1345284 九、發明說明： 【發明所屬之技術領域】 本發明係關於具備狹縫噴嘴之基板處理裝置中的基板搬 送技術。 【先前技術】 / 自先前提出有如下技術：自狹縫喷嘴喷出藥液，於基板 表面形成薄膜之基板處理裝置中搬送基板。如此之技術， 例如於專利文獻1中有所揭示。 於專利文獻1中提出有如下技術：使保持基板之搬運梭 沿水平方向移動，藉由所謂之搬運梭搬送而搬送基板。 [專利文獻1]曰本專利特開平1 ^274265號公報 【發明内容】 [發明所欲解決之問題] 然而，於上述搬運梭搬送中存在如下問題：由於搬送單 70與塗佈單元配置於塗佈單元之塗佈方向上，故當使狹縫 φ 喷嘴於搬送單70侧待機時，待機狀態下之狹縫噴嘴與搬送 基板之搬運梭會干擾。 又，存在如下問題：由於搬運梭之構造為僅保持基板之 側端部，故當基板大型化時，存在所保持之基板中央部弯 曲、破損之可能。 再者，於搬運梭搬送中’搬送基板之高度位置固定，因 此存在裝置佈局之自由度降低之問題。 本發明係雲於上述問題所完成者，其目的在於在具備狹 縫喷嘴之基板處理裝置中，恰當地搬送基板。 118227.doc 1345284 卻板）、以及在該等單㈣搬送基板9G之搬送單元β 又，基板處理系統具帛：曝光部5，其於基板9〇之表面 曝光電路圖案等’·顯像部6，其對被曝光之基板9〇進行顯 像處理’檢查部7，其檢查基板9〇 ;以及搬出部卜其搬出 經基板處理系統處理後的基板9〇。1345284. EMBODIMENT OF THE INVENTION: TECHNICAL FIELD The present invention relates to a substrate transfer technique in a substrate processing apparatus including a slit nozzle. [Prior Art] Since the prior art, a technique has been proposed in which a chemical solution is ejected from a slit nozzle, and a substrate is transported in a substrate processing apparatus that forms a thin film on the surface of the substrate. Such a technique is disclosed, for example, in Patent Document 1. Patent Document 1 proposes a technique of moving a transport shuttle holding a substrate in a horizontal direction and transporting the substrate by a so-called transport shuttle. [Problem to be Solved by the Invention] However, in the above-described conveyance of the shuttle, there is a problem in that the conveyance sheet 70 and the coating unit are disposed on the coating sheet. In the application direction of the cloth unit, when the slit φ nozzle is placed on the transport sheet 70 side, the slit nozzle in the standby state interferes with the transport shuttle of the transport substrate. Further, since the structure of the transport shuttle is such that only the side end portion of the substrate is held, when the substrate is increased in size, there is a possibility that the center portion of the substrate to be held is bent or broken. Further, in the conveyance shuttle conveyance, the height position of the conveyance substrate is fixed, and thus the degree of freedom in the layout of the apparatus is lowered. The present invention has been made in view of the above problems, and an object thereof is to appropriately transport a substrate in a substrate processing apparatus including a slit nozzle. 118227.doc 1345284, and the transfer unit β of the substrate (4), and the substrate processing system includes an exposure unit 5, which exposes a circuit pattern or the like on the surface of the substrate 9A. The image forming process of the exposed substrate 9 is performed. The inspection unit 7 inspects the substrate 9A, and the unloading unit carries out the substrate 9〇 processed by the substrate processing system.
基板處理裝置i具備：塗佈單元1〇，其將處理液塗佈至 基板表面’·搬送單元2〇’其在基板處理裝置ι中搬送基板 9〇 ’以及乾燥單元30，其乾燥在塗佈單元1G中已處理之基 板9〇 ;且基板處理裝置1係在基板處㈣統中承擔在基板 90之表面形成薄膜之塗佈部的裝置。 根據圖i可知，於基板處理裝置^，各單元排列於丫轴 方向上’取入並處理載置於溫度調節部41中之基板9〇,並 且將處理後之基板9〇搬出至溫度調節部42。 圖2係表示塗佈單元1〇之圖。 塗佈單兀10具備平411，該平tll具有作為用以載置並 保持被處理基板90之保持台之功能，並且具有作為附屬之 各構造之基台的功能。平臺u係整體長方體形狀之石製， 且其上表面（保持面1丨〇)及側面被加工成平坦面。 平臺11之上表面為水平面，且為基板9〇之保持面11〇。 於保持面110上分佈形成有複數個真空吸附口（未圖示卜並 且，該真空吸附口於塗佈單元1〇中處理基板9〇之期間吸附 基板90，藉此將基板9〇保持為特定之水平位置。 又，平臺11具備複數個頂升銷LP(lift pin)，且該頂升銷 LP可在Z軸方向上進退，藉此可將基板9〇載置於保持面ιι〇 118227.doc 1345284 上’或者使基板90上升至特定之高度位置。 於平臺11上表面之（-Y)側固定設置走行軌1Ua，且於 (+Y)侧固定設置走行軌1111^走行轨iiia、η 11?均以長度 方向沿著X軸方向之方式而配置。走行軌1Ua具有引導下 述移動子124、134之移動方向之功能，且走行軌1Ub具有 引導下述移動子125、135之移動方向之功能。即，走行軌 111a、111b具有作為線性滑軌之功能。 於平臺11側面之（-Y)側上部固定設置定子丨12a，且於 (+Y)側上部固定設置定子112b。 藉由定子112a與移動子124、134之電磁相互作用，而構 成生成直動驅動力之線性馬達。藉由定子丨丨2b與移動子 125、135之電磁相互作用，而同樣構成生成直動驅動力之 線性馬達。 進而，於平臺11侧面之（-Y)側下部固定設置定標部 113a，且於（+Y)侧下部固定設置定標部1Ub、U4b。再 者，雖僅圖示符號’但於平臺1 1側面之（_γ)侧下部設置與 定標部114b對應之定標部114a。 定標部113a與固定於移動子134上之檢測子136構成線性 編碼器。即’由定標部113a及檢測子136而構成之線性編 碼器’具有根據定標部113 a與檢測子13 6之位置關係，而 檢測移動子134之位置之功能。 同樣’由定標部113b及檢測子137構成之線性編碼器， 具有檢測移動子135之位置之功能。又，由定標部〗丨乜及 檢測子12 6構成之線性編碼器’具有檢測移動子1 μ之位置 118227.doc 1345284 之功能。進而，由定標部114b及檢測子127構成之線性編 碼器’具有檢測移動子125之位置之功能。 於平臺11之（-X)側設置有待機空間115，且於平臺丨丨之 (+X)侧設置有待機空間116 »再者，雖省略圖示，但於每 個待機空間115、116中，均設置有清洗下述狹縫喷嘴 121、131之清洗機構、及待機收容器等。 於平臺11之上方設置架橋構造12、13,該架橋構造12、 1 3自該平臺11之兩側部分大致水平地架設。 架橋構造12主要由喷嘴支撐部120與升降機構122、123 構成’上述喷嘴支撐部120以碳纖維樹脂為骨料，上述升 降機構122、123支撐喷嘴支撐部120之兩端。同樣，架橋 構造13主要由喷嘴支撐部130與升降機構132、133構成， 上述喷嘴支撐部130以碳纖維樹脂為骨料，上述升降機構 132、133支撐喷嘴支撐部130兩端。 於喷嘴支撐部120、130上’分別安裝有狹縫喷嘴121、 131。即，基板處理裝置1具備兩個狹縫喷嘴I]!、131。在 沿水平Y軸方向延伸之狹縫噴嘴121、13 1上，連接有供給 藥液（抗钱液）之配管及包含抗蝕劑用泵之噴出構造（未圖 示）。 又，於狹縫喷嘴121、131上，在喷出前端部設置有狹縫 (未圖示）’且當藉由抗蝕劑用泵而供給抗蝕液時，自各個 狹縫喷出抗蝕液。 升降機構122、123分開配置於架橋構造丨2之兩側，並藉 由喷嘴支撐部120而與狹縫喷嘴121連結。升降機構122、 118227.doc -10- 1345284 123用以使狹縫噴嘴121同步升降，並且亦用以調整狹縫喷 嘴121在YZ平面内之姿勢。同樣，架橋構造13之升降機構 132、133用以使狹縫喷嘴131同步升降，並且用以調整狹 縫喷嘴131在YZ平面内之姿勢。 於升降機構122、123上，分別固定設置有上述移動子 124 125。又，於升降機構132、133上，分別固定設置有 上述移動子134、135。 如上所述，藉由移動子124、134中任一個與定子1 i2a之 電磁相互作用，而構成生成x轴方向之直動驅動力之線性 馬達。因此’升降機構122藉由移動子124及定子112a而移 動。又，升降機構132藉由移動子134及定子112a而移動。 再者’藉由走行軌111a而將升降機構122、132之移動方向 規定為X轴方向。 