KR100734410B1 - 반도체 장치 및 그 동작 방법 - Google Patents

반도체 장치 및 그 동작 방법 Download PDF

Info

Publication number
KR100734410B1
KR100734410B1 KR1020010013395A KR20010013395A KR100734410B1 KR 100734410 B1 KR100734410 B1 KR 100734410B1 KR 1020010013395 A KR1020010013395 A KR 1020010013395A KR 20010013395 A KR20010013395 A KR 20010013395A KR 100734410 B1 KR100734410 B1 KR 100734410B1
Authority
KR
South Korea
Prior art keywords
memory
dram
address
delete delete
sram
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020010013395A
Other languages
English (en)
Korean (ko)
Other versions
KR20010107538A (ko
Inventor
아유카와카즈시게
미우라세이지
사이토우요시카즈
Original Assignee
가부시키가이샤 히타치세이사쿠쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 히타치세이사쿠쇼 filed Critical 가부시키가이샤 히타치세이사쿠쇼
Publication of KR20010107538A publication Critical patent/KR20010107538A/ko
Application granted granted Critical
Publication of KR100734410B1 publication Critical patent/KR100734410B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/005Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor comprising combined but independently operative RAM-ROM, RAM-PROM, RAM-EPROM cells
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/406Management or control of the refreshing or charge-regeneration cycles
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/406Management or control of the refreshing or charge-regeneration cycles
    • G11C11/40607Refresh operations in memory devices with an internal cache or data buffer
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/406Management or control of the refreshing or charge-regeneration cycles
    • G11C11/40618Refresh operations over multiple banks or interleaving
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/4076Timing circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/02Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/06Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/06Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • G11C5/063Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/14Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
    • G11C5/143Detection of memory cassette insertion or removal; Continuity checks of supply or ground lines; Detection of supply variations, interruptions or levels ; Switching between alternative supplies
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C8/00Arrangements for selecting an address in a digital store
    • G11C8/06Address interface arrangements, e.g. address buffers
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C8/00Arrangements for selecting an address in a digital store
    • G11C8/12Group selection circuits, e.g. for memory block selection, chip selection, array selection
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C8/00Arrangements for selecting an address in a digital store
    • G11C8/18Address timing or clocking circuits; Address control signal generation or management, e.g. for row address strobe [RAS] or column address strobe [CAS] signals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0652Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0657Stacked arrangements of devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B10/00Static random access memory [SRAM] devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/061Disposition
    • H01L2224/0612Layout
    • H01L2224/0614Circular array, i.e. array with radial symmetry
    • H01L2224/06144Circular array, i.e. array with radial symmetry covering only portions of the surface to be connected
    • H01L2224/06145Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/061Disposition
    • H01L2224/0612Layout
    • H01L2224/0615Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry
    • H01L2224/06154Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry covering only portions of the surface to be connected
    • H01L2224/06156Covering only the central area of the surface to be connected, i.e. central arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32135Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H01L2224/48139Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01039Yttrium [Y]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01055Cesium [Cs]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1306Field-effect transistor [FET]
    • H01L2924/13091Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • H01L2924/143Digital devices
    • H01L2924/1433Application-specific integrated circuit [ASIC]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/153Connection portion
    • H01L2924/1531Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19041Component type being a capacitor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Dram (AREA)
  • Read Only Memory (AREA)
  • Static Random-Access Memory (AREA)
KR1020010013395A 2000-05-26 2001-03-15 반도체 장치 및 그 동작 방법 Expired - Fee Related KR100734410B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000161123A JP3871853B2 (ja) 2000-05-26 2000-05-26 半導体装置及びその動作方法
JP2000-161123 2000-05-26

Publications (2)

Publication Number Publication Date
KR20010107538A KR20010107538A (ko) 2001-12-07
KR100734410B1 true KR100734410B1 (ko) 2007-07-03

