KR101039994B1 - 발광소자 및 이를 구비한 라이트 유닛 - Google Patents

발광소자 및 이를 구비한 라이트 유닛 Download PDF

Info

Publication number
KR101039994B1
KR101039994B1 KR1020100048291A KR20100048291A KR101039994B1 KR 101039994 B1 KR101039994 B1 KR 101039994B1 KR 1020100048291 A KR1020100048291 A KR 1020100048291A KR 20100048291 A KR20100048291 A KR 20100048291A KR 101039994 B1 KR101039994 B1 KR 101039994B1
Authority
KR
South Korea
Prior art keywords
light emitting
cavity
barrier
resin layer
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020100048291A
Other languages
English (en)
Korean (ko)
Inventor
공성민
안중인
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020100048291A priority Critical patent/KR101039994B1/ko
Priority to US13/110,106 priority patent/US8324654B2/en
Priority to EP11167007.1A priority patent/EP2390915B1/en
Priority to TW100117689A priority patent/TWI521750B/zh
Priority to JP2011115439A priority patent/JP2011249807A/ja
Priority to CN201110139991.8A priority patent/CN102263098B/zh
Application granted granted Critical
Publication of KR101039994B1 publication Critical patent/KR101039994B1/ko
Priority to US13/690,764 priority patent/US8860072B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8502—Surface mount technology [SMT] type packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/852—Encapsulations
    • H10H29/853—Encapsulations characterised by their shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
KR1020100048291A 2010-05-24 2010-05-24 발광소자 및 이를 구비한 라이트 유닛 Expired - Fee Related KR101039994B1 (ko)

Priority Applications (7)

Application Number Priority Date Filing Date Title
KR1020100048291A KR101039994B1 (ko) 2010-05-24 2010-05-24 발광소자 및 이를 구비한 라이트 유닛
US13/110,106 US8324654B2 (en) 2010-05-24 2011-05-18 Light emitting device and light unit having the same
EP11167007.1A EP2390915B1 (en) 2010-05-24 2011-05-20 Light emitting device and light unit having the same
TW100117689A TWI521750B (zh) 2010-05-24 2011-05-20 發光裝置及具有其之發光單元
JP2011115439A JP2011249807A (ja) 2010-05-24 2011-05-24 発光素子及びこれを含むライトユニット
CN201110139991.8A CN102263098B (zh) 2010-05-24 2011-05-24 发光器件及具有该发光器件的光照单元
US13/690,764 US8860072B2 (en) 2010-05-24 2012-11-30 Light emitting device and light unit having the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100048291A KR101039994B1 (ko) 2010-05-24 2010-05-24 발광소자 및 이를 구비한 라이트 유닛

Publications (1)

Publication Number Publication Date
KR101039994B1 true KR101039994B1 (ko) 2011-06-09

Family

ID=44351639

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100048291A Expired - Fee Related KR101039994B1 (ko) 2010-05-24 2010-05-24 발광소자 및 이를 구비한 라이트 유닛

Country Status (6)

Country Link
US (2) US8324654B2 (enExample)
EP (1) EP2390915B1 (enExample)
JP (1) JP2011249807A (enExample)
KR (1) KR101039994B1 (enExample)
CN (1) CN102263098B (enExample)
TW (1) TWI521750B (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011104302A1 (de) * 2011-06-16 2012-12-20 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verwendung eines derartigen Halbleiterbauelements
CN102856313A (zh) * 2011-06-29 2013-01-02 丰田合成株式会社 发光装置
WO2013010765A1 (de) * 2011-07-19 2013-01-24 Osram Opto Semiconductors Gmbh Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements
CN102903837A (zh) * 2011-07-29 2013-01-30 Lg伊诺特有限公司 发光器件封装件及包括其的照明系统
CN102916108A (zh) * 2011-08-05 2013-02-06 展晶科技(深圳)有限公司 发光二极管封装结构
KR101237794B1 (ko) * 2011-08-12 2013-02-28 주식회사 루멘스 발광소자 패키지 및 이를 구비하는 백라이트 유닛
KR20140061854A (ko) * 2012-11-14 2014-05-22 엘지이노텍 주식회사 발광 소자
KR20140073964A (ko) * 2012-12-07 2014-06-17 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 시스템
KR20140143398A (ko) * 2012-03-19 2014-12-16 오스람 옵토 세미컨덕터스 게엠베하 광전자 반도체 칩, 및 상기 반도체 칩을 포함한 헤드램프
KR20230011438A (ko) * 2017-10-31 2023-01-20 엘지디스플레이 주식회사 발광소자 패키지 및 전자기기
WO2023121406A1 (ko) * 2021-12-23 2023-06-29 엘지이노텍 주식회사 회로 기판

