JP5227701B2 - Substrate processing system - Google Patents

Description

  The present invention relates to a substrate processing system.

  For example, when a thin film such as a resist film is formed on various substrates such as a semiconductor substrate, a glass substrate that constitutes a liquid crystal panel, and a substrate that constitutes a hard disk, a coating apparatus that forms a coating film on the substrate while rotating the substrate Used (see, for example, Patent Document 1). For example, the coating apparatus may be mounted as a coating unit on a substrate processing system including a substrate carry-in operation, a coating operation, and a carry-out operation.

Such a substrate processing system is often unitized for each main operation. For example, in the above example, a substrate carry-in unit that performs a carry-in operation and a substrate carry-out unit that performs a carry-out operation are mounted. Become. When a substrate is transferred between a plurality of units, a configuration in which a transfer device is arranged for each unit and a substrate or a cassette that accommodates the substrate is transferred between the transfer devices is generally used.
JP-A-7-130642

  However, in a substrate processing system that uses a plurality of transfer devices for transfer operations between units, configuration and control settings such as arrangement of the transfer devices and delivery control timing are likely to be complicated. There is a problem that the entire configuration becomes complicated and the processing tact becomes long.

  In view of the circumstances as described above, an object of the present invention is to provide a substrate processing system capable of simplifying the system configuration and shortening the processing tact.

  In order to achieve the above object, a substrate processing system according to the present invention is provided with a processing unit for performing predetermined processing on a substrate, and a loading container for storing the substrate before the predetermined processing, and for empty loading. A substrate carry-in unit for collecting a container, a substrate carry-out unit for collecting an unloading container containing the substrate after the predetermined processing, and an empty carrying-out container are supplied, and loading in the processing unit A transport unit having a transport mechanism for transporting the carry-in container between a position and the substrate carry-in unit, and carrying the carry-out container between the unloading position in the processing unit and the substrate carry-out unit. It is characterized by providing.

  According to the present invention, the transport mechanism provided in the transport unit transports the loading container between the loading position in the processing unit and the substrate loading unit, and between the unloading position in the processing unit and the substrate unloading unit. Since the carry-out container is transferred in step 1, the transfer operation in different transfer sections can be performed by one transfer mechanism. Thereby, since the conveyance process by a conveyance mechanism can be unified, a system configuration can be simplified and a process tact can be shortened. In addition, according to the present invention, since the carry-in container and the carry-out container are used separately, there is an advantage that the contamination of the substrate can be prevented.

The substrate processing system is characterized in that the processing unit, the substrate carry-in unit, and the substrate carry-out unit are arranged in a linear direction.
According to the present invention, since the processing unit, the substrate carry-in unit, and the substrate carry-out unit are arranged in the linear direction, the transfer path between the units can be set in the linear direction. Thereby, complication of a conveyance route can be avoided and a system configuration can be simplified.

The substrate processing system is characterized in that the processing unit is disposed between the substrate carry-in unit and the substrate carry-out unit.
According to the present invention, since the processing unit is arranged between the substrate carry-in unit and the substrate carry-out unit, each unit is arranged along the direction of the substrate flow. Thereby, the processing efficiency can be increased.

In the substrate processing system, the transport unit includes a moving mechanism that moves the transport mechanism in the linear direction.
According to the present invention, since the transport unit has the moving mechanism for moving the transport mechanism in the linear direction, the moving operation of the transport mechanism can be simplified. Thereby, the system configuration can be simplified.

In the substrate processing system, the substrate carry-in unit and the substrate carry-out unit are each provided with a plurality of container standby units.
According to the present invention, each of the substrate carry-in unit and the substrate carry-out unit is provided with a plurality of container standby units, so that more substrates can be processed quickly.

In the substrate processing system, at least one of the substrate carry-in unit and the substrate carry-out unit includes a second moving mechanism that moves a plurality of the container standby units.
According to the present invention, since at least one of the substrate carry-in unit and the substrate carry-out unit has the second moving mechanism that moves the plurality of container standby units, the container standby unit is moved closer to the transport unit. be able to. As a result, the transport operation can be performed quickly, and the processing efficiency can be improved.

In the substrate processing system, the second moving mechanism moves the container standby unit so that the supply target container is brought closer to the transport unit and the collection target container is moved away from the transport unit.
According to the present invention, the second moving mechanism moves the container standby unit so as to bring the supply target container closer to the transport unit and move the recovery target container away from the transport unit. The container collecting operation can be performed more quickly. Thereby, efficiency of processing can be achieved.

In the substrate processing system described above, the processing unit is provided with a buffer mechanism having a plurality of second container standby portions corresponding to at least one of the loading position and the unloading position.
According to the present invention, the processing unit is provided with a buffer mechanism having a plurality of second container standby portions corresponding to at least one of the loading position and the unloading position. Loading operation and unloading operation can be performed quickly. Thereby, efficiency of processing can be achieved.

The substrate processing system is characterized in that the buffer mechanism has a third moving mechanism for moving the plurality of second container standby portions.
According to the present invention, since the buffer mechanism has the third movement mechanism that moves the plurality of second container standby parts, the second container standby part can be moved according to the remaining amount of the substrate in the container. it can. Thereby, efficiency of processing can be achieved.

In the substrate processing system, the third moving mechanism moves the second container standby unit in the same direction as the transport direction of the transport mechanism.
According to the present invention, since the third movement mechanism moves the second container standby unit in the same direction as the conveyance direction of the conveyance mechanism, the second container standby unit moves along the conveyance direction. For this reason, the distance between the transport mechanism and the second container standby unit is kept constant. Since the distance is kept constant, the transfer operation between the transfer mechanism and the second container standby unit can be made constant, so that the complexity of the transfer operation can be avoided.

In the substrate processing system, the processing unit includes a pickup mechanism that lifts the substrate from the loading container and places the substrate at the loading position.
According to the present invention, since the processing unit has the pickup mechanism that lifts the substrate from the loading container and places it in the loading position, the substrate loading operation can be performed quickly.

The substrate processing system is characterized in that the transport unit has a rotation mechanism that rotates the direction of the transport mechanism.
According to the present invention, since the feeding unit has the rotation mechanism that rotates the direction of the transport mechanism, the transport operation and the transfer operation are smoothly performed even when the transport direction and the container delivery direction are different. be able to.

In the substrate processing system, an engagement part is formed in the carry-in container and the carry-out container, and the transport mechanism is engaged with the engagement part so that the carry-in container and the carry-out container are engaged. It has the holding member which hold | maintains.
According to the present invention, the carry-in container and the carry-out container have the engaging portion, and the transport mechanism has the holding member that holds the carry-in container and the carry-out container by engaging with the engage portion. As a result, the carrying-in container and the carrying-out container can be reliably held.

The substrate processing system further includes a control device that controls a transfer position of at least one of the carry-in container and the carry-out container in accordance with a processing state of the substrate in the processing unit.
According to the present invention, since the transfer position of at least one of the loading container and the unloading container is controlled according to the processing status of the substrate in the processing unit, the transfer operation can be performed more efficiently. .

In the substrate processing system, the predetermined process includes a coating process for coating a liquid on the substrate, a pre-process for the coating process, and a post-process for the coating process.
According to the present invention, since the predetermined process includes the coating process for applying the liquid material to the substrate, the pre-process of the coating process, and the post-process of the coating process, the system configuration can be simplified even in the processing stage before and after the coating process. Can be

  In the substrate processing system, the preprocessing includes at least one of a process of irradiating the substrate with ultraviolet rays and a process of cleaning the substrate.

  According to the present invention, it is possible to simplify the processing system when performing a wide range of processes including at least one of a process of irradiating a substrate with ultraviolet rays and a process of cleaning the substrate as pre-processing.

In the substrate processing system, the post-processing includes at least one of a process for reducing the pressure around the substrate and a process for heating the substrate.
According to the present invention, it is possible to simplify the processing system when performing a wide range of processes including at least one of a process for reducing the pressure around the substrate and a process for heating the substrate as post-processing.

The substrate processing system may further include a foreign matter detection unit that detects the presence or absence of foreign matter on the substrate after the predetermined processing.
If foreign matter adheres to the substrate after the predetermined processing, the substrate may be damaged at the position where the foreign matter is attached depending on the subsequent processing. According to the present invention, since the foreign matter detection unit for detecting the presence or absence of foreign matter on the substrate after the predetermined processing is further provided, it is possible to prevent the substrate having such foreign matter from being used for subsequent processing. And damage to the substrate can be avoided.

  According to the present invention, it is possible to simplify the system configuration and shorten the processing tact.

Embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a plan view showing a schematic configuration of a substrate processing system SYS according to the present embodiment. FIG. 2 is a front view showing a schematic configuration of the substrate processing system SYS. FIG. 3 is a side view showing a schematic configuration of the substrate processing system SYS.

  In the present embodiment, in describing the configuration of the substrate processing system SYS, for simplicity of description, directions in the drawing will be described using an XYZ coordinate system. In the XYZ coordinate system, the left-right direction in the figure is denoted as the X direction, and the direction orthogonal to the X direction in plan view is denoted as the Y direction. A direction perpendicular to the plane including the X direction axis and the Y direction axis is referred to as a Z direction. In each of the X direction, the Y direction, and the Z direction, the direction of the arrow in the figure is the + direction, and the direction opposite to the arrow direction is the − direction.

  As shown in FIGS. 1 to 3, the substrate processing system SYS is a system that is used by being incorporated in a production line such as a factory, and forms a thin film in a predetermined region of the substrate S. The substrate processing system SYS includes a stage unit STU, a substrate processing unit (processing unit) SPU, a substrate carry-in unit LDU, a substrate carry-out unit ULU, a transport unit CRU, and a control unit CNU.

  In the substrate processing system SYS, the stage unit STU is supported on the floor surface through, for example, leg members, and the substrate processing unit SPU, the substrate carry-in unit LDU, the substrate carry-out unit ULU, and the transfer unit CRU are provided on the upper surface of the stage unit STU. It is an arranged configuration. The substrate processing unit SPU, the substrate carry-in unit LDU, the substrate carry-out unit ULU, and the transfer unit CRU are in a state where the inside of each unit is covered with a cover member. In the substrate processing system SYS, a substrate processing unit SPU, a substrate carry-in unit LDU, and a substrate carry-out unit ULU are arranged on a straight line along the X-axis direction. The substrate processing unit SPU is provided between the substrate carry-in unit LDU and the substrate carry-out unit ULU. In the stage unit STU, the central portion in plan view of the portion where the substrate processing unit SPU is disposed is depressed in the −Z direction with respect to the other portions.

  Examples of the substrate S to be processed by the substrate processing system SYS of the present embodiment include a semiconductor substrate such as silicon, a glass substrate constituting a liquid crystal panel, and a substrate constituting a hard disk. In the present embodiment, for example, a substrate constituting a hard disk and having a disk-shaped base material made of glass or the like coated with diamond will be described as an example.

  Loading and unloading of the substrate S in the substrate processing system SYS of the present embodiment is performed using a cassette C that can accommodate a plurality of the substrates S. The cassette C is a container formed in a bowl shape, and can accommodate the substrates S in a row so that the substrate surfaces of the plurality of substrates S face each other. Therefore, the cassette C is configured to accommodate the substrate S with the substrate S standing in the Z-axis direction. The cassette C has an opening (see FIGS. 4 and 5) at the bottom. Each board | substrate S is accommodated in the state exposed to the bottom part of cassette C through the said opening part. The cassette C is formed in a rectangular shape in a plan view, and has engaging portions Cx on each side portion on the + Z side, for example, as shown in FIG. In the present embodiment, two types of cassettes are used as the cassette C: a loading cassette C1 used when loading the substrate S and a loading cassette C2 used when loading the substrate S. Only the substrate S before processing is accommodated in the loading cassette C1, and only the substrate S after processing is accommodated in the unloading cassette C2. The carry-in cassette C1 is used between the substrate processing unit SPU and the substrate carry-in unit LDU. The carry-out cassette C2 is used between the substrate processing unit SPU and the substrate carry-out unit ULU. Therefore, the carry-in cassette C1 and the carry-out cassette C2 are not mixed and used. The carry-in cassette C1 and the carry-out cassette C2 are formed in, for example, the same shape and the same dimensions.

(Board carry-in unit)
The substrate carry-in unit LDU is disposed on the −X side of the substrate processing system SYS. The substrate carry-in unit LDU is a unit in which a carry-in cassette C1 containing a substrate S before processing is supplied and an empty carry-in cassette C1 is collected. The substrate carry-in unit LDU is elongated in the Y-axis direction, and a plurality of carry-in cassettes C1 can stand by along the Y-axis direction.

  The substrate carry-in unit LDU includes a cassette inlet / outlet 10 and a cassette moving mechanism (second moving mechanism) 51. The cassette entrance 10 is an opening provided on the −Y side of the cover member that covers the substrate carry-in unit LDU. The cassette inlet / outlet 10 is an inlet (supply port) of the loading cassette C1 containing the substrate S before processing, and an outlet (collection port) of the empty loading cassette C1.

  The cassette moving mechanism 11 has a drive mechanism such as a belt conveyor mechanism. In the present embodiment, the driving mechanism includes a conveyance belt (a supply belt 11a and a collection belt 11b). The conveyor belt extends in the Y-axis direction from the + Y side end to the −Y side end of the substrate carry-in unit LDU, and is arranged so that two are arranged in the X-axis direction.

  The supply belt 11a is a conveyance belt disposed on the −X side of the two conveyance belts. The + Z side of the supply belt 11a is a conveyance surface. The supply belt 11a is configured to rotate so that the transport surface moves in the -Y direction. A plurality of loading cassettes C1 that have entered the substrate loading unit LDU via the cassette inlet / outlet 10 are placed on the conveyance surface of the supply belt 11a. The carry-in cassette C1 is moved to the transport unit CRU side by the rotation of the supply belt 11a.

  The recovery belt 11b is a conveyor belt disposed on the + X side of the two conveyor belts. The + Z side of the recovery belt 11b is a conveyance surface. The recovery belt 11b is configured to rotate so that the transport surface moves in the -Y direction. A plurality of empty loading cassettes C1 are placed on the transport surface of the recovery belt 11b. The loading cassette C1 is moved to the cassette entrance 10 side by the rotation of the recovery belt 11b.

  In the present embodiment, for example, the loading cassette C1 can wait at standby positions (container standby portions) provided at five locations on the supply belt 11a and the recovery belt 11b. In the substrate carry-in unit LDU, the standby position of the carry-in cassette C1 can be moved by rotating the supply belt 11a and the recovery belt 11b, and the carry-in cassette can be moved by moving the stand-by position. The conveyance time of C1 can be shortened.

(Substrate processing unit)
The substrate processing unit SPU is disposed on the + X side of the substrate carry-in unit LDU in the substrate processing system SYS and at substantially the center in the X-axis direction. The substrate processing unit SPU performs various processes on the substrate S such as a process of forming a thin film by applying a liquid material such as a resist to the substrate S and a process of removing the thin film formed on the peripheral portion of the substrate S. Is a unit. The substrate processing unit SPU includes a coating device (substrate processing region) CT, a peripheral edge removing device EBR, a buffer mechanism (substrate loading region, substrate unloading region) BF, and a substrate transport device (transport device) SC. .

  The coating apparatus CT is disposed in the center of the substrate processing unit SPU in plan view, and is fixed to the upper surface of the recessed portion of the stage unit STU. The coating device CT is a device that coats and forms a liquid thin film on the substrate S. In the present embodiment, the coating apparatus CT forms a thin film on the substrate S for performing the imprint process. The coating device CT has a nozzle (not shown) that discharges a liquid material, which is a constituent material of the thin film, onto the substrate S. The coating device CT can be accessed from both the −X side and the + X side. Therefore, for example, the substrate S can be loaded and unloaded from both the −X side and the + X side. The coating device CT is configured to perform coating processing at a coating position (portion indicated by a broken line in the drawing) set at a substantially central portion in the X axis direction.

  The peripheral edge removing device EBR is provided at a position along the + X side of the coating device CT and along the −Y side edge of the substrate processing unit SPU. The peripheral edge removing device EBR is an apparatus for removing a thin film formed on the peripheral edge of the substrate S. The removal process by the peripheral edge removing device EBR is preferably performed before the thin film formed on the substrate S is dried. For this reason, it is preferable that the peripheral edge removing device EBR is disposed at a position where the substrate S can be transported from the coating device CT in a short time. The peripheral edge removing device EBR has a dip portion (not shown) that dissolves and removes the thin film formed on the peripheral edge of the substrate S by, for example, immersing the peripheral edge of the substrate S in the solution while rotating the substrate S. ing.

  The buffer mechanism BF is provided at two positions along the + Y side edge of the substrate processing unit SPU and sandwiching the coating apparatus CT in the X-axis direction. Of the two buffer mechanisms BF, the buffer mechanism disposed on the −X side of the coating apparatus CT is the carry-in side buffer mechanism BF1, and the buffer mechanism disposed on the + X side of the coating apparatus CT is the unloading side buffer mechanism BF2. is there.

  The carry-in buffer mechanism BF1 is a part for waiting the carry-in cassette C1 supplied into the substrate processing unit SPU. The carry-in buffer mechanism BF1 is provided with a cassette moving mechanism (third moving mechanism) 20. The cassette moving mechanism 20 has a drive mechanism such as a belt conveyor mechanism. In the present embodiment, two transport belts 20a and 20b are provided as drive mechanisms.

  The conveyor belt 20a is provided in a region along the X-axis direction of the carry-in buffer mechanism BF1. The + Z side surface of the conveyor belt 20a is a conveyor surface, and the supplied loading cassette C1 is placed on the conveyor surface. The transport belt 20a is configured to rotate so that the transport surface moves in the X-axis direction. The carry-in cassette C1 is movable in the X-axis direction within the carry-in buffer mechanism BF1 by the rotation of the carry belt 20a. The conveyor belt 20b is provided at the center in the X-axis direction in the carry-in buffer mechanism BF1. The + Z side surface of the transport belt 20b is a transport surface, and the loading cassette C1 is placed on the transport surface. The conveyance belt 20b is configured to rotate so that the conveyance surface moves along the Y-axis direction. The carry-in cassette C1 is moved in the Y-axis direction by the rotation of the conveyance belt 20b. In this way, the standby position of each loading cassette C1 is moved by the cassette moving mechanism 20.

  The carry-in side buffer mechanism BF1 is arranged to stand by by arranging a plurality of, for example, three carry-in cassettes C1 in the X-axis direction along the region where the transport belt 20a is formed (second container standby unit). The standby position P1 on the −X side in the drawing is a standby position of the loading cassette C1 supplied to the substrate processing unit SPU, for example. The standby position P2 at the center in the X-axis direction in the figure is the standby position of the loading cassette C1 that has moved from the standby position P1. In the drawing, the standby position P3 on the + X side is the standby position of the loading cassette C1 that has moved from the standby position P2.

  In the standby position P2, the + Y side end of the transport belt 20b is disposed. For this reason, the loading cassette C1 disposed at the standby position P2 is moved to the -Y side with respect to the standby position P2 by the transport belt 20b, and can be standby at the standby position P4 of the destination. A loading position LP for the substrate S is provided on the + Z direction side of the standby position P4. The substrate S is transported to the coating apparatus CT via the loading position LP.

  The carry-out side buffer mechanism BF2 is a part for waiting the carry-out cassette C2 supplied into the substrate processing unit SPU. The carry-out side buffer mechanism BF2 is provided with a cassette moving mechanism (third moving mechanism) 22. The cassette moving mechanism 22 has a drive mechanism such as a belt conveyor mechanism. In the present embodiment, like the carry-in buffer mechanism BF1, two transport belts 22a and 22b are provided as drive mechanisms.

  The conveyor belt 22a is provided in a region along the X-axis direction of the carry-out side buffer mechanism BF2. The + Z side surface of the conveyor belt 22a is a conveyor surface, and the unloading cassette C2 that is supplied is placed on the conveyor surface. The conveyor belt 22a is configured to rotate so that the conveyor surface moves in the X-axis direction. The carry-out cassette C2 can move in the carry-out side buffer mechanism BF2 in the X-axis direction by the rotation of the carry belt 22a. The conveyor belt 22b is provided at the center in the X-axis direction in the carry-out side buffer mechanism BF2. Similar to the transport belt 20b, the + Z side surface of the transport belt 22b is a transport surface, and the unloading cassette C2 is placed on the transport surface. The conveyance belt 22b is configured to rotate so that the conveyance surface moves along the Y-axis direction. The carry-out cassette C2 is moved in the Y-axis direction by the rotation of the conveyance belt 22b. Thus, the cassette moving mechanism 22 moves the standby position of each unloading cassette C2.

  The carry-out side buffer mechanism BF2 is arranged to stand by by placing a plurality of, for example, three carry-out cassettes C2 in the X-axis direction along the formation region of the transport belt 22a (second container standby unit). A standby position P5 on the −X side in the drawing is a standby position of the unloading cassette C2 supplied to the substrate processing unit SPU, for example. A standby position P6 in the center in the X-axis direction in the drawing is a standby position of the unloading cassette C2 that has moved from the standby position P5. The + X side standby position P7 in the figure is the standby position of the carry-out cassette C2 that has moved from the standby position P6.

  In the standby position P6, the + Y side end of the transport belt 22b is disposed. For this reason, the unloading cassette C2 disposed at the standby position P6 is moved to the -Y side with respect to the standby position P6 by the transport belt 22b, and can be standby at the standby position P8 of the destination. An unloading position UP for the substrate S is provided above the standby position P8 in the + Z direction. The substrate S is transported from the coating apparatus CT to the unloading cassette C2 via the unloading position UP.

  The substrate transport device SC is provided at two positions in the center in the Y-axis direction of the substrate processing unit SPU and sandwiching the coating apparatus CT in the X-axis direction. Of the two substrate transport devices SC, the device disposed on the −X side of the coating device CT is the carry-in transport device SC1, and the device disposed on the + X side of the coating device CT is the transport-side transport device SC2. It is. The carry-in side conveyance device SC1, the carry-out side conveyance device SC2, and the coating device CT are arranged on a straight line along the X-axis direction.

  The carry-in transport device SC1 accesses the loading positions LP of the coating device CT and the carry-in buffer mechanism BF1, and transports the substrate S therebetween. The carry-in side transport device SC <b> 1 includes a base 30, an arm part 31, and a holding part 32.

  The base 30 is supported on the upper surface of the recessed portion of the stage unit STU. The base 30 has a fixed base 30a and a turntable 30b. The fixed base 30a is a base fixed to the upper surface of the recessed portion of the stage unit SUT. The turntable 30b is disposed on the fixed table 30a. The turntable 30b is provided so as to be rotatable about the Z axis as a rotation axis with respect to the fixed stand 30a.

  The arm portion 31 is supported on the turntable 30 b of the base portion 30. The arm part 31 has an expansion / contraction mechanism (not shown) that can expand and contract in the XY plane direction. An attachment mechanism (not shown) for attaching the holding portion 32 is provided at the tip of the arm portion 31.

  The holding part 32 is attached to the arm part 31 via the attachment mechanism. The holding unit 32 holds the substrate S using a holding force such as an adsorption force. Examples of the generation source of the suction force include a suction mechanism (not shown). The suction mechanism can be disposed, for example, inside the arm portion 31.

  The carry-in side conveyance device SC1 is configured to allow the holding unit 32 to be accessed by both the coating device CT and the loading position LP by the arm unit 31 rotating about the Z axis as a rotation axis or expanding and contracting in the XY plane direction. It has become.

  The unloading-side transport device SC2 accesses the coating device CT, the unloading position UP of the unloading-side buffer mechanism BF2, and the peripheral edge removing device EBR, and transports the substrate S therebetween. The carry-out side conveyance device SC2 has the same configuration as the carry-in side conveyance device SC1, and includes a base 40 (a fixed base 40a and a rotary base 40b), an arm part 41, and a holding part 42. In the carry-out side transfer device SC2, the arm portion 41 rotates about the Z axis as a rotation axis, or expands and contracts in the XY plane direction, whereby the holding portion 42 becomes the coating device CT, the peripheral edge removing device EBR, and the unloading position UP. Can be accessed respectively.

  The substrate processing unit SPU includes a substrate loading mechanism (pickup mechanism) 21 and a substrate unloading mechanism 27 in addition to the above configuration. The substrate loading mechanism 21 is disposed in the vicinity of the standby position P4. 4 to 6 are diagrams schematically showing the configuration of the substrate loading mechanism 21. FIG.

  As shown in these drawings, the substrate loading mechanism 21 has a substrate upper holding mechanism 23 and a substrate lower holding mechanism 24. The substrate upper holding mechanism 23 is arranged on the + X side of the standby position P4. The substrate upper holding mechanism 23 holds the + Z side of the substrate S and moves in the Z-axis direction. The substrate upper holding mechanism 23 includes an elevating member 23a, a clamp member 23b, and an elevating mechanism 23c.

  The elevating member 23a is a support member formed in an L shape in a side view, and is provided so as to be movable in the Z-axis direction. The elevating member 23a has a column portion extending in the Z-axis direction and a protruding portion protruding in the X-axis direction from the upper end of the column portion. Of these, the column portion is provided from the + Z end face of the loading cassette C1 to the + Z side. The protruding portion of the elevating member 23a is disposed at a position overlapping the loading position LP in plan view. A concave portion is formed on the −Z side of the protruding portion so as to match the shape of the substrate S.

  The clamp member 23b is attached to the concave portion of the elevating member 23a. Therefore, the clamp member 23b is also provided at a position overlapping the loading position LP in plan view. The raising / lowering mechanism 23c is a drive part attached to the raising / lowering member 23a, and is arrange | positioned at -Z side of cassette C1 for carrying in. As the elevating mechanism 23c, for example, a driving mechanism such as an air cylinder can be used.

  The substrate lower part holding mechanism 24 is provided at a position overlapping the central part of the loading position LP in plan view. The lower substrate holding mechanism 24 moves in the Z-axis direction while holding the −Z side of the substrate S. The substrate lower part holding mechanism 24 includes an elevating member 24a, a clamp member 24b, and an elevating mechanism 24c. The elevating member 24a is a support member formed in a rod shape, and is provided so as to be movable in the Z-axis direction. The clamp member 24b is attached to the tip of the elevating member 24a on the + Z side, and the clamp member 24b is also disposed at a position overlapping the central portion of the loading position LP in plan view. The elevating mechanism 24c is a drive unit attached to the elevating member 24a, and is disposed on the −Z side of the loading cassette C1. As the elevating mechanism 24c, for example, a driving mechanism such as an air cylinder can be used.

  The elevating mechanism 23c of the upper substrate holding mechanism 23 and the elevating mechanism 24c of the lower substrate holding mechanism 24 can be operated independently of each other, and can be operated in conjunction with each other. .

  The substrate unloading mechanism 27 is disposed in the vicinity of the standby position P8. The substrate unloading mechanism 27 has the same configuration as the substrate loading mechanism 21. 4 to 6, the components (including the unloading position UP) of the substrate unloading mechanism 27 corresponding to the components (including the loading position LP) of the substrate loading mechanism 21 are indicated by reference numerals in parentheses. ing.

  The substrate unloading mechanism 27 includes a substrate upper holding mechanism 25 and a substrate lower holding mechanism 26. The substrate upper holding mechanism 25 includes an elevating member 25a, a clamp member 25b, and an elevating mechanism 25c. The lower substrate holding mechanism 26 includes an elevating member 26a, a clamp member 26b, and an elevating mechanism 26c. Since the positional relationship and function of each component of the substrate unloading mechanism 27 are the same as the corresponding components of the substrate loading mechanism 21, description thereof will be omitted.

(Substrate unloading unit)
1 to 3, the substrate carry-out unit ULU is arranged on the + X side of the substrate processing unit SPU in the substrate processing system SYS. The substrate carry-out unit ULU is a unit in which a carry-out cassette C2 containing the processed substrate S is collected and an empty carry-out cassette C2 is supplied. The substrate carry-out unit ULU is elongated in the Y-axis direction, and a plurality of carry-out cassettes C2 can be arranged along the Y-axis direction.

  The substrate carry-out unit ULU includes a cassette inlet / outlet 60 and a cassette moving mechanism (second moving mechanism) 61. The cassette entrance 60 is an opening provided on the −Y side of the cover member that covers the substrate carry-out unit ULU. The cassette inlet / outlet 60 is an inlet (supply port) of an empty carry-out cassette C2 and an outlet (collection port) of the carry-out cassette C2 containing the processed substrate S.

  The cassette moving mechanism 61 has a drive mechanism such as a belt conveyor mechanism. In this embodiment, the driving mechanism has a conveyor belt. The conveyor belt extends in the Y-axis direction from the + Y side end to the −Y side end of the substrate carry-out unit ULU, and is arranged so that two are arranged in the X-axis direction.

  The supply belt 61a is a conveyance belt disposed on the −X side of the two conveyance belts. The + Z side of the supply belt 61a is a conveyance surface. The supply belt 61a is configured to rotate so that the transport surface moves in the -Y direction. A plurality of carry-out cassettes C2 that have entered the substrate carry-out unit ULU via the cassette inlet / outlet 60 are placed on the conveyance surface of the supply belt 61a. The unloading cassette C2 is moved to the transport unit CRU side by the rotation of the supply belt 61a.

  The recovery belt 61b is a conveyor belt disposed on the + X side of the two conveyor belts. The + Z side of the collection belt 61b is a conveyance surface. The collection belt 61b is configured to rotate so that the conveyance surface moves in the -Y direction. On the transport surface of the recovery belt 61b, a plurality of carry-out cassettes C2 containing the processed substrates S are placed. The unloading cassette C2 is moved to the cassette inlet / outlet 60 side by the rotation of the collecting belt 61b.

  In this embodiment, for example, the carry-out cassette C2 can stand by at a stand-by position (container stand-by portion) provided on the supply belt 61a and the collection belt 61b. In the substrate carry-out unit ULU, the standby position of the carry-out cassette C2 can be moved by rotating the supply belt 61a and the recovery belt 61b, and the carry-out cassette can be moved by moving the stand-by position. It is possible to shorten the transport time of C2.

(Transport unit)
The transport unit CRU is disposed in a region along the + Y side end in the substrate processing system SYS, and is provided so as to be in contact with each of the substrate processing unit SPU, the substrate carry-in unit LDU, and the substrate carry-out unit ULU. The transport unit CRU transports the carry-in cassette C1 between the substrate processing unit SPU and the substrate carry-in unit LDU, and transports the carry-out cassette C2 between the substrate process unit SPU and the substrate carry-out unit ULU. The transport unit CRU includes a rail mechanism RL and a cassette transport device CC.

  The rail mechanism RL is fixed on the stage unit STU and extends linearly in the X-axis direction from the −X side end to the + X side end of the transport unit CRU. The rail mechanism RL is a guide mechanism that guides the moving position of the cassette carrying device CC. The rail mechanism RL has two parallel rail members 70 arranged side by side in the Y-axis direction.

  The cassette carrying device CC is provided on the two rail members 70 so as to straddle the two rail members 70 in plan view. The cassette carrying device CC is a carrying device that accesses the buffer mechanism BF, the substrate carry-in unit LDU, and the substrate carry-out unit ULU of the substrate processing unit SPU and holds and carries the carry-in cassette C1 and the carry-out cassette C2. The cassette carrying device CC includes a movable member 71, a cassette support plate 72, a support plate rotating mechanism 73, a cassette holding member 74, a holding member lifting mechanism 75, and a holding member slide mechanism 76.

  The movable member 71 is formed in an H shape in plan view, and has a recess 71 a that fits into the two rail members 70. The movable member 71 has a drive mechanism (such as a motor mechanism) (not shown) inside, for example. The movable member 71 is movable in a linear moving section along the rail member 70 by the driving force of the driving mechanism.

  The cassette support plate 72 is a plate-like member having a rectangular shape in plan view fixed to the movable member 71. The cassette support plate 72 is formed to have a size larger than the dimensions of the bottoms of the loading cassette C1 and the unloading cassette C2, and can be stabilized in a state where the loading cassette C1 and the unloading cassette C2 are placed. It is like that. Since the cassette support plate 72 is fixed to the movable member 71, it moves integrally with the movable member 71.

  The support plate rotation mechanism 73 is a rotation mechanism that rotates the cassette support plate 72 on the XY plane with the Z axis as the rotation axis. The support plate rotating mechanism 73 can change the longitudinal direction of the loading cassette C1 and the unloading cassette C2 placed on the cassette carrying device CC by rotating the cassette support plate 72. ing.

  The cassette holding member 74 is a U-shaped holding member that is disposed on the + Y side of the cassette support plate 72 in plan view. The cassette holding member 74 is provided so that the position in the X-axis direction overlaps the cassette support plate 72. The cassette holding member 74 is supported by the movable member 71 via a support member (not shown), and moves integrally with the movable member 71. Both end portions of the U-shape of the cassette holding member 74 are holding portions 74a that engage with engaging portions Cx provided in the loading cassette C1 and the unloading cassette C2, respectively. The interval in the X-axis direction between the holding portions 74a (both ends of the U-shape) can be adjusted according to the interval between the engaging portions Cx provided in the carry-in cassette C1 and the carry-out cassette C2. The cassette holding member 74 can more reliably hold the loading cassette C1 and the unloading cassette C2 in the Z-axis direction by engaging the holding portion 74a with the engaging portion Cx. Yes.

  The holding member elevating mechanism 75 is a moving mechanism that is provided in the cassette holding member 74 and moves the cassette holding member 74 in the Z-axis direction. As the holding member elevating mechanism 75, for example, a driving mechanism such as an air cylinder can be used. By moving the cassette holding member 74 in the + Z direction by the holding member elevating mechanism 75, the loading cassette C1 and the unloading cassette C2 held by the cassette holding member 74 can be lifted. Conversely, the cassette that has been lifted can be placed by moving the cassette holding member 74 in the −Z direction by the holding member lifting mechanism 75.

  The holding member slide mechanism 76 is a moving mechanism that is provided in the cassette holding member 74 and moves the cassette holding member 74 in the Y-axis direction. The holding member slide mechanism 76 includes a guide bar 76a extending in the Y-axis direction and a movable member 76b that moves along the guide bar 76a. The movable member 76b is fixed to the cassette holding member 74. As the movable member 76b moves in the Y-axis direction along the guide bar 76a, the cassette holding member 74 moves integrally with the movable member 76b in the Y-axis direction.

(Controller unit)
The control unit CNU is provided in the stage unit STU of the substrate processing system SYS. The control unit CNU controls various operations in the above units such as a substrate processing operation in the substrate processing unit SPU, a cassette moving operation in the substrate carry-in unit LDU and the substrate carry-out unit ULU, and a transport operation in the transport unit CRU. A device and a supply source of materials necessary for each unit are provided. Examples of the material supply source include a liquid supply source and a cleaning liquid supply source.

  The control device can store, for example, information as to which position the cassette transport device CC has transported the cassette C, information as to how many cassettes C have been transported, and the like. Based on the information, the cassette transport device CC can be transported. In addition, the control device can receive the processing process of the substrate S in the substrate processing unit SPU as information, and can perform the transport operation of the cassette transport device CC based on the information. ing.

  Next, the operation of the substrate processing system SYS configured as described above will be described. The operation performed in each unit of the substrate processing system SYS is controlled by the control unit CNU. In the following description, the unit in which the operation is performed will be mainly described. However, each operation is actually performed based on the control of the control unit CNU.

(Cassette supply operation)
First, a cassette supply operation in which the carry-in cassette C1 containing the unprocessed substrate S is arranged in the substrate carry-in unit LDU and the empty carry-out cassette C2 is arranged in the substrate carry-out unit ULU will be described.

  For example, a carry-in cassette C1 containing a substrate S before processing is supplied into the substrate carry-in unit LDU through the cassette entrance 10 by a supply device (not shown). The substrate carry-in unit LDU rotates the supply belt 11a after confirming that the carry-in cassette C1 is placed on the −Y side end of the supply belt 11a. The carry-in cassette C1 moves in the + Y direction by the rotation of the supply belt 11a. The substrate carry-in unit LDU temporarily stops the rotation of the belt when the supply belt 11a moves by the space of the carry-in cassette C1, and waits until the next carry-in cassette C1 is supplied. When the next carry-in cassette C1 is supplied, as described above, the belt is temporarily stopped when it is moved by the space of the carry-in cassette C1, and again put into a standby state. By sequentially feeding the carry-in cassettes C1 while rotating the supply belt 11a, a plurality of carry-in cassettes C1 containing the unprocessed substrates S are arranged in the substrate carry-in unit LDU.

  On the other hand, for example, an empty unloading cassette C2 is supplied into the substrate unloading unit ULU through the cassette inlet / outlet 60 by a supply device (not shown). The substrate carry-out unit ULU rotates the supply belt 61a after confirming that the carry-out cassette C2 is placed on the −Y side end of the supply belt 61a. The carry-out cassette C2 moves in the + Y direction by the rotation of the supply belt 61a. The substrate carry-out unit ULU once stops the rotation of the belt when the supply belt 61a moves by the space of the carry-out cassette C2, and waits until the next carry-out cassette C2 is supplied. When the next carry-out cassette C2 is supplied, as described above, the belt is temporarily stopped when it has moved by the space of the carry-out cassette C2, and again put into a standby state. By sequentially supplying the carry-out cassette C2 while rotating the supply belt 61a, a plurality of empty carry-out cassettes C2 are arranged in the substrate carry-out unit ULU.

(Cassette transfer operation)
Next, a cassette carrying operation for carrying the carry-in cassette C1 supplied to the substrate carry-in unit LDU and the carry-out cassette C2 supplied to the substrate carry-out unit ULU to the substrate processing unit SPU will be described. The cassette carrying operation is performed using a cassette carrying device CC provided in the carrying unit CRU.

  The carrying operation of the carry-in cassette C1 will be described. The transport unit CRU moves the cassette transport device CC in the X-axis direction to a position facing the substrate carry-in unit LDU, and performs alignment so that the position in the X-axis direction overlaps with the carry-in cassette C1. After the alignment, the transport unit CRU slides the cassette holding member 74 in the −Y direction, and −Z of the engaging portion Cx of the loading cassette C1 waiting at the position of the most + Y side in the substrate loading unit LDU. The holding part 74a is arranged on the side. The transport unit CRU adjusts the interval in the X-axis direction and the position in the Z-axis direction of the holding portion 74a in advance so that the holding portion 74a is smoothly arranged on the −Z side of the engaging portion Cx when sliding.

  After engaging the holding portion 74a with the engaging portion Cx, the transport unit CRU moves the cassette holding member 74 in the + Z direction and lifts the loading cassette C1. The transport unit CRU slides the cassette holding member 74 in a state where the loading cassette C1 is lifted in the + Y direction, and moves the loading cassette C1 to a position overlapping the cassette support plate 72 in plan view. The transport unit CRU moves the cassette holding member 74 in the −Z direction at the position to place the loading cassette C1 on the cassette support plate 72. The transport unit CRU adjusts the orientation of the cassette support plate 72 in advance so that the longitudinal direction of the cassette C1 for loading coincides with the longitudinal direction of the cassette support plate 72 when the loading cassette C1 is placed. By these operations, the + Y side loading cassette C1 in the substrate loading unit LDU is taken into the cassette carrying device CC. After the loading, the substrate carry-in unit LDU has the carry-in cassette C1 arranged at the most + Y side among the remaining carry-in cassettes C1 in the substrate carry-in unit LDU arranged at the + Y side end of the substrate carry-in unit LDU. Then, the supply belt 11a is moved. By this operation, the remaining carry-in cassette C1 is moved in the + Y direction as a whole, and a space at the −Y side end on the supply belt 11a is vacated, so that a new carry-in cassette C1 is provided by a supply mechanism (not shown). Is supplied to the empty space.

  After taking in the loading cassette C1, the transport unit CRU moves the cassette transport device CC in the + X direction and rotates the cassette support plate 72 so that the longitudinal direction of the cassette support plate 72 coincides with the Y-axis direction. After the cassette support plate 72 is rotated, the transport unit CRU moves the standby position P1 set in the loading buffer mechanism BF1 of the substrate processing unit SPU in the X-axis direction and the loading cassette C1 in the X-axis direction. The position of the cassette carrying device CC is aligned so that the position overlaps. Either the rotation operation of the cassette support plate 72 or the alignment operation of the cassette transport device CC may be performed first.

  After the alignment operation (or rotation operation), the transport unit CRU lifts the loading cassette C1 placed on the cassette support plate 72 by the cassette holding member 74, and in this state, moves the cassette holding member 74 in the -Y direction. Slide to. When the carry-in cassette C1 is arranged at a position overlapping the standby position P1 in plan view, the transport unit CRU moves the cassette holding member 74 in the −Z direction to place the carry-in cassette C1 at the standby position P1.

  After placing the loading cassette C1, the transport unit CRU releases the holding force with respect to the loading cassette C1 and retracts the cassette holding member 74 to the + Y side. By these operations, the loading cassette C1 taken into the cassette carrying device CC is brought into the substrate processing unit SPU.

  The carrying operation of the carry-out cassette C2 will be described. This transport operation is performed using the cassette transport device CC used in the transport operation of the carry-in cassette C1. The transport unit CRU moves the cassette transport device CC in the X-axis direction to a position facing the substrate carry-out unit ULU, and performs alignment so that the position in the X-axis direction overlaps with the carry-out cassette C2. Then, the carry-out cassette C2 on the most + Y side in the substrate carry-out unit ULU is taken in. This taking-in operation is the same as the taking-in operation of the loading cassette C1. After the loading, the supply belt 61a is moved, and the remaining carry-out cassette C2 is moved in the + Y direction as a whole. Since the space at the −Y side end on the supply belt 61a is vacated by the movement of the carry-out cassette C2, a new carry-out cassette C2 is supplied to the vacant space by a supply mechanism (not shown).

  After taking in the carry-out cassette C2, the carrying unit CRU moves the cassette carrying device CC in the + X direction toward the carry-out side buffer mechanism BF2, so that the longitudinal direction of the cassette support plate 72 coincides with the Y-axis direction. The support plate 72 is rotated. After the cassette support plate 72 is rotated, the transport unit CRU is located on the X-axis direction of the standby position P5 set in the unload-side buffer mechanism BF2 of the substrate processing unit SPU and on the X-axis direction of the unloading cassette C2. The position of the cassette carrying device CC is aligned so that the position overlaps.

  After the alignment, the transport unit CRU places the unloading cassette C2 placed on the cassette support plate 72 at the standby position P5, releases the holding force, and retracts the cassette holding member 74 to the + Y side. This placement operation and retraction operation are the same as the placement operation and retraction operation described for the loading cassette C1. By these operations, the unloading cassette C2 taken into the cassette carrying device CC is brought into the substrate processing unit SPU.

(Substrate processing operation)
Next, the processing operation in the substrate processing unit SPU will be described.
In the substrate processing unit SPU, a moving operation for moving the carry-in cassette C1 containing the unprocessed substrate S and an empty carry-out cassette C2, a loading operation for the substrate S contained in the carry-in cassette C1, and a liquid state on the substrate S The coating operation for applying the body, the peripheral edge removing operation for removing the peripheral portion of the thin film formed on the substrate S, the unloading operation for the processed substrate S, and the empty loading cassette C1 and the processed substrate S A moving operation for moving the accommodated unloading cassette C2 is performed. In addition to the above operations, a substrate S transfer operation is performed between the loading operation and the coating operation, between the coating operation and the peripheral edge removal operation, and between the shaping operation and the unloading operation.

  Of these operations, the moving operation of the loading cassette C1 and the unloading cassette C2 will be described first. The substrate processing unit SPU moves the loading cassette C1 conveyed to the standby position P1 of the loading-side buffer mechanism BF1 to the standby position P2 by the conveyance belt 20a, and moves the loading cassette C1 moved to the standby position P2 to the conveyance belt. 20b is further moved to the standby position P4. Similarly, the substrate processing unit SPU moves the unloading cassette C2 transported to the standby position P5 of the unloading side buffer mechanism BF2 to the standby position P6 by the transport belt 22a, and moves to the standby position P6. Is further moved to the standby position P8 by the conveyor belt 22b. With these operations, the carry-in cassette C1 and the carry-out cassette C2 that have been carried into the substrate processing unit SPU are arranged at the position at the start of processing.

  Next, the loading operation of the substrate S will be described. After confirming that the loading cassette C1 is placed at the standby position P4, the substrate processing unit SPU places the substrate upper holding mechanism 23 at the clamp position and moves the elevating member 24a of the substrate lower holding mechanism 24 in the + Z direction. Move to. By this movement, the clamp member 24b attached to the + Z side end of the elevating member 24a comes into contact with one of the −Z sides arranged on the most −Y side among the substrates S accommodated in the loading cassette C1. The −Z side of the substrate S is held by the clamp member 24b.

  After holding the −Z side of the substrate S, the substrate processing unit SPU further moves the elevating member 24a in the + Z direction while maintaining the holding state. By this movement, the substrate S is lifted to the + Z side by the substrate lower holding mechanism 24, the + Z side of the substrate S comes into contact with the clamp member 23b of the substrate upper holding mechanism 23, and the + Z side of the substrate S is held by the clamp member 23b. . The substrate S is held by both the clamp member 23b of the substrate upper holding mechanism 23 and the clamp member 24b of the substrate lower holding mechanism 24.

  The substrate processing unit SPU simultaneously moves the elevating member 23a and the elevating member 24a in the + Z direction while holding the substrate S by the clamp member 23b and the clamp member 24b. The substrate processing unit SPU links the elevating mechanism 23c and the elevating mechanism 24c so that the elevating member 23a and the elevating member 24a move at a constant speed. The substrate S moves in the + Z direction while being held by the clamp member 23b and the clamp member 24b. The substrate processing unit SPU stops the movement of the elevating member 23a and the elevating member 24a when the substrate S is disposed at the loading position LP. In this way, the loading operation of the substrate S is performed.

  After the loading operation, the substrate processing unit SPU causes the holding unit 32 of the carry-in side transport device SC1 to access the loading position LP, and holds the substrate S disposed at the loading position LP in the holding unit 32. After holding the substrate S by the holding unit 32, the substrate processing unit SPU releases the holding force by the clamp member 23b and the clamp member 24b so that the substrate S is held only by the holding unit 32. From this state, the substrate processing unit SPU retreats the clamp member 23b and the clamp member 24b whose holding force has been released in the -Z direction, and rotates the turntable 30b of the carry-in side transfer device SC1 to apply the substrate S to the coating device. It arrange | positions in the application position in CT.

  Next, an application operation for applying a liquid material to the substrate S will be described. A coating device CT is used for this coating operation. The substrate processing unit SPU rotates the substrate S arranged at the processing position at a high speed and accesses a nozzle (not shown) provided in the coating apparatus CT to the coating region of the substrate S to transfer the liquid material from the nozzle to the substrate S. To discharge. The liquid material discharged onto the substrate S reaches the outer periphery of the substrate S by the rotational centrifugal force, and a thin film is formed on the entire surface of the substrate S.

  After the coating operation, the substrate processing unit SPU accesses the holding unit 42 of the carry-out side transfer device SC2 from the + X side to the substrate S in the coating apparatus CT, and holds the substrate S by the holding unit 42. After the substrate processing unit SPU holds the substrate S by the holding unit 42, the substrate processing unit SPU rotates the turntable 40b and appropriately expands / contracts the arm unit 41 to allow the holding unit 42 to access the peripheral edge removing device EBR. By this operation, the substrate S is disposed in the peripheral edge removing device EBR.

  Next, the peripheral edge removing operation for removing the thin film formed around the substrate S will be described. For this peripheral edge removing operation, the peripheral edge removing device EBR is used. The substrate processing unit SPU immerses the peripheral edge of the substrate S disposed in the peripheral edge removing device EBR in the solution in the dip portion, and rotates the substrate S in this state. Dissolves and is removed.

  After the peripheral edge removing operation, the substrate processing unit SPU moves the elevating member 25a so that the clamp member 25b of the substrate upper holding mechanism 25 is positioned on the + Z side of the unloading position UP. After the movement of the elevating member 25a, the substrate processing unit SPU rotates the rotary table 40b while holding the substrate S by the holding unit 42 of the carry-out side transfer device SC2, and appropriately expands and contracts the arm unit 41 to hold the holding unit 42. To access the unloading position UP. By this operation, the substrate S is placed at the unloading position UP.

  Next, the unloading operation of the substrate S will be described. After confirming that the substrate S is disposed at the unloading position UP, the substrate processing unit SPU moves the lifting member 25a of the substrate upper holding mechanism 25 in the −Z direction and moves the lifting member of the substrate lower holding mechanism 26. 26a is moved in the + Z direction. By this movement, the clamp member 25b attached to the −Z side of the elevating member 25a comes into contact with the + Z side of the substrate S, and the clamp member 26b attached to the + Z side end of the elevating member 26a becomes the −Z side of the substrate S. The + Z side and −Z side of the substrate S are held by the clamp member 25b and the clamp member 26b, respectively.

  The substrate processing unit SPU moves the elevating member 25a and the elevating member 26a simultaneously in the −Z direction while maintaining the holding state. The substrate processing unit SPU links the elevating mechanism 25c and the elevating mechanism 26c so that the elevating member 25a and the elevating member 26a move at a constant speed. The substrate S moves in the −Z direction while being held by the clamp member 25b and the clamp member 26b.

  When the protruding portion of the elevating member 25a approaches the carry-out cassette C2, the substrate processing unit SPU releases the holding force by the clamp member 25b and stops the movement of the elevating member 25a, and moves only the elevating member 26a in the −Z direction. Let The substrate S moves in the −Z direction while being held only by the holding force of the clamp member 26b.

  The substrate processing unit SPU continues to be held by the clamp member 26b until the substrate S reaches the accommodation position in the unloading cassette C2. After reaching the accommodation position, the substrate processing unit SPU releases the holding by the clamp member 26b and moves the elevating member 26a in the −Z direction. By this operation, the substrate S is accommodated in the carry-out cassette C2.

  In the above description of each operation, the state in which the operation is sequentially performed for one substrate S accommodated on the most −Y side of the loading cassette C1 has been described. Then the operation is performed. In this case, the substrate processing unit SPU rotates the transport belt 20b, and is disposed at a position where the most-Y substrate S among the remaining substrates S accommodated in the loading cassette C1 overlaps the loading position LP in plan view. Then, the loading cassette C1 is moved in the -Y direction.

  Similarly, the substrate processing unit SPU rotates the transport belt 22b so that the accommodation position on the most −Y side of the accommodation positions in the unloading cassette C2 is arranged at a position overlapping the unloading position UP in plan view. The unloading cassette C2 is moved in the -Y direction. The substrate processing unit SPU repeatedly performs each of the above processes while moving the carry-in cassette C1 and the carry-out cassette C2.

  When processing a plurality of substrates S, the substrate processing unit SPU performs a processing operation on the plurality of substrates S in parallel. Specifically, while the coating operation is performed on a certain substrate S, the peripheral portion removing operation is performed on the other substrate S, and the loading operation and the unloading operation are performed on the substrate S different from these. As described above, the processing operations are performed in parallel on the plurality of substrates S. By performing parallel processing in this way, the standby time of the substrate S is shortened as much as possible, and the processing tact of the substrate S is shortened.

  When processing of all the substrates S accommodated in the carry-in cassette C1 is completed, the carry-in cassette C1 becomes empty, and all the receiving positions of the carry-out cassette C2 waiting at the standby position P8 are processed. It will be in the state filled with the board | substrate S after. After confirming this state, the substrate processing unit SPU rotates the transport belt 20b in the opposite direction to move the loading cassette C1 from the standby position P4 to the standby position P2, and further rotates the transport belt 20a. Then, the loading cassette C1 is moved to the standby position P3. Similarly, the substrate processing unit SPU rotates the transport belt 22b in the opposite direction to move the unloading cassette C2 from the standby position P8 to the standby position P6, and further rotates the transport belt 22a to unload the cassette. C2 is moved to the standby position P7.

(Cassette transfer operation)
Next, a cassette carrying operation for carrying the empty carry-in cassette C1 to the substrate carry-in unit LDU and carrying the carry-out cassette C2 containing the processed substrate S to the substrate carry-out unit ULU will be described.

  The carrying operation of the carry-in cassette C1 will be described. This carrying operation is performed using the cassette carrying device CC used in the above carrying operation. The transport unit CRU moves the cassette transport device CC to the carry-in buffer mechanism BF1 of the substrate processing unit SPU. An empty carry-in cassette C1 stands by at a stand-by position P3 in the carry-in buffer mechanism BF1. The transport unit CRU rotates the cassette support plate 72 so that the longitudinal direction of the cassette support plate 72 of the cassette transport apparatus CC coincides with the longitudinal direction of the loading cassette C1.

  After rotating the cassette support plate 72, the transport unit CRU performs alignment in the X-axis direction between the cassette transport device CC and the loading cassette C1. After the alignment, the transport unit CRU causes the cassette transport device CC to take in the empty carry-in cassette C1 waiting at the standby position P3. This capturing operation is the same as the capturing operation described above.

  After taking in the carry-in cassette C1, the transport unit CRU moves the cassette transport device CC toward the substrate carry-in unit LDU in the -X direction so that the longitudinal direction of the cassette support plate 72 coincides with the X-axis direction. The support plate 72 is rotated. The transport unit CRU rotates the cassette support plate 72, and then performs alignment in the X-axis direction between the cassette transport device CC and the recovery belt 11b provided in the substrate carry-in unit LDU.

  After the alignment, the transport unit CRU places the empty loading cassette C1 placed on the cassette support plate 72 on the + Y side end of the collection belt 11b, and moves the cassette holding member 74 to the + Y side. Evacuate. This placement operation and retraction operation are the same as the above-described placement operation and retraction operation. By these operations, the carry-in cassette C1 taken into the cassette carrying device CC is carried into the substrate carry-in unit LDU.

  The carrying operation of the carry-out cassette C2 will be described. This transfer operation is performed by using the cassette transfer device CC, similarly to the transfer operation of the carry-in cassette C1. The transport unit CRU moves the cassette transport device CC in the X-axis direction to the carry-out buffer mechanism BF2 of the substrate processing unit SPU. At the standby position P7 in the carry-out side buffer mechanism BF2, a carry-out cassette C2 containing the processed substrate S is on standby. The transport unit CRU rotates the cassette support plate 72 so that the longitudinal direction of the cassette support plate 72 of the cassette transport apparatus CC coincides with the longitudinal direction of the unloading cassette C2.

  After rotating the cassette support plate 72, the transport unit CRU moves the cassette transport device CC so that the position of the cassette transport device CC in the X-axis direction matches the position of the unloading cassette C2 in the X-axis direction. Perform alignment. After the alignment, the transport unit CRU causes the cassette transport device CC to take in the unloading cassette C2 that is waiting at the standby position P7. This capturing operation is the same as the capturing operation described above.

  After the capturing operation, the transport unit CRU moves the cassette transport device CC in the −X direction toward the substrate transport unit ULU, and the cassette support plate 72 so that the longitudinal direction of the cassette support plate 72 coincides with the X-axis direction. Rotate. The transport unit CRU rotates the cassette support plate 72, and then performs alignment in the X-axis direction between the cassette transport device CC and the recovery belt 61b provided in the substrate carry-out unit ULU.

  After the alignment, the transport unit CRU places the unloading cassette C2 placed on the cassette support plate 72 on the + Y side end of the collection belt 61b, and retracts the cassette holding member 74 to the + Y side. . This placement operation and retraction operation are the same as the above-described placement operation and retraction operation. By these operations, the carry-out cassette C2 taken into the cassette carrying device CC is carried into the substrate carry-out unit ULU.

(Cassette collection operation)
Next, a cassette collecting operation for collecting the empty loading cassette C1 and the unloading cassette C2 containing the processed substrate S will be described.

  After confirming that the empty carry-in cassette C1 has been transported, the substrate carry-in unit LDU rotates the collection belt 11b to move the carry-in cassette C1 in the -Y direction. When moving in the −Y direction, for example, the loading cassette C1 may be moved directly to the cassette inlet / outlet 10, or the loading cassette C1 may be moved little by little so that the + Y side end of the collecting belt 11b is opened. You may make it let me.

  When the carry-in cassette C1 is made to go straight to the cassette inlet / outlet 10, the carry-in cassette C1 is transferred to the outside of the substrate carry-in unit LDU via the cassette inlet / outlet 10. The carry-in cassette C1 conveyed to the outside of the substrate carry-in unit LDU is collected by a collection mechanism (not shown). This operation is repeated each time the carry-in cassette C1 is transported to the substrate carry-in unit LDU.

  When the carry-in cassette C1 is moved little by little, for example, every time the carry-in cassette C1 is transported to the substrate carry-in unit LDU, the carry-in cassette C1 is moved so as to be shifted in the −Y direction by one space. it can. This operation is repeated a plurality of times, and when the most -Y side loading cassette C1 reaches the cassette inlet / outlet port 10, a recovery operation by a recovery mechanism (not shown) is performed.

  On the other hand, after confirming that the unloading cassette C2 containing the processed substrate S has been transported, the substrate unloading unit ULU rotates the collection belt 61b to move the unloading cassette C2 in the -Y direction. Let In this movement, as in the case of the substrate carry-in unit LDU, the carry-out cassette C2 may be moved directly to the cassette inlet / outlet 60 or may be moved little by little in the −Y direction. As a result of this movement, the carry-out cassette C2 is finally transferred to the outside of the substrate carry-out unit ULU via the cassette inlet / outlet 60. The carry-out cassette C2 carried out of the substrate carry-out unit ULU is collected by a collection mechanism (not shown).

(Cassette refill operation)
In the above description, during the processing in the substrate processing unit SPU, the loading cassette C1 is disposed at the standby position P4 of the loading side buffer mechanism BF1, and the unloading cassette C2 is positioned at the standby position of the loading side buffer mechanism BF2. It is arranged at P8. At this time, the standby position P1 of the carry-in side buffer mechanism BF1 and the standby position P5 of the carry-out side buffer mechanism BF2 are vacant (a state where the cassette is not in standby).

  After confirming that the standby position P1 and the standby position P5 are vacant, the transport unit CRU uses the cassette transport device CC to move to the standby position P1 and the standby position P5 to the next loading cassette C1 and unloading cassette. C2 is conveyed. The transport unit CRU first moves the cassette transport device CC to the substrate carry-in unit LDU and takes in the next carry-in cassette C1.

  After the taking-in operation, the carrying unit CRU moves the cassette carrying device CC to the loading-side buffer mechanism BF1, and places the loaded carrying-in cassette C1 at the standby position P1. Similarly, the transport unit CRU moves the cassette transport device CC to the substrate unloading unit ULU to take in the next unloading cassette C2, and then moves the cassette transport device CC to the unloading side buffer mechanism BF2 to unload the cassette C2. Is placed at the standby position P5.

  After the loading cassette C1 and the unloading cassette C2 are placed, the substrate processing unit SPU transfers the transport belt 20a and the transport until the processing of the substrate S accommodated in the loading cassette C1 at the standby position P4 is completed. The operation of the belt 20b is put on standby. When the processing is completed, the substrate processing unit SPU rotates the transport belt 20b to move the loading cassette C1 from the standby position P4 to the standby position P2.

  By this operation, the loading cassette C1 that accommodates the unprocessed substrate S waits at the standby position P1, and the empty loading cassette C1 waits at the standby position P2. When the substrate processing unit SPU rotates the transport belt 20a in this state, the loading cassette C1 at the standby position P2 moves to the standby position P3, and the loading cassette C1 at the standby position P1 moves to the standby position P2. In this way, the moving operation is performed efficiently. Therefore, in practice, when performing the coating operation or the like in the substrate processing unit SPU, it is preferable to place the loading cassette C1 in the standby position P1 and the standby position P2.

  Similarly, when the transport belt 22a is rotated when the carry-out cassette C2 is moved from the standby position P8 to the standby position P6, the carry-out cassette C2 at the standby position P6 moves to the standby position P7, and The unloading cassette C2 of P5 moves to the standby position P6. Thus, the moving operation is also efficiently performed in the carry-out buffer mechanism BF2. Therefore, in practice, when performing the coating operation or the like in the substrate processing unit SPU, it is preferable to keep the unloading cassette C2 in the standby position P5 and the standby position P6.

  When the carry-in cassette C1 moves from the standby position P1 to the standby position P2, and the carry-out cassette C2 moves from the standby position P5 to the standby position P6, the standby position P1 and the standby position P5 become empty again. Further, the next carry-in cassette C1 and carry-out cassette C2 can be conveyed to the standby position P1 and the standby position P5 in the vacant state, and can be made to stand by respectively. Thus, every time the standby position P1 and standby position P5 of the carry-in side buffer mechanism BF1 and the carry-out side buffer mechanism BF2 become empty, the transport unit CRU transports the carry-in cassette C1 from the substrate carry-in unit LDU, The unloading cassette C2 is transported from the substrate unloading unit ULU.

  As described above, according to the present embodiment, the cassette transport device CC provided in the transport unit CRU transports the loading cassette C1 between the loading position LP and the substrate loading unit LDU, and unloads the position UP and the substrate. Since the unloading cassette C2 is transported to and from the unloading unit ULU, it is possible to cause one cassette transporting device CC to perform transporting operations in different transport sections. For this reason, the conveyance processing by the cassette conveyance device CC can be unified, the configuration of the substrate processing system SYS can be simplified, and the processing tact can be shortened. Further, according to the present embodiment, since the carry-in cassette C1 and the carry-out cassette C2 are selectively used, there is an advantage that the contamination of the substrate S can be prevented.

  Moreover, according to this embodiment, since the substrate processing unit SPU, the substrate carry-in unit LDU, and the substrate carry-out unit ULU are arranged in the linear direction, the conveyance path between the units is set in the linear direction. Can do. Thereby, complication of a conveyance route can be avoided and the composition of substrate processing system SYS can be simplified. In addition, according to the present embodiment, since the substrate processing unit SPU is disposed between the substrate carry-in unit LDU and the substrate carry-out unit ULU, each unit moves along the direction of the substrate carrying flow. Will be placed. Thereby, the processing efficiency can be increased.

  In addition to these, in this embodiment, since the transport unit CRU moves the cassette transport device CC in the linear direction (X-axis direction), the moving operation of the cassette transport device CC can be simplified. In addition, the substrate carry-in unit LDU and the substrate carry-out unit ULU can each wait for a plurality of cassettes, and these serve as a plurality of cassette standby units, so that more substrates can be quickly transferred. It becomes possible to process.

  Further, the substrate carry-in unit LDU and the substrate carry-out unit ULU are fed by the supply belts 11a and 61a and the recovery belts 11b and 61b to the carry unit CRU side for the carry-in cassette C1, and to the cassette entrance 10 for the carry-out cassette C2. Since the cassette standby section can be moved to the 60 side, the supply operation and the recovery operation of the loading cassette C1 and the unloading cassette C2 can be performed efficiently.

  Further, the substrate processing unit SPU is provided with a carry-in side buffer mechanism BF1 and a carry-out side buffer mechanism BF2 corresponding to the loading position LP and the unloading position UP, and a plurality of cassettes C can stand by in each buffer mechanism. Thus, the loading operation and unloading operation of the substrate S in the substrate processing unit SPU can be performed quickly, and the processing efficiency can be improved. Further, the buffer mechanism BF has transport belts 20 and 22 for moving the standby position of the cassette C, and the standby position of the cassette C can be moved according to the remaining amount of the substrate S in the cassette C. Therefore, processing efficiency can be improved. Since these standby positions are provided along the conveyance direction (X-axis direction) by the cassette conveyance device CC, the distance between the cassette conveyance device CC and each standby position is constant. By keeping the distance constant, the cassette transport device CC can easily access each standby position.

  Further, since the substrate processing unit SPU has the substrate loading mechanism 21 that lifts the substrate S from the loading cassette C1 and places it at the loading position LP, the substrate loading operation can be performed quickly. Similarly, since the substrate processing unit SPU has the substrate unloading mechanism 27, the unloading operation of the substrate S can be performed quickly.

  Further, since the cassette carrying device CC has a rotating mechanism that rotates the direction of the cassette support plate 72, the carrying operation and the delivery operation can be smoothly performed even when the carrying direction and the cassette direction are different. Can do. Further, an engaging portion Cx is formed in the loading cassette C1 and the unloading cassette C2, and a cassette holding unit that holds the loading cassette C1 and the unloading cassette C2 by engaging the engaging device with the engaging portion Cx. Since the member 74 is provided, the carry-in cassette C1 and the carry-out cassette C2 can be reliably held.

  Further, since the control unit CNU controls the transfer positions of the loading cassette C1 and the unloading cassette C2 according to the processing status of the substrate S in the substrate processing unit SPU, the transfer operation can be performed more efficiently. it can.

The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
In the above embodiment, the control unit CNU controls the transfer positions of the loading cassette C1 and the unloading cassette C2 according to the processing status of the substrate S in the substrate processing unit SPU. However, the present invention is not limited to this. For example, the configuration may be such that the transfer position and timing of the carry-in cassette C1 and the carry-out cassette C2 are controlled in advance during the entire operation of the substrate processing system SYS.

  In the above embodiment, the loading cassette C1 and the unloading cassette C2 are formed with the engaging portion Cx, and the cassette carrying device CC engages the holding portion 74a of the cassette holding member 74 with the engaging portion Cx. However, the present invention is not limited to this. For example, the cassette holding member 74 has other parts such as the bottoms of the loading cassette C1 and the unloading cassette C2. It may be configured to hold.

  Moreover, in the said embodiment, although it was set as the structure which has the rotation mechanism in which the cassette conveyance apparatus CC rotates the direction of the cassette support plate 72, it is not restricted to this, For example, the direction of the cassette support plate 72 is fixed. It does not matter as a configuration. In this case, in the substrate processing system SYS, the cassette C is supplied, collected and moved so that the longitudinal direction of the cassette C is always aligned with the longitudinal direction of the cassette support plate 72. Thereby, operation | movement of the cassette conveying apparatus CC can be simplified more.

  In the above embodiment, the substrate processing unit SPU includes the substrate loading mechanism 21 that lifts the substrate S from the loading cassette C1 and places the substrate S at the loading position LP. However, the present invention is not limited to this. The configuration of the mechanism 21 may be another configuration. The same applies to the configuration of the substrate unloading mechanism 27.

  In the above embodiment, the buffer mechanism BF is configured to move the standby position of the cassette C in the X-axis direction. However, the present invention is not limited to this, and the standby position of the cassette C is moved in another direction. It doesn't matter if you do. Further, the standby position of the cassette C may be fixed without being moved.

  Moreover, in the said embodiment, although it was set as the structure which each arrange | positions carrying-in side buffer mechanism BF1 and carrying-out side buffer mechanism BF2 as buffer mechanism BF, it is not restricted to this, For example, either one of both buffer mechanism BF It may be configured to arrange only one of them. The configuration is not limited to a configuration in which a plurality of buffer mechanisms BF are arranged, and a configuration in which the buffer mechanisms BF are arranged in one place may be used.

  In the above-described embodiment, the supply belts 11a and 61a and the recovery belts 11b and 61b allow the loading cassette C1 to be directed to the transport unit CRU side, and the unloading cassette C2 to be directed to the cassette entrances 10 and 60, respectively. Although the cassette standby unit is configured to move, the present invention is not limited to this, and the cassette standby unit may be configured to move to either one.

  In the above embodiment, the substrate loading unit LDU and the substrate unloading unit ULU are each configured to wait for a plurality of cassettes C. However, the present invention is not limited to this. For example, each unit waits for only one cassette C. It does not matter as a configuration to be made. Accordingly, the present invention can be applied even when the substrate processing system SYS is small.

  In the above embodiment, the transport unit CRU is configured to move the cassette transport device CC in the linear direction (X-axis direction). However, the present invention is not limited to this, and is configured to be movable in a plurality of different directions. Alternatively, it may be configured to be movable in the curve direction. In this way, by setting a wide conveyance path regardless of the linear direction, it is possible to widen the design range regarding the arrangement of each unit.

  For example, in addition to the configuration in which the substrate processing unit SPU is disposed between the substrate carry-in unit LDU and the substrate carry-out unit ULU as in the above embodiment, the substrate carry-in unit LDU, the substrate carry-out unit ULU, and the substrate processing unit SPU It can also be set as the structure arrange | positioned in a different position.

  In addition, the substrate processing unit SPU, the substrate carry-in unit LDU, and the substrate carry-out unit ULU are not limited to the configuration arranged in the linear direction as in the above embodiment. For example, each unit is placed at the vertex position of an equilateral triangle or the right triangle position. A wide range of designs is possible, such as arranging

  Moreover, in the said embodiment, although the example which performs mainly the application | coating process which apply | coats and forms a thin film to the board | substrate S as a process in the substrate processing unit SPU was demonstrated, it is not restricted to this, For example, a substrate processing unit As a main configuration, the pre-processing and post-processing of the coating process may be performed. Examples of the pretreatment include a process of irradiating the substrate S with ultraviolet light and a process of cleaning the substrate S. Examples of the post-processing include a process for reducing the pressure around the substrate S and a process for heating the substrate S.

  In the above embodiment, the loading position LP and the unloading position UP are set first, and the substrate loading mechanism 21 and the substrate unloading mechanism 25 are arranged in accordance with the loading position LP and the unloading position UP. However, on the contrary, the positions of the substrate loading mechanism 21 and the substrate unloading mechanism 25 are set first, and the loading position LP and the position below the positions of the substrate lower support mechanisms 24 and 26 in the + Z direction are set. It may be configured to set the unloading position UP.

  In the above embodiment, the coating apparatus CT is configured to discharge the liquid material onto the substrate S while rotating the substrate S. However, the present invention is not limited to this, and other types of coating apparatuses, for example, The present invention can be applied even when a dip type coating device or a slit nozzle type coating device is used. Further, the coating apparatus CT is not limited to a type of apparatus that forms a thin film on one side of the substrate S, and may be a type of apparatus that can form a thin film on both sides of the substrate S.

  Moreover, in the said embodiment, although the board | substrate carrying-in unit LDU demonstrated and demonstrated the structure which has a belt conveyor mechanism as the cassette moving mechanism 11 in the said embodiment, it is not restricted to this. In addition to the belt conveyor mechanism, for example, a structure having a fork member that holds the engaging portion Cx of the loading cassette C1 may be used. As this hawk member, it can be set as the structure similar to the cassette holding member 74 of the cassette conveying apparatus CC, for example. The engaging portion Cx of the loading cassette C1 can be held by the hawk member and moved in the substrate loading unit LDU. The fork member can also be used as the cassette moving mechanism 61 of the substrate carry-out unit ULU. Of course, other transport mechanisms such as a rail mechanism, a linear motor, and an air cylinder may be used in addition to the hawk member.

  In the above-described embodiment, the transport belts 20a, 20b, 22a, and 22b are taken as examples of mechanisms for moving the standby positions of the loading cassette C1 and the unloading cassette C2 in the loading buffer mechanism BF1 and the unloading buffer mechanism BF2. However, the present invention is not limited to this. For example, in the loading-side buffer mechanism BF1, the loading cassette C1 is moved in order of the standby position P1, the standby position P2, the standby position P4, the standby position P2, and the standby position P3. It may be configured to provide a moving mechanism. Similarly, the buffer mechanism BF2 may be configured to include a moving mechanism that sequentially moves the unloading cassette C2 in the standby position P5, the standby position P6, the standby position P8, the standby position P6, and the standby position 7. Examples of such a moving mechanism include a configuration having a fork member that holds the engaging portion Cx of the carry-in cassette C1 and the carry-out cassette C2. As this hawk member, it can be set as the structure similar to the cassette holding member 74 of the cassette conveying apparatus CC, for example.

  Moreover, in the said embodiment, although it was set as the structure by which the board | substrate conveyance apparatus SC was arrange | positioned in two places in the substrate processing unit SPU, it is not restricted to this, For example, the board | substrate conveyance apparatus SC was arrange | positioned in one place. It may be a configuration, or may be a configuration arranged at three or more locations.

  In the above embodiment, the cassette C can be accommodated in a state where the substrate S is erected in the Z-axis direction and is transported while the substrate S is erected. However, the present invention is not limited to this. The cassette C can accommodate the substrate surface of the substrate S in a state parallel to the XY plane, and the cassette C may be transported in this state.

  Moreover, in the said embodiment, although it was set as the structure which arrange | positions the peripheral part removal apparatus EBR only in the carrying-out side conveying apparatus SC2 side, it is not restricted to this, For example, as a structure arrange | positioned also in the carrying-in side conveying apparatus SC1 side. It doesn't matter. By configuring in this way, for example, both the carry-in side transfer device SC1 and the carry-out side transfer device SC2 can be simultaneously carried.

  In addition to the configuration of the above embodiment, the substrate processing system SYS may further include, for example, a foreign matter detection unit that detects the presence or absence of foreign matter on the substrate S after the coating process. If a foreign substance adheres to the substrate S after the coating process, the substrate S may be damaged at the position where the foreign substance is attached when a subsequent process such as an imprint process is performed. On the other hand, by further including a foreign matter detection unit that detects the presence or absence of foreign matter on the substrate S after the coating process, the substrate S to which such foreign matter is attached can be detected. Since it can be prevented from being used for the printing process, the substrate S can be prevented from being damaged.

  If the substrate processing system SYS includes a foreign substance detection unit, the foreign substance detection unit is independent of the stage unit STU, the substrate processing unit SPU, the substrate carry-in unit LDU, the substrate carry-out unit ULU, and the transfer unit CRU. It may be configured as a unit, for example, may be configured inside the substrate processing unit SPU. A configuration in which foreign matter detection can be performed before the substrate S after coating processing is accommodated in the carry-out cassette C2 is preferable, but foreign matter detection can be performed in a state where the substrate S is accommodated in the carry-out cassette C2. Of course. When the foreign substance is detected before the substrate S is accommodated in the carry-out cassette C2, for example, the substrate S in which the foreign substance is detected is provided with a collecting mechanism that separately collects the substrate S without being accommodated in the carry-out cassette C2. It doesn't matter.

The top view which shows the structure of the substrate processing system which concerns on embodiment of this invention. The front view which shows the structure of the substrate processing system which concerns on this embodiment. The side view which shows the structure of the substrate processing system which concerns on this embodiment. The figure which shows the structure of a board | substrate loading mechanism and a board | substrate unloading mechanism. The figure which shows the structure of a board | substrate loading mechanism and a board | substrate unloading mechanism. The figure which shows the structure of a board | substrate loading mechanism and a board | substrate unloading mechanism.

Explanation of symbols

  SYS ... Substrate processing system S ... Substrate STU ... Stage unit SPU ... Substrate processing unit LDU ... Substrate carry-in unit ULU ... Substrate carry-out unit CRU ... Transfer unit CNU ... Control unit SUT ... Stage unit C1 ... Carry-in cassette C2 ... Carry-out cassette CT ... coating device EBR ... peripheral edge removing device BF ... buffer mechanism SC ... substrate transport device P1 to P8 ... standby position LP ... loading position UP ... unloading position RL ... rail mechanism CC ... cassette transport device Cx ... engaging portions 20, 22 ... cassette moving mechanism 21 ... substrate loading mechanism 27 ... substrate unloading mechanism 11, 61 ... cassette moving mechanism 11a, 61a ... supply belt 11b, 61b ... collection belt 71 ... movable member 71a ... concave portion 72 ... Cassette support plate 73 ... Support plate rotation mechanism 74 ... Cassette holding member 74a ... Holding portion 75 ... Holding member lifting mechanism 76 ... Holding member slide mechanism 76a ... Guide bar 76b ... Movable member

Claims (18)

A processing unit for performing predetermined processing on the substrate;
A substrate loading unit for storing the substrate before the predetermined processing is supplied, and a substrate loading unit for collecting the empty loading container;
A substrate unloading unit in which the unloading container containing the substrate after the predetermined processing is collected and the empty unloading container is supplied;
A transport mechanism for transporting the loading container between the loading position in the processing unit and the substrate carry-in unit and transporting the unloading container between the unloading position in the processing unit and the substrate unloading unit. A substrate processing system. The substrate processing system according to claim 1, wherein the processing unit, the substrate carry-in unit, and the substrate carry-out unit are arranged in a linear direction. The substrate processing system according to claim 1, wherein the processing unit is disposed between the substrate carry-in unit and the substrate carry-out unit. The substrate processing system according to claim 2, wherein the transport unit includes a moving mechanism that moves the transport mechanism in the linear direction. The substrate processing system according to any one of claims 1 to 4, wherein each of the substrate carry-in unit and the substrate carry-out unit is provided with a plurality of container standby portions. 6. The substrate processing system according to claim 5, wherein at least one of the substrate carry-in unit and the substrate carry-out unit includes a second moving mechanism that moves a plurality of the container standby units. The substrate processing system according to claim 6, wherein the second moving mechanism moves the container standby unit so as to bring the supply target container closer to the transport unit and to move the collection target container away from the transport unit. 8. The buffer mechanism having a plurality of second container standby portions corresponding to at least one of the loading position and the unloading position is provided in the processing unit. The substrate processing system as described in any one of them. The substrate processing system according to claim 8, wherein the buffer mechanism includes a third moving mechanism that moves the plurality of second container standby portions. The substrate processing system according to claim 9, wherein the third movement mechanism moves the second container standby unit in the same direction as the conveyance direction of the conveyance mechanism. The substrate processing system according to any one of claims 1 to 10, wherein the processing unit includes a pickup mechanism that lifts the substrate from the loading container and places the substrate in the loading position. The substrate processing system according to any one of claims 1 to 11, wherein the transport unit includes a rotation mechanism that rotates a direction of the transport mechanism. An engaging portion is formed in the carry-in container and the carry-out container,
The said conveyance mechanism has a holding member engaged with the said engaging part, and hold | maintains the said container for carrying in and the said container for carrying out. The Claims 1-12 characterized by the above-mentioned. Substrate processing system. The apparatus according to claim 1, further comprising a control device that controls a transfer position of at least one of the carry-in container and the carry-out container in accordance with a processing state of the substrate in the processing unit. The substrate processing system as described in any one of Claims. 15. The predetermined process includes a coating process for coating a liquid material on the substrate, a pre-process for the coating process, and a post-process for the coating process. Substrate processing system. The substrate processing system according to claim 15, wherein the pretreatment includes at least one of a process of irradiating the substrate with ultraviolet rays and a process of cleaning the substrate. The substrate processing system according to claim 16, wherein the post-processing includes at least one of a process for reducing the pressure around the substrate and a process for heating the substrate. The substrate processing system according to any one of claims 1 to 17, further comprising a foreign matter detection unit that detects the presence or absence of foreign matter on the substrate after the predetermined processing.

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