KR101109883B1 - 반도체 장치 - Google Patents
반도체 장치 Download PDFInfo
- Publication number
- KR101109883B1 KR101109883B1 KR1020050013190A KR20050013190A KR101109883B1 KR 101109883 B1 KR101109883 B1 KR 101109883B1 KR 1020050013190 A KR1020050013190 A KR 1020050013190A KR 20050013190 A KR20050013190 A KR 20050013190A KR 101109883 B1 KR101109883 B1 KR 101109883B1
- Authority
- KR
- South Korea
- Prior art keywords
- delete delete
- memory
- mos transistor
- circuit
- voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/004—Reading or sensing circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0004—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0033—Disturbance prevention or evaluation; Refreshing of disturbed memory data
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0064—Verifying circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0069—Writing or programming circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/34—Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
- G11C16/3436—Arrangements for verifying correct programming or erasure
- G11C16/3454—Arrangements for verifying correct programming or for detecting overprogrammed cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0069—Writing or programming circuits or methods
- G11C2013/0092—Write characterized by the shape, e.g. form, length, amplitude of the write pulse
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/82—Array having, for accessing a cell, a word line, a bit line and a plate or source line receiving different potentials
Landscapes
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004043948 | 2004-02-20 | ||
| JPJP-P-2004-00043948 | 2004-02-20 | ||
| JPJP-P-2005-00001979 | 2005-01-07 | ||
| JP2005001979A JP4646636B2 (ja) | 2004-02-20 | 2005-01-07 | 半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020110062555A Division KR101149273B1 (ko) | 2004-02-20 | 2011-06-27 | 반도체 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20060042055A KR20060042055A (ko) | 2006-05-12 |
| KR101109883B1 true KR101109883B1 (ko) | 2012-03-13 |
Family
ID=34863502
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020050013190A Expired - Fee Related KR101109883B1 (ko) | 2004-02-20 | 2005-02-17 | 반도체 장치 |
| KR1020110062555A Expired - Fee Related KR101149273B1 (ko) | 2004-02-20 | 2011-06-27 | 반도체 장치 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020110062555A Expired - Fee Related KR101149273B1 (ko) | 2004-02-20 | 2011-06-27 | 반도체 장치 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US7206216B2 (enExample) |
| JP (1) | JP4646636B2 (enExample) |
| KR (2) | KR101109883B1 (enExample) |
| CN (2) | CN101587746B (enExample) |
| TW (1) | TW200534469A (enExample) |
Families Citing this family (66)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100498493B1 (ko) * | 2003-04-04 | 2005-07-01 | 삼성전자주식회사 | 저전류 고속 상변화 메모리 및 그 구동 방식 |
| JP4646636B2 (ja) * | 2004-02-20 | 2011-03-09 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US8335103B2 (en) * | 2004-09-30 | 2012-12-18 | Nxp B.V. | Integrated circuit with memory cells comprising a programmable resistor and method for addressing memory cells comprising a programmable resistor |
| KR100657944B1 (ko) * | 2005-01-12 | 2006-12-14 | 삼성전자주식회사 | 상전이 램 동작 방법 |
| US8036013B2 (en) * | 2005-03-30 | 2011-10-11 | Ovonyx, Inc. | Using higher current to read a triggered phase change memory |
| US7453715B2 (en) * | 2005-03-30 | 2008-11-18 | Ovonyx, Inc. | Reading a phase change memory |
| US20060284156A1 (en) * | 2005-06-16 | 2006-12-21 | Thomas Happ | Phase change memory cell defined by imprint lithography |
| US7460389B2 (en) * | 2005-07-29 | 2008-12-02 | International Business Machines Corporation | Write operations for phase-change-material memory |
| JP4867297B2 (ja) * | 2005-11-08 | 2012-02-01 | ソニー株式会社 | 記憶装置のベリファイ方法 |
| KR100738092B1 (ko) * | 2006-01-05 | 2007-07-12 | 삼성전자주식회사 | 상전이 메모리 소자의 멀티-비트 동작 방법 |
| US7859896B2 (en) | 2006-02-02 | 2010-12-28 | Renesas Electronics Corporation | Semiconductor device |
| JP4922645B2 (ja) * | 2006-03-31 | 2012-04-25 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| KR100763253B1 (ko) * | 2006-05-30 | 2007-10-04 | 삼성전자주식회사 | 반도체 메모리 장치 및 그에 따른 프리차아지 방법 |
| WO2007141865A1 (ja) * | 2006-06-08 | 2007-12-13 | Renesas Technology Corp. | 半導体装置及びその製造方法 |
| JP5072843B2 (ja) * | 2006-07-21 | 2012-11-14 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| EP1898425A1 (fr) * | 2006-09-05 | 2008-03-12 | Stmicroelectronics Sa | Mémoire à changement de phase comprenant un décodeur de colonne basse tension |
| WO2008029446A1 (fr) * | 2006-09-05 | 2008-03-13 | Fujitsu Limited | Procédé d'écriture d'appareil de stockage a semi-conducteur non volatil |
| US7885102B2 (en) | 2006-09-15 | 2011-02-08 | Renesas Electronics Corporation | Semiconductor device |
| WO2008035392A1 (en) * | 2006-09-19 | 2008-03-27 | Renesas Technology Corp. | Semiconductor integrated circuit device |
| KR100827703B1 (ko) * | 2006-12-14 | 2008-05-07 | 삼성전자주식회사 | 상변화메모리 장치의 테스트 방법 |
| KR100843144B1 (ko) * | 2006-12-20 | 2008-07-02 | 삼성전자주식회사 | 저항체를 이용한 비휘발성 메모리 장치 및 그 구동 방법 |
| US8139432B2 (en) * | 2006-12-27 | 2012-03-20 | Samsung Electronics Co., Ltd. | Variable resistance memory device and system thereof |
| KR100886215B1 (ko) * | 2006-12-27 | 2009-03-02 | 삼성전자주식회사 | 저항체를 이용한 비휘발성 메모리 장치 |
| US7626860B2 (en) * | 2007-03-23 | 2009-12-01 | International Business Machines Corporation | Optimized phase change write method |
| US7817454B2 (en) | 2007-04-03 | 2010-10-19 | Micron Technology, Inc. | Variable resistance memory with lattice array using enclosing transistors |
| KR100843242B1 (ko) * | 2007-04-04 | 2008-07-02 | 삼성전자주식회사 | 플래시 메모리 장치 및 그 구동방법 |
| JP5413938B2 (ja) * | 2007-05-08 | 2014-02-12 | ピーエスフォー ルクスコ エスエイアールエル | 半導体記憶装置及びその書き込み制御方法 |
| US7929332B2 (en) * | 2007-06-29 | 2011-04-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor memory device and semiconductor device |
| WO2009013819A1 (ja) * | 2007-07-25 | 2009-01-29 | Renesas Technology Corp. | 半導体記憶装置 |
| JP2009032349A (ja) * | 2007-07-30 | 2009-02-12 | Panasonic Corp | 不揮発性メモリ制御システム |
| US8179739B2 (en) * | 2007-08-10 | 2012-05-15 | Renesas Electronics Corporation | Semiconductor device and its manufacturing method |
| JP5291311B2 (ja) * | 2007-08-31 | 2013-09-18 | 株式会社アイ・オー・データ機器 | Usbストレージシステムおよびデータ転送制御用のプログラム |
| KR101384357B1 (ko) * | 2007-11-20 | 2014-04-15 | 삼성전자주식회사 | 상 변화 메모리 장치 및 이의 비트라인 디스차지 방법 |
| US7791933B2 (en) * | 2007-12-21 | 2010-09-07 | International Business Machines Corporation | Optimized phase change write method |
| US20090046499A1 (en) * | 2008-02-05 | 2009-02-19 | Qimonda Ag | Integrated circuit including memory having limited read |
| KR101452957B1 (ko) * | 2008-02-21 | 2014-10-21 | 삼성전자주식회사 | 리드 와일 라이트 동작시 커플링 노이즈를 방지할 수 있는상 변화 메모리 장치 |
| DE102008015585B4 (de) | 2008-03-19 | 2022-05-25 | Samsung Electronics Co., Ltd. | Nichtflüchtiges Speicherbauelement |
| US7990761B2 (en) | 2008-03-31 | 2011-08-02 | Ovonyx, Inc. | Immunity of phase change material to disturb in the amorphous phase |
| EP2107571B1 (en) * | 2008-04-03 | 2012-04-25 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device |
| KR101415877B1 (ko) | 2008-05-19 | 2014-07-07 | 삼성전자 주식회사 | 저항체를 이용한 비휘발성 메모리 장치 |
| US8094485B2 (en) | 2008-05-22 | 2012-01-10 | Panasonic Corporation | Variable resistance nonvolatile storage device with oxygen-deficient oxide layer and asymmetric substrate bias effect |
| JP5221222B2 (ja) * | 2008-06-25 | 2013-06-26 | 株式会社東芝 | 半導体記憶装置 |
| WO2010004652A1 (ja) * | 2008-07-11 | 2010-01-14 | 株式会社ルネサステクノロジ | 相変化メモリ、半導体装置及びrfidモジュール |
| KR101412941B1 (ko) | 2008-07-29 | 2014-06-26 | 누모닉스 비.브이. | 프로그래밍 후 복구 지연을 감소시키기 위한 상-변화 셀 판독용 포텐셜 극성 반전 |
| WO2010021134A1 (ja) | 2008-08-20 | 2010-02-25 | パナソニック株式会社 | 抵抗変化型不揮発性記憶装置およびメモリセルの形成方法 |
| US8228714B2 (en) * | 2008-09-09 | 2012-07-24 | Qualcomm Incorporated | Memory device for resistance-based memory applications |
| TWI453744B (zh) * | 2008-10-09 | 2014-09-21 | Micron Technology Inc | 反轉極性以讀取相變單元致使縮短程式化後之延遲 |
| JP5127661B2 (ja) * | 2008-10-10 | 2013-01-23 | 株式会社東芝 | 半導体記憶装置 |
| JP5127665B2 (ja) * | 2008-10-23 | 2013-01-23 | 株式会社東芝 | 半導体記憶装置 |
| KR101537316B1 (ko) * | 2008-11-14 | 2015-07-16 | 삼성전자주식회사 | 상 변화 메모리 장치 |
| JP2010123209A (ja) * | 2008-11-20 | 2010-06-03 | Elpida Memory Inc | メモリ装置及びその書き込み方法 |
| KR20100064714A (ko) * | 2008-12-05 | 2010-06-15 | 삼성전자주식회사 | 저항체를 이용한 비휘발성 메모리 장치 |
| US8194441B2 (en) * | 2010-09-23 | 2012-06-05 | Micron Technology, Inc. | Phase change memory state determination using threshold edge detection |
| US8885399B2 (en) * | 2011-03-29 | 2014-11-11 | Nxp B.V. | Phase change memory (PCM) architecture and a method for writing into PCM architecture |
| TW201417102A (zh) * | 2012-10-23 | 2014-05-01 | Ind Tech Res Inst | 電阻式記憶體裝置 |
| JP5647722B2 (ja) * | 2013-11-07 | 2015-01-07 | ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. | 半導体装置 |
| US9530523B2 (en) * | 2014-06-25 | 2016-12-27 | Intel Corporation | Thermal disturb as heater in cross-point memory |
| JP6426940B2 (ja) * | 2014-08-19 | 2018-11-21 | ルネサスエレクトロニクス株式会社 | 半導体装置及びフォーミング方法 |
| KR102514045B1 (ko) * | 2016-04-21 | 2023-03-24 | 삼성전자주식회사 | 저항성 메모리 장치 및 이를 포함하는 메모리 시스템 |
| IT201600098496A1 (it) | 2016-09-30 | 2018-03-30 | St Microelectronics Srl | Decodificatore di indirizzo per una matrice di memoria non volatile utilizzante transistori mos di selezione |