同樣’藉由移動子125、135中任一個與定子112b之電磁 性相互作用’而構成生成χ軸方向之直動驅動力之線性馬 達。因此’升降機構丨23藉由移動子125及定子112b而移 動。又，升降機構133藉由移動子135及定子112b而移動。 再者’藉由走行軌111b而將升降機構123、133之移動方向 規定為X轴方向。 又’移動子124在X軸方向上之位置可根據檢測子126而 檢測’並且移動子丨25在X軸方向上之位置可根據檢測子 127而檢測。同樣，移動子134在X轴方向上之位置可根據 檢測子136而檢測，並且移動子135在χ軸方向上之位置可 根據檢測子137而檢測。 H8227.doc < 5 ) 1345284The substrate processing apparatus i includes an application unit 1 that applies a treatment liquid to the substrate surface '·transport unit 2 ′′, and conveys the substrate 9 〇 ′ and the drying unit 30 in the substrate processing apparatus 1 , and dries and coats it. The substrate 9A processed in the unit 1G; and the substrate processing apparatus 1 is a device for forming a coating portion of a film on the surface of the substrate 90 at the substrate. According to FIG. 1, in the substrate processing apparatus, each unit is arranged in the z-axis direction to take in and process the substrate 9〇 placed in the temperature adjustment unit 41, and carry out the processed substrate 9〇 to the temperature adjustment unit. 42. Fig. 2 is a view showing the coating unit 1A. The coating unit 10 has a flat 411 having a function as a holding table for placing and holding the substrate 90 to be processed, and having a function as a base for each of the attached structures. The platform u is made of a stone having an overall rectangular parallelepiped shape, and its upper surface (holding surface 1) and the side surface are processed into a flat surface. The upper surface of the platform 11 is a horizontal plane and is a holding surface 11〇 of the substrate 9〇. A plurality of vacuum adsorption ports are formed on the holding surface 110 (not shown), and the vacuum adsorption port adsorbs the substrate 90 during the processing of the substrate 9 in the coating unit 1 , thereby maintaining the substrate 9 为 as specific In addition, the platform 11 is provided with a plurality of lift pins LP, and the top lift pins LP can advance and retreat in the Z-axis direction, thereby placing the substrate 9 〇 on the holding surface ιι 〇 118227. Doc 1345284 Upper 'or raise the substrate 90 to a specific height position. The travel rail 1Ua is fixedly disposed on the (-Y) side of the upper surface of the platform 11, and the travel rail 1111^ travel rails iiia, η are fixedly disposed on the (+Y) side. 11? is disposed in such a manner that the longitudinal direction thereof is along the X-axis direction. The traveling rail 1Ua has a function of guiding the moving direction of the moving members 124, 134 described below, and the traveling rail 1Ub has a moving direction for guiding the following moving members 125, 135 The function of the traveling rails 111a, 111b is to function as a linear slide rail. The stator bore 12a is fixedly disposed on the (-Y) side upper side of the platform 11 side, and the stator 112b is fixedly disposed on the (+Y) side upper portion. The electromagnetic interaction between the stator 112a and the moving parts 124, 134 The linear motor that generates the direct drive force is configured to form a linear motor that generates a linear driving force by the electromagnetic interaction between the stator 2b and the moving members 125 and 135. Further, on the side of the platform 11 ( -Y) The setting portion 113a is fixedly disposed at the lower side portion, and the scaling portions 1Ub and U4b are fixedly disposed at the lower portion of the (+Y) side. Further, the symbol "but only the symbol 'but the lower side (_γ) side of the side surface of the platform 1 1 The scaling unit 114a corresponding to the scaling unit 114b is provided. The scaling unit 113a and the detector 136 fixed to the moving member 134 constitute a linear encoder, that is, a linear encoder composed of the scaling unit 113a and the detector 136. 'The function of detecting the position of the mover 134 according to the positional relationship between the scaler 113a and the detector 136. Similarly, the linear encoder composed of the scaler 113b and the detector 137 has the detection mover 135 The function of the position. Further, the linear encoder constituting the scaling unit 检测 and the detecting unit 126 has a function of detecting the position 118227.doc 1345284 of the moving sub 1 μ. Further, the scaling unit 114b and the detecting unit 127 Constructed linear encoder 'has The function of detecting the position of the mover 125. The standby space 115 is provided on the (-X) side of the platform 11, and the standby space 116 is provided on the (+X) side of the platform ». Each of the standby spaces 115 and 116 is provided with a cleaning mechanism for cleaning the slit nozzles 121 and 131, a standby container, and the like. The bridge structures 12 and 13 are provided above the platform 11, and the bridge structure 12 and 1 are provided. 