Family

ID=18665196

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020010013395A Expired - Fee Related KR100734410B1 (ko) 2000-05-26 2001-03-15 반도체 장치 및 그 동작 방법

Country Status (4)

Country Link
US (7) US6392950B2 (enExample)
JP (1) JP3871853B2 (enExample)
KR (1) KR100734410B1 (enExample)
TW (1) TWI286317B (enExample)

Families Citing this family (101)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6418070B1 (en) * 1999-09-02 2002-07-09 Micron Technology, Inc. Memory device tester and method for testing reduced power states
US6614703B2 (en) * 2000-01-13 2003-09-02 Texas Instruments Incorporated Method and system for configuring integrated systems on a chip
TW587252B (en) * 2000-01-18 2004-05-11 Hitachi Ltd Semiconductor memory device and data processing device
JP2002033436A (ja) * 2000-07-14 2002-01-31 Hitachi Ltd 半導体装置
US6445636B1 (en) * 2000-08-17 2002-09-03 Micron Technology, Inc. Method and system for hiding refreshes in a dynamic random access memory
KR100380409B1 (ko) * 2001-01-18 2003-04-11 삼성전자주식회사 반도체 메모리 소자의 패드배열구조 및 그의 구동방법
JP2002251884A (ja) * 2001-02-21 2002-09-06 Toshiba Corp 半導体記憶装置及びそのシステム装置
JP2002324393A (ja) * 2001-04-25 2002-11-08 Mitsubishi Electric Corp 半導体記憶装置
JP2003006041A (ja) * 2001-06-20 2003-01-10 Hitachi Ltd 半導体装置
JP4768163B2 (ja) * 2001-08-03 2011-09-07 富士通セミコンダクター株式会社 半導体メモリ
US6625081B2 (en) * 2001-08-13 2003-09-23 Micron Technology, Inc. Synchronous flash memory with virtual segment architecture
US7082071B2 (en) * 2001-08-23 2006-07-25 Integrated Device Technology, Inc. Integrated DDR/SDR flow control managers that support multiple queues and MUX, DEMUX and broadcast operating modes
US6795360B2 (en) 2001-08-23 2004-09-21 Integrated Device Technology, Inc. Fifo memory devices that support all four combinations of DDR or SDR write modes with DDR or SDR read modes
TW525168B (en) * 2001-09-04 2003-03-21 Macronix Int Co Ltd Memory structure and the controller used therewith
TW516118B (en) * 2001-09-11 2003-01-01 Leadtek Research Inc Decoding conversion device and method capable of supporting multiple memory chips and their application system
US6728150B2 (en) * 2002-02-11 2004-04-27 Micron Technology, Inc. Method and apparatus for supplementary command bus
US6917544B2 (en) * 2002-07-10 2005-07-12 Saifun Semiconductors Ltd. Multiple use memory chip
JP2004055834A (ja) * 2002-07-19 2004-02-19 Renesas Technology Corp 混成集積回路装置
JP4499982B2 (ja) * 2002-09-11 2010-07-14 株式会社日立製作所 メモリシステム
JP5138869B2 (ja) * 2002-11-28 2013-02-06 ルネサスエレクトロニクス株式会社 メモリモジュール及びメモリシステム
US20050149792A1 (en) * 2002-12-20 2005-07-07 Fujitsu Limited Semiconductor device and method for testing the same
US6876563B1 (en) * 2002-12-20 2005-04-05 Cypress Semiconductor Corporation Method for configuring chip selects in memories
JP4068974B2 (ja) * 2003-01-22 2008-03-26 株式会社ルネサステクノロジ 半導体装置
WO2004095465A1 (ja) * 2003-04-23 2004-11-04 Fujitsu Limited 半導体記憶装置
