JP4105617B2 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
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- JP4105617B2 JP4105617B2 JP2003328501A JP2003328501A JP4105617B2 JP 4105617 B2 JP4105617 B2 JP 4105617B2 JP 2003328501 A JP2003328501 A JP 2003328501A JP 2003328501 A JP2003328501 A JP 2003328501A JP 4105617 B2 JP4105617 B2 JP 4105617B2
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- Prior art keywords
- substrate
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- block
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- processing
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Description
2 バークブロック
3 レジスト塗布ブロック
4 現像処理ブロック
5 インターフェイスブロック
12 基板移載機構
21,31,41,42 熱処理タワー
55 搬送機構
80 膜厚測定ユニット
85 線幅測定ユニット
90 マクロ欠陥検査ユニット
95 検査用バッファ
AHL1〜AHL3 密着強化処理部
BRC1〜BRC3,SC1〜SC3 塗布処理ユニット
C キャリア
CC セルコントローラ
CP1〜CP13 クールプレート
HP1〜HP11 ホットプレート
IB 検査ブロック
MC メインコントローラ
MP メインパネル
PASS1〜PASS12 基板載置部
PHP1〜PHP12 加熱部
SD1〜SD5 現像処理ユニット
TC 搬送ロボットコントローラ
TR1〜TR5 搬送ロボット
W 基板
Claims (4)
- インデクサ(1)から所定の順序にて払い出された基板(W)にレジスト塗布処理を行うとともに、一旦装置外に搬出されて露光処理が行われて再度装置内に搬入された該基板に現像処理を行った後に該基板を前記インデクサに戻す基板処理装置であって、
現像処理が終了した基板に所定の検査を行う検査ユニット(80,85,90)と前記検査ユニットに対して基板の受け渡しを行う搬送機構(TR5)とを含む検査ブロック(IB)を備え、
前記検査ブロックから前記インデクサまで何らかの基板処理を行うことなく現像処理後の基板が戻る場合には、現像処理が終了した基板のうち検査の対象となっていない基板が検査対象となっている基板を前記検査ブロックにて追い越すことを許可することを特徴とする基板処理装置。 - 請求項1記載の基板処理装置において、
検査対象となっている基板を前記検査ブロックにて追い越した基板は、その追い越した順序のままインデクサまで戻されることを特徴とする基板処理装置。 - 請求項1または請求項2記載の基板処理装置において、
前記検査ブロックは、前記検査ブロックに基板を受け入れるために基板を載置する入口基板載置部(PASS8)と、前記検査ブロックから基板を払い出すために基板を載置する出口基板載置部(PASS6)とをさらに備え、
検査対象となっている基板に前記検査ユニットによる検査が行われている間に、前記入口基板載置部に載置された検査の対象となっていない基板を前記搬送機構が前記出口基板載置部に搬送することを特徴とする基板処理装置。 - 請求項3記載の基板処理装置において、
前記検査ブロックは、基板を収容可能なバッファ(95)をさらに備え、
検査対象となっている先行基板に前記検査ユニットによる検査が行われているときに、前記入口基板載置部に検査対象となっている後続基板が載置されると、前記搬送機構は当該後続基板を前記バッファに収納することを特徴とする基板処理装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003328501A JP4105617B2 (ja) | 2003-09-19 | 2003-09-19 | 基板処理装置 |
US10/945,014 US7525650B2 (en) | 2003-09-19 | 2004-09-20 | Substrate processing apparatus for performing photolithography |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003328501A JP4105617B2 (ja) | 2003-09-19 | 2003-09-19 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005093920A JP2005093920A (ja) | 2005-04-07 |
JP4105617B2 true JP4105617B2 (ja) | 2008-06-25 |
Family
ID=34308823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003328501A Expired - Lifetime JP4105617B2 (ja) | 2003-09-19 | 2003-09-19 | 基板処理装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7525650B2 (ja) |
JP (1) | JP4105617B2 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007287909A (ja) * | 2006-04-17 | 2007-11-01 | Tokyo Electron Ltd | 塗布、現像装置及び塗布、現像装置の制御方法並びに記憶媒体 |
JP4560022B2 (ja) * | 2006-09-12 | 2010-10-13 | 東京エレクトロン株式会社 | 塗布、現像装置及び塗布、現像装置の制御方法並びに記憶媒体 |
