化水素基であり、R2はエポキシ基または一価炭化水素基であり、R1のうち少なくとも1つはアルケニル基であり、R2のうち少なくとも1つはアルケニル基であり、R2のうち少なくとも1つはエポキシ基であり、aは0または正数であり、bは正数であり、cは0または正数であり、dは0または正数であり、b/(b+c+d)は0.65以上であり、eは正数であり、fは0または正数であり、gは正数であり、hは0または正数であり、f/(f+g+h)は0.65未満である)。 - ポリオルガノシロキサン(A)の全てのケイ素原子のモル数(Si)およびアルケニル基のモル数(Ak)の割合(Ak/Si)が0.01〜0.2であることを特徴とする請求項1に記載の硬化性組成物。
- ポリオルガノシロキサン(A)がケイ素原子に結合されているアリール基を1つ以上含むことを特徴とする請求項1に記載の硬化性組成物。
- ポリオルガノシロキサン(A)の全てのケイ素原子のモル数(Si)およびアリール基のモル数(Ar)の割合(Ar/Si)が0.5〜1.5であることを特徴とする請求項3に記載の硬化性組成物。
- ポリオルガノシロキサン(B)の全てのケイ素原子のモル数(Si)およびアルケニル基のモル数(Ak)の割合(Ak/Si)が0.05〜0.4であることを特徴とする請求項1に記載の硬化性組成物。
- ポリオルガノシロキサン(B)がケイ素原子に結合されているアリール基を1つ以上含むことを特徴とする請求項1に記載の硬化性組成物。
- ポリオルガノシロキサン(B)の全てのケイ素原子のモル数(Si)およびアリール基のモル数(Ar)の割合(Ar/Si)が0.5〜1.5であることを特徴とする請求項6に記載の硬化性組成物。
- ポリオルガノシロキサン(B)の全てのケイ素原子のモル数(Si)およびエポキシ基のモル数(Ep)の割合(Ep/Si)が0.1以下であることを特徴とする請求項1に記載の硬化性組成物。
- 化学式2において、(e+f)/(e+f+g+h)が0.2〜0.7であり、f/(f+g+h)が0.3以下であり、g/(g+h)が0.8以上であることを特徴とする請求項1に記載の硬化性組成物。
- ポリオルガノシロキサン(B)は、25℃での粘度が5、000cP以上であることを特徴とする請求項1に記載の硬化性組成物。
- ポリオルガノシロキサン(B)は、重量平均分子量が800〜100、000であることを特徴とする請求項1に記載の硬化性組成物。
- ポリオルガノシロキサン(B)は、ポリオルガノシロキサン(A)100重量部に対して50重量部以上の割合で含むことを特徴とする請求項1に記載の硬化性組成物。
- ケイ素化合物(C)は、下記化学式15の化合物または下記化学式16の平均組成式を有する化合物であることを特徴とする請求項1に記載の硬化性組成物:
[化学式15]
R4 3SiO(R4 2SiO)nSiR4 3
[化学式16]
(R5 3SiO1/2)a(R5 2SiO2/2)b(R5SiO3/2)c(SiO2)d
(前記化学式15および16において、R4はそれぞれ独立的な水素または一価の炭化水素基であり、R4のうち少なくとも2つは水素原子であり、R4のうち少なくとも1つはアリール基であり、nは1〜100であり、R5はそれぞれ独立的な水素または一価の炭化水素基であり、R5のうち少なくとも2つは水素原子であり、R5のうち少なくとも1つはアリール基であり、aは正数であり、bは0または正数であり、cは正数であり、dは正数である)。 - ケイ素化合物(C)の全てのケイ素原子のモル数(Si)およびケイ素原子結合水素原子のモル数(H)の割合(H/Si)は、0.2〜0.8であることを特徴とする請求項1に記載の硬化性組成物。
- ケイ素化合物(C)は、ケイ素原子に結合されているアリール基を1つ以上含むことを特徴とする請求項1に記載の硬化性組成物。
- ケイ素化合物(C)の全てのケイ素原子のモル数(Si)およびアリール基のモル数(Ar)の割合(Ar/Si)は、0.5〜1.5であることを特徴とする請求項15に記載の硬化性組成物。
- ポリオルガノシロキサン(A)およびポリオルガノシロキサン(B)の全てのアルケニル基のモル数(Ak)とケイ素化合物(C)の全てのケイ素原子結合水素原子のモル数(H)との割合(H/Ak)は、0.5〜2.0であることを特徴とする請求項1に記載の硬化性組成物。
- 硬化された請求項1に記載の硬化性組成物に封止されることを特徴とする光半導体。
- 請求項18に記載の光半導体をバックライトユニットに含むことを特徴とする液晶ディスプレイ。
- 請求項18に記載の光半導体を含むことを特徴とする照明器具。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2012-0082686 | 2012-07-27 | ||
KR20120082686 | 2012-07-27 | ||
PCT/KR2013/006798 WO2014017887A1 (ko) | 2012-07-27 | 2013-07-29 | 경화성 조성물 |
KR10-2013-0089715 | 2013-07-29 | ||
KR1020130089715A KR101560045B1 (ko) | 2012-07-27 | 2013-07-29 | 경화성 조성물 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015524496A JP2015524496A (ja) | 2015-08-24 |
JP5987221B2 true JP5987221B2 (ja) | 2016-09-07 |
Family
ID=50264926