US6982892B2 (en) 2003-05-08 2006-01-03 Micron Technology, Inc. Apparatus and methods for a physical layout of simultaneously sub-accessible memory modules
US7120075B1 (en) 2003-08-18 2006-10-10 Integrated Device Technology, Inc. Multi-FIFO integrated circuit devices that support multi-queue operating modes with enhanced write path and read path queue switching
JP4398225B2 (ja) * 2003-11-06 2010-01-13 株式会社ルネサステクノロジ 半導体装置
US20050127490A1 (en) * 2003-12-16 2005-06-16 Black Bryan P. Multi-die processor
US7657706B2 (en) * 2003-12-18 2010-02-02 Cisco Technology, Inc. High speed memory and input/output processor subsystem for efficiently allocating and using high-speed memory and slower-speed memory
KR100944349B1 (ko) * 2003-12-22 2010-03-02 주식회사 하이닉스반도체 분할 신호라인을 갖는 반도체 메모리 장치
KR100596776B1 (ko) * 2004-01-08 2006-07-04 주식회사 하이닉스반도체 멀티 칩 어셈블리 및 이의 구동 방법
JP3881658B2 (ja) 2004-01-23 2007-02-14 沖電気工業株式会社 中継部材、中継部材を用いたマルチチップパッケージ、及びその製造方法
US7126829B1 (en) 2004-02-09 2006-10-24 Pericom Semiconductor Corp. Adapter board for stacking Ball-Grid-Array (BGA) chips
US7339837B2 (en) * 2004-05-18 2008-03-04 Infineon Technologies Ag Configurable embedded processor
US7308526B2 (en) * 2004-06-02 2007-12-11 Intel Corporation Memory controller module having independent memory controllers for different memory types
KR100585158B1 (ko) * 2004-09-13 2006-05-30 삼성전자주식회사 Ecc 메모리 모듈
US8156276B2 (en) 2005-08-01 2012-04-10 Ati Technologies Ulc Method and apparatus for data transfer
KR100799158B1 (ko) * 2005-09-21 2008-01-29 삼성전자주식회사 반도체 메모리 및 이를 포함하는 반도체 메모리 모듈
US7562271B2 (en) 2005-09-26 2009-07-14 Rambus Inc. Memory system topologies including a buffer device and an integrated circuit memory device
US11328764B2 (en) 2005-09-26 2022-05-10 Rambus Inc. Memory system topologies including a memory die stack
WO2007058617A1 (en) * 2005-11-17 2007-05-24 Chee Keng Chang A controller for non-volatile memories, and methods of operating the memory controller
JP4930970B2 (ja) * 2005-11-28 2012-05-16 ルネサスエレクトロニクス株式会社 マルチチップモジュール
CN100454438C (zh) * 2005-12-27 2009-01-21 中国科学院计算技术研究所 适合矩阵转置的ddr存储控制器及矩阵行列访问方法
JP4900661B2 (ja) * 2006-02-22 2012-03-21 ルネサスエレクトロニクス株式会社 不揮発性記憶装置
JP4894306B2 (ja) * 2006-03-09 2012-03-14 富士通セミコンダクター株式会社 半導体メモリ、メモリシステムおよび半導体メモリの動作方法
KR100816690B1 (ko) * 2006-04-13 2008-03-27 주식회사 하이닉스반도체 온도 감지장치를 구비하는 반도체메모리소자
US7716411B2 (en) 2006-06-07 2010-05-11 Microsoft Corporation Hybrid memory device with single interface
JP5143413B2 (ja) * 2006-12-20 2013-02-13 オンセミコンダクター・トレーディング・リミテッド 半導体集積回路
WO2008086488A2 (en) 2007-01-10 2008-07-17 Mobile Semiconductor Corporation Adaptive memory system for enhancing the performance of an external computing device
US7821069B2 (en) 2007-01-25 2010-10-26 Denso Corporation Semiconductor device and method for manufacturing the same
WO2008131058A2 (en) 2007-04-17 2008-10-30 Rambus Inc. Hybrid volatile and non-volatile memory device
US8874831B2 (en) 2007-06-01 2014-10-28 Netlist, Inc. Flash-DRAM hybrid memory module
JP4922860B2 (ja) * 2007-08-01 2012-04-25 株式会社日立製作所 半導体装置
US7944047B2 (en) * 2007-09-25 2011-05-17 Qimonda Ag Method and structure of expanding, upgrading, or fixing multi-chip package
DE102007051839B4 (de) * 2007-10-30 2015-12-10 Polaris Innovations Ltd. Kontrollschaltung, Speichervorrichtung mit einer Kontrollschaltung und Verfahren zum Durchführen eines Schreibkommandos bzw. zum Betrieb einer Speichervorrichtung mit einer Kontrollschaltung
JP2009123763A (ja) * 2007-11-12 2009-06-04 Denso Corp 半導体装置及びその製造方法
JP4910117B2 (ja) * 2008-04-04 2012-04-04 スパンション エルエルシー 積層型メモリ装置
JP5259369B2 (ja) * 2008-12-16 2013-08-07 ルネサスエレクトロニクス株式会社 半導体装置及びその製造方法
JP2010171169A (ja) * 2009-01-22 2010-08-05 Sanken Electric Co Ltd 半導体モジュール及びその制御方法
JP2011065732A (ja) * 2009-09-18 2011-03-31 Elpida Memory Inc 半導体記憶装置
JP2011081732A (ja) * 2009-10-09 2011-04-21 Elpida Memory Inc 半導体装置及びその調整方法並びにデータ処理システム
JP5426311B2 (ja) * 2009-10-14 2014-02-26 ピーエスフォー ルクスコ エスエイアールエル 半導体装置
JP2011170943A (ja) 2010-02-22 2011-09-01 Sony Corp 記憶制御装置、記憶装置、記憶装置システム
CN101866695B (zh) * 2010-06-21 2013-01-16 苏州国芯科技有限公司 一种NandflashU盘控制器读写Norflash存储器的方法
JP5621409B2 (ja) * 2010-08-23 2014-11-12 株式会社バッファロー メモリモジュール
KR101728067B1 (ko) 2010-09-03 2017-04-18 삼성전자 주식회사 반도체 메모리 장치
KR101736384B1 (ko) 2010-09-29 2017-05-16 삼성전자주식회사 비휘발성 메모리 시스템
US8713379B2 (en) 2011-02-08 2014-04-29 Diablo Technologies Inc. System and method of interfacing co-processors and input/output devices via a main memory system
US8930647B1 (en) 2011-04-06 2015-01-06 P4tents1, LLC Multiple class memory systems
US9176671B1 (en) 2011-04-06 2015-11-03 P4tents1, LLC Fetching data between thread execution in a flash/DRAM/embedded DRAM-equipped system
US9432298B1 (en) * 2011-12-09 2016-08-30 P4tents1, LLC System, method, and computer program product for improving memory systems
US9158546B1 (en) 2011-04-06 2015-10-13 P4tents1, LLC Computer program product for fetching from a first physical memory between an execution of a plurality of threads associated with a second physical memory
US9170744B1 (en) 2011-04-06 2015-10-27 P4tents1, LLC Computer program product for controlling a flash/DRAM/embedded DRAM-equipped system
US9164679B2 (en) 2011-04-06 2015-10-20 Patents1, Llc System, method and computer program product for multi-thread operation involving first memory of a first memory class and second memory of a second memory class
US9417754B2 (en) 2011-08-05 2016-08-16 P4tents1, LLC User interface system, method, and computer program product
JP2013101728A (ja) * 2011-11-07 2013-05-23 Elpida Memory Inc 半導体装置
US8705307B2 (en) 2011-11-17 2014-04-22 International Business Machines Corporation Memory system with dynamic refreshing
KR101903520B1 (ko) * 2012-01-06 2018-10-04 에스케이하이닉스 주식회사 반도체 장치
JP5976392B2 (ja) * 2012-05-16 2016-08-23 ルネサスエレクトロニクス株式会社 半導体集積回路およびその動作方法
KR20140030962A (ko) * 2012-09-04 2014-03-12 에스케이하이닉스 주식회사 데이터 저장 장치 및 그것의 동작 방법
US8812744B1 (en) 2013-03-14 2014-08-19 Microsoft Corporation Assigning priorities to data for hybrid drives
US9626126B2 (en) 2013-04-24 2017-04-18 Microsoft Technology Licensing, Llc Power saving mode hybrid drive access management
US9946495B2 (en) 2013-04-25 2018-04-17 Microsoft Technology Licensing, Llc Dirty data management for hybrid drives
KR102097027B1 (ko) 2013-05-28 2020-05-27 에스케이하이닉스 주식회사 반도체 시스템
US9436600B2 (en) 2013-06-11 2016-09-06 Svic No. 28 New Technology Business Investment L.L.P. Non-volatile memory storage for multi-channel memory system
JP6290579B2 (ja) * 2013-10-15 2018-03-07 Necプラットフォームズ株式会社 メモリ制御装置、メモリ制御方法、及び、情報処理装置
KR102140784B1 (ko) * 2013-12-03 2020-08-03 삼성전자주식회사 비휘발성 메모리 장치의 데이터 기록 방법
US9536590B1 (en) 2014-09-03 2017-01-03 Marvell International Ltd. System and method of memory electrical repair
US10078448B2 (en) * 2015-07-08 2018-09-18 Samsung Electronics Co., Ltd. Electronic devices and memory management methods thereof
KR102373544B1 (ko) 2015-11-06 2022-03-11 삼성전자주식회사 요청 기반의 리프레쉬를 수행하는 메모리 장치, 메모리 시스템 및 메모리 장치의 동작방법
US10163494B1 (en) * 2017-05-31 2018-12-25 Taiwan Semiconductor Manufacturing Co., Ltd. Memory device and fabrication method thereof
TWI631681B (zh) * 2017-12-15 2018-08-01 Lyontek Inc. 雙晶片封裝結構
US10803920B2 (en) * 2018-11-26 2020-10-13 Birad—Research & Development Company Ltd. Refresh controller for first-in first-out memories
WO2020210928A1 (en) * 2019-04-15 2020-10-22 Yangtze Memory Technologies Co., Ltd. Integration of three-dimensional nand memory devices with multiple functional chips
DE112019007422T5 (de) * 2019-05-31 2022-02-24 Micron Technology, Inc. Speicherkomponente für ein system-on-chip-gerät
US10790039B1 (en) * 2019-09-26 2020-09-29 Micron Technology, Inc. Semiconductor device having a test circuit
WO2021106224A1 (ja) 2019-11-29 2021-06-03 キオクシア株式会社 半導体記憶装置、及びメモリシステム
KR20210127339A (ko) * 2020-04-14 2021-10-22 에스케이하이닉스 주식회사 리프레시 주기가 다른 다수의 영역을 구비한 메모리 장치, 이를 제어하는 메모리 컨트롤러 및 이를 포함하는 메모리 시스템
US11309301B2 (en) 2020-05-28 2022-04-19 Sandisk Technologies Llc Stacked die assembly including double-sided inter-die bonding connections and methods of forming the same
US11335671B2 (en) 2020-05-28 2022-05-17 Sandisk Technologies Llc Stacked die assembly including double-sided inter-die bonding connections and methods of forming the same
JP2022143741A (ja) * 2021-03-18 2022-10-03 キオクシア株式会社 半導体集積回路及びその動作方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR880014567A (ko) * 1987-05-22 1988-12-24 미다 가쓰시게 반도체 장치
JPH08263229A (ja) * 1995-03-23 1996-10-11 Hitachi Ltd 半導体記憶装置
JPH1186560A (ja) * 1997-09-16 1999-03-30 Nec Corp 半導体集積回路装置
KR100282971B1 (ko) * 1996-11-15 2001-03-02 포만 제프리 엘 동적랜덤액세스메모리어셈블리및동적랜덤액세스메모리모듈의조립방법
KR100289427B1 (ko) * 1993-11-30 2001-05-02 이데이 노부유끼 반도체 불휘발성 기억장치

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US599474A (en) * 1898-02-22 Edgar peckham
US604953A (en) * 1898-05-31 Reading attachment for meters
JPS63282997A (ja) * 1987-05-15 1988-11-18 Mitsubishi Electric Corp ブロツクアクセスメモリ
EP0304263A3 (en) 1987-08-17 1990-09-12 Lsi Logic Corporation Semiconductor chip assembly
JP2865170B2 (ja) 1988-07-06 1999-03-08 三菱電機株式会社 電子回路装置
JPH03225695A (ja) 1990-01-30 1991-10-04 Nec Corp メモリカード
US5278796A (en) * 1991-04-12 1994-01-11 Micron Technology, Inc. Temperature-dependent DRAM refresh circuit
JPH05189964A (ja) 1992-01-16 1993-07-30 Mitsubishi Electric Corp Dramコントロール回路及び半導体装置のコントロール回路
JPH05299616A (ja) 1992-04-16 1993-11-12 Hitachi Ltd 半導体記憶装置
JPH05299575A (ja) 1992-04-17 1993-11-12 Mitsubishi Electric Corp メモリ内蔵半導体装置
JP3400824B2 (ja) * 1992-11-06 2003-04-28 三菱電機株式会社 半導体記憶装置
JPH07176185A (ja) 1993-12-20 1995-07-14 Canon Inc リフレッシュ制御装置
KR0129197B1 (ko) * 1994-04-21 1998-10-01 문정환 메모리셀어레이의 리플레쉬 제어회로
JPH08185695A (ja) * 1994-08-30 1996-07-16 Mitsubishi Electric Corp 半導体記憶装置、その動作方法およびその製造方法
US5737748A (en) * 1995-03-15 1998-04-07 Texas Instruments Incorporated Microprocessor unit having a first level write-through cache memory and a smaller second-level write-back cache memory
JPH08305680A (ja) 1995-04-28 1996-11-22 Matsushita Electric Ind Co Ltd 半導体装置
US5933623A (en) * 1995-10-26 1999-08-03 Hitachi, Ltd. Synchronous data transfer system
US5644541A (en) * 1995-11-03 1997-07-01 Philip K. Siu Memory substitution system and method for correcting partially defective memories
JPH1011348A (ja) 1996-06-24 1998-01-16 Ricoh Co Ltd Dramの制御装置およびそのdram
JP2907127B2 (ja) 1996-06-25 1999-06-21 日本電気株式会社 マルチチップモジュール
US5966736A (en) * 1997-03-07 1999-10-12 Advanced Micro Devices, Inc. Multiplexing DRAM control signals and chip select on a processor
US6094704A (en) * 1997-06-17 2000-07-25 Micron Technology, Inc. Memory device with pipelined address path
JP3161383B2 (ja) * 1997-09-16 2001-04-25 日本電気株式会社 半導体記憶装置
US5889714A (en) * 1997-11-03 1999-03-30 Digital Equipment Corporation Adaptive precharge management for synchronous DRAM
JPH11219984A (ja) 1997-11-06 1999-08-10 Sharp Corp 半導体装置パッケージおよびその製造方法ならびにそのための回路基板
JPH11204721A (ja) 1998-01-07 1999-07-30 Hitachi Ltd 半導体装置
JPH11220091A (ja) 1998-02-02 1999-08-10 Toshiba Microelectronics Corp 半導体装置
JPH11219600A (ja) * 1998-02-03 1999-08-10 Mitsubishi Electric Corp 半導体集積回路装置
WO1999046775A2 (en) * 1998-03-10 1999-09-16 Rambus, Inc. Performing concurrent refresh and current control operations in a memory subsystem
JPH11283361A (ja) 1998-03-26 1999-10-15 Matsushita Electric Ind Co Ltd 記憶装置
KR19990078379A (ko) * 1998-03-30 1999-10-25 피터 토마스 디코딩 오토리프레시 모드를 가지는 디램
US6016282A (en) * 1998-05-28 2000-01-18 Micron Technology, Inc. Clock vernier adjustment
US5999474A (en) * 1998-10-01 1999-12-07 Monolithic System Tech Inc Method and apparatus for complete hiding of the refresh of a semiconductor memory
JP2000339954A (ja) * 1999-05-31 2000-12-08 Fujitsu Ltd 半導体記憶装置
JP4555416B2 (ja) 1999-09-22 2010-09-29 富士通セミコンダクター株式会社 半導体集積回路およびその制御方法
JP5299616B2 (ja) 2008-10-23 2013-09-25 富士ゼロックス株式会社 静電荷像現像用トナー及びその製造方法、静電荷像現像剤、トナーカートリッジ、プロセスカートリッジ、画像形成方法、並びに、画像形成装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR880014567A (ko) * 1987-05-22 1988-12-24 미다 가쓰시게 반도체 장치
KR100289427B1 (ko) * 1993-11-30 2001-05-02 이데이 노부유끼 반도체 불휘발성 기억장치
JPH08263229A (ja) * 1995-03-23 1996-10-11 Hitachi Ltd 半導体記憶装置
KR100282971B1 (ko) * 1996-11-15 2001-03-02 포만 제프리 엘 동적랜덤액세스메모리어셈블리및동적랜덤액세스메모리모듈의조립방법
JPH1186560A (ja) * 1997-09-16 1999-03-30 Nec Corp 半導体集積回路装置

Also Published As

Publication number Publication date
US20020131318A1 (en) 2002-09-19
KR20010107538A (ko) 2001-12-07
JP3871853B2 (ja) 2007-01-24
US6411561B2 (en) 2002-06-25
US6587393B2 (en) 2003-07-01
US20010048616A1 (en) 2001-12-06
US20120262992A1 (en) 2012-10-18
US6392950B2 (en) 2002-05-21
US8223578B2 (en) 2012-07-17
US20030206478A1 (en) 2003-11-06
US20010046167A1 (en) 2001-11-29
US20090245004A1 (en) 2009-10-01
US6847575B2 (en) 2005-01-25
US8711650B2 (en) 2014-04-29
TWI286317B (en) 2007-09-01
JP2001344967A (ja) 2001-12-14
US20050128853A1 (en) 2005-06-16
US7554872B2 (en) 2009-06-30

Similar Documents

Publication Publication Date Title
KR100734410B1 (ko) 반도체 장치 및 그 동작 방법
KR100884157B1 (ko) 반도체 장치
KR100924408B1 (ko) 반도체 장치
JP4574602B2 (ja) 半導体装置
JP4534485B2 (ja) 半導体装置及びメモリモジュール
JP5391370B2 (ja) メモリモジュールとコントローラ
JP2010231883A (ja) 半導体装置
JP2004206873A (ja) 半導体装置
KR100958767B1 (ko) 메모리 모듈
JP4766526B2 (ja) メモリモジュール
JP2010225161A (ja) 半導体記憶装置

Legal Events

Date Code Title Description
R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PE0801 Dismissal of amendment

St.27 status event code: A-2-2-P10-P12-nap-PE0801

D12-X000 Request for substantive examination rejected

St.27 status event code: A-1-2-D10-D12-exm-X000

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20120611

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

FPAY Annual fee payment

Payment date: 20130531

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20140627

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20140627

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000