KR100300614B1 - 레지스트도포/현상장치및피처리체의처리장치 - Google Patents

레지스트도포/현상장치및피처리체의처리장치 Download PDF

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Publication number
KR100300614B1
KR100300614B1 KR1019950009914A KR19950009914A KR100300614B1 KR 100300614 B1 KR100300614 B1 KR 100300614B1 KR 1019950009914 A KR1019950009914 A KR 1019950009914A KR 19950009914 A KR19950009914 A KR 19950009914A KR 100300614 B1 KR100300614 B1 KR 100300614B1
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KR
South Korea
Prior art keywords
processing
processed
cassette
wafer
schedule
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019950009914A
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English (en)
Korean (ko)
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KR950034476A (ko
Inventor
미우라요시카즈
아라이히데오
아키모토마사미
오가와시즈오
나가노도시히코
Original Assignee
다카시마 히로시
도오교오에레구토론큐우슈우가부시끼가이샤
히가시 데쓰로
동경 엘렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 다카시마 히로시, 도오교오에레구토론큐우슈우가부시끼가이샤, 히가시 데쓰로, 동경 엘렉트론 주식회사 filed Critical 다카시마 히로시
Publication of KR950034476A publication Critical patent/KR950034476A/ko
Application granted granted Critical
Publication of KR100300614B1 publication Critical patent/KR100300614B1/ko
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Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1019950009914A 1994-04-26 1995-04-26 레지스트도포/현상장치및피처리체의처리장치 Expired - Lifetime KR100300614B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6110421A JPH07297258A (ja) 1994-04-26 1994-04-26 板状体の搬送装置
JP94-110421 1994-04-26

Publications (2)

Publication Number Publication Date
KR950034476A KR950034476A (ko) 1995-12-28
KR100300614B1 true KR100300614B1 (ko) 2001-11-30

Family

ID=14535342

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950009914A Expired - Lifetime KR100300614B1 (ko) 1994-04-26 1995-04-26 레지스트도포/현상장치및피처리체의처리장치

Country Status (4)

Country Link
US (2) US5803932A (https=)
JP (1) JPH07297258A (https=)
KR (1) KR100300614B1 (https=)
TW (1) TW280937B (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980042582A (ko) * 1997-11-19 1998-08-17 히가시데쓰로 처리시스템
KR101052946B1 (ko) * 2003-06-18 2011-07-29 도쿄엘렉트론가부시키가이샤 처리시스템
KR20210040261A (ko) * 2019-10-02 2021-04-13 도쿄엘렉트론가부시키가이샤 도포, 현상 장치 및 도포, 현상 방법

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* Cited by examiner, † Cited by third party
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KR19980042582A (ko) * 1997-11-19 1998-08-17 히가시데쓰로 처리시스템
KR101052946B1 (ko) * 2003-06-18 2011-07-29 도쿄엘렉트론가부시키가이샤 처리시스템
KR20210040261A (ko) * 2019-10-02 2021-04-13 도쿄엘렉트론가부시키가이샤 도포, 현상 장치 및 도포, 현상 방법
KR102386590B1 (ko) 2019-10-02 2022-04-15 도쿄엘렉트론가부시키가이샤 도포, 현상 장치 및 도포, 현상 방법

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US5803932A (en) 1998-09-08
KR950034476A (ko) 1995-12-28
US5980591A (en) 1999-11-09
TW280937B (https=) 1996-07-11
JPH07297258A (ja) 1995-11-10

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