Families Citing this family (128)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7728345B2 (en) * 2001-08-24 2010-06-01 Cao Group, Inc. Semiconductor light source for illuminating a physical space including a 3-dimensional lead frame
EP2195864A4 (en) * 2007-08-27 2010-10-13 Lg Electronics Inc LUMINOUS ELEMENT ENCLOSURE AND LIGHTING DEVICE THEREFOR
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US8791471B2 (en) * 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
JPWO2011037185A1 (ja) * 2009-09-24 2013-02-21 京セラ株式会社 実装用基板、発光体、および実装用基板の製造方法
KR101039994B1 (ko) * 2010-05-24 2011-06-09 엘지이노텍 주식회사 발광소자 및 이를 구비한 라이트 유닛
KR101064036B1 (ko) * 2010-06-01 2011-09-08 엘지이노텍 주식회사 발광 소자 패키지 및 조명 시스템
JP2012104739A (ja) * 2010-11-12 2012-05-31 Toshiba Corp 発光素子
KR101411255B1 (ko) * 2011-01-28 2014-06-23 삼성디스플레이 주식회사 광원 모듈 및 이의 제조 방법
US20120314419A1 (en) * 2011-06-08 2012-12-13 Wen-Kung Sung Heat dissipation structure of light-emitting diode
CN103000782B (zh) * 2011-09-13 2016-09-07 展晶科技(深圳)有限公司 发光二极管封装结构
CN103094267B (zh) * 2011-11-01 2018-05-25 日亚化学工业株式会社 发光装置，照明器具
TWI508332B (zh) * 2011-11-09 2015-11-11 友達光電股份有限公司 發光光源及其顯示面板
US9223138B2 (en) 2011-12-23 2015-12-29 Microsoft Technology Licensing, Llc Pixel opacity for augmented reality
CN103187485A (zh) * 2011-12-27 2013-07-03 展晶科技(深圳)有限公司 发光二极管的制造方法
CN103187487A (zh) * 2011-12-28 2013-07-03 展晶科技(深圳)有限公司 半导体封装制程及其封装结构
JP6196018B2 (ja) * 2012-01-19 2017-09-13 株式会社小糸製作所 発光装置
US9606586B2 (en) 2012-01-23 2017-03-28 Microsoft Technology Licensing, Llc Heat transfer device
JP6064606B2 (ja) 2012-01-31 2017-01-25 日亜化学工業株式会社 発光装置
DE102013201363A1 (de) * 2012-01-31 2013-08-01 Nichia Corp. Lichtemittierendes Bauelement
US9726887B2 (en) * 2012-02-15 2017-08-08 Microsoft Technology Licensing, Llc Imaging structure color conversion
US9368546B2 (en) 2012-02-15 2016-06-14 Microsoft Technology Licensing, Llc Imaging structure with embedded light sources
US9297996B2 (en) 2012-02-15 2016-03-29 Microsoft Technology Licensing, Llc Laser illumination scanning
US9779643B2 (en) 2012-02-15 2017-10-03 Microsoft Technology Licensing, Llc Imaging structure emitter configurations
JP2013182975A (ja) * 2012-03-01 2013-09-12 Sharp Corp 発光装置及びこれを用いたバックライトシステム
US8858025B2 (en) * 2012-03-07 2014-10-14 Lg Innotek Co., Ltd. Lighting device
US9578318B2 (en) 2012-03-14 2017-02-21 Microsoft Technology Licensing, Llc Imaging structure emitter calibration
JP2013197369A (ja) * 2012-03-21 2013-09-30 Rohm Co Ltd 光源装置およびｌｅｄランプ
US11068049B2 (en) 2012-03-23 2021-07-20 Microsoft Technology Licensing, Llc Light guide display and field of view
US9558590B2 (en) 2012-03-28 2017-01-31 Microsoft Technology Licensing, Llc Augmented reality light guide display
US10191515B2 (en) 2012-03-28 2019-01-29 Microsoft Technology Licensing, Llc Mobile device light guide display
US9717981B2 (en) 2012-04-05 2017-08-01 Microsoft Technology Licensing, Llc Augmented reality and physical games
CN103378278B (zh) * 2012-04-28 2016-01-06 展晶科技(深圳)有限公司 发光二极管封装结构
KR101957884B1 (ko) * 2012-05-14 2019-03-13 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 조명 장치
US10502876B2 (en) 2012-05-22 2019-12-10 Microsoft Technology Licensing, Llc Waveguide optics focus elements
CN102709441A (zh) * 2012-05-24 2012-10-03 重庆四联光电科技有限公司 Led封装结构
US8989535B2 (en) 2012-06-04 2015-03-24 Microsoft Technology Licensing, Llc Multiple waveguide imaging structure
CN102800785A (zh) * 2012-06-25 2012-11-28 浙江英特来光电科技有限公司 一种分离式可调光贴片smdled白灯
CN103515367B (zh) * 2012-06-25 2016-10-05 青岛玉兰祥商务服务有限公司 发光二极管封装结构
DE102012105677B4 (de) * 2012-06-28 2016-06-09 Osram Opto Semiconductors Gmbh Leuchtdiodenmodul und Kfz-Scheinwerfer
KR20140004881A (ko) * 2012-07-03 2014-01-14 삼성디스플레이 주식회사 백라이트 유닛
