JP2002520830A - バッチローダーを有する二本アーム・サブストレート取扱いロボット - Google Patents

バッチローダーを有する二本アーム・サブストレート取扱いロボット

Info

Publication number
JP2002520830A
JP2002520830A JP2000559040A JP2000559040A JP2002520830A JP 2002520830 A JP2002520830 A JP 2002520830A JP 2000559040 A JP2000559040 A JP 2000559040A JP 2000559040 A JP2000559040 A JP 2000559040A JP 2002520830 A JP2002520830 A JP 2002520830A
Authority
JP
Japan
Prior art keywords
substrate
arm
substrates
batch loader
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000559040A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002520830A5 (enExample
Inventor
キャメロン，ジェームス，エー．
レイリング，スティーブン，ジー．
Original Assignee
ピーアールアイ オートメーション インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ピーアールアイ オートメーション インコーポレイテッド filed Critical ピーアールアイ オートメーション インコーポレイテッド
Publication of JP2002520830A publication Critical patent/JP2002520830A/ja
Publication of JP2002520830A5 publication Critical patent/JP2002520830A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S294/00—Handling: hand and hoist-line implements
    • Y10S294/907—Sensor controlled device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2000559040A 1998-07-10 1999-07-09 バッチローダーを有する二本アーム・サブストレート取扱いロボット Pending JP2002520830A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/113,599 1998-07-10
US09/113,599 US6450755B1 (en) 1998-07-10 1998-07-10 Dual arm substrate handling robot with a batch loader
PCT/US1999/015484 WO2000002803A1 (en) 1998-07-10 1999-07-09 Dual arm substrate handling robot with a batch loader

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010142639A Division JP5543285B2 (ja) 1998-07-10 2010-06-23 基板取扱いロボット

Publications (2)

Publication Number Publication Date
JP2002520830A true JP2002520830A (ja) 2002-07-09
JP2002520830A5 JP2002520830A5 (enExample) 2006-08-31

Family

ID=22350418

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2000559040A Pending JP2002520830A (ja) 1998-07-10 1999-07-09 バッチローダーを有する二本アーム・サブストレート取扱いロボット
JP2010142639A Expired - Lifetime JP5543285B2 (ja) 1998-07-10 2010-06-23 基板取扱いロボット
JP2013012443A Expired - Lifetime JP5567704B2 (ja) 1998-07-10 2013-01-25 基板取扱いロボットの基板取り出し方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2010142639A Expired - Lifetime JP5543285B2 (ja) 1998-07-10 2010-06-23 基板取扱いロボット
JP2013012443A Expired - Lifetime JP5567704B2 (ja) 1998-07-10 2013-01-25 基板取扱いロボットの基板取り出し方法

Country Status (5)

Country Link
US (3) US6450755B1 (enExample)
EP (1) EP1133441A1 (enExample)
JP (3) JP2002520830A (enExample)
KR (1) KR100651305B1 (enExample)
WO (1) WO2000002803A1 (enExample)

Cited By (5)

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JP2007005582A (ja) * 2005-06-24 2007-01-11 Asm Japan Kk 基板搬送装置及びそれを搭載した半導体基板製造装置
CN1321327C (zh) * 2002-12-27 2007-06-13 东京毅力科创株式会社 搬运机构、使用搬运机构的移动式探针板搬运装置及探测装置
JP2010541201A (ja) * 2007-09-22 2010-12-24 ダイナミック マイクロシステムズ セミコンダクター イクイップメント ゲーエムベーハー 複数のウェハを取り扱う能力を備えた受渡し機構
JP2014022598A (ja) * 2012-07-19 2014-02-03 Kawasaki Heavy Ind Ltd 基板搬送装置
JP2014160775A (ja) * 2013-02-20 2014-09-04 Tokyo Electron Ltd 基板搬送装置、基板処理装置および基板収容方法

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JP2004071730A (ja) * 2002-08-05 2004-03-04 Sendai Nikon:Kk レチクルハンドリング方法、レチクルハンドリング装置及び露光装置
CN1290396C (zh) * 2002-08-06 2006-12-13 松下电器产业株式会社 用于安装元件的方法和装置
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US7384907B2 (en) * 2002-12-13 2008-06-10 Duke University Method of treating infection with ABl tyrosine kinase inhibitors
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JP3999723B2 (ja) * 2003-10-08 2007-10-31 川崎重工業株式会社 基板保持装置
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US20120136472A1 (en) * 2010-11-25 2012-05-31 Li Yan-Ze Dual-arm type robotic arm and its method of transporting panels
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TWI729319B (zh) 2017-10-27 2021-06-01 美商應用材料股份有限公司 具有空間分離的單個晶圓處理環境
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KR102512865B1 (ko) * 2018-11-14 2023-03-23 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 반송 방법
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US6450755B1 (en) 2002-09-17
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EP1133441A1 (en) 2001-09-19
KR100651305B1 (ko) 2006-11-28

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