3 is erected substantially horizontally from both sides of the platform 11. The bridge structure 12 is mainly composed of the nozzle support portion 120 and the elevating mechanisms 122 and 123. The nozzle support portion 120 has carbon fiber resin as an aggregate, and the lift mechanisms 122 and 123 support both ends of the nozzle support portion 120. Similarly, the bridging structure 13 is mainly composed of a nozzle supporting portion 130 and a lifting mechanism 132, 133. The nozzle supporting portion 130 has carbon fiber resin as an aggregate, and the elevating mechanisms 132 and 133 support both ends of the nozzle supporting portion 130. The slit nozzles 121 and 131 are attached to the nozzle support portions 120 and 130, respectively. That is, the substrate processing apparatus 1 includes two slit nozzles I]! and 131. In the slit nozzles 121 and 13 1 extending in the horizontal Y-axis direction, a pipe for supplying a chemical liquid (anti-money liquid) and a discharge structure (not shown) including a pump for resist are connected. Further, in the slit nozzles 121 and 131, a slit (not shown) is provided at the discharge tip end portion, and when the resist liquid is supplied by the resist pump, the resist is ejected from each slit. liquid. The elevating mechanisms 122 and 123 are disposed on both sides of the bridging structure 2, and are coupled to the slit nozzle 121 by the nozzle supporting portion 120. The lifting mechanism 122, 118227.doc -10- 1345284 123 is used to synchronously lift and lower the slit nozzle 121, and is also used to adjust the posture of the slit nozzle 121 in the YZ plane. Similarly, the lifting mechanisms 132, 133 of the bridging structure 13 are used to simultaneously raise and lower the slit nozzles 131 and to adjust the posture of the slit nozzles 131 in the YZ plane. The moving members 124 125 are fixedly disposed on the lifting mechanisms 122 and 123, respectively. Further, the moving members 134 and 135 are fixed to the elevating mechanisms 132 and 133, respectively. As described above, the linear motor that generates the linear driving force in the x-axis direction is constituted by the electromagnetic interaction between the moving members 124, 134 and the stator 1 i2a. Therefore, the elevating mechanism 122 is moved by the moving member 124 and the stator 112a. Further, the elevating mechanism 132 is moved by the moving member 134 and the stator 112a. Further, the moving direction of the elevating mechanisms 122 and 132 is defined as the X-axis direction by the traveling rail 111a. Similarly, the linear motor that generates the linear driving force in the x-axis direction is formed by the electromagnetic interaction of any one of the moving members 125, 135 with the stator 112b. Therefore, the elevating mechanism 丨 23 is moved by the moving sub-125 and the stator 112b. Further, the elevating mechanism 133 is moved by the moving sub-135 and the stator 112b. Further, the moving direction of the elevating mechanisms 123 and 133 is defined by the traveling rail 111b as the X-axis direction. Further, the position of the moving sub-124 in the X-axis direction can be detected based on the detector 126 and the position of the moving sub-frame 25 in the X-axis direction can be detected based on the detector 127. Similarly, the position of the moving sub-134 in the X-axis direction can be detected based on the detector 136, and the position of the moving sub-135 in the x-axis direction can be detected based on the detector 137. H8227.doc < 5 ) 1345284
即’於塗佈單元10中，可一面Μ由後从祕 卸糟由線性編碼器而檢測架 橋構造12、13在X軸方向上之位置，—蕤 曲错由線性馬達而 使架橋構造12、13在X軸方向上移動。 根據如此之構造’塗佈單元10一面使抗蝕液自狹縫噴嘴 ui喷出，一面使狹縫喷嘴121、131沿著基板9〇之表 面移動。藉此，狹縫噴嘴121、131掃描基板9〇之表面，並 將抗蝕液噴出（塗佈）於基板9〇表面之特定區域（以下，稱為 「抗蝕劑塗佈區域」）。 即，於本實施形態之塗佈單元1〇中，狹縫喷嘴Η丨、^ 之塗佈方向均為X軸方向。因此，基板處理裝置丨之各單元 之排列方向（Y軸方向），與塗佈單元1〇之塗佈方向（χ軸方 向）垂直。 再者，於狹縫喷嘴121不塗佈抗餘液時，如圖2所示，狹 縫噴嘴121待機於待機空間115之上方。又，於狹縫喷嘴 131不塗佈抗银液時，如圖2所示，狹縫喷嘴^待機於待 機空間116之上方。 返回圖1 ’搬送單元20係於基板處理裝置1中搬送基板9〇 之單元’且上述搬送單元2〇具備搬送機械臂21 ' 22及搬送 輸送機23。 圖3係表示搬送機械臂21之平面圖。又，圓4係表示搬送 機械臂21及塗佈單元1〇之侧視圖。 搬送機械臂21具備基台210、臂部211、升降機構216、 以及旋轉機構219，上述基台21〇用以固定搬送機械臂21之 各構成。 HB227.doc -12- 1345284That is, in the coating unit 10, the position of the bridging structures 12, 13 in the X-axis direction can be detected by the linear encoder from the rear, and the bridging structure 12 can be made by the linear motor. 