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015523023A Active JP5987221B2 (ja) | 2012-07-27 | 2013-07-29 | 硬化性組成物 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9243166B2 (ja) |
EP (1) | EP2878634B1 (ja) |
JP (1) | JP5987221B2 (ja) |
KR (1) | KR101560045B1 (ja) |
CN (1) | CN104487517B (ja) |
TW (1) | TWI519604B (ja) |
WO (1) | WO2014017887A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105940040B (zh) * | 2014-01-28 | 2019-04-02 | 株式会社Lg化学 | 固化产物 |
JP6272747B2 (ja) * | 2014-12-08 | 2018-01-31 | 信越化学工業株式会社 | 加熱硬化型シリコーン組成物、該組成物からなるダイボンド材及び該ダイボンド材の硬化物を用いた光半導体装置 |
WO2018236127A1 (en) * | 2017-06-19 | 2018-12-27 | Dow Silicones Corporation | LIQUID SILICONE COMPOSITION FOR TRANSFER OR INJECTION MOLDING OF OPTICAL PARTS, OPTICAL PARTS MADE THEREFROM, AND CORRESPONDING PROCESS |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01287169A (ja) * | 1988-04-01 | 1989-11-17 | Toshiba Silicone Co Ltd | 導電性シリコーンゴム組成物 |
JPH08113696A (ja) * | 1994-10-14 | 1996-05-07 | Toray Dow Corning Silicone Co Ltd | 粉体塗料用樹脂組成物 |
JP3241338B2 (ja) | 1998-01-26 | 2001-12-25 | 日亜化学工業株式会社 | 半導体発光装置 |
JP2001196151A (ja) | 2000-01-12 | 2001-07-19 | Takazono Sangyo Kk | 発熱体装置及び発熱体温度制御方法 |
JP2002226551A (ja) | 2001-01-31 | 2002-08-14 | Matsushita Electric Ind Co Ltd | 発光ダイオード |
JP4948716B2 (ja) * | 2001-06-29 | 2012-06-06 | 東レ・ダウコーニング株式会社 | 硬化性エポキシ樹脂組成物 |
JP4050070B2 (ja) * | 2002-02-28 | 2008-02-20 | 東レ・ダウコーニング株式会社 | シリコーンレジン組成物、硬化性樹脂組成物、および硬化物 |
JP4908736B2 (ja) * | 2003-10-01 | 2012-04-04 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
DE602004016776D1 (de) * | 2003-12-26 | 2008-11-06 | Dow Corning Toray Co Ltd | Härtbare silikonzusammensetzung und ihre verwendung als klebstoff |
JP2006063092A (ja) * | 2004-07-29 | 2006-03-09 | Dow Corning Toray Co Ltd | 硬化性オルガノポリシロキサン組成物、その硬化方法、光半導体装置および接着促進剤 |
JP4757504B2 (ja) * | 2005-02-03 | 2011-08-24 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 剥離性硬化皮膜形成用シリコーン組成物 |
JP5392805B2 (ja) * | 2005-06-28 | 2014-01-22 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン樹脂組成物および光学部材 |
JP5060074B2 (ja) * | 2006-05-11 | 2012-10-31 | 東レ・ダウコーニング株式会社 | 接着促進剤、硬化性オルガノポリシロキサン組成物、および半導体装置 |
JP5248012B2 (ja) * | 2006-12-25 | 2013-07-31 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物 |
KR20100048996A (ko) * | 2007-06-15 | 2010-05-11 | 세키스이가가쿠 고교가부시키가이샤 | 광 반도체 소자용 밀봉제 및 광 반도체 소자 |
JP5136963B2 (ja) * | 2008-03-24 | 2013-02-06 | 信越化学工業株式会社 | 硬化性シリコーンゴム組成物及び半導体装置 |
JP5972512B2 (ja) * | 2008-06-18 | 2016-08-17 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物及び半導体装置 |
EP2530740B1 (en) * | 2010-01-25 | 2018-08-01 | LG Chem, Ltd. | Photovoltaic module |
