JP4444154B2 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
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- JP4444154B2 JP4444154B2 JP2005134306A JP2005134306A JP4444154B2 JP 4444154 B2 JP4444154 B2 JP 4444154B2 JP 2005134306 A JP2005134306 A JP 2005134306A JP 2005134306 A JP2005134306 A JP 2005134306A JP 4444154 B2 JP4444154 B2 JP 4444154B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41815—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Robotics (AREA)
- Quality & Reliability (AREA)
- Automation & Control Theory (AREA)
- General Engineering & Computer Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
2 バークブロック
3 レジスト塗布ブロック
4 現像処理ブロック
5 インターフェイスブロック
12 基板移載機構
21,31,41,42 熱処理タワー
55 搬送機構
100 ホストコンピュータ
BRC1〜BRC3,SC1〜SC3 塗布処理ユニット
CC セルコントローラ
CP1〜CP14 クールプレート
EXP 露光ユニット
HP1〜HP11 ホットプレート
MC メインコントローラ
PASS1〜PASS10 基板載置部
PHP1〜PHP12 加熱部
SD1〜SD5 現像処理ユニット
TC 搬送ロボットコントローラ
TR1〜TR4 搬送ロボット
W 基板
Claims (2)
- 基板の処理を行う複数の基板処理部を有する基板処理部群と、前記基板処理部群に未処理基板を渡すととともに前記基板処理部群から処理済み基板を受け取るインデクサ部と、前記インデクサ部および前記複数の基板処理部に対して基板搬送を行う搬送手段とを備え、前記インデクサから払い出された基板にレジスト塗布処理を行って装置外部の露光ユニットに該基板を渡すとともに、前記露光ユニットから戻された露光後の基板に現像処理を行って前記インデクサに格納する基板処理装置であって、
前記複数の基板処理部は、相互に同一処理工程における同一条件の処理を行う複数の並行処理部を含み、
未処理基板を前記インデクサから前記基板処理部群に渡す前に、当該未処理基板を前記複数の並行処理部のうちのいずれに搬送するかを決定することによって当該未処理基板の搬送系路を予め設定する搬送系路設定手段と、
前記搬送系路設定手段によって設定された搬送系路に基づいて、前記複数の基板処理部のうち当該搬送系路に含まれしかも露光処理前の各工程の処理を行う基板処理部に設定されている処理条件の調整を行う処理条件制御手段と、
を備えることを特徴とする基板処理装置。 - 基板の処理を行う複数の基板処理部を有する基板処理部群と、前記基板処理部群に未処理基板を渡すととともに前記基板処理部群から処理済み基板を受け取るインデクサ部と、前記インデクサ部および前記複数の基板処理部に対して基板搬送を行う搬送手段とを備え、前記インデクサから払い出された基板にレジスト塗布処理を行って装置外部の露光ユニットに該基板を渡すとともに、前記露光ユニットから戻された露光後の基板に現像処理を行って前記インデクサに格納する基板処理装置であって、
前記複数の基板処理部は、相互に同一処理工程における同一条件の処理を行う複数の並行処理部を含み、
未処理基板を前記インデクサから前記基板処理部群に渡す前に、当該未処理基板を前記複数の並行処理部のうちのいずれに搬送するかを決定することによって当該未処理基板の搬送系路を予め設定する搬送系路設定手段と、
前記搬送系路設定手段によって設定された搬送系路に基づいて、前記複数の基板処理部のうち当該搬送系路に含まれしかも露光処理後の各工程の処理を行う基板処理部に設定されている処理条件の調整を行う処理条件制御手段と、
を備えることを特徴とする基板処理装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005134306A JP4444154B2 (ja) | 2005-05-02 | 2005-05-02 | 基板処理装置 |
TW095112149A TWI323831B (en) | 2005-05-02 | 2006-04-06 | Substrate processing apparatus |
CNB2006100771828A CN100498547C (zh) | 2005-05-02 | 2006-04-27 | 衬底处理装置 |
US11/416,036 US20060245855A1 (en) | 2005-05-02 | 2006-05-02 | Substrate processing apparatus |
KR1020060039384A KR100806418B1 (ko) | 2005-05-02 | 2006-05-02 | 기판처리장치 |
US12/765,255 US20100202867A1 (en) | 2005-05-02 | 2010-04-22 | Substrate processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005134306A JP4444154B2 (ja) | 2005-05-02 | 2005-05-02 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006310698A JP2006310698A (ja) | 2006-11-09 |
JP4444154B2 true JP4444154B2 (ja) | 2010-03-31 |
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Application Number | Title | Priority Date | Filing Date |
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JP2005134306A Expired - Fee Related JP4444154B2 (ja) | 2005-05-02 | 2005-05-02 | 基板処理装置 |
Country Status (5)