| KR102634322B1 (ko) * | 2016-10-10 | 2024-02-07 | 삼성전자주식회사 | 양방향 스위치를 갖는 가변 저항 메모리 장치, 메모리 시스템, 그리고 그것의 동작 방법 |
| US10205088B2 (en) * | 2016-10-27 | 2019-02-12 | Tdk Corporation | Magnetic memory |
| US10311921B1 (en) * | 2017-12-29 | 2019-06-04 | Sandisk Technologies Llc | Multiple-mode current sources for sense operations |
| US10727275B2 (en) * | 2018-05-18 | 2020-07-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Memory layout for reduced line loading |
| CN111276177B (zh) * | 2020-02-21 | 2022-05-03 | 京东方科技集团股份有限公司 | 移位寄存器及其驱动方法、栅极驱动电路、显示装置 |
| WO2023212887A1 (en) * | 2022-05-06 | 2023-11-09 | Yangtze Advanced Memory Industrial Innovation Center Co., Ltd | Memory peripheral circuit having recessed channel transistors with elevated sources/drains and method for forming thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040012995A1 (en) | 2002-07-18 | 2004-01-22 | Masatoshi Ishikawa | Thim film magnetic memory device permitting high precision data read |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57172761A (en) * | 1981-04-17 | 1982-10-23 | Hitachi Ltd | Semiconductor integrated circuit |
| JPH0729996A (ja) * | 1993-07-12 | 1995-01-31 | Seiko Epson Corp | 半導体記憶装置 |
| JP2001015704A (ja) * | 1999-06-29 | 2001-01-19 | Hitachi Ltd | 半導体集積回路 |
| US6141255A (en) * | 1999-09-02 | 2000-10-31 | Advanced Micro Devices, Inc. | 1 transistor cell for EEPROM application |
| TW584976B (en) * | 2000-11-09 | 2004-04-21 | Sanyo Electric Co | Magnetic memory device |
| JP4731041B2 (ja) * | 2001-05-16 | 2011-07-20 | ルネサスエレクトロニクス株式会社 | 薄膜磁性体記憶装置 |
| US6590807B2 (en) * | 2001-08-02 | 2003-07-08 | Intel Corporation | Method for reading a structural phase-change memory |
| JP2003100084A (ja) | 2001-09-27 | 2003-04-04 | Toshiba Corp | 相変化型不揮発性記憶装置 |
| JP2003179162A (ja) * | 2001-12-12 | 2003-06-27 | Matsushita Electric Ind Co Ltd | 半導体記憶装置 |
| US7116593B2 (en) * | 2002-02-01 | 2006-10-03 | Hitachi, Ltd. | Storage device |
| JP4294256B2 (ja) * | 2002-03-28 | 2009-07-08 | 株式会社ルネサステクノロジ | 半導体記憶装置 |
| JP4282314B2 (ja) * | 2002-06-25 | 2009-06-17 | シャープ株式会社 | 記憶装置 |
| JP4242117B2 (ja) * | 2002-07-11 | 2009-03-18 | 株式会社ルネサステクノロジ | 記憶装置 |
| JP4376495B2 (ja) * | 2002-08-13 | 2009-12-02 | 富士通マイクロエレクトロニクス株式会社 | 半導体メモリ |
| US6903982B2 (en) * | 2002-10-10 | 2005-06-07 | Infineon Technologies Ag | Bit line segmenting in random access memories |
| JP4355136B2 (ja) * | 2002-12-05 | 2009-10-28 | シャープ株式会社 | 不揮発性半導体記憶装置及びその読み出し方法 |
| US7064970B2 (en) * | 2003-11-04 | 2006-06-20 | Micron Technology, Inc. | Serial transistor-cell array architecture |
| JP4322645B2 (ja) * | 2003-11-28 | 2009-09-02 | 株式会社日立製作所 | 半導体集積回路装置 |
| JP4385778B2 (ja) * | 2004-01-29 | 2009-12-16 | ソニー株式会社 | 記憶装置 |
| JP4646636B2 (ja) * | 2004-02-20 | 2011-03-09 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US7064670B2 (en) | 2004-02-25 | 2006-06-20 | Dmatek, Ltd. | Method and apparatus for portable transmitting devices |
-
2005
- 2005-01-07 JP JP2005001979A patent/JP4646636B2/ja not_active Expired - Fee Related
- 2005-01-21 TW TW094101903A patent/TW200534469A/zh not_active IP Right Cessation