JP4877075B2 (ja) * | 2007-05-29 | 2012-02-15 | 東京エレクトロン株式会社 | 塗布、現像装置及び塗布、現像装置の運転方法並びに記憶媒体 |
JP5006122B2 (ja) | 2007-06-29 | 2012-08-22 | 株式会社Sokudo | 基板処理装置 |
JP5128918B2 (ja) | 2007-11-30 | 2013-01-23 | 株式会社Sokudo | 基板処理装置 |
JP5318403B2 (ja) | 2007-11-30 | 2013-10-16 | 株式会社Sokudo | 基板処理装置 |
JP5160204B2 (ja) * | 2007-11-30 | 2013-03-13 | 株式会社Sokudo | 基板処理装置 |
JP5179170B2 (ja) | 2007-12-28 | 2013-04-10 | 株式会社Sokudo | 基板処理装置 |
JP5001828B2 (ja) * | 2007-12-28 | 2012-08-15 | 株式会社Sokudo | 基板処理装置 |
JP4983724B2 (ja) * | 2008-05-27 | 2012-07-25 | 東京エレクトロン株式会社 | 塗布、現像装置及び塗布、現像方法並びに記憶媒体 |
JP2011211218A (ja) * | 2011-06-02 | 2011-10-20 | Tokyo Electron Ltd | 塗布、現像装置及び塗布、現像装置の制御方法並びに記憶媒体 |
CN108107680B (zh) * | 2016-11-25 | 2020-10-30 | 沈阳芯源微电子设备股份有限公司 | 堆叠式涂胶显影系统 |
JP2018117003A (ja) * | 2017-01-17 | 2018-07-26 | 株式会社ディスコ | ウェーハ加工装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4852516A (en) * | 1986-05-19 | 1989-08-01 | Machine Technology, Inc. | Modular processing apparatus for processing semiconductor wafers |
JPH10294351A (ja) | 1997-04-21 | 1998-11-04 | Sharp Corp | 半導体装置製造用クリーンボックス、及び半導体装置の製造システム並びに製造方法 |
JPH10335411A (ja) | 1997-05-29 | 1998-12-18 | Kokusai Electric Co Ltd | カセット取出し装置及びカセット取出し方法並びに基板処理装置 |
JP3455458B2 (ja) | 1999-02-01 | 2003-10-14 | 東京エレクトロン株式会社 | 塗布、現像装置及び塗布現像処理における基板再生システム |
US6763130B1 (en) * | 1999-07-21 | 2004-07-13 | Applied Materials, Inc. | Real time defect source identification |
JP3801849B2 (ja) | 2000-08-07 | 2006-07-26 | 東京エレクトロン株式会社 | 基板処理装置及びその方法 |
JP4004248B2 (ja) | 2000-09-01 | 2007-11-07 | 大日本スクリーン製造株式会社 | 基板処理装置および基板検査方法 |
US6684125B2 (en) * | 2000-12-31 | 2004-01-27 | Texas Instruments Incorporated | In-situ randomization and recording of wafer processing order at process tools |
US7089075B2 (en) * | 2001-05-04 | 2006-08-08 | Tokyo Electron Limited | Systems and methods for metrology recipe and model generation |
JP3870052B2 (ja) * | 2001-09-20 | 2007-01-17 | 株式会社日立製作所 | 半導体装置の製造方法及び欠陥検査データ処理方法 |
JP3916468B2 (ja) * | 2002-01-11 | 2007-05-16 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
US6960416B2 (en) * | 2002-03-01 | 2005-11-01 | Applied Materials, Inc. | Method and apparatus for controlling etch processes during fabrication of semiconductor devices |
JP4090986B2 (ja) * | 2003-12-24 | 2008-05-28 | 東京エレクトロン株式会社 | 線幅測定方法,基板の処理方法及び基板の処理装置 |
-
2003
- 2003-09-19 JP JP2003328501A patent/JP4105617B2/ja not_active Expired - Lifetime
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2004
- 2004-09-20 US US10/945,014 patent/US7525650B2/en active Active
Also Published As
Publication number | Publication date |
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US7525650B2 (en) | 2009-04-28 |
JP2005093920A (ja) | 2005-04-07 |
US20050061242A1 (en) | 2005-03-24 |
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