13 moves in the X-axis direction. According to such a configuration, the coating unit 10 ejects the resist liquid from the slit nozzle ui, and moves the slit nozzles 121 and 131 along the surface of the substrate 9. Thereby, the slit nozzles 121 and 131 scan the surface of the substrate 9A, and eject (coat) the resist liquid to a specific region on the surface of the substrate 9 (hereinafter referred to as "resist coating region"). That is, in the coating unit 1A of the present embodiment, the application directions of the slit nozzles ^ and ^ are both in the X-axis direction. Therefore, the arrangement direction (Y-axis direction) of each unit of the substrate processing apparatus 垂直 is perpendicular to the application direction (the y-axis direction) of the coating unit 1A. Further, when the slit nozzle 121 is not coated with the residual liquid, as shown in Fig. 2, the slit nozzle 121 stands by above the standby space 115. Further, when the slit nozzle 131 is not coated with the anti-silver liquid, as shown in Fig. 2, the slit nozzle ^ stands by above the standby space 116. Referring back to Fig. 1, the transport unit 20 is a unit that transports the substrate 9A in the substrate processing apparatus 1, and the transport unit 2A includes a transport robot 21'22 and a transport conveyor 23. FIG. 3 is a plan view showing the transfer robot 21. Further, the circle 4 indicates a side view of the transfer robot 21 and the coating unit 1A. The transport robot 21 includes a base 210, an arm portion 211, an elevating mechanism 216, and a rotating mechanism 219. The base 21 is configured to fix each of the transport robots 21. HB227.doc -12- 1345284
臂部211具備機械手212、第1臂2l4及第2臂215。又，機 械手212具備4個夾盤213。 於夾盤213上’豎直設置有複數個未圖示之支撐銷。機 械手212藉由使設置於夾盤213上之複數個支撐銷之前端與 基板90之背面抵接，而自下方支樓基板9〇。 如上所述，機械手2 12具備4個夾盤213，藉此搬送機械 臂21不僅可支撐基板90之端部，亦可支撐中央部。因此， 與如先前之搬運梭搬送般僅支.樓基板9〇之端部之情形相 比’可抑制所支撐之基板90之彎曲，因此即使於基板9〇大 型化之情形時，亦可無破損地搬送基板9〇。 第1臂214及第2臂215與機械手212連結。根據如此之構 造，臂部211可伸縮自由’且機械手212可在水平面内進 退。再者，本實施形態之搬送機械臂2丨僅在沿γ軸之方向 上進退。又，本實施形態之搬送機械臂21於圖3所示之狀 態下’沿（+Y)方向前進’並沿（_γ)方向後退。 升降機構216具備支撐部件217及支柱部件218。藉由未 圖示之直動機構，安裝有臂部211之支撐部件217，可沿著 支柱部件218而沿Ζ轴方向升降。即，升降機構216具有使 臂部211在特定範圍内沿ζ轴方向升降之功能。 如此，搬送機械臂21具備升降機構216 ,藉此可使由機 械手212所支撑之基板9G沿2軸方向移動。#，搬送機械臂 21可於上下方向搬送基板90。 旋轉機構219具備未圖示之旋轉馬達， 降機構216以軸〇為中心而一體旋轉。即 118227.doc 且使臂部211及升 ’旋轉機構219具 •13· 1345284 有調整臂部211之進退方向之功能，例如，由圖3所示之狀 態可知，若旋轉機構219旋轉1 80。，則臂部211成為向後轉 之狀態。即，變成沿（·γ)方向前進，並沿方向後退之 狀態。 圖5係表示搬送機械臂22之平面圖。又，圖6係表示搬送 機械臂22之側視圖。 搬送機械臂22具備基台220、上臂部221、下臂部222、 升降機構223及旋轉機構224。 搬送機械臂22與搬送機械臂21之不同之處在於具備上臂 部22 1及下臂部222 ’上述上臂部221及下臂部222分別與搬 送機械臂21之臂部211具有大致相同之構造。 再者，本實施形態之升降機構223及旋轉機構224，均係 使上臂部221及下臂部222—體升降或者旋轉之機構。即， 於升降機構223變更上臂部221之高度位置時，同時亦變更 下臂部222之高度位置。又，於旋轉機構224變更上臂部 221之朝向時’同時下臂部222之朝向亦變更。然而，搬送 機械臂22亦可分別具備獨立變更上臂部221及下臂部222之 两度位置或者朝向之機構。 圖7係表示乾燥單元30及搬送輸送機23之圖。 乾燥單元30具備蓋部31、腔室32及吸引機構34，且乾燥 單元30配置於搬送輸送機23(搬送單元2〇)之上方。乾燥單 几3〇構成為如下單元，即，對經塗佈單元10處理後之基板 90 ’進行作為後處理之乾燥處理。 蓋部3 1係以與χγ平面平行之方式而配置之板狀部件， H8227.doc •14- 1345284 並藉由未圖示之框架而士 0 而支撐。又，如圖7之箭頭所示，蓋 部3 1可沿Z軸方向升降，B l 一 y _ 在上方位置（圖7所示之位置）與 下方位置之間升降。®去_ 者，蓋。卩31於下方位置迎合腔室 32 〇The arm portion 211 includes a robot hand 212, a first arm 214, and a second arm 215. Further, the robot hand 212 is provided with four chucks 213. A plurality of support pins (not shown) are vertically disposed on the chuck 213. The robot hand 212 is biased from the lower branch substrate 9 by abutting the front ends of the plurality of support pins provided on the chuck 213 with the back surface of the substrate 90. As described above, the robot 2 12 is provided with four chucks 213, whereby the transport robot 21 can support not only the end portion of the substrate 90 but also the center portion. Therefore, compared with the case where only the end portion of the floor substrate 9 is supported as in the case of the conventional shuttle transport, the bending of the supported substrate 90 can be suppressed, so that even when the substrate 9 is enlarged, there is no The substrate 9 is transported in a damaged manner. The first arm 214 and the second arm 215 are coupled to the robot hand 212. According to such a configuration, the arm portion 211 is retractable freely and the robot 212 can retreat in the horizontal plane. Further, the transfer robot arm 2 of the present embodiment advances and retreats only in the direction along the γ-axis. Further, the transfer robot 21 of the present embodiment is advanced in the (+Y) direction in the state shown in Fig. 3 and retreats in the (_γ) direction. The elevating mechanism 216 includes a support member 217 and a strut member 218. The support member 217 to which the arm portion 211 is attached is attached to the support member 217 in the z-axis direction along the support member 218 by a linear motion mechanism (not shown). That is, the elevating mechanism 216 has a function of elevating and lowering the arm portion 211 in the x-axis direction within a specific range. As described above, the transport robot 21 includes the elevating mechanism 216, whereby the substrate 9G supported by the robot 212 can be moved in the two-axis direction. #, The transport robot 21 can transport the substrate 90 in the vertical direction. The rotation mechanism 219 includes a rotation motor (not shown), and the down mechanism 216 integrally rotates around the shaft. That is, the arm portion 211 and the raising/rotating mechanism 219 have the function of adjusting the advancing and retracting direction of the arm portion 211. For example, as shown in Fig. 3, the rotating mechanism 219 is rotated by 180. Then, the arm portion 211 is in a state of being turned rearward. That is, it becomes a state of advancing in the (·γ) direction and retreating in the direction. FIG. 5 is a plan view showing the transfer robot 22 . Further, Fig. 6 is a side view showing the transfer robot 22. The transport robot 22 includes a base 220, an upper arm portion 221, a lower arm portion 222, a lifting mechanism 223, and a rotating mechanism 224. The transfer robot 22 is different from the transfer robot 21 in that it has an upper arm portion 22 1 and a lower arm portion 222 ′. The upper arm portion 221 and the lower arm portion 222 have substantially the same structure as the arm portion 211 of the transfer robot arm 21 . Further, both of the elevating mechanism 223 and the rotating mechanism 224 of the present embodiment are mechanisms for elevating or rotating the upper arm portion 221 and the lower arm portion 222. That is, when the elevation mechanism 223 changes the height position of the upper arm portion 221, the height position of the lower arm portion 222 is also changed. Further, when the rotation mechanism 224 changes the orientation of the upper arm portion 221, the orientation of the lower arm portion 222 is also changed. However, the transfer robot 22 may be provided with a mechanism for independently changing the position or orientation of the upper arm portion 221 and the lower arm portion 222. FIG. 7 is a view showing the drying unit 30 and the conveyance conveyor 23. The drying unit 30 includes a lid portion 31, a chamber 32, and a suction mechanism 34, and the drying unit 30 is disposed above the conveying conveyor 23 (transport unit 2). The drying unit 3 is configured as a unit in which the substrate 90' treated by the coating unit 10 is subjected to a drying treatment as a post-treatment. The lid portion 3 1 is a plate-like member that is disposed in parallel with the χγ plane, and is supported by a frame (not shown) and is supported by a 0. Further, as indicated by the arrow in Fig. 7, the cover portion 3 1 is movable up and down in the Z-axis direction, and B l - y _ is raised and lowered between the upper position (the position shown in Fig. 7) and the lower position. ® go _, cover.卩31 greets the chamber at the lower position 32 〇
腔室32係主要形成乾燥單WG之處理室之部件。 於蓋部31之下表面及腔室32之上表面形成有凹口，且蓋 部31與腔室32彼此迎合，藉此形成密閉之處理空間”。再 者’處理空間33形成為可充分收容水平姿勢之基板90之大 小的空間。 /及引機構34主要由配管構成，該配管使裝置外之空氣調 節裝置與處理空間33連通。根據如此之構造，於乾燥單元 3〇中’藉由裝置外之空氣調節裝置，可吸引處理空間％内 之環境氣體。即’乾燥單元3G可進行減壓乾燥處理。 再者，詳情雖未圖示’但乾燥單U具備自下方貫通腔 室32之複數個頂升銷（未圖示）。並且，該複數個頂升銷之 • 冑端與基板90之背面抵接，藉此乾燥單元刊自下方支撐已 搬入之基板90。又，複數個頂升銷可於支樓基板％之狀離 下進行升降，因此乾燥單元3〇可調整已搬入之基板9〇在: 軸方向上之高度位置。 搬送輸送機23具備複數個排列於γ轴方向上之搬送滚筒 230。各滾筒230以其長度方向均與χ軸平行之方式而配 f。又，各搬送滚筒230分別具有與X軸平行之旋轉軸，並 藉由未圖示之旋轉機構而旋轉。 搬入搬送輸送機23之基板90由複數個搬送滾筒23〇之上 I18227.doc -15- < S > 表面支撐’並藉由該等搬送滾筒230旋轉而沿Y軸方向搬 送再者搬送輸送機23決定各搬送滾筒23〇之旋轉方 向’以便沿（+Υ)方向搬送基板9〇。 統-各搬送滾筒230之上表面之高度位置，以成為溫度 調節部42接收基板9〇時之高度位置。 如此，於搬送輸送機23中統一各搬送滾筒23〇上表面之 高度位置，因此搬送輸送機23可以水平姿勢搬送基板9〇。 又，由於搬送滾筒230上表面之高度位置為溫度調節部42 之路線之高度位置，故於搬送輸送機23與溫度調節部42之 間可易於交接基板90。 根據如上所述之構成，對基板處理裝置丨中搬送基板9〇 之情形加以說明。 首先，搬送機械臂21具有將待機於溫度調節部41之基板 90搬入基板處理裝置1之功能。即，搬送機械臂2丨之臂部 211，於朝向（-Y)方向之狀態下沿（_γ)方向前進，並接收位 於溫度調節部41之特定位置之基板9〇，藉此將基板9〇搬入 基板處理裝置1。 此時，臂部211可藉由升降機構216而升降，因此故搬送 機械臂21可接收待機於任意高度位置（更詳細而言，於升 降機構216使臂部211升降之範圍内之高度位置）之基板 90。即，與先前之搬運梭搬送相比，可任意選擇使基板9〇 待機之位置’因此溫度調節部41之佈局的自由度增大。 接收基板90後，臂部211向（+γ)方向後退。於該狀態 下’旋轉機構219使臂部211旋轉180。，藉此將臂部211之 118227.doc 1345284 朝向變更為（+Y)方向。藉此’臂部211成為圖3中二點鎖線 所示之狀態。 繼而’升降機構216將臂部211自該狀態調整為向塗佈單 元10搬送基板90之高度位置。並且，當升降機構216之高 度調整結束時，臂部211向（+Υ)方向前進。藉此，臂部211 ‘· 成為圖3中之實線所示之狀態。 於該狀態下’搬送機械臂21將藉由機械手212而保持之 φ 基板90交接至平臺11，並搬入塗佈單元10。即，搬送機械 臂21具有將搬入基板處理裝置！之基板9〇(搬送機械臂21自 溫度調節部41接收之基板90)搬送至塗佈單元1〇之功能。 當本實施形態之塗佈單元10中搬入基板9〇時，如圖2所 不，塗佈單元1〇使狹縫喷嘴121、131於又軸方向之兩側待 機。換言之，將基板9〇搬送至塗佈單元1〇之搬送機械臂 21 ’相對於塗佈單元10 ,而配置於與塗佈單元1〇之塗佈方 向垂直之方向上，因此塗佈單元1〇可使狹縫喷嘴m、m • 預先於X軸方向之兩侧待機。 如此，在兩個狭縫喷嘴121、131分開待機於χ軸方向之 狀態下，將基板90搬入狹縫喷嘴121、131之間之位置。因 ;最初之塗佈處理中，即使於使用狹縫喷嘴Η〗、m 中之任一個時，亦可馬上開始塗佈動作。 搬入塗佈單元10之基板90’藉由塗佈單元1〇而被塗佈 蝕液，但省略其詳情。 ，而’㈣機械臂22具有將經塗佈單元1()處理後的基板 〇塗佈單元10搬出之功能。再者，基板9〇之搬出係藉由 118227.doc -17- 1345284 搬送機械臂22之上臂部221或者下臂部222中之任一方而進 行，以下，對藉由上臂部221而搬出基板90之例加以說 明。 首先，旋轉機構224將上臂部221之朝向調整為（-Y)方 向，且升降機構223將上臂部221調整為與塗佈單元1〇對應 之高度位置。於該狀態下，上臂部221使機械手向（·γ)方 向前進，藉此上臂部221自塗佈單元10接收基板90。並 且’上臂部221使機械手向（+Y)方向後退，藉此將所接收 之基板90自塗佈單元1〇搬出。 如此’搬送機械臂21、22可根據塗佈單元1〇而調整基板 90之搬入高度位置或者搬出高度位置，因此塗佈單元1〇之 佈局的自由度增大。即，基板處理裝置1，可易於對應基 板90之大型化，而使塗佈單元1〇之平臺^在^軸方向上之 尺寸大型化。 當自塗佈單元10搬出基板90時，搬送機械臂22藉由旋轉 機構224而將上臂部221之朝向變更為（+γ)方向。並且，根 據乾燥單元3〇，藉由升降機構223而調整上臂部221之高度 位置’上述上臂部221保持自塗佈單元1〇所搬出之基板 90 〇 當高度調整結束時，上臂部221向乾燥單元3〇前進，並 將基板90交接至腔室32之頂升銷。即，搬送機械臂22具有 將基板90自塗佈單元1〇搬送至乾燥單元川之功能。 如此，由於搬送機械臂22可使所搬送之基板9〇沿2轴方 D移動^:可將乾操單元3〇配置於任意高度位置（更詳細 118227.doc • 18 · 1345284 而言，於升降機構223使上臂部221升降之範圍内之高度位 置）。因此，於基板處理裝置1中，可將乾燥單元30配置於 搬送輸送機23之上方（所謂之多層配置），因此可減小佔據 面積。 藉由乾燥單元30而處理搬送至乾燥單元3〇之基板9〇，但 *' 省略其詳情。 經乾燥單元30處理後之基板9〇藉由搬送機械臂22之上臂 φ 部221而接收，並將其自乾燥單元30搬出。再者，即使由 上臂部221搬入乾燥單元3〇之基板9〇，亦並非必須由上臂 部221搬出，亦可由下臂部222搬出。又，亦可進行如下動 作（交換動作），即，由下臂部222接收完成乾燥之基板9〇 後’將由上臂部221所保持之未乾燥之基板9〇搬入乾燥單 元30。 藉由升降機構223並根據搬送輸送機23，而調整將基板 90自乾燥單元30搬出之上臂部221之高度位置。當升降機 鲁 構223之高度調整結束後，上臂部221使保持基板9〇之機械 手沿（+Y)方向前進，並將該基板9〇搬入搬送輸送機23。 如此，由於搬送機械臂22可使所搬送之基板90沿Z轴方 向移動，故可將搬送輸送機23配置於任意高度位置（更詳 細而言，於升降機構223使上臂部221升降之範圍内之高度 位置）。因此，於基板處理裝置1中，可進行如下配置， 即，如上所述，使搬送輸送機23之高度位置與溫度調節部 42接收基板90之高度位置一致。換言之，可根據溫度調節 部42之規格而配置搬送輸送機23。 118227.doc •19- 1345284 將基板90搬入後，搬送輸送機23使搬送滾筒230旋轉， 藉此將所搬入之基板90沿（+Y)方向搬送至特定之位置。由 搬送輸送機23所搬送之基板90，由溫度調節部42接收。 即’搬送輸送機23具有將經基板處理裝置1處理後之基板 90自基板處理裝置1中搬出的功能。 如上所述’於本實施形態之基板處理裝置1中，塗佈單 元10及搬送單元20排列於與塗佈單元10之塗佈方向垂直之 方向上。藉此，於塗佈單元10中，可使狹縫喷嘴121、m 於X軸方向之兩側待機。 再者，於本實施形態中，對塗佈單元1 〇具備兩個狹縫喷 嘴121 ' 131之情形進行了說明，但亦可適用於僅具備1個 狹縫喷嘴之塗佈單元。此時，塗佈單元可使狹縫喷嘴待機 於X軸方向之任一側，且塗佈單元之佈局的自由度增大。 < 2.變形例> 以上，對本發明之實施形態進行了說明，但本發明並非 限定於上述實施形態，而可進行各種變形。 例如，於上述實細形態中，對與乾燥單元3〇形成多層構 造之搬送單元20(搬送輸送機23)設置於乾燥單元3〇下方之 例進行了說明，但搬送單元20之配置並非限定於此。即， 搬送單元20亦可設置於乾燥單元3〇之上方。 又，與乾燥單元30形成多層構造之搬送單元2〇並非限定 於搬送輸送機23。例如’亦可為如轉盤般變更基板％方向 之裝置’或僅使基板90待機之緩衝器。即，適當地將對應 溫度調節部42接收基板90之方法之構造的裝置設為搬送單 118227.doc -20- 1M5284 元2 0即可β 又’搬送機械臂21亦可與搬送機械臂22相同，具備2個 臂部。 【圖式簡單說明】 圖1係表示具備本發明之基板處理裝置之基板處理系統 的圖。 圖2係表示塗佈單元之圖。 圖3係表示搬送機械臂之平面圖。 圖4係表示搬送機械臂及塗佈單元之侧視圖。 圖5係表示搬送機械臂之平面圖。 圖6係表示搬送機械臂之側視圖。 圖7係表示乾燥單元及搬送輸送機之圖。 【主要元件符號說明】 1 基板處理裝置 10 塗佈單元 11 平臺 20 搬送單元 21、22 搬送機械臂 23 搬送輸送機 30 乾燥單元 110 保持面 112a、112b 定子 124 ' 125 、 134 、 135 移動子 121 、 131 狹縫噴嘴 118227.doc -21 · 1345284 216 升降機構 219 旋轉機構 230 搬送滾筒The chamber 32 is primarily a component of a processing chamber that dries a single WG. A notch is formed on the lower surface of the lid portion 31 and the upper surface of the chamber 32, and the lid portion 31 and the chamber 32 are in contact with each other, thereby forming a sealed processing space. Further, the processing space 33 is formed to be sufficiently accommodated. The space of the size of the substrate 90 in the horizontal position. / and the guiding mechanism 34 is mainly composed of a pipe that allows the air conditioning device outside the device to communicate with the processing space 33. According to such a configuration, in the drying unit 3' The air conditioning device outside can attract the ambient gas in the processing space. That is, the drying unit 3G can perform the vacuum drying process. Further, although the details are not shown, the drying unit U has a plurality of through chambers 32 from below. And a top lift pin (not shown), and the top end of the plurality of top lift pins abuts against the back surface of the substrate 90, whereby the drying unit is fed from below to support the loaded substrate 90. Further, a plurality of jacking The pin can be lifted and lowered in the form of the base substrate %, so that the drying unit 3 can adjust the height position of the loaded substrate 9 in the axial direction. The transport conveyor 23 has a plurality of rows arranged in the γ-axis direction. Transfer Each of the rollers 230 is provided so that its longitudinal direction is parallel to the χ axis. Further, each of the transport rollers 230 has a rotation axis parallel to the X axis, and is rotated by a rotation mechanism (not shown). The substrate 90 of the transport conveyor 23 is transported in the Y-axis direction by a plurality of transport rollers 23 I18227.doc -15- < S > surface support ' and rotated by the transport drum 230. 23, the rotation direction of each of the transport rollers 23 is determined so as to transport the substrate 9 in the (+Υ) direction. The height position of the upper surface of each of the transport rollers 230 is the height position at which the temperature adjusting portion 42 receives the substrate 9〇. In this way, the height of the upper surface of each of the transport rollers 23 is unified in the transport conveyor 23. Therefore, the transport conveyor 23 can transport the substrate 9A in a horizontal posture. Further, the height position of the upper surface of the transport drum 230 is the temperature adjustment unit 42. Since the height of the route is high, the substrate 90 can be easily transferred between the conveyance conveyor 23 and the temperature adjustment unit 42. According to the configuration described above, the substrate processing device 丨 is transferred to the substrate 9〇. First, the transfer robot 21 has a function of loading the substrate 90 waiting for the temperature adjustment unit 41 into the substrate processing apparatus 1. That is, the arm portion 211 of the transfer robot arm 2 is in the direction of the (-Y) direction. The (_γ) direction is advanced, and the substrate 9A located at a specific position of the temperature adjustment unit 41 is received, whereby the substrate 9〇 is carried into the substrate processing apparatus 1. At this time, the arm portion 211 can be moved up and down by the elevating mechanism 216, so The transport robot 21 can receive the substrate 90 that stands by at any height position (more specifically, the height position within the range in which the lift mechanism 216 raises and lowers the arm portion 211). That is, it can be arbitrarily compared with the previous transport shuttle transport. The position at which the substrate 9 is placed in standby is selected. Therefore, the degree of freedom in the layout of the temperature adjustment portion 41 is increased. After receiving the substrate 90, the arm portion 211 is retracted in the (+γ) direction. In this state, the rotation mechanism 219 rotates the arm portion 211 by 180. Thereby, the orientation of the 118227.doc 1345284 of the arm portion 211 is changed to the (+Y) direction. Thereby, the arm portion 211 is in the state shown by the two-point lock line in Fig. 3. Then, the elevating mechanism 216 adjusts the arm portion 211 from the state to the height position at which the substrate 90 is transferred to the coating unit 10. Further, when the height adjustment of the elevating mechanism 216 is completed, the arm portion 211 advances in the (+Υ) direction. Thereby, the arm portion 211' is in a state shown by the solid line in FIG. In this state, the transport robot 21 transfers the φ substrate 90 held by the robot 212 to the stage 11, and carries it into the coating unit 10. That is, the transfer robot arm 21 has a substrate handling device to be carried in! The substrate 9A (the substrate 90 received by the transfer robot 21 from the temperature adjustment unit 41) is transferred to the coating unit 1A. When the substrate 9 is loaded into the coating unit 10 of the present embodiment, as shown in Fig. 2, the coating unit 1 causes the slit nozzles 121 and 131 to stand on both sides in the axial direction. In other words, the transfer robot 21' that transports the substrate 9 to the coating unit 1 is disposed in a direction perpendicular to the application direction of the coating unit 1 with respect to the coating unit 10, and thus the coating unit 1〇 The slit nozzles m and m can be placed in advance on both sides in the X-axis direction. In this manner, the substrate 90 is carried into the position between the slit nozzles 121 and 131 while the two slit nozzles 121 and 131 are separated from each other in the x-axis direction. In the first coating treatment, even when any one of the slit nozzles Η and m is used, the coating operation can be started immediately. The substrate 90' loaded into the coating unit 10 is coated with etching liquid by the coating unit 1B, but the details thereof are omitted. Further, the '(4) robot arm 22 has a function of carrying out the substrate coating unit 10 processed by the coating unit 1 (). Further, the substrate 9 is transported by any one of the upper arm portion 221 or the lower arm portion 222 of the robot arm 22 by 118227.doc -17-1345284. Hereinafter, the substrate 90 is carried out by the upper arm portion 221. An example is given. First, the rotating mechanism 224 adjusts the orientation of the upper arm portion 221 to the (-Y) direction, and the elevating mechanism 223 adjusts the upper arm portion 221 to a height position corresponding to the coating unit 1A. In this state, the upper arm portion 221 advances the robot in the (·γ) direction, whereby the upper arm portion 221 receives the substrate 90 from the coating unit 10. Further, the upper arm portion 221 retracts the robot in the (+Y) direction, whereby the received substrate 90 is carried out from the coating unit 1A. Thus, the transfer robots 21 and 22 can adjust the loading height position or the carry-out height position of the substrate 90 in accordance with the application unit 1〇, so that the degree of freedom in the layout of the coating unit 1 is increased. In other words, the substrate processing apparatus 1 can easily increase the size of the substrate 90 in the axial direction by increasing the size of the substrate 90. When the substrate 90 is carried out from the coating unit 10, the transfer robot 22 changes the orientation of the upper arm portion 221 to the (+γ) direction by the rotation mechanism 224. Further, according to the drying unit 3, the height position of the upper arm portion 221 is adjusted by the elevating mechanism 223. The upper arm portion 221 holds the substrate 90 carried out from the coating unit 1A. When the height adjustment is completed, the upper arm portion 221 is dried. The unit 3 is advanced and the substrate 90 is handed over to the top lift pin of the chamber 32. That is, the transfer robot 22 has a function of transporting the substrate 90 from the coating unit 1 to the drying unit. In this way, the transport robot arm 22 can move the transported substrate 9 〇 along the two-axis D: the dry-handling unit 3 〇 can be placed at any height position (more detailed 118227.doc • 18 · 1345284) The mechanism 223 raises the height position within the range in which the upper arm portion 221 is raised and lowered. Therefore, in the substrate processing apparatus 1, the drying unit 30 can be disposed above the transport conveyor 23 (so-called multi-layer arrangement), so that the occupation area can be reduced. The substrate 9 搬 conveyed to the drying