- 2005-02-15 US US11/057,682 patent/US7206216B2/en not_active Expired - Fee Related
- 2005-02-17 KR KR1020050013190A patent/KR101109883B1/ko not_active Expired - Fee Related
- 2005-02-18 CN CN2009101513831A patent/CN101587746B/zh not_active Expired - Fee Related
- 2005-02-18 CN CNB2005100093026A patent/CN100533596C/zh not_active Expired - Fee Related
-
2007
- 2007-03-09 US US11/715,918 patent/US7385838B2/en not_active Expired - Fee Related
-
2011
- 2011-06-27 KR KR1020110062555A patent/KR101149273B1/ko not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040012995A1 (en) | 2002-07-18 | 2004-01-22 | Masatoshi Ishikawa | Thim film magnetic memory device permitting high precision data read |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101587746A (zh) | 2009-11-25 |
| JP4646636B2 (ja) | 2011-03-09 |
| KR101149273B1 (ko) | 2012-05-25 |
| US20070159871A1 (en) | 2007-07-12 |
| TW200534469A (en) | 2005-10-16 |
| KR20110090861A (ko) | 2011-08-10 |
| JP2005267837A (ja) | 2005-09-29 |
| KR20060042055A (ko) | 2006-05-12 |
| CN101587746B (zh) | 2011-01-26 |
| US7206216B2 (en) | 2007-04-17 |
| US20050185445A1 (en) | 2005-08-25 |
| CN1658328A (zh) | 2005-08-24 |
| US7385838B2 (en) | 2008-06-10 |
| CN100533596C (zh) | 2009-08-26 |
| TWI359491B (enExample) | 2012-03-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101109883B1 (ko) | 반도체 장치 | |
| US8787068B2 (en) | Semiconductor device | |
| JP4524455B2 (ja) | 半導体装置 | |
| KR100855585B1 (ko) | 소오스 라인 공유구조를 갖는 저항성 랜덤 억세스 메모리및 그에 따른 데이터 억세스 방법 | |
| US7239562B2 (en) | Semiconductor device | |
| US9318158B2 (en) | Non-volatile memory using bi-directional resistive elements | |
| US8139404B2 (en) | Semiconductor memory device | |
| US7778071B2 (en) | Phase change memory device having decentralized driving units | |
| KR20060080545A (ko) | 반도체 장치 | |
| JP2012027972A (ja) | 抵抗変化型メモリデバイスおよびその駆動方法 | |
| US9361976B2 (en) | Sense amplifier including a single-transistor amplifier and level shifter and methods therefor | |
| US9324430B2 (en) | Method for defining a default state of a charge trap based memory cell | |
| KR20120069942A (ko) | 사전 디스차지 기능을 갖는 반도체 메모리 장치, 이를 포함하는 반도체 집적 회로 및 이것의 구동 방법 | |
| JP4668668B2 (ja) | 半導体装置 | |
| JP5135406B2 (ja) | 半導体装置 | |
| KR101051166B1 (ko) | 상 변화 메모리 장치 | |
| JP2015149108A (ja) | 半導体装置及び記憶装置並びにその制御方法 | |
| JP2013206529A (ja) | 半導体記憶装置 | |
| US8264871B2 (en) | Phase change memory device | |
| JP2008071384A (ja) | 半導体記憶装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| A201 | Request for examination | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| N231 | Notification of change of applicant | ||
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| A107 | Divisional application of patent | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0107 | Divisional application |
St.27 status event code: A-0-1-A10-A18-div-PA0107 St.27 status event code: A-0-1-A10-A16-div-PA0107 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20150119 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20150119 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |