JP4900661B2 - 不揮発性記憶装置 - Google Patents
不揮発性記憶装置 Download PDFInfo
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- JP4900661B2 JP4900661B2 JP2006045463A JP2006045463A JP4900661B2 JP 4900661 B2 JP4900661 B2 JP 4900661B2 JP 2006045463 A JP2006045463 A JP 2006045463A JP 2006045463 A JP2006045463 A JP 2006045463A JP 4900661 B2 JP4900661 B2 JP 4900661B2
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Description
Claims (6)
- 平面形状が長方形からなる第1表面、平面視において上記第1表面の短辺に沿って、かつ直線状に配置された第1電極列、平面視において上記第1表面の2つの長辺のうちの一方の長辺のみに沿って、かつ直線状に配置された第2電極列、上記第1電極列と上記第2電極列とを電気的に接続する内部配線、および上記第1表面とは反対側の第1裏面を有する搭載基板と、
平面形状が長方形からなる第2表面、平面視において上記第2表面の短辺に沿って、かつ直線状に配置された第1ボンディングパッド列、および上記第2表面とは反対側の第2裏面を有し、上記第2裏面が上記搭載基板の上記第1表面と対向し、かつ上記第1および第2電極列が露出し、かつ平面視において上記第2表面の長辺が上記第1表面の長辺と並ぶように上記搭載基板の上記表面上に搭載された不揮発性メモリチップと、
平面形状が四角形からなる第3表面、平面視において上記第3表面の第1辺のみに沿って、かつ直線状に配置された第2ボンディングパッド列、および上記第3表面とは反対側の第3裏面を有し、上記第3裏面が上記不揮発性メモリチップの上記第2表面と対向し、かつ上記第1ボンディングパッド列が露出し、かつ平面視において上記第3表面の上記第1辺が上記第1および第2表面のそれぞれの長辺と並び、かつ平面視において、上記第1辺と上記第1表面の2つの長辺のうちの上記一方の長辺との間隔が、上記第1辺とは反対側の第2辺と上記第1表面の2つの長辺のうちの他方の長辺との間隔よりも小さくなるように上記不揮発性メモリチップ上に搭載され、上記不揮発性メモリチップを制御するコントロールチップと、
上記第1ボンディングパッド列と上記第1電極列をそれぞれ電気的に接続する第1ボンディングワイヤ群と、
上記第2ボンディングパッド列と上記第2電極列をそれぞれ電気的に接続する第2ボンディングワイヤ群と、
を含み、
上記第1ボンディングパッド列は、上記第2表面の2つの長辺のうち、平面視において上記コントロールチップの上記第1辺と上記搭載基板の上記一方の長辺との間に位置する長辺に沿って配置されていなく、
上記第2ボンディングパッド列は、上記第1ボンディングパッド列よりも上記搭載基板の上記第1表面から離れている不揮発性記憶装置。 - 請求項1において、
上記第1電極列は、上記第1表面の2つ短辺のうちの一方の短辺のみに沿って配置されており、
上記第1ボンディングパッド列は、上記第2表面の2つの短辺のうちの上記一方の短辺のみに沿って配置されている不揮発性記憶装置。 - 請求項1において、
上記第1電極列は、上記第1表面の2つ短辺それぞれに沿って配置されており、
上記第1ボンディングパッド列は、上記第2表面の2つの短辺それぞれに沿って配置されている不揮発性記憶装置。 - 請求項2又は3において、
上記コントロールチップは、読み出しデータの誤り検出訂正回路、不良部分を予備領域に代替する冗長回路、メモリブロック単位で書換回数を平準化する平準化回路のいずれか1つを含むメモリ管理回路を有する不揮発性記憶装置。 - 請求項4において、
上記不揮発性メモリチップは、第1半導体製造技術により形成され、
上記コントロールチップは、上記第1半導体製造技術とは異なる第2半導体製造技術により形成される不揮発性記憶装置。 - 請求項4において、
上記コントロールチップは、複数の不揮発性メモリチップに対しても組み合わせが可能とされ、
上記不揮発性メモリチップは、1ないし複数が搭載される不揮発性記憶装置。
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JP4498403B2 (ja) * | 2007-09-28 | 2010-07-07 | 株式会社東芝 | 半導体装置と半導体記憶装置 |
JP5183186B2 (ja) * | 2007-12-14 | 2013-04-17 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP5150242B2 (ja) * | 2007-12-27 | 2013-02-20 | 株式会社東芝 | 半導体記憶装置 |
JP5150243B2 (ja) * | 2007-12-27 | 2013-02-20 | 株式会社東芝 | 半導体記憶装置 |
US8004071B2 (en) * | 2007-12-27 | 2011-08-23 | Kabushiki Kaisha Toshiba | Semiconductor memory device |
JP5207868B2 (ja) * | 2008-02-08 | 2013-06-12 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP5166903B2 (ja) * | 2008-02-08 | 2013-03-21 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP5543629B2 (ja) * | 2008-02-08 | 2014-07-09 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP5538682B2 (ja) * | 2008-03-06 | 2014-07-02 | ピーエスフォー ルクスコ エスエイアールエル | 半導体装置及びその製造方法 |
JP2010021449A (ja) * | 2008-07-11 | 2010-01-28 | Toshiba Corp | 半導体装置 |
JP5362404B2 (ja) * | 2009-03-25 | 2013-12-11 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置の製造方法 |
CN101866915B (zh) * | 2009-04-15 | 2015-08-19 | 三星电子株式会社 | 集成电路装置及其操作方法、存储器存储装置及电子系统 |
KR20100114421A (ko) * | 2009-04-15 | 2010-10-25 | 삼성전자주식회사 | 적층 패키지 |
US8656086B2 (en) * | 2010-12-08 | 2014-02-18 | Avocent Corporation | System and method for autonomous NAND refresh |
US9536863B2 (en) * | 2011-12-22 | 2017-01-03 | Intel Corporation | Interconnection of a packaged chip to a die in a package utilizing on-package input/output interfaces |
JP2014220439A (ja) | 2013-05-10 | 2014-11-20 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体装置 |
US10297571B2 (en) | 2013-09-06 | 2019-05-21 | Toshiba Memory Corporation | Semiconductor package |
KR102247916B1 (ko) * | 2014-01-16 | 2021-05-04 | 삼성전자주식회사 | 계단식 적층 구조를 갖는 반도체 패키지 |
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