TWM448801U (zh) * 2012-07-04 2013-03-11 台灣道康寧股份有限公司 發光二極體裝置及導線架料片
TW201403789A (zh) * 2012-07-06 2014-01-16 隆達電子股份有限公司 發光二極體陣列
TWI473294B (zh) * 2012-08-03 2015-02-11 新世紀光電股份有限公司 發光裝置
JP5686262B2 (ja) * 2012-08-17 2015-03-18 復盛精密工業股▲ふん▼有限公司 発光ダイオードのリードフレームアセンブリーの製造方法
DE102012107829B4 (de) * 2012-08-24 2024-01-25 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische Bauelemente und Verfahren zur Herstellung eines optoelektronischen Bauelements
KR101998762B1 (ko) * 2012-08-24 2019-07-10 엘지이노텍 주식회사 발광 소자 패키지
US8960933B2 (en) * 2012-08-24 2015-02-24 Salvatore Guerrieri LED housing
RU2648980C2 (ru) * 2012-08-24 2018-03-29 Филипс Лайтинг Холдинг Б.В. Испускающий свет узел, лампа и осветительный прибор
CN103682028A (zh) * 2012-08-30 2014-03-26 展晶科技(深圳)有限公司 发光二极管封装结构及其制造方法
CN103682018B (zh) * 2012-09-21 2017-04-26 展晶科技(深圳)有限公司 发光二极管及其制造方法
CN104882439B (zh) * 2012-09-29 2019-01-15 四川新力光源股份有限公司 Led器件
JP6102187B2 (ja) * 2012-10-31 2017-03-29 日亜化学工業株式会社 発光装置用パッケージ及びそれを用いた発光装置
WO2014068440A1 (en) * 2012-11-01 2014-05-08 Koninklijke Philips Electronics N.V. Led-based device with wide color gamut
CN103807665A (zh) * 2012-11-09 2014-05-21 群康科技(深圳)有限公司 液晶显示器、背光模块及其发光二极管组件
TW201418843A (zh) * 2012-11-09 2014-05-16 群康科技(深圳)有限公司 液晶顯示器、背光模組及其發光二極體組件
CN102931179A (zh) * 2012-11-14 2013-02-13 南京市江宁区丁卯电子科技中心 一种发光装置
CN103094452A (zh) * 2012-11-14 2013-05-08 南京市江宁区丁卯电子科技中心 一种led的封装方法
JP6224320B2 (ja) * 2012-12-19 2017-11-01 ローム株式会社 Ｌｅｄモジュール
US10192358B2 (en) 2012-12-20 2019-01-29 Microsoft Technology Licensing, Llc Auto-stereoscopic augmented reality display
JP6107136B2 (ja) * 2012-12-29 2017-04-05 日亜化学工業株式会社 発光装置用パッケージ及びそれを備える発光装置、並びにその発光装置を備える照明装置
TWI756532B (zh) * 2013-02-08 2022-03-01 晶元光電股份有限公司 發光二極體元件及其製造方法
JP5784261B2 (ja) 2013-02-20 2015-09-24 三菱電機株式会社 冷却装置及びこれを用いた冷却装置付きパワーモジュール
JP6476567B2 (ja) * 2013-03-29 2019-03-06 日亜化学工業株式会社 発光装置
CN103280511B (zh) * 2013-05-27 2017-02-15 广东深莱特科技股份有限公司 用于防led引线断开的分压装置及其使用方法
CN103346238A (zh) * 2013-06-24 2013-10-09 深圳雷曼光电科技股份有限公司 一种表面贴装式led支架、led器件及led显示屏
JP6484396B2 (ja) 2013-06-28 2019-03-13 日亜化学工業株式会社 発光装置用パッケージ及びそれを用いた発光装置
TWI523277B (zh) * 2013-07-12 2016-02-21 葳天科技股份有限公司 White light emitting diode module with ultraviolet light
JP2015041685A (ja) * 2013-08-21 2015-03-02 豊田合成株式会社 発光装置
KR20150025231A (ko) * 2013-08-28 2015-03-10 서울반도체 주식회사 광원 모듈 및 그 제조 방법, 및 백라이트 유닛
JP6230392B2 (ja) * 2013-11-29 2017-11-15 シチズン電子株式会社 発光装置
TWI559578B (zh) * 2014-03-11 2016-11-21 佰鴻工業股份有限公司 A light-emitting diode module with mixed light
CN103872218B (zh) * 2014-03-18 2016-09-28 深圳市瑞丰光电子股份有限公司 Led支架及led发光体
DE102014208960A1 (de) * 2014-05-12 2015-11-12 Osram Opto Semiconductors Gmbh Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zum Herstellen eines oberflächenmontierbaren optoelektronischen Bauelements
CN104037169B (zh) * 2014-06-19 2017-02-22 深圳市华星光电技术有限公司 一种led封装结构及液晶显示装置
WO2016006444A1 (ja) * 2014-07-08 2016-01-14 シャープ株式会社 発光装置
US9304235B2 (en) 2014-07-30 2016-04-05 Microsoft Technology Licensing, Llc Microfabrication
US10678412B2 (en) 2014-07-31 2020-06-09 Microsoft Technology Licensing, Llc Dynamic joint dividers for application windows
US10254942B2 (en) 2014-07-31 2019-04-09 Microsoft Technology Licensing, Llc Adaptive sizing and positioning of application windows
US10592080B2 (en) 2014-07-31 2020-03-17 Microsoft Technology Licensing, Llc Assisted presentation of application windows
KR102170218B1 (ko) * 2014-08-05 2020-10-26 엘지이노텍 주식회사 발광소자 패키지
JP6524624B2 (ja) * 2014-09-19 2019-06-05 日亜化学工業株式会社 発光装置
US9853197B2 (en) * 2014-09-29 2017-12-26 Bridgelux, Inc. Light emitting diode package having series connected LEDs
CN105591007B (zh) * 2014-10-23 2018-04-03 展晶科技(深圳)有限公司 发光二极管封装结构
