KR100651305B1 - 배치 로더를 구비한 이중 아암 기판 처리 로봇 - Google Patents
배치 로더를 구비한 이중 아암 기판 처리 로봇 Download PDFInfo
- Publication number
- KR100651305B1 KR100651305B1 KR1020017000444A KR20017000444A KR100651305B1 KR 100651305 B1 KR100651305 B1 KR 100651305B1 KR 1020017000444 A KR1020017000444 A KR 1020017000444A KR 20017000444 A KR20017000444 A KR 20017000444A KR 100651305 B1 KR100651305 B1 KR 100651305B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- arm
- paddle
- loader
- batch loader
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 129
- 230000009977 dual effect Effects 0.000 title description 11
- 230000007246 mechanism Effects 0.000 claims abstract description 28
- 238000012545 processing Methods 0.000 claims abstract description 23
- 239000012636 effector Substances 0.000 claims abstract description 15
- 230000004044 response Effects 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 38
- 238000003860 storage Methods 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims 1
- 238000012546 transfer Methods 0.000 description 16
- 235000012431 wafers Nutrition 0.000 description 9
- 210000000245 forearm Anatomy 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 230000009467 reduction Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000009331 sowing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S294/00—Handling: hand and hoist-line implements
- Y10S294/907—Sensor controlled device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/113,599 | 1998-07-10 | ||
| US09/113,599 US6450755B1 (en) | 1998-07-10 | 1998-07-10 | Dual arm substrate handling robot with a batch loader |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20010053490A KR20010053490A (ko) | 2001-06-25 |
| KR100651305B1 true KR100651305B1 (ko) | 2006-11-28 |
Family
ID=22350418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020017000444A Expired - Lifetime KR100651305B1 (ko) | 1998-07-10 | 1999-07-09 | 배치 로더를 구비한 이중 아암 기판 처리 로봇 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US6450755B1 (enExample) |
| EP (1) | EP1133441A1 (enExample) |
| JP (3) | JP2002520830A (enExample) |
| KR (1) | KR100651305B1 (enExample) |
| WO (1) | WO2000002803A1 (enExample) |
Families Citing this family (67)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6350097B1 (en) * | 1999-04-19 | 2002-02-26 | Applied Materials, Inc. | Method and apparatus for processing wafers |
| US6582175B2 (en) * | 2000-04-14 | 2003-06-24 | Applied Materials, Inc. | Robot for handling semiconductor wafers |
| US7891935B2 (en) | 2002-05-09 | 2011-02-22 | Brooks Automation, Inc. | Dual arm robot |
| US7230441B2 (en) * | 2002-07-18 | 2007-06-12 | Rudolph Technologies, Inc. | Wafer staging platform for a wafer inspection system |
| US20040013503A1 (en) * | 2002-07-22 | 2004-01-22 | Jaswant Sandhu | Robotic hand with multi-wafer end effector |
| JP2004071730A (ja) * | 2002-08-05 | 2004-03-04 | Sendai Nikon:Kk | レチクルハンドリング方法、レチクルハンドリング装置及び露光装置 |
| CN1290396C (zh) * | 2002-08-06 | 2006-12-13 | 松下电器产业株式会社 | 用于安装元件的方法和装置 |
| US6696367B1 (en) * | 2002-09-27 | 2004-02-24 | Asm America, Inc. | System for the improved handling of wafers within a process tool |
| US7384907B2 (en) * | 2002-12-13 | 2008-06-10 | Duke University | Method of treating infection with ABl tyrosine kinase inhibitors |
| JP4391744B2 (ja) * | 2002-12-27 | 2009-12-24 | 東京エレクトロン株式会社 | 移動式プローブカード搬送装置、プローブ装置及びプローブ装置へのプローブカードの搬送方法 |
| KR100553685B1 (ko) * | 2003-05-14 | 2006-02-24 | 삼성전자주식회사 | 반도체 기판을 컨테이너로부터 언로딩하는 이송장치 및이송방법 |
| JP3999723B2 (ja) * | 2003-10-08 | 2007-10-31 | 川崎重工業株式会社 | 基板保持装置 |
| US20070269297A1 (en) | 2003-11-10 | 2007-11-22 | Meulen Peter V D | Semiconductor wafer handling and transport |
| US10086511B2 (en) | 2003-11-10 | 2018-10-02 | Brooks Automation, Inc. | Semiconductor manufacturing systems |
| TWI274640B (en) * | 2004-04-08 | 2007-03-01 | Fabworx Solutions Inc | Hub assembly for robotic arm having pin spacers |
| US7396412B2 (en) | 2004-12-22 | 2008-07-08 | Sokudo Co., Ltd. | Coat/develop module with shared dispense |
| US7798764B2 (en) * | 2005-12-22 | 2010-09-21 | Applied Materials, Inc. | Substrate processing sequence in a cartesian robot cluster tool |
| US20060182556A1 (en) * | 2005-01-10 | 2006-08-17 | Au Optronics Corporation | Substrate transportation device (wire) |
| US7625027B2 (en) * | 2005-05-24 | 2009-12-01 | Aries Innovations | Vacuum actuated end effector |
| JP2007005582A (ja) * | 2005-06-24 | 2007-01-11 | Asm Japan Kk | 基板搬送装置及びそれを搭載した半導体基板製造装置 |