Country | Link |
---|---|
US (2) | US20060245855A1 (ja) |
JP (1) | JP4444154B2 (ja) |
KR (1) | KR100806418B1 (ja) |
CN (1) | CN100498547C (ja) |
TW (1) | TWI323831B (ja) |
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WO2007114293A1 (ja) * | 2006-03-31 | 2007-10-11 | Youthengineering Co., Ltd. | ウエハー用保管庫及びその保管制御方法 |
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US7745095B2 (en) * | 2007-07-05 | 2010-06-29 | Asml Netherlands B.V. | Lithographic method and device manufactured thereby |
US20090023297A1 (en) * | 2007-07-18 | 2009-01-22 | Sokudo Co., Ltd. | Method and apparatus for hmds treatment of substrate edges |
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JP5370806B2 (ja) | 2008-04-22 | 2013-12-18 | 富士電機株式会社 | インプリント方法およびその装置 |
JP5077764B2 (ja) | 2008-04-22 | 2012-11-21 | 富士電機株式会社 | インプリント方法およびその装置 |
JP5458633B2 (ja) * | 2008-06-20 | 2014-04-02 | 株式会社Ihi | 処理設備及び搬送制御方法 |
JP5243205B2 (ja) * | 2008-11-25 | 2013-07-24 | 株式会社Sokudo | 基板処理装置 |
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JP5562561B2 (ja) * | 2009-01-23 | 2014-07-30 | 株式会社Sokudo | 基板処理装置 |
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JP5469015B2 (ja) * | 2009-09-30 | 2014-04-09 | 東京エレクトロン株式会社 | 基板処理装置および基板搬送方法 |
JP5713081B2 (ja) * | 2010-07-09 | 2015-05-07 | 東京エレクトロン株式会社 | 塗布、現像装置 |
JP5936853B2 (ja) * | 2011-12-05 | 2016-06-22 | 株式会社Screenセミコンダクターソリューションズ | 基板処理装置および基板処理方法 |
JP2014003164A (ja) * | 2012-06-19 | 2014-01-09 | Tokyo Electron Ltd | 半導体装置の製造方法及び半導体装置並びに半導体装置の製造システム |
CN103208448B (zh) * | 2013-03-18 | 2015-10-21 | 无锡华瑛微电子技术有限公司 | 半导体晶圆传输装置 |
CN103760753B (zh) * | 2013-12-31 | 2017-04-12 | 深圳市华星光电技术有限公司 | 基板烘烤装置及其温度调节方法 |
CN104091773B (zh) * | 2014-07-11 | 2017-09-29 | 上海华力微电子有限公司 | 半导体制造的多平行动态流程控制方法 |
US10403517B2 (en) | 2015-02-18 | 2019-09-03 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus |
CN109037111B (zh) | 2015-02-25 | 2022-03-22 | 株式会社思可林集团 | 基板处理装置 |
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US7308329B2 (en) * | 2004-12-28 | 2007-12-11 | Olympus Corporation | Method and apparatus for inspecting semiconductor wafer |
JP4523513B2 (ja) * | 2005-08-05 | 2010-08-11 | 東京エレクトロン株式会社 | 基板受け渡し装置、基板受け渡し方法及び記憶媒体 |
US7657390B2 (en) * | 2005-11-02 | 2010-02-02 | Applied Materials, Inc. | Reclaiming substrates having defects and contaminants |
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2005
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- 2006-04-06 TW TW095112149A patent/TWI323831B/zh not_active IP Right Cessation
- 2006-04-27 CN CNB2006100771828A patent/CN100498547C/zh not_active Expired - Fee Related
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KR20060114649A (ko) | 2006-11-07 |
JP2006310698A (ja) | 2006-11-09 |
US20100202867A1 (en) | 2010-08-12 |
CN100498547C (zh) | 2009-06-10 |
CN1858654A (zh) | 2006-11-08 |
TW200707113A (en) | 2007-02-16 |
KR100806418B1 (ko) | 2008-02-21 |
US20060245855A1 (en) | 2006-11-02 |
TWI323831B (en) | 2010-04-21 |
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