JP6256699B2 (ja) * 2014-11-11 2018-01-10 豊田合成株式会社 発光装置
EP3232482A4 (en) * 2014-12-11 2018-05-23 Citizen Electronics Co., Ltd Light emitting device
JP6827265B2 (ja) * 2015-01-05 2021-02-10 シチズン電子株式会社 Ｌｅｄ発光装置
JP2016138901A (ja) * 2015-01-26 2016-08-04 株式会社日立エルジーデータストレージ 光モジュール、及び走査型画像表示装置
US9535253B2 (en) 2015-02-09 2017-01-03 Microsoft Technology Licensing, Llc Display system
US9423360B1 (en) 2015-02-09 2016-08-23 Microsoft Technology Licensing, Llc Optical components
US9429692B1 (en) 2015-02-09 2016-08-30 Microsoft Technology Licensing, Llc Optical components
US11086216B2 (en) 2015-02-09 2021-08-10 Microsoft Technology Licensing, Llc Generating electronic components
US9827209B2 (en) 2015-02-09 2017-11-28 Microsoft Technology Licensing, Llc Display system
US10018844B2 (en) 2015-02-09 2018-07-10 Microsoft Technology Licensing, Llc Wearable image display system
US9372347B1 (en) 2015-02-09 2016-06-21 Microsoft Technology Licensing, Llc Display system
US10317677B2 (en) 2015-02-09 2019-06-11 Microsoft Technology Licensing, Llc Display system
US9513480B2 (en) 2015-02-09 2016-12-06 Microsoft Technology Licensing, Llc Waveguide
EP3261136B1 (en) * 2015-02-13 2019-10-02 Citizen Electronics Co., Ltd. Light-emitting device and method for producing the same
KR102408618B1 (ko) * 2015-02-16 2022-06-14 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지 및 이를 포함하는 조명 장치
EP3266049B1 (en) * 2015-03-06 2020-06-17 Lumileds Holding B.V. Led-based lighting device with asymmetrically distributed led chips
JP6374339B2 (ja) * 2015-03-26 2018-08-15 日亜化学工業株式会社 発光装置
US9853017B2 (en) * 2015-06-05 2017-12-26 Lumens Co., Ltd. Light emitting device package and light emitting device package module
JP6472728B2 (ja) * 2015-08-04 2019-02-20 日亜化学工業株式会社 発光装置および発光装置を備えたバックライト
KR102522590B1 (ko) * 2016-03-25 2023-04-17 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 조명 장치
EP3223322B1 (en) * 2016-03-25 2019-05-01 LG Innotek Co., Ltd. Light emitting device package
JP6790416B2 (ja) * 2016-03-31 2020-11-25 日亜化学工業株式会社 発光装置
DE102016212138A1 (de) * 2016-07-04 2018-01-04 Osram Gmbh Licht-emittierendes Modul, Licht-emittierende Vorrichtung und Verfahren zum Herstellen und zum Betreiben desselben
JP6885701B2 (ja) * 2016-10-17 2021-06-16 ローム株式会社 半導体装置
JP6583247B2 (ja) * 2016-12-21 2019-10-02 日亜化学工業株式会社 発光装置
JP6414609B2 (ja) * 2017-02-28 2018-10-31 日亜化学工業株式会社 発光装置用パッケージ及びそれを備える発光装置、並びにその発光装置を備える照明装置
KR102369820B1 (ko) * 2017-03-22 2022-03-03 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 패키지 및 조명 시스템
CN107479252B (zh) * 2017-08-31 2020-11-13 深圳市华星光电技术有限公司 Led灯珠及背光光源、背光模组
KR102385940B1 (ko) * 2017-09-01 2022-04-13 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 광원 장치
EP3460861B1 (en) * 2017-09-21 2023-03-01 InnoLux Corporation Display device
US11257990B2 (en) * 2017-09-29 2022-02-22 Nichia Corporation Light emitting device
JP6435031B2 (ja) * 2017-10-05 2018-12-05 ローム株式会社 Ｌｅｄモジュール
CN110047825A (zh) * 2019-04-29 2019-07-23 广西师范大学 一种可蓝绿双波段激发红色荧光粉的白光led封装结构及发光方式
JP7337590B2 (ja) * 2019-08-05 2023-09-04 ローム株式会社 半導体発光装置
CN114335290B (zh) * 2019-08-13 2024-12-31 光宝光电(常州)有限公司 封装结构
CN112397630A (zh) * 2019-08-13 2021-02-23 光宝光电(常州)有限公司 发光装置
KR102825814B1 (ko) * 2019-11-22 2025-06-27 삼성전자주식회사 발광다이오드 패키지
CN111106101A (zh) * 2019-12-31 2020-05-05 深圳市吉瑞光电有限公司 一种smd多颜色led灯珠支架
KR102338177B1 (ko) * 2020-02-24 2021-12-10 주식회사 에스엘바이오닉스 반도체 발광소자
JP7513878B2 (ja) * 2020-09-15 2024-07-10 日亜化学工業株式会社 発光装置
JP7506319B2 (ja) 2020-09-30 2024-06-26 日亜化学工業株式会社 発光装置
KR20230067129A (ko) * 2021-11-09 2023-05-16 삼성전기주식회사 인쇄회로기판
KR102571515B1 (ko) * 2022-10-18 2023-08-29 주식회사 엘티전자 광섬유 접속장치 및 그가 적용되는 디스플레이 장치
CN116435201B (zh) * 2023-06-12 2023-09-12 四川遂宁市利普芯微电子有限公司 一种塑封封装方法以及器件封装结构

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050070349A (ko) * 2003-12-30 2005-07-07 서울옵토디바이스주식회사 다색 발광 다이오드의 제조 방법
JP2008041699A (ja) 2006-08-01 2008-02-21 Showa Denko Kk Ｌｅｄパッケージ
KR20100042126A (ko) * 2008-10-15 2010-04-23 삼성엘이디 주식회사 Ｌｅｄ 패키지 모듈

Family Cites Families (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3351447B2 (ja) * 1994-04-08 2002-11-25 日亜化学工業株式会社 Ｌｅｄディスプレイ
JP3572924B2 (ja) * 1997-03-06 2004-10-06 松下電器産業株式会社 発光装置及びそれを用いた記録装置
JP2000106458A (ja) * 1998-09-29 2000-04-11 Matsushita Electronics Industry Corp 画像書込み用発光装置
JP3829582B2 (ja) * 2000-05-12 2006-10-04 豊田合成株式会社 発光装置
DE10020465A1 (de) * 2000-04-26 2001-11-08 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement mit Lumineszenzkonversionselement
DE10041686A1 (de) 2000-08-24 2002-03-14 Osram Opto Semiconductors Gmbh Bauelement mit einer Vielzahl von Lumineszenzdiodenchips
JP2002314143A (ja) * 2001-04-09 2002-10-25 Toshiba Corp 発光装置
US20030222268A1 (en) * 2002-05-31 2003-12-04 Yocom Perry Niel Light sources having a continuous broad emission wavelength and phosphor compositions useful therefor
CN100338786C (zh) * 2002-06-19 2007-09-19 三垦电气株式会社 半导体发光装置及其制法和半导体发光装置用反射器
EP1597764A1 (de) 2003-02-28 2005-11-23 Osram Opto Semiconductors GmbH Optoelektronisches bauteil mit strukturiert metallisiertem gehäusekörper, verfahren zur herstellung eines derartigen bauteils und verfahren zur strukturierten metallisierung eines kunststoff enthaltenden körpers
JP2005079329A (ja) * 2003-08-29 2005-03-24 Stanley Electric Co Ltd 表面実装型発光ダイオード
JP4654670B2 (ja) * 2003-12-16 2011-03-23 日亜化学工業株式会社 発光装置及びその製造方法
JP4572312B2 (ja) * 2004-02-23 2010-11-04 スタンレー電気株式会社 Ｌｅｄ及びその製造方法
US20050225222A1 (en) * 2004-04-09 2005-10-13 Joseph Mazzochette Light emitting diode arrays with improved light extraction
JP4922555B2 (ja) * 2004-09-24 2012-04-25 スタンレー電気株式会社 Ｌｅｄ装置
WO2006046221A2 (en) * 2004-10-29 2006-05-04 Peter O'brien An illuminator and manufacturing method
KR100663906B1 (ko) * 2005-03-14 2007-01-02 서울반도체 주식회사 발광 장치
JP2006309209A (ja) * 2005-03-31 2006-11-09 Mitsubishi Chemicals Corp 画像表示装置
JP4535928B2 (ja) * 2005-04-28 2010-09-01 シャープ株式会社 半導体発光装置
US7329942B2 (en) 2005-05-18 2008-02-12 Ching-Fu Tsou Array-type modularized light-emitting diode structure and a method for packaging the structure
KR101200400B1 (ko) * 2005-12-01 2012-11-16 삼성전자주식회사 백색 발광 다이오드
US7646450B2 (en) * 2005-12-29 2010-01-12 Lg Display Co., Ltd. Light emitting diode array, method of manufacturing the same, backlight assembly having the same, and LCD having the same
JP2007231253A (ja) 2006-01-31 2007-09-13 Asahi Glass Co Ltd 透光封止用硬化性樹脂組成物、樹脂封止発光素子及びその製造方法
KR100875443B1 (ko) * 2006-03-31 2008-12-23 서울반도체 주식회사 발광 장치
KR100775574B1 (ko) * 2006-04-20 2007-11-15 알티전자 주식회사 고효율 발광 다이오드 패키지
JP4805026B2 (ja) * 2006-05-29 2011-11-02 シャープ株式会社 発光装置、表示装置及び発光装置の制御方法