| US8573919B2 (en) * | 2005-07-11 | 2013-11-05 | Brooks Automation, Inc. | Substrate transport apparatus |
| JP4440178B2 (ja) * | 2005-07-25 | 2010-03-24 | 東京エレクトロン株式会社 | 基板の搬送装置 |
| US8220354B2 (en) * | 2006-06-28 | 2012-07-17 | Genmark Automation, Inc. | Belt-driven robot having extended Z-axis motion |
| US8701519B2 (en) * | 2006-06-28 | 2014-04-22 | Genmark Automation, Inc. | Robot with belt-drive system |
| US9117859B2 (en) * | 2006-08-31 | 2015-08-25 | Brooks Automation, Inc. | Compact processing apparatus |
| KR100810488B1 (ko) | 2006-11-15 | 2008-03-07 | 주식회사 로보스타 | 더블암형 로봇 |
| EP2097342B1 (de) * | 2006-11-27 | 2023-03-22 | Brooks CCS RS AG | Transfervorrichtung für eine überkopf-transportanlage |
| US8950998B2 (en) * | 2007-02-27 | 2015-02-10 | Brooks Automation, Inc. | Batch substrate handling |
| US8317449B2 (en) * | 2007-03-05 | 2012-11-27 | Applied Materials, Inc. | Multiple substrate transfer robot |
| WO2008136832A1 (en) * | 2007-05-07 | 2008-11-13 | Symyx Technologies, Inc. | Apparatus and method for moving a substrate |
| SG147353A1 (en) * | 2007-05-07 | 2008-11-28 | Mfg Integration Technology Ltd | Apparatus for object processing |
| US8099190B2 (en) * | 2007-06-22 | 2012-01-17 | Asm International N.V. | Apparatus and method for transferring two or more wafers whereby the positions of the wafers can be measured |
| US8277165B2 (en) * | 2007-09-22 | 2012-10-02 | Dynamic Micro System Semiconductor Equipment GmbH | Transfer mechanism with multiple wafer handling capability |
| DE102007047600A1 (de) * | 2007-10-05 | 2009-04-23 | Scolomatic Gmbh | Greifersystem |
| KR20090041883A (ko) * | 2007-10-25 | 2009-04-29 | 삼성전자주식회사 | 웨이퍼 슬롯 가변지정에 의한 웨이퍼 로딩 및 언로딩하기위한 반도체 제조설비 및 그 방법 |
| TWI372717B (en) * | 2007-12-14 | 2012-09-21 | Prime View Int Co Ltd | Apparatus for transferring substrate |
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| US8731718B2 (en) * | 2010-10-22 | 2014-05-20 | Lam Research Corporation | Dual sensing end effector with single sensor |
| KR102223624B1 (ko) | 2010-11-10 | 2021-03-05 | 브룩스 오토메이션 인코퍼레이티드 | 기판 처리 장치 |
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| JP6378595B2 (ja) | 2014-09-19 | 2018-08-22 | 東京エレクトロン株式会社 | 基板搬送装置 |
| USD817878S1 (en) * | 2016-07-08 | 2018-05-15 | UBTECH Robotics Corp. | Servo |
| USD817879S1 (en) * | 2016-07-08 | 2018-05-15 | UBTECH Robotics Corp. | Servo |
| TWI729319B (zh) | 2017-10-27 | 2021-06-01 | 美商應用材料股份有限公司 | 具有空間分離的單個晶圓處理環境 |
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| JP1619125S (enExample) * | 2018-03-29 | 2018-11-26 | ||
| USD892881S1 (en) * | 2018-03-29 | 2020-08-11 | Daihen Corporation | Power transmission unit and power receiving unit of an industrial robot arm |
| JP1612766S (enExample) * | 2018-03-29 | 2018-09-03 | ||
| JP1612912S (enExample) * | 2018-03-29 | 2018-09-03 | ||
| JP1612908S (enExample) * | 2018-03-29 | 2018-09-03 | ||
| KR102512865B1 (ko) * | 2018-11-14 | 2023-03-23 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치 및 기판 반송 방법 |
| US12009241B2 (en) | 2019-10-14 | 2024-06-11 | Asm Ip Holding B.V. | Vertical batch furnace assembly with detector to detect cassette |
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-
1998
- 1998-07-10 US US09/113,599 patent/US6450755B1/en not_active Expired - Lifetime
-
1999
- 1999-07-09 EP EP99932361A patent/EP1133441A1/en not_active Withdrawn
- 1999-07-09 WO PCT/US1999/015484 patent/WO2000002803A1/en not_active Ceased
- 1999-07-09 KR KR1020017000444A patent/KR100651305B1/ko not_active Expired - Lifetime
- 1999-07-09 JP JP2000559040A patent/JP2002520830A/ja active Pending
-
2000
- 2000-06-23 US US09/603,295 patent/US6632065B1/en not_active Expired - Fee Related
-
2002
- 2002-09-16 US US10/244,852 patent/US7179044B2/en not_active Expired - Lifetime
-
2010
- 2010-06-23 JP JP2010142639A patent/JP5543285B2/ja not_active Expired - Lifetime
-
2013
- 2013-01-25 JP JP2013012443A patent/JP5567704B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| WO2000002803A1 (en) | 2000-01-20 |
| US20030017044A1 (en) | 2003-01-23 |
| US7179044B2 (en) | 2007-02-20 |
| US6632065B1 (en) | 2003-10-14 |
| JP2013093615A (ja) | 2013-05-16 |
| WO2000002803A9 (en) | 2000-09-08 |
| KR20010053490A (ko) | 2001-06-25 |
| JP5567704B2 (ja) | 2014-08-06 |
| US6450755B1 (en) | 2002-09-17 |
| JP2002520830A (ja) | 2002-07-09 |
| JP5543285B2 (ja) | 2014-07-09 |
| JP2010251790A (ja) | 2010-11-04 |
| EP1133441A1 (en) | 2001-09-19 |
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