unit 3 is processed by the drying unit 30, but *' is omitted. The substrate 9 processed by the drying unit 30 is received by the upper arm φ portion 221 of the transfer robot 22, and is carried out from the drying unit 30. Further, even if the upper arm portion 221 is carried into the substrate 9A of the drying unit 3, it is not necessarily carried out by the upper arm portion 221, and may be carried out by the lower arm portion 222. Further, the operation (exchange operation) may be performed in which the undried substrate 9 held by the upper arm portion 221 is carried into the drying unit 30 after the lower arm portion 222 receives the substrate 9 which has been dried. The height of the substrate 90 from the drying unit 30 from the upper arm portion 221 is adjusted by the elevating mechanism 223 in accordance with the transport conveyor 23. When the height adjustment of the elevator mechanism 223 is completed, the upper arm portion 221 advances the robot holding the substrate 9A in the (+Y) direction, and carries the substrate 9 into the conveyance conveyor 23. In this manner, since the transport robot 22 can move the transported substrate 90 in the Z-axis direction, the transport conveyor 23 can be disposed at an arbitrary height position (more specifically, the lift mechanism 223 raises and lowers the upper arm portion 221). Height position). Therefore, in the substrate processing apparatus 1, it is possible to arrange the height position of the transport conveyor 23 and the height position of the temperature adjustment unit 42 receiving the substrate 90 as described above. In other words, the transport conveyor 23 can be arranged in accordance with the specifications of the temperature adjustment unit 42. 118227.doc • 19- 1345284 After the substrate 90 is carried in, the transport conveyor 23 rotates the transport drum 230, thereby transporting the loaded substrate 90 to a specific position in the (+Y) direction. The substrate 90 conveyed by the conveyance conveyor 23 is received by the temperature adjustment unit 42. In other words, the transport conveyor 23 has a function of transporting the substrate 90 processed by the substrate processing apparatus 1 from the substrate processing apparatus 1. As described above, in the substrate processing apparatus 1 of the present embodiment, the coating unit 10 and the conveying unit 20 are arranged in a direction perpendicular to the coating direction of the coating unit 10. Thereby, in the coating unit 10, the slit nozzles 121 and m can be made to stand on both sides in the X-axis direction. Further, in the present embodiment, the case where the coating unit 1 is provided with the two slit nozzles 121'131 has been described. However, the present invention is also applicable to a coating unit having only one slit nozzle. At this time, the coating unit can stand the slit nozzle on either side of the X-axis direction, and the degree of freedom in the layout of the coating unit increases. < 2. Modified Example> Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made. For example, in the above-described actual embodiment, the example in which the transport unit 20 (transport conveyor 23) having a multilayer structure with the drying unit 3 is disposed below the drying unit 3A has been described. However, the arrangement of the transport unit 20 is not limited to this. That is, the transport unit 20 may be disposed above the drying unit 3A. Further, the transport unit 2 having a multilayer structure with the drying unit 30 is not limited to the transport conveyor 23. For example, it may be a device that changes the % direction of the substrate as a turntable or a buffer that only makes the substrate 90 stand by. In other words, the device corresponding to the structure of the method for receiving the substrate 90 by the temperature adjusting unit 42 is appropriately set as the transport sheet 118227.doc -20-1 M5284 yuan 2 0, and the 'transporting robot arm 21 can be the same as the transport robot arm 22 With 2 arms. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a substrate processing system including a substrate processing apparatus of the present invention. Fig. 2 is a view showing a coating unit. Fig. 3 is a plan view showing the transfer robot. Fig. 4 is a side view showing the transfer robot arm and the coating unit. Fig. 5 is a plan view showing the transfer robot. Fig. 6 is a side view showing the transfer robot. Fig. 7 is a view showing a drying unit and a conveying conveyor. [Description of main components] 1 substrate processing apparatus 10 coating unit 11 platform 20 transport unit 21, 22 transport robot 23 transport conveyor 30 drying unit 110 holding surfaces 112a, 112b stator 124 ' 125 , 134 , 135 moving sub 121 , 131 slit nozzle 118227.doc -21 · 1345284 216 lifting mechanism 219 rotating mechanism 230 conveying roller
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