JP4969138B2 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
- Publication number
- JP4969138B2 JP4969138B2 JP2006113415A JP2006113415A JP4969138B2 JP 4969138 B2 JP4969138 B2 JP 4969138B2 JP 2006113415 A JP2006113415 A JP 2006113415A JP 2006113415 A JP2006113415 A JP 2006113415A JP 4969138 B2 JP4969138 B2 JP 4969138B2
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- substrate
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- processing apparatus
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- substrate processing
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- 239000000758 substrate Substances 0.000 title claims description 168
- 238000012545 processing Methods 0.000 title claims description 55
- 238000000576 coating method Methods 0.000 claims description 63
- 239000011248 coating agent Substances 0.000 claims description 62
- 238000012546 transfer Methods 0.000 claims description 39
- 238000012805 post-processing Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims 1
- 230000032258 transport Effects 0.000 description 57
- 230000007246 mechanism Effects 0.000 description 53
- 238000001035 drying Methods 0.000 description 30
- 230000003028 elevating effect Effects 0.000 description 28
- 238000000034 method Methods 0.000 description 9
- 230000003993 interaction Effects 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Description
図1は、本発明に係る基板処理装置1を備えた基板処理システムを示す図である。
以上、本発明の実施の形態について説明してきたが、本発明は上記実施の形態に限定されるものではなく様々な変形が可能である。
10 塗布ユニット
11 ステージ
110 保持面
112a,112b 固定子
124,125,134,135 移動子
121,131 スリットノズル
20 搬送ユニット
21,22 搬送ロボット
216 昇降機構
219 回転機構
23 搬送コンベア
230 搬送ローラ
30 乾燥ユニット
Claims (4)
- 基板の表面に薄膜を規制する基板処理装置であって、
スリットノズルから処理液を吐出させつつ、前記スリットノズルを塗布方向に移動させて基板の表面に処理液を塗布する塗布ユニットと、
前記基板処理装置において基板を搬送する搬送ユニットと、
を備え、
前記塗布ユニットおよび前記搬送ユニットは、前記塗布方向に垂直な方向に配列されるとともに、
前記搬送ユニットは、基板の両側の位置と中央部とをそれぞれ支持する複数の支持部材を備えることを特徴とする基板処理装置。 - 請求項1に記載の基板処理装置であって、
前記搬送ユニットが基板を昇降させる昇降手段をさらに備えることを特徴とする基板処理装置。 - 請求項2に記載の基板処理装置であって、
前記塗布ユニットにおける処理が終了した基板に対して、後処理を行う後処理ユニットをさらに備え、
前記後処理ユニットは、前記搬送ユニットと多段構造を形成することを特徴とする基板処理装置。 - 請求項1ないし3のいずれかに記載の基板処理装置であって、
前記搬送ユニットは、前記塗布ユニットに対して一方側から基板を搬入する搬送ロボットと他方側から基板を搬出する搬送ロボットとを含むことを特徴とする基板処理装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006113415A JP4969138B2 (ja) | 2006-04-17 | 2006-04-17 | 基板処理装置 |
TW096103632A TWI345284B (en) | 2006-04-17 | 2007-02-01 | Substrate processing apparatus |
CN2007100843178A CN101060066B (zh) | 2006-04-17 | 2007-02-27 | 基板处理装置 |
KR1020070020161A KR100795657B1 (ko) | 2006-04-17 | 2007-02-28 | 기판 처리 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006113415A JP4969138B2 (ja) | 2006-04-17 | 2006-04-17 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007287914A JP2007287914A (ja) | 2007-11-01 |
JP4969138B2 true JP4969138B2 (ja) | 2012-07-04 |
Family
ID=38759402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006113415A Active JP4969138B2 (ja) | 2006-04-17 | 2006-04-17 | 基板処理装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4969138B2 (ja) |
KR (1) | KR100795657B1 (ja) |
CN (1) | CN101060066B (ja) |
TW (1) | TWI345284B (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101520939B1 (ko) * | 2008-09-12 | 2015-05-18 | 주식회사 디엠에스 | 슬릿코터 |
JP5537380B2 (ja) * | 2009-11-16 | 2014-07-02 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
KR101081883B1 (ko) | 2009-12-21 | 2011-11-09 | 주식회사 케이씨텍 | 노즐 간극의 정밀제어가 가능한 기판 코터 장치 |
JP5417186B2 (ja) * | 2010-01-08 | 2014-02-12 | 大日本スクリーン製造株式会社 | 基板処理装置 |
CN102320753A (zh) * | 2011-08-09 | 2012-01-18 | 深圳市华星光电技术有限公司 | 玻璃基板的涂布设备及其涂布方法 |
KR102126421B1 (ko) * | 2012-04-13 | 2020-06-24 | 가부시키가이샤 니콘 | 롤용 카세트 장치 |
CN102931120B (zh) * | 2012-10-25 | 2017-09-29 | 上海集成电路研发中心有限公司 | 工件传输系统 |
KR101456471B1 (ko) * | 2013-03-06 | 2014-10-31 | (주) 티에이에스 | 이송 시스템 |
JP5735161B1 (ja) * | 2014-07-08 | 2015-06-17 | 中外炉工業株式会社 | 塗布装置及びその改良方法 |
CN105363627A (zh) * | 2015-10-09 | 2016-03-02 | 昆山希盟自动化科技有限公司 | Ccd对位的loca贴合机 |
CN106585067A (zh) * | 2015-10-19 | 2017-04-26 | 深圳莱宝高科技股份有限公司 | 一种面板处理装置及其处理方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2838345B2 (ja) * | 1992-10-28 | 1998-12-16 | 東京エレクトロン株式会社 | 基板搬送装置 |
JP3094055B2 (ja) * | 1993-05-18 | 2000-10-03 | 東京エレクトロン株式会社 | フィルタ装置及びレジスト処理システム |
JPH07297258A (ja) * | 1994-04-26 | 1995-11-10 | Tokyo Electron Ltd | 板状体の搬送装置 |
JPH1022358A (ja) * | 1996-06-28 | 1998-01-23 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP3571471B2 (ja) * | 1996-09-03 | 2004-09-29 | 東京エレクトロン株式会社 | 処理方法,塗布現像処理システム及び処理システム |
JP3622842B2 (ja) * | 2000-12-11 | 2005-02-23 | 住友精密工業株式会社 | 搬送式基板処理装置 |
JP4003611B2 (ja) * | 2002-10-28 | 2007-11-07 | トヨタ自動車株式会社 | 発電電動装置 |
JP4080349B2 (ja) * | 2003-02-21 | 2008-04-23 | 大日本スクリーン製造株式会社 | 減圧乾燥装置および被膜形成装置 |
JP2005142372A (ja) * | 2003-11-06 | 2005-06-02 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
JP2005270932A (ja) * | 2004-03-26 | 2005-10-06 | Tokyo Electron Ltd | 塗布膜形成装置 |
-
2006
- 2006-04-17 JP JP2006113415A patent/JP4969138B2/ja active Active
-
2007
- 2007-02-01 TW TW096103632A patent/TWI345284B/zh active
- 2007-02-27 CN CN2007100843178A patent/CN101060066B/zh active Active
- 2007-02-28 KR KR1020070020161A patent/KR100795657B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN101060066A (zh) | 2007-10-24 |
CN101060066B (zh) | 2010-09-15 |
JP2007287914A (ja) | 2007-11-01 |
TW200810004A (en) | 2008-02-16 |
KR20070102933A (ko) | 2007-10-22 |
KR100795657B1 (ko) | 2008-01-21 |
TWI345284B (en) | 2011-07-11 |
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