KR100809210B1 (ko) * 2006-07-10 2008-02-29 삼성전기주식회사 고출력 ｌｅｄ 패키지 및 그 제조방법
JP5205724B2 (ja) * 2006-08-04 2013-06-05 日亜化学工業株式会社 発光装置
JP2008108835A (ja) * 2006-10-24 2008-05-08 Harison Toshiba Lighting Corp 半導体発光装置及びその製造方法
WO2008071206A1 (en) * 2006-12-12 2008-06-19 Inverto Nv Led lighting that has continuous and adjustable color temperature (ct), while maintaining a high cri
KR101396588B1 (ko) * 2007-03-19 2014-05-20 서울반도체 주식회사 다양한 색온도를 갖는 발광 장치
JP2008270144A (ja) 2007-03-22 2008-11-06 Furukawa Electric Co Ltd:The ライトボックス
US7832886B2 (en) * 2007-04-16 2010-11-16 Gigno Technology Co., Ltd. Light emitting module
JP2008270305A (ja) * 2007-04-17 2008-11-06 Nichia Corp 発光装置
JP2008294071A (ja) * 2007-05-22 2008-12-04 Toshiba Corp 光半導体装置と、照明装置および表示装置
JP2009021426A (ja) * 2007-07-12 2009-01-29 Sharp Corp チップ部品型ｌｅｄ及びその製造方法
TWI378573B (en) * 2007-10-31 2012-12-01 Young Lighting Technology Corp Light emitting diode package
US7985980B2 (en) * 2007-10-31 2011-07-26 Sharp Kabushiki Kaisha Chip-type LED and method for manufacturing the same
KR100891810B1 (ko) * 2007-11-06 2009-04-07 삼성전기주식회사 백색 발광 소자
KR20090059622A (ko) 2007-12-07 2009-06-11 엘지디스플레이 주식회사 백라이트 유닛과 그 구동방법
DE102008003971A1 (de) 2008-01-11 2009-07-16 Ledon Lighting Jennersdorf Gmbh Leuchtdiodenanordnung mit Schutzrahmen
JP5349811B2 (ja) * 2008-02-06 2013-11-20 シャープ株式会社 半導体発光装置
KR100992778B1 (ko) * 2008-05-23 2010-11-05 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
JP2010034183A (ja) * 2008-07-28 2010-02-12 Citizen Electronics Co Ltd 発光装置
KR100924912B1 (ko) * 2008-07-29 2009-11-03 서울반도체 주식회사 웜화이트 발광장치 및 그것을 포함하는 백라이트 모듈
US7919339B2 (en) * 2008-09-08 2011-04-05 Iledm Photoelectronics, Inc. Packaging method for light emitting diode module that includes fabricating frame around substrate
KR101503499B1 (ko) 2008-09-11 2015-03-18 서울반도체 주식회사 멀티칩 발광 다이오드 패키지
US7871842B2 (en) * 2008-10-03 2011-01-18 E. I. Du Pont De Nemours And Company Production process for surface-mounting ceramic LED package, surface-mounting ceramic LED package produced by said production process, and mold for producing said package
KR101081246B1 (ko) * 2008-11-21 2011-11-08 엘지이노텍 주식회사 발광 장치 및 그 제조방법
JP5342867B2 (ja) * 2008-12-19 2013-11-13 スタンレー電気株式会社 半導体発光装置及び駆動方法
JP5277085B2 (ja) * 2009-06-18 2013-08-28 スタンレー電気株式会社 発光装置及び発光装置の製造方法
DE102009028322A1 (de) * 2009-08-07 2011-02-10 Robert Bosch Gmbh Ladevorrichtung zum Aufladen eines Akkupacks
JP5330153B2 (ja) * 2009-08-21 2013-10-30 シャープ株式会社 半導体発光装置
TW201128756A (en) * 2010-02-02 2011-08-16 Forward Electronics Co Ltd Semiconductor package structure
JP2012004519A (ja) * 2010-05-17 2012-01-05 Sharp Corp 発光装置および照明装置
KR101039994B1 (ko) * 2010-05-24 2011-06-09 엘지이노텍 주식회사 발광소자 및 이를 구비한 라이트 유닛
TWI422073B (zh) * 2010-05-26 2014-01-01 英特明光能股份有限公司 發光二極體封裝結構

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050070349A (ko) * 2003-12-30 2005-07-07 서울옵토디바이스주식회사 다색 발광 다이오드의 제조 방법
JP2008041699A (ja) 2006-08-01 2008-02-21 Showa Denko Kk Ｌｅｄパッケージ
KR20100042126A (ko) * 2008-10-15 2010-04-23 삼성엘이디 주식회사 Ｌｅｄ 패키지 모듈

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011104302A1 (de) * 2011-06-16 2012-12-20 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verwendung eines derartigen Halbleiterbauelements
CN102856313A (zh) * 2011-06-29 2013-01-02 丰田合成株式会社 发光装置
KR101439602B1 (ko) * 2011-06-29 2014-11-03 도요다 고세이 가부시키가이샤 발광 장치
US9368700B2 (en) 2011-07-19 2016-06-14 Osram Opto Semiconductors Gmbh Optoelectronic component and method for producing an optoelectronic component
WO2013010765A1 (de) * 2011-07-19 2013-01-24 Osram Opto Semiconductors Gmbh Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements
CN103890983B (zh) * 2011-07-19 2016-10-05 欧司朗光电半导体有限公司 光电子器件和用于制造光电子器件的方法
CN103890983A (zh) * 2011-07-19 2014-06-25 欧司朗光电半导体有限公司 光电子器件和用于制造光电子器件的方法
CN102903837A (zh) * 2011-07-29 2013-01-30 Lg伊诺特有限公司 发光器件封装件及包括其的照明系统
US9882104B2 (en) 2011-07-29 2018-01-30 Lg Innotek Co., Ltd Light emitting device package having LED disposed in lead frame cavities
EP2551903A3 (en) * 2011-07-29 2015-04-22 LG Innotek Co., Ltd. Light emitting device package and lighting system including the same
CN102916108A (zh) * 2011-08-05 2013-02-06 展晶科技(深圳)有限公司 发光二极管封装结构
KR101237794B1 (ko) * 2011-08-12 2013-02-28 주식회사 루멘스 발광소자 패키지 및 이를 구비하는 백라이트 유닛
KR20140143398A (ko) * 2012-03-19 2014-12-16 오스람 옵토 세미컨덕터스 게엠베하 광전자 반도체 칩, 및 상기 반도체 칩을 포함한 헤드램프
KR102069911B1 (ko) * 2012-03-19 2020-01-23 오스람 옵토 세미컨덕터스 게엠베하 광전자 반도체 칩, 및 상기 반도체 칩을 포함한 헤드램프
KR20140061854A (ko) * 2012-11-14 2014-05-22 엘지이노텍 주식회사 발광 소자
KR101997249B1 (ko) * 2012-11-14 2019-07-08 엘지이노텍 주식회사 발광 소자
KR20140073964A (ko) * 2012-12-07 2014-06-17 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 시스템
KR102019503B1 (ko) 2012-12-07 2019-09-06 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 시스템
KR20230011438A (ko) * 2017-10-31 2023-01-20 엘지디스플레이 주식회사 발광소자 패키지 및 전자기기
KR102580740B1 (ko) * 2017-10-31 2023-09-19 엘지디스플레이 주식회사 발광소자 패키지 및 전자기기
WO2023121406A1 (ko) * 2021-12-23 2023-06-29 엘지이노텍 주식회사 회로 기판

Also Published As

Publication number Publication date
US8324654B2 (en) 2012-12-04
US8860072B2 (en) 2014-10-14
CN102263098B (zh) 2015-09-16
EP2390915A1 (en) 2011-11-30
US20130087817A1 (en) 2013-04-11
CN102263098A (zh) 2011-11-30
EP2390915B1 (en) 2014-10-08
JP2011249807A (ja) 2011-12-08
TWI521750B (zh) 2016-02-11
US20110215349A1 (en) 2011-09-08
TW201203633A (en) 2012-01-16

Similar Documents

Publication Publication Date Title
KR101039994B1 (ko) 발광소자 및 이를 구비한 라이트 유닛
JP5815610B2 (ja) 発光素子及びこれを備えた照明システム
EP2337072B1 (en) Light emitting device and light unit using the same
KR101028329B1 (ko) 발광 소자 패키지 및 그 제조방법
TWI434443B (zh) 發光裝置封裝件
US20110175122A1 (en) Light emitting device package and light unit having the same
KR101047633B1 (ko) 발광소자 및 이를 구비한 라이트 유닛
KR20140095913A (ko) 발광 모듈 및 이를 구비한 조명 장치
KR20140049274A (ko) 광원 모듈 및 이를 구비한 조명시스템
KR20130038065A (ko) 발광 소자 패키지 및 이를 구비한 백라이트 유닛
KR20110128693A (ko) 발광 소자 패키지 및 이를 구비한 라이트 유닛
KR20110138756A (ko) 발광 소자
KR101905520B1 (ko) 발광 소자
KR20130014262A (ko) 발광 소자 및 이를 구비한 라이트 유닛
KR101936289B1 (ko) 발광 소자
KR20130069211A (ko) 발광소자 패키지 및 이를 구비한 라이트 유닛
KR102042482B1 (ko) 발광소자 패키지 및 이를 구비한 라이트 유닛
KR101916089B1 (ko) 발광소자 패키지 및 이를 구비한 라이트 유닛
KR102509010B1 (ko) 발광 소자 및 이를 구비한 라이트 유닛
KR101926468B1 (ko) 발광 소자 패키지
KR101724707B1 (ko) 라이트 유닛
KR101946834B1 (ko) 발광 소자 패키지 및 이를 구비한 라이트 유닛
KR20130024150A (ko) 발광 소자 패키지 및 이를 구비한 라이트 유닛
KR101905573B1 (ko) 발광 모듈 및 이를 구비한 조명 시스템
KR20130069212A (ko) 발광소자 패키지 및 이를 구비한 라이트 유닛

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

A201 Request for examination
A302 Request for accelerated examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D17-exm-PA0302

St.27 status event code: A-1-2-D10-D16-exm-PA0302

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20140423

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

FPAY Annual fee payment

Payment date: 20150506

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20160504

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20170512

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20180509

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20190514

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20240602

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20240602