EP2530123B1 (en) * | 2010-01-25 | 2015-11-11 | LG Chem, Ltd. | Curable composition |
JP5825687B2 (ja) * | 2010-01-25 | 2015-12-02 | エルジー・ケム・リミテッド | 光電池用シート |
CN102712756B (zh) * | 2010-01-25 | 2017-05-03 | Lg化学株式会社 | 有机硅树脂 |
JP5748773B2 (ja) * | 2010-01-25 | 2015-07-15 | エルジー・ケム・リミテッド | 硬化性組成物 |
JP5170471B2 (ja) * | 2010-09-02 | 2013-03-27 | 信越化学工業株式会社 | 低ガス透過性シリコーン樹脂組成物及び光半導体装置 |
WO2012091000A1 (ja) * | 2010-12-27 | 2012-07-05 | 東レ・ダウコーニング株式会社 | 硬化性エポキシ樹脂組成物 |
KR20120078606A (ko) * | 2010-12-31 | 2012-07-10 | 제일모직주식회사 | 봉지재 및 상기 봉지재를 포함하는 전자 소자 |
KR101453615B1 (ko) * | 2011-11-25 | 2014-10-27 | 주식회사 엘지화학 | 경화성 조성물 |
-
2013
- 2013-07-29 WO PCT/KR2013/006798 patent/WO2014017887A1/ko active Application Filing
- 2013-07-29 KR KR1020130089715A patent/KR101560045B1/ko active IP Right Grant
- 2013-07-29 CN CN201380039685.4A patent/CN104487517B/zh active Active
- 2013-07-29 EP EP13823004.0A patent/EP2878634B1/en active Active
- 2013-07-29 JP JP2015523023A patent/JP5987221B2/ja active Active
- 2013-07-29 TW TW102127096A patent/TWI519604B/zh active
-
2015
- 2015-01-27 US US14/606,682 patent/US9243166B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2014017887A1 (ko) | 2014-01-30 |
EP2878634A4 (en) | 2016-03-02 |
EP2878634A1 (en) | 2015-06-03 |
JP2015524496A (ja) | 2015-08-24 |
US20150137171A1 (en) | 2015-05-21 |
KR20140015217A (ko) | 2014-02-06 |
US9243166B2 (en) | 2016-01-26 |
KR101560045B1 (ko) | 2015-10-15 |
CN104487517A (zh) | 2015-04-01 |
TWI519604B (zh) | 2016-02-01 |
EP2878634B1 (en) | 2017-10-04 |
TW201418367A (zh) | 2014-05-16 |
CN104487517B (zh) | 2017-06-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5907262B2 (ja) | 硬化性組成物 | |
JP5850446B2 (ja) | 硬化性組成物 | |
JP6542811B2 (ja) | 硬化性組成物 | |
JP6203189B2 (ja) | 硬化性組成物 | |
JP6108132B2 (ja) | 硬化性組成物 | |
KR101560036B1 (ko) | 경화성 조성물 | |
JP5871413B2 (ja) | 硬化性組成物 | |
KR101443979B1 (ko) | 경화성 조성물 | |
JP5831959B2 (ja) | 硬化性組成物 | |
JP6066385B2 (ja) | 硬化性組成物 | |
JP5987221B2 (ja) | 硬化性組成物 | |
JP6432844B2 (ja) | 硬化性組成物 | |
JP5893212B2 (ja) | 硬化性組成物 | |
KR20130058641A (ko) | 경화성 조성물 | |
JP5893209B2 (ja) | 硬化性組成物 | |
JP6350887B2 (ja) | 硬化性組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20151218 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160104 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160404 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160711 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160719 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5987221 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |