CN103077911A - Coating device - Google Patents
Coating device Download PDFInfo
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- CN103077911A CN103077911A CN2012105800199A CN201210580019A CN103077911A CN 103077911 A CN103077911 A CN 103077911A CN 2012105800199 A CN2012105800199 A CN 2012105800199A CN 201210580019 A CN201210580019 A CN 201210580019A CN 103077911 A CN103077911 A CN 103077911A
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Abstract
A substrate processing system includes a processing unit which performs a predetermined process on a substrate; a substrate loading unit which supplies a loading container accommodating the substrate not subjected to the predetermined process and collects the empty loading container; a substrate unloading unit which collects an unloading container accommodating the substrate subjected to the predetermined process and supplies the empty unloading container; and a carrying unit which includes a carrying mechanism for carrying the loading container between the substrate loading unit and a loading position inside the processing unit and carrying the unloading container between the substrate unloading unit and an unloading position inside the processing unit. A suction portion which is rotatably provided in the arm portion arranged relatively to a base portion so as to suction and hold the substrate. The carrying device utilizes a retaining portion to maintain the state of the substrate and drive it to rotate. The coating device utilizes nozzles to eject a liquid material onto front and rear surfaces of the substrate while rotating the substrate in a vertical state.
Description
The application be that August 25, application number in 2009 are 200910167447.7 the applying date, denomination of invention divides an application for the application for a patent for invention of " base plate processing system, conveying device and applying device ".
Technical field
The present invention relates to base plate processing system, conveying device and applying device.
Background technology
For example, at the glass substrate that consists of semiconductor substrate, liquid crystal panel, when consisting of the films such as various substrates formation resist films such as substrate of hard disk, when making the substrate rotation, form the applying device (for example, with reference to patent documentation 1) of coated film at this substrate.
Applying device is for example as coating element, sometimes is equipped on to comprise sending into action, coating action, sending in the base plate processing system of action of substrate.
Such base plate processing system is in the majority by the situation of each main motor unit, for example, in above-mentioned example, sometimes carries the substrate discharge unit that the substrate of sending into action is sent into the unit, sent action.In the situation that run through conveying substrate between a plurality of unit, usually in each cell location conveying device, between each conveying device, carry out substrate or accommodate the transfer of the box etc. of this substrate.
Secondly, be equipped with the rotating mechanism that makes the substrate rotation at such applying device.Rotating mechanism can be with such as with substrate adsorption etc. and the state that keeps makes this substrate rotation.
When substrate is remained in rotating mechanism, for example, utilize conveying device in the majority to the situation of rotating mechanism conveying substrate from the outside.As such conveying device, for example, known have a conveying device that is provided with the structure of substrate maintaining part at the front end of arm.As the substrate maintaining part that arranges in this conveying device, for example, the known structure that adsorption section with absorption substrate is arranged.This conveying device after substrate is delivered to applying device, and the rotating mechanism of applying device between carry out the transfer of substrate.
Secondly, in such applying device, usually with respect to the horizontal plane parallel placement of substrate, make its rotation with the state of the real estate that keeps downside.
On the other hand, for example, to as the substrate that consists of hard disk etc., applying on the two sides of substrate the substrate of aqueous body, the real estate that can not keep downside, therefore, for example, such as the record in the patent documentation 1, make the structure of its rotation when having proposed to utilize maintainance block to keep substrate.
[patent documentation 1] Japanese kokai publication hei 7-130642 communique.
Yet, sending in the base plate processing system that uses a plurality of conveying devices in the action between the unit, the configuration of this conveying device and shift on the structures such as sequential of control or the easy complicated such as the setting in the control, thereupon, there is the whole complicated of system configuration, and, process the elongated problem of beat.
Summary of the invention
In view of aforesaid situation, the first purpose of the present invention is to provide can simplied system structure, can shorten the base plate processing system of processing beat.
Secondly, in the situation of the transfer of carrying out substrate between conveying device and the applying device, for example, need the contraposition of substrate, maybe need to remove the absorption in the substrate maintaining part for example, in rotating mechanism, again adsorb substrate, again keep, therefore, need the corresponding time.Therefore, required processing time (beat) of each substrate is elongated, becomes problem boosting productivity.To this, not only in the film forming situation of substrate, and so long as the processing that substrate is rotated is then carrying out also may becoming equally problem when other are processed.
In view of aforesaid situation, the second purpose of the present invention is to provide and can shortens the processing beat, and the conveying device that can boost productivity.
Secondly, according to the method for record in the patent documentation 1 as can be known, under the state that substrate is kept flat, apply aqueous body on the two sides, therefore, between the back side of the surface of substrate and substrate, the coating environment is different, and the state of the film of formation may be different.
In view of aforesaid situation, the 3rd purpose of the present invention is to provide the applying device of the state that can improve the aqueous body that applies at substrate.
The first mode of the present invention (aspect) is a kind of base plate processing system, wherein, possesses: processing unit, and it carries out predetermined processing to substrate; Substrate is sent into the unit, and it is supplied to the sending into of described substrate that contains before the described predetermined processing and use container, and described the sending into of reclaiming sky used container; The sending of described substrate that substrate discharge unit, its recovery contain after the described predetermined processing used container, and is supplied to empty described sending and uses container; Supply unit, it has conveying mechanism, " loaded " position and the described substrate of this conveying mechanism in described processing unit sent between the unit and to be carried described sending into use container, and described the sending of conveying used container between the unloading position in described processing unit and the described substrate discharge unit.
According to this mode as can be known, " loaded " position and the substrate of the conveying mechanism that is arranged at supply unit in processing unit sent into to send between the unit and used container, and, send between unloading position in processing unit and the substrate discharge unit and use container, the conveying that therefore, a conveying mechanism is carried out between different delivery areas is moved.Thus, can simplification based on the transport process of conveying mechanism, therefore, can simplied system structure, can shorten the processing beat.In addition, according to this mode as can be known, separately use to send into container and use container with sending, therefore, also have advantages of the pollution that can prevent substrate.
Preferably in the aforesaid substrate treatment system, the unit sent into by described processing unit, described substrate and described substrate discharge unit is disposed on the rectilinear direction.
In this case, the unit sent into by processing unit, substrate and the substrate discharge unit is disposed on the rectilinear direction, therefore, the transport path between each unit can be set on this rectilinear direction.Thus, can avoid the complicated of transport path, can simplied system structure.
Preferably in the aforesaid substrate treatment system, described processing unit is disposed at described substrate and sends between unit and the described substrate discharge unit.
In this case, processing unit is disposed at substrate and sends between unit and the substrate discharge unit, and therefore, each unit is along the direction that the flows configuration of substrate.Thus, can improve the efficient of processing.
Preferably in the aforesaid substrate treatment system, described supply unit has makes described conveying mechanism along travel mechanism that described rectilinear direction moves.
In this case, supply unit has makes conveying mechanism along the travel mechanism that rectilinear direction moves, therefore, and shift action that can the simplification conveying mechanism.Thus, can simplied system structure.
In the aforesaid substrate treatment system, send into unit and described substrate discharge unit at described substrate and be respectively arranged with a plurality of container standby section.
In this case, send into unit and substrate discharge unit at substrate and be respectively arranged with a plurality of container standby section, therefore, can promptly process more substrate.
Preferably in the aforesaid substrate treatment system, described substrate is sent at least one party in unit and the described substrate discharge unit and is had the second travel mechanism that a plurality of described container standby section is moved.
In this case, substrate is sent at least one party in unit and the substrate discharge unit and is had the second travel mechanism that a plurality of container standby section is moved, and therefore, can make container standby section to the position movement of more close supply unit.Thus, action can be promptly carried, the efficient activity of processing can be realized.
Preferably in the aforesaid substrate treatment system, described the second travel mechanism is so that supply with object container near described supply unit, and the mode that makes the recycle object container leave described supply unit moves described container standby section.
In this case, the second travel mechanism is so that supply with object container near supply unit, and the mode that makes the recycle object container leave supply unit moves container standby section, therefore, can more promptly supply with the supply action of object container and the recovery action of recycle object container.Thus, can realize the efficient activity processed.
Preferably in the aforesaid substrate treatment system, be provided with buffer gear at described processing unit, this buffer gear has corresponding with at least one party in described " loaded " position and the described unloading position a plurality of second container standby section.
In this case, be provided with buffer gear at processing unit, this buffer gear has corresponding with at least one party in " loaded " position and the unloading position a plurality of second container standby section, therefore, can promptly carry out loading action and the unloading action of the substrate in the processing unit.Thus, can realize the efficient activity processed.
Preferably in the aforesaid substrate treatment system, described buffer gear has the 3rd travel mechanism that a plurality of described second container standby section is moved.
In this case, buffer gear has the 3rd travel mechanism that a plurality of second container standby section is moved, and therefore, can according to the residual quantity of the substrate in the container, second container standby section be moved.Thus, can realize the efficient activity processed.
Preferably in the aforesaid substrate treatment system, described the 3rd travel mechanism makes described second container standby section mobile in the direction identical with the throughput direction of described conveying mechanism.
In this case, the 3rd travel mechanism makes second container standby section mobile in the direction identical with the throughput direction of conveying mechanism, and therefore, second container standby section moves along throughput direction.Therefore, the distance between conveying mechanism and the second container standby section remains constant.Constant by this distance is remained, can make the conveying action between conveying mechanism and the second container standby section constant, therefore, can avoid carrying the complicated of action.
Preferably in the aforesaid substrate treatment system, described processing unit has mechanism for picking, and described mechanism for picking lifts described substrate from described sending into container, and described substrate is disposed at described " loaded " position.
In this case, processing unit has from sending into container and lifts substrate, substrate is disposed at the mechanism for picking of " loaded " position, therefore, can promptly carry out the loading action of substrate.
Preferably in the aforesaid substrate treatment system, described supply unit has the rotating mechanism towards rotation that makes described conveying mechanism.
In this case, supply unit has the rotating mechanism towards rotation that makes conveying mechanism, therefore, even in the different situation of the shift direction of throughput direction and container, also can carry swimmingly action and transfer action.
Preferably in the aforesaid substrate treatment system, be formed with the holding section described sending into container and described sending with container, described conveying mechanism has to engage with described holding section and keep described to be sent into container and the described holding member of sending with container.
In this case, be formed with the holding section sending into container and send with container, conveying mechanism has with the holding section and engages, and keeps sending into container and sends holding member with container, can keep reliably sending into container and sends and use container.
Preferably in the aforesaid substrate treatment system, also possess control device, described control device is controlled described sending into container and the described transfer position of sending with at least one party in the container according to the treatment situation of the described substrate in the described processing unit.
In this case, according to the treatment situation of the substrate in the processing unit, control is sent into container and is sent the transfer position of using at least one party in the container, therefore can more effectively carry action.
Preferably in the aforesaid substrate treatment system, described predetermined processing comprises: in the pre-treatment that coating is processed, described coating is processed of the aqueous body of described substrate coating and the reprocessing of described coating processing.
In this case, predetermined processing comprises: the reprocessing of processing in the coating of the aqueous body of coating of substrates is processed, coating is processed pre-treatment and coating, therefore, the front and back of processing about coating the processing stage, also can simplied system structure.
Preferably in the aforesaid substrate treatment system, described pre-treatment comprises to the processing of described substrate irradiation ultraviolet radiation and cleans at least a processing in the processing of described substrate.
In this case, as pre-treatment, comprise in the situation of processing of wide cut of at least a processing in the processing of the processing of substrate irradiation ultraviolet radiation and cleaning base plate, can simplify treatment system.
Preferably in the aforesaid substrate treatment system, described reprocessing comprises the processing of the Decompression that makes described substrate and heats at least a processing in the processing of described substrate.
In this case, as reprocessing, comprise in the situation of processing of wide cut of at least a processing in the processing of the processing of the Decompression that makes substrate and heated substrates, can simplify treatment system.
Preferably in the aforesaid substrate treatment system, also possess the foreign matter detecting unit, described foreign matter detecting unit detects on the described substrate after the described predetermined processing foreign.
If foreign matter is attached to the substrate after the predetermined processing, then owing to processing afterwards, substrate may be damaged at the attachment position of this foreign matter.Thereby, in this case, also possess the foreign matter detecting unit, on the substrate after the described foreign matter detecting unit detection predetermined processing foreign is arranged, therefore, the situation in the processing after being used in of substrate that such foreign matter adheres to can be prevented, the breakage of substrate can be avoided.
The conveying device of the second mode of the present invention (aspect), it is sent into zone and substrate at substrate and sends conveying substrate between zone and the processing substrate zone, wherein, possesses: arm, it is arranged at base portion; Attraction section, it is set to can be with respect to the rotation of described arm, and attracts described substrate and with its maintenance.
According to the manner as can be known, attracting the attraction section of substrate and its maintenance to be set to can be with respect to the arm rotation that arranges at base portion, therefore, can utilize maintaining part to keep making its rotation under the state of substrate.Therefore, in the situation that the processing substrate zone makes substrate rotation, do not need rotating mechanism etc. is carried out the transfer of substrate yet.Owing to there not being the transfer of substrate, can correspondingly carry out rapidly therefore, can shortening the processing beat from the operation of the processing that is transported to substrate of substrate, can boost productivity.
Preferably in above-mentioned conveying device, described substrate is the substrate with peristome, and described attraction section has the attraction hole that attracts along the surface of the described substrate of described peristome.
In this case, have in the situation of processing of substrate of peristome, attract the hole to attract along the surface of the substrate of this peristome, therefore, can with substrate from peripheral part to the part that is attracted hole to attract by this till wide zone as processing object.
Preferably in above-mentioned conveying device, described attraction hole is configured to attract the non-processing section of described substrate.
In this case, attract the hole to be configured to attract the non-processing section of substrate, therefore, can in situation the about processing section of substrate not being exerted an influence, attract substrate.
Preferably in above-mentioned conveying device, described attraction section has the protuberance that embeds described peristome.
In this case, attraction section has the protuberance that embeds peristome, therefore, and by at least a portion of protuberance occlusion of openings section.Thus, when attracting substrate, attract to comprise in the situation in zone of peristome, also can in the situation that do not reduce attraction and attract, can keep more reliably substrate.
Preferably in above-mentioned conveying device, described protuberance is set to can be with respect to other part dismounting of described attraction section.
In this case, protuberance is set to can be with respect to other part dismounting of attraction section, for example, and can be in the situation that do not need protuberance, with respect to other part dismounting of attraction section.In addition, for example, can also separately use the different a plurality of protuberances of size, therefore, in the situation of the different substrate of the size of processing peristome, also can tackle.Thus, mode that can diversified attracting holding.
Preferably in above-mentioned conveying device, the overhang of described protuberance is below the thickness of described substrate.
In this case, the overhang of protuberance is below the thickness of substrate, therefore, can prevent that this protuberance is to the side-prominent situation of the opposing face of the adsorption plane of substrate.Thus, can easily configure miscellaneous part at the opposition side of the adsorption plane of substrate.
In above-mentioned conveying device, it is characterized in that being equipped with the drive division that makes the rotation of described attraction section at described arm.
In this case, be equipped with the drive division that makes attraction section rotation at arm, therefore, further miniaturization device structure.
Preferably in above-mentioned conveying device, also possess external drive section, described external drive section and described attraction section between make described substrate rotation with the state that clips described substrate.
In this case, externally make the substrate rotation with the state that clips substrate between drive division and the attraction section, therefore, can not make its rotation when driving mechanism also keeps substrate in the situation that the arm side does not arrange.Therefore, can miniaturization, simplify the structure of arm side, can carry the required burden of action to suppress to be Min..
Preferably in above-mentioned conveying device, described external drive section is arranged at described processing substrate zone.
In this case, at the processing substrate region division external drive section is arranged, therefore, the processing action of substrate and spinning movement interlock are carried out.Thus, can realize the efficient activity processed.
Preferably in above-mentioned conveying device, described external drive section has the press section of pressing described substrate, and described press section is corresponding with described attraction section and form.
In this case, external drive section has the press section of pressing substrate, and the press section is corresponding with attraction section and form, and therefore, makes based on the attraction of attraction section with based on the pressing force of press section to apply to substrate accordingly.Thus, can keep reliably substrate.
Preferably in above-mentioned conveying device, described arm has: axial region, and it can rotate with respect to described base portion, and can be flexible in the rotating shaft direction of this rotation; Pars contractilis, it is arranged at described axial region, and can be flexible with the direction of described rotating shaft direction quadrature, and described attraction section is arranged at the front end of described pars contractilis.
In this case, arm is rotated with respect to base portion, can make this arm flexible in the rotating shaft direction of this rotation, and then can make arm flexible with rotating shaft direction orthogonal direction.Therefore, can make in the attraction section of the front end setting of pars contractilis and run through wide region and move.
Preferably in above-mentioned conveying device, described external drive section has the press section of pressing described substrate, and described press section is corresponding with described attraction section and form.
In this case, external drive section has the press section of pressing substrate, and the press section is corresponding with attraction section and form, and therefore, can utilize pressing and keep reliably substrate based on the attraction of attraction section based on the press section.
Preferably in above-mentioned conveying device, described external drive section makes described press section press described substrate when described substrate is disposed at the processing substrate position in described processing substrate zone.
In this case, external drive section makes the press section press substrate in the processing substrate position that substrate is disposed at the processing substrate zone, therefore, begins to keep reliably this substrate in the time of can be from the configuration of substrate.
Preferably in above-mentioned conveying device, also possess control part, described control part switches the attraction state of described attraction section when the rotation of the described substrate that is driven by described external drive section.
In this case, also possess control part, described control part switches the attraction state of attraction section when the rotation of the substrate that is driven by external drive section, therefore, and the confining force of the substrate that can be pressed by the press section in the side adjustment of attraction section.
Preferably in above-mentioned conveying device, described control part is removed the attraction based on described attraction section before the rotation of the described substrate that is driven by described external drive section.
In this case, control part is removed the attraction based on attraction section before the rotation of the substrate that is undertaken by external drive section, therefore, can effectively carry out the spinning movement of substrate.
Preferably in above-mentioned conveying device, described control part is removed the attraction based on described attraction section in the rotation of the described substrate that is driven by described external drive section.
In this case, control part is removed the attraction based on attraction section in the rotation of the substrate that is driven by external drive section, therefore, can effectively carry out the spinning movement of substrate.
Preferably in above-mentioned conveying device, described control part is removed described attraction according to the rotation status of described substrate.
In this case, control part is removed according to the rotation status of substrate and is attracted, and therefore, can carry out the flexibly correspondence according to the rotation status of substrate.
Preferably in above-mentioned conveying device, described control part is removed the attraction based on described attraction section after the predetermined processing to described substrate.
In this case, control part is removed the attraction based on attraction section after the predetermined processing to substrate, therefore, can keep reliably substrate during predetermined processing.
Preferably in above-mentioned conveying device, described external drive section also makes described substrate rotation after described predetermined processing.
In this case, external drive section also makes substrate rotation after predetermined processing, therefore, can prevent the situation that the rotation status of the substrate after the predetermined processing sharply stops.
Third Way of the present invention (aspect) is a kind of applying device, wherein, possesses: rotating mechanism, its state of erectting with substrate make described substrate rotation; Applying mechanism, it has in the rotation of described substrate the nozzle that sprays respectively aqueous body to surface and the back side of described substrate.
According to this mode as can be known, can utilize nozzle to spray aqueous body from the two sides with the substrate of the state rotation of erectting, therefore, the coating environment that can make aqueous body at surface and the back side of substrate is more approaching.According to this mode as can be known, the state of the aqueous body of coating is approached, therefore, can prevent the different situation of state of the film of the aqueous body that forms at substrate.Thus, can improve the state of the aqueous body that applies at substrate.
Preferably in above-mentioned applying device, described rotating mechanism is to make described substrate rotation more than 70 ° and under the state of the angle below 90 ° described substrate is with respect to the horizontal plane erect.
In this case, rotating mechanism is to make this substrate rotation more than 70 ° and under the state of the angle below 90 ° substrate is with respect to the horizontal plane erect, therefore, can prevent the remarkable different situation of state at the back side of the state on surface of substrate and substrate, can apply equably aqueous body on the two sides of substrate.
Preferably in above-mentioned applying device, described nozzle forms from the peripheral part side spray of the described substrate of central portion side direction of described substrate and goes out described aqueous body.
In this case, nozzle forms from the peripheral part side spray of the central portion side direction substrate of substrate and goes out aqueous body, therefore, and the emission direction of nozzle and the direction alignment direction that acts on the centrifugal force on the substrate.Thus, can more effectively apply aqueous body.
Preferably in above-mentioned applying device, described nozzle forms from described central portion side direction described peripheral part side bending.
In this case, nozzle forms from the side bending of central portion side direction peripheral part, therefore, can in the situation of the governor motion that the emission direction of regulating aqueous body is not set separately etc., utilize simple structure to regulate the emission direction of aqueous body.
Preferably in above-mentioned applying device, the ejection face of the front end of described nozzle tilts with respect to the emission direction of aqueous body and forms.
In this case, the ejection face of front end tilts with respect to the emission direction of aqueous body and forms in the nozzle, therefore, can reduce the surface tension of the aqueous body in the spray nozzle front end.
Thus, when the coating that stops aqueous body, can well remove this aqueous body, can make aqueous body be difficult for remaining in spray nozzle front end.
Preferably in above-mentioned applying device, described nozzle is arranged at downside with respect to the rotating shaft of described rotating mechanism.
In this case, nozzle is arranged at downside with respect to the rotating shaft of rotating mechanism, therefore, can make the emission direction of aqueous body consistent with gravity direction.Thus, can make the easily diffusion on substrate of aqueous body.
Preferably in above-mentioned applying device, described nozzle is disposed at same position in face side and the rear side of described substrate.
In this case, nozzle is disposed at same position in face side and the rear side of substrate, therefore, can make the coating environment approaching with the back side of substrate on the surface of substrate.Thus, aqueous body can be coated in equably the two sides of substrate.
Preferably in above-mentioned applying device, described applying mechanism has the travel mechanism that described nozzle is moved.
In this case, applying mechanism has the travel mechanism that nozzle is moved, and therefore, can make according to the treatment situation of device the position movement of nozzle.Thus, can carry out the more processing of wide cut.
Preferably in above-mentioned applying device, also possesses nozzle management organization, the state of the described nozzle of described nozzle management organization management.
In this case, also possess nozzle management organization, therefore the state of described nozzle management organization management nozzle, can remain the state of nozzle constant.Thus, can keep the discharge performance of nozzle.
Preferably in above-mentioned applying device, nozzle management organization has cleaning part, and described cleaning part impregnated in the cleaning fluid by the front end with nozzle and cleans.
In this case, nozzle management organization has cleaning part, and described cleaning part impregnated in the cleaning fluid by the front end with nozzle and cleans, and therefore, can clean the aqueous body that the front end at nozzle adheres to and removes.If the front end at nozzle adheres to aqueous body, then spray nozzle clogging may reduce discharge performance.In the present invention, by the front end of washer jet, can prevent the reduction of such discharge performance.
Preferably in above-mentioned applying device, described nozzle management organization has: the attraction section that attracts the front end of described nozzle.
In this case, nozzle management organization has the attraction section of the front end that attracts nozzle, therefore, and the cleaning fluid after can removing the aqueous body that the front end at nozzle adheres to or clean this aqueous body from spray nozzle front end etc.Thus, spray nozzle front end can be remained the more state of cleaning.
Preferably in above-mentioned applying device, described nozzle management organization has the liquid receiving portion of accepting from the described aqueous body of described nozzle preparation property ejection.
In this case, nozzle management organization has the liquid receiving portion of accepting from the aqueous body of nozzle preparation property ejection, therefore, forms the state that easily carries out the spray action of the aqueous body of preparation property.Thus, can prevent the situation of the discharge performance reduction of nozzle.
Preferably in above-mentioned applying device, also possess a glass section, described cup section configures in the mode of the side that surrounds described substrate.
In this case, also possess a glass section, described cup section configures in the mode of the side that surrounds substrate, therefore, can tackle because the effect of the centrifugal force that the rotation of substrate causes and the aqueous body that disperses from substrate.Thus, the environment of device inside can be remained the state of cleaning.
Preferably in above-mentioned applying device, described cup section has the resettlement section of accommodating described aqueous body.
In this case, cup section has the resettlement section of accommodating aqueous body, therefore, the aqueous body that disperses can be concentrated on this resettlement section.Thus, can effectively manage the aqueous body that disperses.
Preferably in above-mentioned applying device, be set to can be with respect to other part dismounting of described cup section with the opposed part of the sidepiece of described substrate in the described cup section.
In this case, be set to can be with respect to other part dismounting of cup section with the opposed part of the sidepiece of substrate in the cup section, and therefore, cup section forms the state of easy maintenance.Thus, can easily carry out cleaning of glass section.
Preferably in above-mentioned applying device, described cup section has the governor motion of the opening size of regulating described opposed part.
In this case, cup section has the governor motion of the opening size of regulating opposed part, therefore, also can tackle neatly in the different situation of the environment of the coatings such as degree of the dispersing processing of the thickness of substrate or aqueous body.
Preferably in above-mentioned applying device, described cup section has inboard cup and outside cup, is provided with at described inboard glass to make this inboard cup at the second rotating mechanism that rotates along the direction of the periphery of described substrate.
In this case, cup section has inboard cup and outside cup, is provided with at inboard cup to make this inboard cup at the second rotating mechanism that rotates along the direction of the periphery of substrate, therefore, can inboard cup be rotated not making.
Preferably in above-mentioned applying device, described resettlement section has the output mechanism of at least one party in the gas of discharging in described aqueous body and the described resettlement section.
In this case, the resettlement section has the output mechanism of at least one party in the gas of discharging in aqueous body and the resettlement section, therefore, can utilize the aqueous body in this output mechanism discharge resettlement section, and, can in the resettlement section, form flowing of gas.
Preferably in above-mentioned applying device, described cup section forms circle, and described output mechanism is along the tangential direction setting of the periphery of described cup section.
In this case, cup section forms circle, and therefore output mechanism, can discharge aqueous body along the direction of rotation of substrate along the tangential direction setting of the periphery of cup section.
Preferably in above-mentioned applying device, described output mechanism has gas-liquid separation mechanism at discharge path.
Output mechanism has gas-liquid separation mechanism at discharge path, therefore, can easily process aqueous body.
Preferably in above-mentioned applying device, also possess the cleaning fluid of the described cup section remover liquid nozzle to described substrate ejection.
In this case, also possess the cleaning fluid of the cup section remover liquid nozzle to the substrate ejection, therefore, the cleaning fluid that the rotation by substrate is ejected on the substrate disperses in cup.Thus, can effective cleaning cup section.
Preferably in above-mentioned applying device, as described remover liquid nozzle, use described nozzle.
In this case, as remover liquid nozzle, use said nozzle, therefore, can realize the efficient activity of safeguarding.
Preferably in above-mentioned applying device, also possesses the adjustment part of the coating state of the peripheral part of adjusting described substrate.
In this case, also possess the adjustment part of the coating state of the peripheral part of adjusting substrate, therefore, can improve the coating property of aqueous body.
Preferably in above-mentioned applying device, described adjustment part has by the peripheral part with described substrate and impregnated in the section of removing of removing described aqueous body in the lysate.
In this case, the adjustment part has by the peripheral part with substrate and impregnated in the section of removing of removing aqueous body in the lysate, therefore, can effectively remove the aqueous body in the peripheral part coating.
Preferably in above-mentioned applying device, the described section of removing has the lysate nozzle of described lysate to the circumference ejection of described substrate.
In this case, the section of removing has the lysate nozzle of lysate to the circumference ejection of substrate, therefore, can in the situation of the position movement that does not make substrate, utilize this lysate nozzle to remove the circumference of substrate.Thus, can realize the efficient activity of the processing of substrate.
Preferably in above-mentioned applying device, described lysate nozzle can spray the cleaning fluid of described cup section.
In this case, the lysate nozzle can spray the cleaning fluid of glass section, therefore, can make the lysate nozzle carry out respectively substrate peripheral part coating state adjustment and the cup cleaning.Thus, can not carrying out each action in the situation of the wiper mechanism of configuration cup separately, can avoid the complicated of apparatus structure.
Preferably in above-mentioned applying device, the described section of removing has control part, described control part does not spray described lysate with the position of described substrate contacts from described lysate nozzle at described lysate, and, under the state that has sprayed described lysate, make this lysate nozzle to the ejection position movement to described substrate ejection.
In this case, the section of removing has control part, described control part does not make lysate nozzle ejection lysate with the position of substrate contacts at lysate, and, under the state that has sprayed lysate, make this lysate nozzle to the ejection position movement to the substrate ejection, therefore, can improve the adjustment precision of the coating state of the peripheral part on the substrate.
Preferably in above-mentioned applying device, described adjustment part has the second attraction section of the peripheral part that attracts described substrate.
In this case, the adjustment part has the second attraction section of the peripheral part that attracts substrate, therefore can promptly remove aqueous body or lysate that the peripheral part at substrate adheres to.
The invention effect
According to the first mode of the present invention as can be known, can simplify the structure of base plate processing system, can shortening processing beat.
According to the second mode of the present invention as can be known, can shorten the processing beat of conveying device, can boost productivity.
According to Third Way of the present invention as can be known, can improve the state of the aqueous body that applies at substrate.
Description of drawings
Fig. 1 is the vertical view of structure of the base plate processing system of expression embodiments of the present invention.
Fig. 2 is the front view of structure of the base plate processing system of expression present embodiment.
Fig. 3 is the end view of structure of the base plate processing system of expression present embodiment.
Fig. 4 is the figure of the structure of expression base board delivery device.
Fig. 5 A and 5B are the figure that expression attracts the structure of parts.
Fig. 6 A and 6B are the figure of the structure of the inaccessible parts of expression.
Fig. 7 is the figure of the structure of expression maintaining part.
Fig. 8 A and 8B are the figure of the structure of expression maintaining part.
Fig. 9 is the figure of the structure of expression substrate loader structure and substrate feel trim actuator.
Figure 10 is the figure of the structure of expression substrate loader structure and substrate feel trim actuator.
Figure 11 is the figure of the structure of expression substrate loader structure and substrate feel trim actuator.
Figure 12 is the figure of the action of expression base board delivery device.
Figure 13 is the figure that represents equally the action of base board delivery device.
Figure 14 is the figure of other structures of expression base board delivery device of the present invention.
Figure 15 is the figure of other structures of expression base board delivery device of the present invention.
Figure 16 is the applying mechanism of expression in the base board delivery device of the present invention and the figure of the structure of substrate processing unit.
Figure 17 is the front view of the structure of expression substrate processing unit.
Figure 18 is the vertical view of the structure of expression substrate processing unit.
Figure 19 is the figure of structure of the front end of expression nozzle.
Figure 20 is the figure of the structure of the inboard cup of expression.
Figure 21 is the figure of the structure of expression nozzle management organization.
Figure 22 is that the expression circumference is removed the figure of the structure of mechanism.
Figure 23 is that the expression circumference is removed the figure of other structures of mechanism.
Figure 24 A and Figure 24 B are the figure of other structures of expression applying device of the present invention.
Among the figure: the SYS-base plate processing system; The S-substrate; The Sa-peristome; The S1-processing section; The non-processing section of S2-; The SPU-substrate processing unit; The C-box; The CT-applying device; The EBR-circumference is removed device; The BF-buffer gear; The SC-base board delivery device; SC1-sends into side conveying device SC; SC2-sends side conveying device SC; The LP-" loaded " position; The UP-unloading position; 30,40-base portion; 31,41-arm; 32,42-maintaining part; 33,43-rotating mechanism; 34,44-attracts mechanism; 35,45-travel mechanism; 36,46-attracts parts; 36a, 46a-adsorption section; 36b, 46b-department of assembly; 36c, 46c-slot part; 37, the inaccessible parts of 47-; The 81-maintaining part; The 81a-abutting part; The 81b-axial region; The 81c-bearing surface; 82-rotates maintaining part; The 82a-motor apparatus; The 82b-rotation holding member; The 82c-abutting part; The 82d-axial region; The 82e-bearing surface.
Embodiment
Based on the description of drawings embodiments of the present invention.
Fig. 1 is the vertical view of schematic configuration of the base plate processing system SYS of expression present embodiment.Fig. 2 is the front view of the schematic configuration of expression base plate processing system SYS.Fig. 3 is the end view of the schematic configuration of expression base plate processing system SYS.
In the present embodiment, simple for what represent when the structure of base plate processing system SYS is described, the use XYZ coordinate is the direction in the key diagram.In this XYZ coordinate system, left and right directions among the figure is labeled as directions X, will be in the situation that the bearing mark of overlooking with the directions X quadrature be Y-direction.The bearing mark vertical with the plane that comprises directions X axle and Y-direction axle is the Z direction.Be described as follows about directions X, Y-direction and Z direction, the direction of the arrow among the figure is respectively+direction, and the direction opposite with the direction of arrow is-direction.
Such as Fig. 1～shown in Figure 3, base plate processing system SYS is such as manufacturing lines such as the factories of packing into and use, and in the regional film forming system of the regulation of substrate S.Base plate processing system SYS possesses: objective table cell S TU; Substrate is sent into unit LDU; Substrate processing unit SPU; Substrate discharge unit ULU; Supply unit CRU; Control unit CNU.
In base plate processing system SYS, objective table cell S TU is supported on floor such as via pin components etc., and substrate processing unit SPU, substrate are sent into the upper surface that unit LDU, substrate discharge unit ULU and supply unit CRU are disposed at objective table cell S TU.Substrate processing unit SPU, substrate send into unit LDU, substrate discharge unit ULU and supply unit CRU forms the state that each inside, unit is covered by cap assembly.In base plate processing system SYS, unit LDU sent into by substrate processing unit SPU, substrate and substrate discharge unit ULU is arranged in along on the straight line of X-direction.Substrate processing unit SPU is arranged at substrate and sends between unit LDU and the substrate discharge unit ULU.Central portion among the objective table cell S TU in the situation of overlooking of the part of placement substrate processing unit SPU forms with respect to the state of other parts to-Z direction depression.
Processing object as the base plate processing system SYS of present embodiment is substrate S, for example, can enumerate the semiconductor substrate such as silicon, consist of liquid crystal panel glass substrate, consist of the substrate of hard disk etc.In the present embodiment, the substrate of hard disk will for example be consisted of, namely be coated with adamantine substrate on the surface of the discoid base material that comprises glass etc., namely in the situation that the central portion of overlooking is provided with the substrate S of peristome (with reference to Figure 12, Figure 13 etc.) is that example describes.
Sending into and sending of substrate S among the base plate processing system SYS of present embodiment is to use can to accommodate the box C of many this substrate S and carry out.Box C forms bucket-shaped container, can so that the opposed mode of the real estate of a plurality of substrate S with this substrate S with one row accommodate.Thereby box C forms in Z-direction and erects the structure of accommodating this substrate S under the state of substrate S.Box C has peristome (with reference to Fig. 9 and Figure 10) in the bottom.Each substrate S accommodates with the state that exposes to the bottom of box C via this peristome.It is rectangular-shaped that box C in the situation that overlook forms, and for example, as shown in Figure 2, has holding section Cx in each limit part of+Z side.In the present embodiment, as box C, use sending into of using when sending into substrate S with box C1, when sending substrate S, use send these two kinds of boxes of usefulness box C2.In sending into box C1, only accommodate the substrate S before processing, the substrate S after in sending with box C2, only accommodating processing.Send into to send between the unit LDU at substrate processing unit SPU and substrate with box C1 and use.Send with box C2 and between substrate processing unit SPU and substrate discharge unit ULU, use.Thereby, can not mix to use to send into box C1 and use box C2 with sending.Send into box C1 and send with box C2 and for example form identical shaped, same size.
(substrate is sent into the unit)
Substrate is sent into unit LDU and is disposed among the base plate processing system SYS-the X side.Substrate is sent into unit LDU and is supplied to the sending into of substrate S that contains before processing to use box C1, and reclaims the empty unit of using box C1 of sending into.Substrate is sent among the unit LDU Y direction and is long limit, and a plurality of sending into can be along the Y direction standby with box C1.
Substrate is sent into unit LDU and is possessed: box gateway 10 and box travel mechanism (the second travel mechanism) 11.Box gateway 10 be covered substrate send into unit LDU cap assembly-peristome that the Y side arranges.Box gateway 10 is to contain the entrance (supply port) of using box C1 of sending into of processing front substrate S, and is the empty outlet (reclaiming mouth) of using box C1 of sending into.
Box travel mechanism 11 has such as driving mechanisms such as belt transport mechanisms.In the present embodiment, as this driving mechanism, has conveyer belt (supplying with band 11a and recovery band 11b).Conveyer belt send into from substrate unit LDU+the Y side end arranges two side by side configurations on X-direction to extending along Y direction the-Y side end.
Supply with being to be disposed in two conveyer belts-conveyer belt of X side with 11a.Supply with 11a+the Z side becomes conveyor surface.Supply with forming this conveyor surface with 11a to+structure that Y-direction is rotated movably.Supplying with entering substrate via box gateway 10 and send into sending in the unit LDU and use box C1 with the conveyor surface mounting of 11a being a plurality of.This is sent into box C1 and utilizes the rotation of supplying with 11a to come to supply unit CRU side shifting.
Reclaim with being to be disposed in two conveyer belts+conveyer belt of X side with 11b.Reclaim with 11b+the Z side becomes conveyor surface.Reclaim with forming conveyor surface with 11b to-structure that Y-direction is rotated movably.Use box C1 the sending into of a plurality of skies of conveyor surface mounting of reclaiming with 11b.This is sent into box C1 by reclaiming with the rotation with 11b to come to box gateway 10 side shiftings.
In the present embodiment, for example, send into box C1 and can supply with 11a and reclaim with position of readiness (the container standby section) standby that five places are set respectively on 11b.Send among the unit LDU at substrate, supply with band 11a and recovery band 11b rotation by making, can move the position of readiness of sending into box C1, move by making this position of readiness, can shorten and send into the time of delivery of using box C1.
(substrate processing unit)
Substrate processing unit SPU be disposed at substrate among the base plate processing system SYS send into unit LDU+the X side is the substantial middle of X-direction.Substrate processing unit SPU carries out for the film forming processing of aqueous body such as substrate S coating resist or removes the processing etc. of the film that the peripheral part at substrate S forms to the unit of the various processing of substrate S.Substrate processing unit SPU possesses: applying device (processing substrate zone) CT, circumference are removed device EBR, buffer gear (substrate is sent into the zone, substrate is sent the zone) BF and base board delivery device (conveying device) SC.
Applying device CT is disposed at the substantial middle in the situation of overlooking among the substrate processing unit SPU, is fixed in the upper surface of part of the depression of objective table cell S TU.Applying device CT is the device that forms the film of aqueous body in substrate S coating.In the present embodiment, the applying device CT film that is formed for impressing and processes at substrate S.Applying device CT has: will be as the aqueous body of the constituent material of this film not shown nozzle to the upper ejection of substrate S.Can from-X side and+these both sides of X side enter applying device CT.Thereby, can from-X side and+sending into and sending of substrate S carried out in these both sides of X side.Applying device CT applies processing in the coating position (part that dotted line represents in figure) of the substantial middle section setting of X-direction.
Circumference remove device EBR be arranged at applying device CT+the X side and along substrate processing unit SPU-position on the end limit of Y side.It is the device of removing the film that forms at the circumference of substrate S that circumference is removed device EBR.The processing of removing that utilizes circumference to remove device EBR is preferably carried out during the film that substrate S forms is undried.Therefore, circumference is removed device EBR preferred disposition in the position of substrate S being carried with the short time from applying device CT.Circumference is removed device EBR and is had: for example by making substrate S rotation time, the circumference of this substrate S be impregnated in lysate, the Film Fractionation that will form at substrate S circumference and the not shown dipping portion of removing.
Buffer gear BF be arranged at along substrate processing unit SPU+position of Y side end edge namely clips the position, two places of applying device CT in X-direction.Be disposed among the buffer gear BF at two places applying device CT-buffer gear of X side is for sending into side buffer gear (substrate is sent into the zone) BF1, be disposed at applying device CT+buffer gear of X side is for sending side buffer gear (substrate is sent the zone) BF2.
Send into side buffer gear BF1 and be and make the part with box C1 standby sent into of supplying with in the substrate processing unit SPU.Be provided with box travel mechanism (the 3rd travel mechanism) 20 sending into side buffer gear BF1.Box travel mechanism 20 has such as driving mechanisms such as belt transport mechanisms.In the present embodiment, be provided with two conveyer belt 20a and 20b as driving mechanism.
Conveyer belt 20a is arranged at along the zone of sending into the X-direction of side buffer gear BF1.Conveyer belt 20a+face of Z side becomes conveyor surface, supplies with sending into box C1 of coming and load on this conveyor surface.Conveyer belt 20a forms the structure that conveyor surface rotates movably along X-direction.By the rotation of conveyer belt 20a, sending into can be mobile in sending into side buffer gear BF1 along X-direction with box C1.Conveyer belt 20b is arranged at the central portion of sending into the X-direction in the side buffer gear BF1.Conveyer belt 20b+face of Z side becomes conveyor surface, sends in this conveyor surface mounting and use box C1.Conveyer belt 20b forms the structure that conveyor surface rotates movably along Y direction.By the rotation of conveyer belt 20b, send into box C1 and move along Y direction.Like this, by box travel mechanism 20, the position of readiness of respectively sending into box C1 moves.
Send into side buffer gear BF1 make a plurality of for example three send into box C1 and on conveyer belt 20a and in X-direction, arrange standby (second container standby section).Among the figure-the position of readiness P1 of X side for example supplies with the position of readiness with box C1 sent into of coming to substrate processing unit SPU.The position of readiness P2 of the central authorities of X-direction is the position of readiness of sending into usefulness box C1 that moves from position of readiness P1 among the figure.Among the figure+the position of readiness P3 of X side sends into position of readiness with box C1 from what position of readiness P2 moved.
In position of readiness P2, dispose said conveyer belt 20b+the Y side end.Therefore, position of readiness P2 configuration send into box C1 can utilize conveyer belt 20b with respect to position of readiness P2 to-Y side shifting, move the position of readiness P4 standby of destination at this.Position of readiness P4+the Z direction is provided with the " loaded " position LP of substrate S.Substrate S carries to applying device CT via this " loaded " position LP.
Sending side buffer gear BF2 is to make in substrate processing unit SPU to supply with the part of using box C2 standby of sending of coming.Be provided with box travel mechanism (the 3rd travel mechanism) 22 sending side buffer gear BF2.Box travel mechanism 22 has such as driving mechanisms such as belt transport mechanisms.In the present embodiment, and send into side buffer gear BF1 in the same manner, be provided with two conveyer belt 22a and 22b as driving mechanism.
Conveyer belt 22a is arranged at the zone along X-direction of sending side buffer gear BF2.Conveyer belt 22a+face of Z side becomes conveyor surface, supplies with sending with box C2 of coming and load on this conveyor surface.Conveyer belt 22a forms the structure that conveyor surface rotates movably to X-direction.By the rotation of conveyer belt 22a, sending can be mobile in sending side buffer gear BF2 along X-direction with box C2.Conveyer belt 22b is arranged at the central portion of sending the X-direction in the side buffer gear BF2.Conveyer belt 22b and conveyer belt 20b in the same manner, conveyer belt 22b+face of Z side becomes conveyor surface, sends in this conveyor surface mounting and use box C2.Conveyer belt 22b forms the structure that conveyor surface rotates movably along Y direction.By the rotation of conveyer belt 22b, send with box C2 and move along Y direction.Like this, utilize box travel mechanism 22 that the position of readiness of respectively sending with box C2 is moved.
Sending side buffer gear BF2 arranges and standby (second container standby section) a plurality of for example usefulness box C2 that send of three on conveyer belt 22a and in X-direction.Among the figure-the position of readiness P5 of X side for example supplies with the position of readiness with box C2 sent of coming to substrate processing unit SPU.The position of readiness P6 of the central authorities of X-direction is the position of readiness of sending usefulness box C2 that moves from position of readiness P5 among the figure.Among the figure+the position of readiness P7 of X side sends position of readiness with box C2 from what position of readiness P6 moved.
In position of readiness P6, dispose said conveyer belt 22b+the Y side end.Therefore, position of readiness P6 configuration send with box C2 can utilize conveyer belt 22b with respect to position of readiness P6 to-Y side shifting, move the position of readiness P6 standby of destination at this.Position of readiness P8+the Z direction is provided with the unloading position UP of substrate S.Substrate S comes to sending with the conveying of box C2 side from applying device CT via this unloading position UP.
Base board delivery device SC is arranged at the position of the Y direction central authorities of substrate processing unit SPU, that is, on X-direction across the position, two places of applying device CT.Be disposed among the base board delivery device SC at two places applying device CT-device of X side is for sending into side conveying device SC1, be disposed at applying device CT+device of X side is for sending side conveying device SC2.Send into side conveying device SC1, send side conveying device SC2 and applying device CT is disposed at along on the straight line of X-direction.
Send into the " loaded " position LP that side conveying device SC1 enters respectively applying device CT and sends into side buffer gear BF1, conveying substrate S between these.Fig. 4 is the schematic diagram that the structure of side conveying device is sent in expression.Such as Fig. 1～shown in Figure 4, send into side conveying device SC1 and have: base portion 30, arm 31 and maintaining part (attraction section) 32.
Rotating mechanism 33 is disposed in the framework 31a+the Z side.Rotating mechanism 33 has motor apparatus 33a and rotating shaft member 33b.Motor apparatus 33a and rotating shaft member 33b can be mobile integratedly along left and right directions among the figure.Motor apparatus 33a is drive unit from revolving force to rotating shaft member 33b that give.Rotating shaft member 33b is with respect to being circular bar-like member under the cross section of XY plane parallel ground configuration.
The actuating force that rotating shaft member 33b utilizes motor apparatus 33a is take the center of this circle as the rotating shaft rotation.Rotating shaft member 33b is configured to the outside of an end from peristome 31c to framework 31a outstanding (protuberance 33c).End face in the protuberance 33c of rotating shaft member 33b side is provided with for the recess 33d that maintaining part 32 is installed.The cross section of recess 33d forms circle.Protuberance 33c has the fixed mechanism that this maintaining part 32 is fixed with the state that maintaining part 32 is installed on recess 33d.By utilizing fixedly maintaining part 32 of this fixed mechanism, rotating shaft member 33b and maintaining part 32 are rotated integratedly.
Rotating shaft member 33b has through hole 33e, and through hole 33e connects along the rotating shaft direction between the end face 33g of opposite side of the bottom surface 33f of recess 33d of rotating shaft member 33b and this rotating shaft member 33b and forms.The bottom surface 33f side of the recess 33d of rotating shaft member 33b and end face 33g side form the state that is communicated with via through hole 33e.
Attract mechanism 34 to be arranged at the end face 33g side of rotating shaft member 33b.Attract mechanism 34 to have the suction devices such as suction pump 34a.Suction pump 34a is connected with through hole 33e in the end face 33g of rotating shaft member 33b.Suction pump 34a attracts through hole 33e by the end face 33g from rotating shaft member 33b, can attract the maintaining part 32 that configures at the bottom surface 33f of the recess 33d that is communicated with this through hole 33e.
Movable member 35c has screw part 35d and connecting portion 35e.Screw part 35d and rotating shaft member 35b form, and have not shown ridge on the surface.Connecting portion 35e is fixed in for example motor apparatus 33a of rotating mechanism 33.Lower surface at link 35e is formed with ridge, this ridge and the ridge engagement that forms at screw part 35d.
If utilize the driving of motor apparatus 35a, make rotating shaft member 35b rotation, then rotating shaft member 35b and screw part 35d rotate integratedly.By the rotation of screw part 35d, move link 35e and mobile integratedly at the fixing rotating mechanism 33 of this connecting portion 35e left and right directions in the figure with the link 35e of the ridge of this screw part 35d engagement left and right directions in the figure.Move by this, the maintaining part 32 of right-hand member setting in the figure of rotating mechanism 33 left and right directions in the figure moves.
Maintaining part 32 can be fixed in the recess 33d of rotating shaft member 33b removably.Maintaining part 32 such as confining forces such as using absorption affinity keeps substrate S.Maintaining part 32 has the parts 36 of attraction and inaccessible parts 37.Attracting parts 36 and inaccessible parts 37 to be set to can dismounting.
Fig. 5 is the figure that expression attracts the structure of parts 36.Fig. 5 A is the front view that attracts parts 36, and Fig. 5 B is the end view that attracts parts 36.
Attract parts 36 to have adsorption section 36a and the 36b of department of assembly.Adsorption section 36a is arranged at face side among the figure that attracts parts 36, forms discoid.Adsorption section 36a is the part of absorption substrate S.The end face of the face side of adsorption section 36a becomes the adsorption plane 36e of absorption substrate S.36e is formed with slot part 36c at this adsorption plane.Slot part 36c in the situation that main for example looking form+shape.Slot part 36c forms along with the central portion under looking near the master of adsorption section 36a, and 36e deepens gradually with respect to adsorption plane.
The 36b of department of assembly is arranged at the central portion under the backsight that rear side among the figure that attracts parts 36 namely attracts parts 36, forms bar-shaped.The 36b of department of assembly is the part of inserting recess 33d.The end face of the rear side of the 36b of department of assembly becomes when assembling and the bearing surface 36f of the bottom butt of recess 33d.The diameter that the 36b of department of assembly forms self is below the diameter of recess 33d.
Attracting parts 36 to be formed with through hole 36d.Through hole 36d is arranged at adsorption section 36a under main the looking and the central portion of the 36b of department of assembly, and forms in the mode that connects from face side to rear side for this adsorption section 36a and the 36b of department of assembly.Through hole 36d is connected with slot part 36c in adsorption section 36a side.The adsorption plane 36e side and the bearing surface 36f side that comprise slot part 36c form the state that is communicated with via through hole 36d.
In the situation that the 36b of department of assembly is installed on recess 33d, through hole 36d forms the state that is communicated with the through hole 33e of rotating shaft member 33b.Therefore, attract the adsorption plane 36e side of parts 36 to form the state that is connected with the suction pump 34a that attracts mechanism 34 via through hole 33e and through hole 36d.
Fig. 6 is the figure of the structure of the inaccessible parts 37 of expression.Fig. 6 A is the front view of inaccessible parts 37, and Fig. 6 B is the end view of inaccessible parts 37.
Fig. 7 is that expression is assemblied in inaccessible parts 37 front view that attracts parts 36.Fig. 8 A is that expression is along the figure of the shape in the A-A cross section among Fig. 7.Fig. 8 B is that expression is along the figure of the shape in the B-B cross section among Fig. 7.
Sending among the side conveying device SC1 of so consisting of, arm 31 rotates take Z axis as rotating shaft, or moves along the XY in-plane, forms thus to make maintaining part 32 enter the two structure of applying device CT and " loaded " position LP.Each rotating shaft member that is disposed at arm 31 grades forms and utilizes the structure of shaft coupling connection also harmless a plurality of spindle units.
Return Fig. 1～Fig. 3, send that side conveying device SC2 enters respectively applying device CT, unloading position UP and the circumference of sending side buffer gear BF2 removed device EBR, conveying substrate S between these.Sending side conveying device SC2 has: base portion 40 (fixed station 40a, rotating platform 40b), arm 41 and maintaining part (attraction section) 42.The structure of sending side conveying device SC2 forms the structure identical with sending into side conveying device SC1, therefore, omits the explanation of each structure important document.In Fig. 4～Fig. 8, the structure important document of sending side conveying device SC2 corresponding with each structure important document of sending into side conveying device SC1 illustrated by the symbol in the bracket.Below, when relating to the structure important document of sending side conveying device SC2, use the title identical with the corresponding structure important document of sending into side conveying device SC1, after this title, mark the symbol in the bracket of Fig. 4～Fig. 8 and put down in writing.
Substrate processing unit SPU also has except said structure: substrate loader structure (mechanism for picking) 21 and substrate feel trim actuator 27.Substrate loader structure 21 be disposed at position of readiness P4 near.Fig. 9～Figure 11 is the figure that roughly represents the structure of substrate loader structure 21.
As shown in these figures, substrate loader structure 21 has substrate top maintaining body 23 and substrate bottom maintaining body 24.Substrate top maintaining body 23 is disposed at position of readiness P4's+the X side.Substrate top maintaining body 23 keeps substrate S's+Z side and moving along Z-direction.Substrate top maintaining body 23 has Lift Part 23a, hold assembly 23b and elevating mechanism 23c.
Substrate bottom maintaining body 24 is arranged at overlooks down the position overlapping with the central portion of " loaded " position LP.Substrate bottom maintaining body 24 keeps substrate S's-Z side and moving along Z-direction.Substrate bottom maintaining body 24 has: Lift Part 24a, hold assembly 24b and elevating mechanism 24c.Lift Part 24a forms bar-shaped pillar part, is set to and can moves along Z-direction.Hold assembly 24b is installed on Lift Part 24a's+front end of Z side, and about this hold assembly 24b, also be disposed at and overlook down the position overlapping with the central portion of " loaded " position LP.Elevating mechanism 24c is the drive division that is installed on Lift Part 24a, be disposed at send into box C1-the Z side.As elevating mechanism 24c, for example, can use the driving mechanisms such as cylinder.
The elevating mechanism 24c of the elevating mechanism 23c of substrate top maintaining body 23 and substrate bottom maintaining body 24 can distinguish independent operating, and, can also make both interlocks and move.
Substrate feel trim actuator 27 be disposed at position of readiness P8 near.Substrate feel trim actuator 27 forms the structure identical with substrate loader structure 21.In Fig. 9～Figure 11, the structure important document (comprising unloading position UP) of substrate feel trim actuator 27 that will be corresponding with each structure important document (comprising " loaded " position LP) of substrate loader structure 21 is illustrated by the symbol in the bracket.
Substrate feel trim actuator 27 has substrate top maintaining body 25 and substrate bottom maintaining body 26.Substrate top maintaining body 25 has Lift Part 25a, hold assembly 25b and elevating mechanism 25c.Substrate bottom maintaining body 26 has Lift Part 26a, hold assembly 26b and elevating mechanism 26c.About the position relationship of each structure important document of substrate feel trim actuator 27 or function etc., the structure important document corresponding with substrate loader structure 21 is identical, and therefore description thereof is omitted.
(substrate discharge unit)
Return Fig. 1～Fig. 3, substrate discharge unit ULU be disposed at substrate processing unit SPU among the base plate processing system SYS+the X side.Substrate discharge unit ULU is that the sending of substrate S that contains after the processing used box C2, and is supplied to the empty unit of sending with box C2.Y direction can configure a plurality of sending with box C2 for long limit among the substrate discharge unit ULU along Y direction.
Substrate discharge unit ULU possesses box gateway 60 and box travel mechanism (the second travel mechanism) 61.Box gateway 60 be arranged at covered substrate discharge unit ULU cap assembly-peristome of Y side.Box gateway 60 is empty entrances (supply port) of sending with box C2, be contain substrate S after the processing send outlet with box C2 (reclaim mouthful).
Box travel mechanism 61 is such as having the driving mechanisms such as belt transport mechanism.In the present embodiment, as this driving mechanism, has conveyer belt.Conveyer belt from substrate discharge unit ULU+the Y side end arranges to extending along Y direction the-Y side end, arranges two configurations in X-direction.
Supply with being to be disposed in two conveyer belts-conveyer belt of X side with 61a.Supply with 61a+the Z side becomes conveyor surface.Supply with forming this conveyor surface with 61a to+structure that Y-direction is rotated movably.Supplying with entering sending in the substrate discharge unit ULU via box gateway 60 and use box C2 with the conveyor surface mounting of 61a being a plurality of.This is sent with box C2 and utilizes the rotation of supplying with 61a, to supply unit CRU side shifting.
Reclaim with being to be disposed in two conveyer belts+conveyer belt of X side with 61b.Reclaim with 61b+the Z side becomes conveyor surface.Reclaiming with forming with 61b makes conveyor surface to-structure that Y-direction is rotated movably.Use box C2 the sending of substrate S of reclaiming with after containing processing with the conveyor surface mounting of 61b is a plurality of.This is sent with box C2 and utilizes the rotation of reclaiming with 61b, to box gateway 60 side shiftings.
In the present embodiment, for example, can make to send with box C2 and supply with band 61a and reclaiming with being with 61b to be respectively arranged with quinary position of readiness (container standby section) standby.In substrate discharge unit ULU, supply with band 61a and recovery band 61b rotation by making, the position of readiness of sending with box C2 is moved, move by making this position of readiness, can shorten the time of delivery of sending with box C2.
(supply unit)
Supply unit CRU be disposed at along in the base plate processing system SYS+zone of Y side end edge, be set to send into unit LDU with substrate processing unit SPU, substrate and substrate discharge unit ULU joins respectively.Supply unit CRU sends into to send between the unit LDU at substrate processing unit SPU and substrate and uses box C1, and, between substrate processing unit SPU and substrate discharge unit ULU, send and use box C2.Supply unit CRU has rail mechanism RL and box conveying device CC.
Rail mechanism RL is fixed on the objective table cell S TU, from supply unit CRU-the X side end extend to arrange to+X side end along X-direction with linearity.Rail mechanism RL is the guide of the shift position of guide box conveying device CC.Rail mechanism RL has two parallel track components 70 of alignment arrangements on Y direction.
Box conveying device CC is arranged on these two track components 70 in the mode across two track components 70 under overlooking.Box conveying device CC is that the buffer gear BF, the substrate that enter respectively substrate processing unit SPU are sent into unit LDU and substrate discharge unit ULU, keeps sending into box C1 and sending the conveying device of carrying with box C2.Box conveying device CC has: movable member 71, box support plate 72, support plate rotating mechanism 73, box holding member 74, holding member elevating mechanism 75 and holding member slide mechanism 76.
Movable member 71 is in the situation that overlook and form H word shape, has the recess 71a chimeric with two track components 70.Movable member 71 is such as have not shown driving mechanism (motor mechanism etc.) in inside.Movable member 71 can utilize the actuating force of this driving mechanism, moves at the moving section along the linearity of track component 70.
Box support plate 72 is to be fixed under the overlooking of movable member 71 to be the plate-shaped member of rectangle.Box support plate 72 forms than sending into box C1 and send the large size of size with the bottom of box C2, can send into box C1 and under sending with the state of box C2 and stablize having loaded this.Box support plate 72 is fixed in movable member 71, and is therefore, mobile integratedly with movable member 71.
Support plate rotating mechanism 73 is the rotating mechanisms that make 72 rotations of box support plate on the XY plane take Z axis as rotating shaft.Support plate rotating mechanism 73 is by making box support plate 72 rotation, can change sending into of loading of box conveying device CC with box C1 and send usefulness box C2 long side direction towards.
Box holding member 74 is to be disposed under the overlooking of box support plate 72 under overlooking+Y side to be the holding member of U word shape.Position and box support plate 72 that box holding member 74 is set on the X-direction are overlapping.Box holding member 74 is supported on movable member 71 via not shown support unit, and is mobile integratedly with movable member 71.The two end portions of the U word of box holding member 74 becomes respectively and is sending into box C1 and sending the maintaining part 74a that the holding section Cx that arranges with box C2 engages.The interval of the X-direction of maintaining part 74a (two end portions of U word) can be according to regulating sending into box C1 and the interval of sending the holding section Cx that arranges with box C2.Box holding member 74 can be to sending into box C1 and sending the maintenance of carrying out more reliably Z-direction with box C2 by maintaining part 74a is engaged with holding section Cx.
Holding member elevating mechanism 75 is to be arranged at box holding member 74, makes this box holding member 74 along travel mechanism that Z-direction moves.As holding member elevating mechanism 75, such as using the driving mechanisms such as cylinder.By utilizing holding member elevating mechanism 75 that box holding member 74 is moved to+Z direction, can lift what box holding member 74 kept and send into box C1 and send and use box C2.On the contrary, by utilizing holding member elevating mechanism 75 box holding member 74 is moved to-Z direction, can load the box that lifts.
Holding member slide mechanism 76 is to be arranged at box holding member 74 to make this box holding member 74 along travel mechanism that Y direction moves.Holding member slide mechanism 76 has: the guide post 76b that extends in Y direction, the movable member 76a that moves along this guide post 76b.Movable member 76a is fixed in box holding member 74.Movable member 76a is mobile in Y direction along guide post 76b, and box holding member 74 moves along Y direction integratedly with movable member 76a thus.
(control unit)
Control unit CNU is arranged in the objective table cell S TU of base plate processing system SYS.Control unit CNU possesses: send into the supply source of material necessary in the control device of each action in above-mentioned each unit such as the box shift action among unit LDU or the substrate discharge unit ULU, the conveying action among the supply unit CRU or above-mentioned each unit etc. such as processing substrate action, substrate among the control substrate processing unit SPU.As the supply source of material, for example, can enumerate the supply source of aqueous body or the supply source of cleaning fluid etc.
Secondly, the action of the base plate processing system SYS that consists of as described above is described.Utilize control unit CNU to be controlled at the action of carrying out in each unit of base plate processing system SYS.In the following description, describe take the unit that moves as main body, but in practice, carry out each action based on the control of control unit CNU.
(box is supplied with action)
At first, the sending into of the substrate S before explanation will contain and process is disposed at substrate with box C1 and sends into unit LDU, and the box supply that is disposed at substrate discharge unit ULU with box C2 of sending of sky is moved.
For example, utilize not shown feedway etc., sending into of the substrate S that contains before processing sent in the unit LDU to substrate via box gateway 10 with box C1 supplied with.Substrate send into unit LDU confirmed to send into load with box C1 in supply with 11a-situation of Y side end after, make and supply with the rotation with band 11a.Send into box C1 and utilize to supply with moving to+Y-direction with the rotation of 11a.Substrate is sent into unit LDU and is being supplied with when having moved this with 11a and send into amount of space degree with box C1, stop temporarily with rotation, standby is supplied with box C1 to sending into of next and is come.Sending into box C1 secondarily supplied with in the situation about coming, in the same manner as described above, when having moved the amount of space degree of sending into box C1, stop temporarily with rotation, again form holding state.Make and supply with when rotate with 11a, supply with to send into successively and use box C1, in substrate is sent into unit LDU, arrange thus and a plurality ofly contain front the sending into of substrate S of processing and use box C1.
On the other hand, such as utilizing not shown feedway etc., make empty send to supply with in the substrate discharge unit ULU via box gateway 60 with box C2 come.Substrate discharge unit ULU confirmed to send load with box C2 in supply with 61a-situation of Y side end after, make and supply with the rotation with band 61a.Send with box C2 and utilize to supply with moving to+Y-direction with the rotation of 61a.Substrate discharge unit ULU is supplying with when having moved this with 61a and send amount of space degree with box C2, stop temporarily with rotation, standby is supplied with box C2 to sending of next and is come.Sending into box C1 secondarily supplied with in the situation about coming, in the same manner as described above, when having moved the amount of space degree of sending with box C2, stop temporarily with rotation, again form holding state.When supply usefulness is rotated with 61a, supply with to send successively and use box C2, in substrate discharge unit ULU, arrange thus sending of a plurality of skies and use box C2.
(box is carried action)
Secondly, explanation will be supplied in substrate and send into sending into box C1 and the box of carrying to substrate processing unit SPU respectively with box C2 of sending that is supplied in substrate discharge unit ULU of unit LDU and carry and move.It is to use the box conveying device CC that arranges at supply unit CRU to carry out that box is carried action.
The conveying action of sending into box C1 is described.Supply unit CRU makes box conveying device CC move to the position of sending into unit LDU towards substrate along X-direction, and send into box C1 between ground, position on the overlapping X-direction carry out contraposition.Supply unit CRU makes box holding member 74 slide to-Y-direction after contraposition, the position standby of relying on most in substrate is sent into unit LDU+Y side send into the holding section Cx of box C1-Z side configuration maintaining part 74a.Supply unit CRU with maintaining part 74a when sliding be disposed at swimmingly holding section Cx-mode of Z side regulates the interval of X-direction of maintaining part 74a and the position of Z-direction in advance.
After making maintaining part 74a and holding section Cx engages, supply unit CRU makes box holding member 74 move, lift to send into and use box C1 to+Z direction.Supply unit CRU makes to lift to send into the box holding member 74 of the state of box C1 and slides to+Y-direction, makes to send into box C1 to overlooking time the position movement overlapping with box support plate 72.Supply unit CRU makes box holding member 74 move to-Z direction in this position, will send into box C1 to load on box support plate 72.Supply unit CRU with loaded make when sending into box C1 send into the long side direction of the box C1 mode consistent with the long side direction of box support plate 72 in advance damper box support plate 72 towards.By these actions, substrate is sent into relying on most in the unit LDU+sending into box C1 of Y side and is taken into box conveying device CC.After having carried out being taken into, substrate send into unit LDU so that substrate send into remaining in the unit LDU send into being disposed among the box C1 rely on most+the Y side send into box C1 be disposed at substrate send into unit LDU+mode of Y side end makes supply with being with 11a to move.By this action, this is remaining sends into box C1 integral body and moves to+Y-direction, supply with on the 11a-space empty of Y side end opens, and therefore, utilizes not shown feed mechanism, new sending into box C1 supplied with in the space that this sky is opened.
Send into behind the box C1 being taken into, supply unit CRU make box conveying device CC to+directions X moves, so that the long side direction of box support plate 72 mode consistent with Y direction rotated this box support plate 72.Supply unit CRU is after making box support plate 72 rotation, so that the position on the X-direction of sending into the position of readiness P1 that side buffer gear BF1 sets of substrate processing unit SPU and sending into the position contraposition of the location overlap mode on the X-direction of box C1 with box conveying device CC.Which of location action that carries out first the spinning movement of box support plate 72 and box conveying device CC is also harmless.
After location action (or spinning movement), supply unit CRU utilizes box holding member 74 to lift sending into box C1 of box support plate 72 mounting, makes box holding member 74 to-Y-direction slip under this state.Supply unit CRU is disposed to send into box C1 and overlooks the lower position overlapping with position of readiness P1, therefore, box holding member 74 is moved to-Z direction, will send into box C1 to load in position of readiness P1.
Send into behind the box C1 in mounting, supply unit CRU removes sending into the confining force with box C1, and box holding member 74 is kept out of the way to+Y side.By these actions, being taken into sending into box C1 of box conveying device CC becomes the state of sending in the substrate processing unit SPU.
The conveying action of sending with box C2 is described.This conveying action is to use the box conveying device CC that uses in the above-mentioned conveying action of sending into box C1 to carry out.Supply unit CRU makes box conveying device CC move to towards the position of substrate discharge unit ULU along X-direction, and send with box C2 between make the location overlap ground on the X-direction carry out contraposition, carry out being taken into box C2 of sending of relying on most in the substrate discharge unit ULU+Y side.This is taken into action and moves identical with being taken into of box C1 with sending into.After having carried out being taken into, make and supply with being with 61a to move, remaining sending with box C2 integrally moved to+Y-direction.By sending the movement with box C2, supply with on the 61a-space empty of Y side end opens, and therefore, utilizes not shown feed mechanism, and new sending with box C2 supplied with to the space that this sky is opened.
Send with behind the box C2 being taken into, supply unit CRU makes box conveying device CC edge-directions X move towards sending side buffer gear BF2, so that the long side direction of box support plate 72 mode consistent with Y direction rotated this box support plate 72.Supply unit CRU is after making box support plate 72 rotation, so that the position on the X-direction of sending the position of readiness P5 that side buffer gear BF2 sets of substrate processing unit SPU and send the position contraposition that makes box conveying device CC with the mode of the location overlap on the X-direction of box C2.
After contraposition, supply unit CRU makes sending with box C2 of box support plate 72 mounting and loads in position of readiness P5, and the releasing confining force makes box holding member 74 keep out of the way to+Y side.This mounting is moved and is kept out of the way action with identical about sending into the mounting action of putting down in writing with box C1 and keeping out of the way action.By these actions, be taken into sending with box C2 of box conveying device CC and form the state of sending in the substrate processing unit SPU.
(processing substrate action)
Next illustrates the processing action among the substrate processing unit SPU.
In substrate processing unit SPU, make respectively the substrate S that contains before processing send into box C1 and send the shift action that moves with box C2, send into the loading action of the substrate S that accommodates with box C1, apply the coating action of aqueous body at substrate S, the unloading of removing the substrate S after the circumference of the periphery of the film that substrate S forms is removed action, processing is moved and make and accommodate the free shift action that moves with box C2 of sending of sending into the substrate S after box C1 and the processing.Except above-mentioned each action, load between action and the coating action, the coating action and circumference is removed between the action and shaping action and unloading action between carry out the action of sending of substrate S.
In these actions, at first, illustrate and send into box C1 and send the shift action of usefulness box C2.Substrate processing unit SPU utilizes conveyer belt 20a to make to be transported to the sending into box C1 of position of readiness P1 of sending into side buffer gear BF1 and moves to position of readiness P2, utilizes conveyer belt 20b to move to sending into box C1 and then to position of readiness P4 of moving of this position of readiness P2.Equally, substrate processing unit SPU utilizes conveyer belt 22a to make to be transported to the sending with box C2 of position of readiness P5 of sending side buffer gear BF2 and moves to position of readiness P6, utilizes conveyer belt 22b to move to sending with box C2 and then to position of readiness P8 of moving of this position of readiness P6.By these actions, be transported to sending into box C1 and send position when being disposed at processing and beginning with box C2 in the substrate processing unit SPU.
Secondly, the loading action of substrate S is described.Substrate processing unit SPU confirmed to send into be disposed at the situation of position of readiness P4 with box C1 after, substrate top maintaining body 23 is disposed at clip position, and the Lift Part 24a that makes substrate bottom maintaining body 24 moves to+Z direction.Move by this, be installed on Lift Part 24a+be disposed among the hold assembly 24b of Z side end and the substrate S that in sending into box C1, accommodates rely on most-one of the Y side-Z side butt, utilize this hold assembly 24b maintenance substrate S-the Z side.
Kept substrate S-the Z rear flank, substrate processing unit SPU is keeping under the state of hold mode, and Lift Part 24a is moved further to+Z direction.Move by this, utilize substrate bottom maintaining body 24 that substrate S is lifted to+Z side, substrate S+the hold assembly 23b butt of Z side and substrate top maintaining body 23, utilize this hold assembly 23b keep substrate S+the Z side.Substrate S forms by the state of the two maintenance of hold assembly 24b of the hold assembly 23b of substrate top maintaining body 23 and substrate bottom maintaining body 24.
Substrate processing unit SPU utilizes hold assembly 23b and hold assembly 24b to keep under the state of substrate S, and Lift Part 23a and Lift Part 24a are moved to+Z direction simultaneously.Substrate processing unit SPU makes elevating mechanism 23c and elevating mechanism 24c interlock so that the movement of Lift Part 23a and Lift Part 24a becomes the mode of constant speed.Substrate S moves being held under the state that parts 23b and hold assembly 24b keep to+Z direction.Substrate processing unit SPU stops the movement of Lift Part 23a and Lift Part 24a in the situation that substrate S is disposed at " loaded " position LP.Like this, carry out the loading action of substrate S.
After loading action, substrate processing unit SPU makes the maintaining part 32 of sending into side conveying device SC1 enter " loaded " position LP, makes the substrate S in this " loaded " position LP configuration remain in maintaining part 32.When making maintaining part 32 enter " loaded " position LP, substrate processing unit SPU makes rotating platform 30b rotation, and the front end face 31b that makes arm 31 is towards+Y side, and CD-ROM drive motor device 35a makes arm 31 move to Y direction.Follow the movement of this arm 31, the maintaining part 32 that is installed on the front end face 31b (with reference to Fig. 4) of arm 31 enters " loaded " position LP.
Figure 12 is the profile of the state of expression when making maintaining part 32 enter " loaded " position LP.The figure of the appearance when Figure 13 is expression about substrate S from the state of unilateral observation Figure 12 opposite with maintaining part 32.As shown in these figures, when maintaining part 32 enters " loaded " position LP, attract adsorption plane 36e and the substrate S butt of parts 36, and inaccessible parts 37 embed the peristome Sa of substrate S.It is inner that inaccessible parts 37 are disposed at peristome Sa, and peristome Sa between form the state that 38 ground, gap form a part of having stopped up peristome Sa.
After maintaining part 32 is entered, substrate processing unit SPU operation suction pump 34a.By the action of this suction pump 34a, attract to become negative pressure in the slot part 36c in the slot part 36c via through hole 33e and through hole 36d.By becoming negative pressure in the slot part 36c, will pull to adsorption plane 36e side at substrate S and the inaccessible parts 37 that this slot part 36c configures, substrate S is adsorbed on adsorption plane 36e, forms the state of state maintained portion 32 maintenances of erectting in Z-direction.
In this action, attract the adsorption plane 36e and the interior butt of the non-processing section S2 of substrate S of parts 36, therefore, can not exert an influence to the processing section S1 of substrate S and attract substrate S.The part of slot part 36c is outstanding from the peristome Sa of substrate S, form on the surface of substrate S across state, therefore, also can adsorb reliably about the surface of substrate S.
Even inaccessible parts 37 pull to adsorption plane 36e side, also form between through hole 36d and the holding section 37b empty standard width of a room in an old-style house every state, therefore, can not hinder and attract action.Therefore the central portion of inaccessible parts 37 Sa of occlusion of openings section, is compared with the situation that this central portion is not blocked, and attraction acts on substrate S effectively.
Substrate processing unit SPU removes the confining force based on hold assembly 23b and hold assembly 24b after maintained portion 32 keeps with the state of erectting substrate S, form the only state of maintained portion 32 maintenances of substrate S.From this state, substrate processing unit SPU makes the hold assembly 23b that removed confining force and hold assembly 24b keep out of the way to-Z direction.After the keeping out of the way of hold assembly 23b and hold assembly 24b, substrate processing unit SPU makes the rotating platform 30b rotation of sending into side conveying device SC1, keep under the state of substrate S, with the state that this substrate S is erect along Z-direction, it is carried to the coating position in the applying device CT.
Secondly, the coating action that applies aqueous body at substrate S is described.In this coating action, use applying device CT.The state High Rotation Speed of substrate processing unit SPU so that substrate S is erect along Z-direction makes the nozzle 52 that arranges at applying device CT enter the area of application of substrate S, sprays aqueous body from this nozzle to substrate S.In the present embodiment, when making this substrate S rotation, utilize under the state of sending into side conveying device SC1 maintenance substrate S, use this to send into side conveying device SC1, make substrate S rotation.
Specifically, substrate processing unit SPU operation motor apparatus 33a under the state that substrate S is disposed at coating position 50.By the effect of motor apparatus 33a, rotating shaft member 33b rotation, the maintaining part 32 that remains in rotating shaft member 33b is rotated integratedly with rotating shaft member 33b.By this action, the state rotation of substrate S to erect along Z-direction.
Substrate processing unit SPU after making its rotation under the state that substrate S is erect along Z-direction, make respectively coating position 50+the Z side and-nozzle 52 of X side enters substrate S, surface from these nozzles 52 to substrate S and back spraying from go out aqueous body.The centrifugal force of the aqueous body utilization rotation of ejection spreads all over to the periphery of substrate S, thereby forms film on the two sides of substrate S.
Each nozzle 52 forms the state of the rotating shaft that is disposed at substrate S-Z side, therefore, in the situation that do not contact configuration nozzle 52 with maintaining part 32 and arm 31.And the outer circumferential side of each nozzle 52 from the rotation shaft side of substrate S to substrate S sprays aqueous body, therefore, suppresses to the movement of the aqueous body of the central portion of substrate S.
When substrate processing unit SPU applies aqueous body when making substrate S rotation, make inboard cup CP1 rotation.By the rotation of substrate S, be ejected in the aqueous body that exceeds substrate S in the aqueous body on the substrate S and disperse and be contained in the resettlement section 53 via the peristome that the opposed part 53a at inboard cup CP1 forms.In resettlement section 53, by the rotation of inboard cup CP1, produce flowing of aqueous body and flowing of gas to this direction of rotation.Aqueous body and gas were discharged to discharge path via the output mechanism 54 that is connected with outside cup CP2 along flowing.Aqueous body and the gas of discharging to discharge path are collected mechanism's 55 separation, and gas is by in the collecting mechanism 55, and aqueous body remains in the collecting mechanism 55.To discharge via not shown discharge portion at collecting mechanism 55 interior residual aqueous bodies.
After coating action, substrate processing unit SPU is for the substrate S in the applying device CT, and the maintaining part 42 of sending side conveying device SC2 is entered from+X side, utilizes this maintaining part 42 to keep substrate S.Move identical based on the maintenance action of the substrate S of maintaining part 42 with the maintenance of above-mentioned substrate S based on maintaining part 32.By this action, the one side that forms substrate S is admitted to maintaining part 32 maintenances of side conveying device SC1, and the another side of substrate S is sent the state of maintaining part 42 maintenances of side conveying device SC2.
Substrate processing unit SPU stops the operation of suction pump 34a after utilizing maintaining part 42 to keep substrate S, remove the maintenance based on maintaining part 32.By this action, the maintaining part 42 that substrate S only is sent side conveying device SC2 keeps, and substrate S shifts to sending side conveying device SC2 from sending into side conveying device SC1.
Secondly, illustrate that the circumference of removing the film of formation around substrate S removes action.Remove in the action at this circumference and to use circumference to remove device EBR.The circumference of the substrate S that will configure in circumference is removed device EBR impregnated in the lysate in the dipping portion, in the situation that make substrate S rotation under this state, is dissolved in the film of the circumference that floods in the lysate and removes.In the present embodiment, remove at circumference and to make substrate S when rotation in the action, utilize to send and use this to send side conveying device SC2 under the state that side conveying device SC2 keeps substrate S to make substrate S rotation.After removing the film of circumference, substrate processing unit SPU makes the circumference of substrate S to mobile between the attracting pad 58c of the 58b of attraction section, attracts the circumference of substrate S.Attract action by this, can remove at the residual aqueous body of the circumference of substrate S or lysate etc.
Specifically, after the transfer of substrate S, substrate processing unit SPU makes rotating platform 40b rotation, and, make arm 41 suitably flexible, make maintaining part 42 enter circumference and remove device EBR.After entering, arm 41 is moved substrate processing unit SPU or dipping portion moves, and the circumference with substrate S impregnated in the lysate of dipping portion thus.Under this state, the motor apparatus 43a of side conveying device SC2 is sent in substrate processing unit SPU operation.By the effect of motor apparatus 43a, rotating shaft member 43b rotation, the attraction parts 46 that keep at rotating shaft member 43b rotate integratedly with this rotating shaft member 43b.By this rotation, remove the film of the circumference of substrate S.
After circumference is removed action, substrate processing unit SPU so that the hold assembly 25b of substrate top maintaining body 25 be positioned at unloading position UP's+mode of Z side moves Lift Part 25a.After the movement of Lift Part 25a, the maintaining part 42 that substrate processing unit SPU sends side conveying device SC2 in utilization has kept under the state of substrate S, makes rotating platform 40b rotation, and, make arm 41 suitably flexible, make maintaining part 42 enter unloading position UP.By this action, substrate S is disposed at unloading position UP.
Secondly, the unloading action of substrate S is described.Substrate processing unit SPU is after having confirmed that substrate S is disposed at the situation of unloading position UP, and the Lift Part 25a that makes substrate top maintaining body 25 moves to-Z direction, and the Lift Part 26a that makes substrate bottom maintaining body 26 moves to+Z direction.Move by this, be installed on Lift Part 25a-the hold assembly 25b of Z side and substrate S+Z side butt, and, be installed on Lift Part 26a+the hold assembly 26b of Z side end and substrate S-Z side butt, utilize this hold assembly 25b and hold assembly 26b keep respectively substrate S+the Z side and-the Z side.
Substrate processing unit SPU stops to send the operation of the suction pump 44a of side conveying device SC2 after having confirmed to utilize hold assembly 25b and hold assembly 26b the two maintains the situation of substrate S, remove the maintenance based on the substrate S of maintaining part 42.By this action, only keep substrate S by hold assembly 25b and hold assembly 26b.Substrate processing unit SPU keeps under the state based on the hold mode of hold assembly 25b and hold assembly 26b, make Lift Part 25a and Lift Part 26a to-the Z direction is mobile simultaneously.Substrate processing unit SPU makes elevating mechanism 25c and elevating mechanism 26c interlock so that the movement of Lift Part 25a and Lift Part 26a becomes the mode of constant speed.Substrate S moves being held under the state that parts 25b and hold assembly 26b keep to-Z direction.
If the ledge of Lift Part 25a use box C2 near sending, then substrate processing unit SPU releasing is based on the confining force of hold assembly 25b, and stops the movement of Lift Part 25a, and Lift Part 26a is moved to-Z direction.Substrate S moves to-Z direction under the state that is only kept by the confining force of hold assembly 26b.
Substrate processing unit SPU continues based on the maintenance of hold assembly 26b until substrate S arrives the collecting position of sending with in the box C2.After arriving this collecting position, substrate processing unit SPU removes the maintenance based on hold assembly 26b, and Lift Part 26a is moved to-Z direction.By this action, substrate S is contained in and sends with in the box C2.
In explanation of above-mentioned each action, illustrate from sending into the appearance that substrate S begins to move successively that the relying on most of box C1-the Y side is accommodated, but in practice, move continuously about a plurality of substrate S.In this case, substrate processing unit SPU makes conveyer belt 20b rotation, make send into box C1 rely on most among the red remaining substrate S that accommodates-the substrate S of Y side be disposed at overlook time with the overlapping position of " loaded " position LP this is sent into box C1 move to-Y-direction.
Equally, substrate processing unit SPU makes conveyer belt 22b rotation so that send with rely on most in the collecting position in the box C2-collecting position of Y side overlook time with the overlapping position of unloading position UP this is sent with box C2 move to-Y-direction.Substrate processing unit SPU makes to send into box C1 and send and carries out this with box C2 and move, repeatedly carry out above-mentioned each process.
In the situation that process about many substrate S, substrate processing unit SPU processes action concurrently to these many substrate S.Specifically, for certain substrate S apply action during, other substrates S is carried out circumference removes action, and then the substrate S different from these loaded action or unloading action, as described above a plurality of substrate S are processed action concurrently.By carrying out like this parallel processing, do one's utmost to shorten the stand-by time of substrate S, realize the shortening of the processing beat of substrate S.
In the situation that the processing of all substrate S that accommodate in sending into box C1 finishes, this is sent into box C1 becomes empty state, forms the state that the substrate S after sending of position of readiness P8 standby is processed with all collecting positions of box C2 fills up.Substrate processing unit SPU makes conveyer belt 20b to direction rotation contrary to the above after having confirmed this state, makes to send into box C1 and moves to position of readiness P2 from position of readiness P4, and then make conveyer belt 20a rotation, makes to send into box C1 and moves to position of readiness P3.Equally, substrate processing unit SPU make conveyer belt 22b to contrary to the above towards rotation, make to send with box C2 and move to position of readiness P6 from position of readiness P8, and then make conveyer belt 22a rotation, make to send with box C2 and move to position of readiness P7.
Secondly, the service action of spray nozzle part NZ and the CP of cup section among the applying device CT is described.If the number of times of coating action is overlapping, then the solidfied material of aqueous body or the impurity such as the dirt in the atmosphere or dust are attached to spray nozzle part NZ or the CP of cup section sometimes.This impurity for example may plug nozzle 52, reduction ejection characteristic or the interior discharge path of the obstruction cup CP of section.In addition, in each spray action, need the ejection environment of managing nozzle 52 that it is not changed.Thereby, need to regularly carry out the service action of spray nozzle part NZ and the CP of cup section.
In the service action of spray nozzle part NZ, use the nozzle NM of management organization.When washer jet 52, substrate processing unit SPU moves spray nozzle part NZ, makes nozzle 52 enter the NM of nozzle management organization.Mobile in the cleaning fluid of the front end that substrate processing unit SPU makes nozzle 52 in the cleaning part 57a, the front end of washer jet 52.
After this cleaning action, substrate processing unit SPU makes the front end of nozzle 52 mobile between the attracting pad 75d in the 57b of attraction section, attracts the front end of nozzle 52.Attract action by this, remove at the residual impurity such as cleaning fluid of nozzle 52.
After attracting action, substrate processing unit SPU moves the front end of nozzle 52 in liquid receiving portion 57c.In this liquid receiving portion 57c, carry out the preparation spray action of nozzle 52.By spraying aqueous body from nozzle 52 preparation properties, regulate the ejection environment of nozzle 52.Substrate processing unit SPU is after the front end that makes nozzle 52 is mobile in the liquid receiving portion 57c, to the aqueous body of nozzle 52 ejections.The aqueous body of ejection is trapped in the liquid receiving portion 57c, and is reclaimed by not shown recovering mechanism.
The service action of the CP of cup section is described.When the CP of Washing cup section, use remover liquid nozzle section 56.Substrate processing unit SPU makes under the state of substrate S rotation to replace nozzle 52 when carrying out above-mentioned coating action, make remover liquid nozzle section 56 from substrate S+the X side and-the X side enters the ejection cleaning fluid from each remover liquid nozzle section 56 to substrate S.The cleaning fluid that is ejected on the substrate S moves by the circumference of rotary centrifugal force to substrate S, from the circumference of substrate S to the inside a cup CP1 side disperse.The cleaning fluid that disperses is contained in the resettlement section 53 via the peristome of opposed part 53a.At this moment, substrate processing unit SPU is by making inboard cup CP1 rotation, can be in the resettlement section the flowing of 53 interior formation cleaning fluids, utilize flowing of this cleaning fluid, clean in the resettlement section 53 and in the discharge path.The discharge of this cleaning fluid and the discharge of aqueous body are in the same manner, and be separated from the gas and discharge in collecting mechanism 55.
To the cleaning action of the CP of cup section, for example unload carry out under the state of opposed part 53a of resettlement section 53 also harmless.Beyond the situation of carrying out cleaning action, for example unload opposed part 53a, clean separately this opposed part 53a also harmless, unload opposed part 53a after, carry out glass maintenance of other parts of the CP of section also harmless.
(box is carried action)
Secondly, illustrate that sending into of sky sent into unit LDU with box C1 to substrate carries, and, the sending with box C2 of substrate S that contains after the processing moved to the box conveying that substrate discharge unit ULU carries.
The conveying action of sending into box C1 is described.This is sent to move to use at the above-mentioned box conveying device CC that uses in the action that sends and carries out.What supply unit CRU made that box conveying device CC moves to substrate processing unit SPU sends into side buffer gear BF1.Empty send into the position of readiness P3 standby in sending into side buffer gear BF1 with box C1.Supply unit CRU is so that the long side direction of the box support plate 72 of box conveying device CC makes box support plate 72 rotation with sending into the consistent mode of the long side direction of box C1.
After making 72 rotations of box support plate, supply unit CRU carries out box conveying device CC and sends into the contraposition on the X-direction between the box C1.After contraposition, supply unit CRU makes box conveying device CC carry out the action that is taken into box C1 sent at the sky of position of readiness P3 standby.This be taken into action with above-mentioned be taken into move identical.
Sending into after being taken into of box C1, supply unit CRU makes box conveying device CC send into unit LDU towards substrate and moves to-directions X, makes the long side direction of box support plate 72 and X-direction as one man make this box support plate 72 rotations.Supply unit CRU is after making box support plate 72 rotation, at box conveying device CC be arranged at recovery that substrate sends into unit LDU with the contraposition of carrying out between with 11b on the X-direction.
After contraposition, supply unit CRU will load in sending into of the sky on the box support plate 72 load with box C1 in reclaim with 11b+the Y side end on, box holding member 74 is kept out of the way to+Y side.The action of this mounting and keep out of the way action with above-mentioned mounting action and keep out of the way move identical.By these actions, send in the unit LDU to substrate with box C1 and to carry being taken into sending into of box conveying device CC.
The conveying action of sending with box C2 is described.This conveying action is moved in the same manner with above-mentioned sending into the conveying of box C1, and CC carries out with the box conveying device.Supply unit CRU makes box conveying device CC send side buffer gear BF2 along what X-direction moved to substrate processing unit SPU.Contain the position of readiness P7 standby in sending side buffer gear BF2 with box C2 of sending of substrate S after the processing.Supply unit CRU is so that the long side direction of the box support plate 72 of box conveying device CC makes box support plate 72 rotation with sending with the consistent mode of the long side direction of box C2.
After making box support plate 72 rotation, supply unit CRU is so that the position on the X-direction of box conveying device CC and this are sent the contraposition of carrying out this box conveying device CC with the mode of the position consistency on the X-direction of box C2.After contraposition, supply unit CRU makes box conveying device CC carry out being taken into box C2 of sending in position of readiness P7 standby.This be taken into action with above-mentioned be taken into move identical.
After being taken into action, supply unit CRU makes box conveying device CC move to+directions X towards substrate discharge unit ULU, makes the long side direction of box support plate 72 and X-direction as one man make this box support plate 72 rotations.Supply unit CRU after making box support plate 72 rotation, in box conveying device CC and the recovery that is arranged at substrate discharge unit ULU with the contraposition of carrying out between with 61b on the X-direction.
After contraposition, supply unit CRU will load in sending on the box support plate 72 load with box C2 in reclaim with 61b+the Y side end on, box holding member 74 is kept out of the way to+Y side.The action of this mounting and keep out of the way action with above-mentioned mounting action and keep out of the way move identical.By these actions, carry in substrate discharge unit ULU being taken into sending with box C2 of box conveying device CC.
(box reclaims action)
Secondly, illustrate to reclaim and empty send into box C1 and sending with the box recovery of box C2 of the substrate S after containing processing moved.
Substrate send into unit LDU confirmed empty send into carry the situation of coming with box C1 after, make to reclaim with band 11b and rotate, this is sent into box C1 moves to-Y-direction.To this-when Y-direction moves, for example make send into box C1 make a beeline toward box gateway 10 also can, with sky open reclaim with 11b+degree of Y side end makes to send into to move on a small quantity with box C1 and also can.
Send into the past box gateway 10 of box C1 make a beeline in the situation that make, send into box C1 and carry to the outside that substrate is sent into unit LDU via box gateway 10.Send into the sending into box C1 of outside conveying of unit LDU is reclaimed by not shown recovering mechanism to substrate.Send into when coming with box C1 sending into unit LDU to substrate at every turn, repeatedly carry out this action.
In the situation that make send into move with box C1 a small amount of, for example when sending into unit LDU and send into box C1 to substrate at every turn, can make its to-Y-direction is mobile with sending into the spatial offset ground of box C1 of an amount.Repeatedly carry out repeatedly this action, rely on most-sending into box C1 of Y side arrive in the situation of box gateway 10, carries out the recovery action based on not shown recovering mechanism.
On the other hand, after the sending of the substrate S of substrate discharge unit ULU after having confirmed to contain processing carried situation about coming with box C2, make and reclaim the rotation with band 61b, this is sent with box C2 move to-Y-direction.When this moves, the situation of sending into unit LDU with substrate in the same manner, make send with box C2 make a beeline toward box gateway 60 also can, with on a small quantity to-Y-direction with departing from movement also can.Move by this, send with box C2 and finally carry to the outside of substrate discharge unit ULU via box gateway 60.Sending with box C2 of sending to the outside of substrate discharge unit ULU reclaimed by not shown recovering mechanism.
(box replenishes action)
In the above description, carry out among the substrate processing unit SPU processing during, send into box C1 and be disposed at the position of readiness P4 that sends into side buffer gear BF1, send with box C2 and be disposed at the position of readiness P8 that sends side buffer gear BF2.At this moment, the position of readiness P5 that sends into the position of readiness P1 of side buffer gear BF1 and send side buffer gear BF2 forms empty state (box is the state of standby not).
Supply unit CRU utilizes box conveying device CC will ensuingly send into box C1 and sends usefulness box C2 to this position of readiness P1 and position of readiness P5 conveying after having confirmed that position of readiness P1 and position of readiness P5 form the situation of empty state.Supply unit CRU at first makes box conveying device CC move to substrate and sends into unit LDU, is taken into ensuing sending into and uses box C1.After being taken into action, supply unit CRU moves to box conveying device CC to send into side buffer gear BF1, and sending into box C1 of being taken into is positioned in position of readiness P1.Equally, supply unit CRU makes box conveying device CC move to substrate discharge unit ULU, is taken into ensuing sending and uses box C2, and box conveying device CC is moved to sending side buffer gear BF2, will send with box C2 and be positioned in position of readiness P5.
Sending into box C1 and after sending mounting action with box C2, the action standby that substrate processing unit SPU makes conveyer belt 20a and conveyer belt 20b to the processing of the substrate S that accommodates with box C1 sending into of position of readiness P4 roughly finishes.If this processing finishes, then substrate processing unit SPU makes conveyer belt 20b rotation, makes to send into box C1 and moves to position of readiness P2 from position of readiness P4.
By this action, form the sending into of substrate S that contains before processing and use box C1 in position of readiness P1 standby, the empty state in position of readiness P2 standby with box C1 of sending into.Under this state, substrate processing unit SPU makes in the situation of conveyer belt 20a rotation, and sending into box C1 of position of readiness P2 moved to position of readiness P3, and sending into box C1 of position of readiness P1 moved to position of readiness P2.Like this, effectively carry out shift action.Thereby, preferred in fact apply in the situation of action etc. with substrate processing unit SPU, form and send into usefulness box C1 at the state of position of readiness P1 and position of readiness P2 standby.
Equally, make in the situation of conveyer belt 22a rotation when sending the state that has moved to position of readiness P6 from position of readiness P8 with box C2 forming, sending with box C2 of position of readiness P6 moved to position of readiness P7, and sending with box C2 of position of readiness P5 moved to position of readiness P6.Like this, in sending side buffer gear BF2, also effectively carry out shift action.Thereby, preferably in fact apply with substrate processing unit SPU in the situation such as action, form and send usefulness box C2 at the state of position of readiness P5 and position of readiness P6 standby.
Send into box C1 and move to position of readiness P2 from position of readiness P1, send in the situation about moving from position of readiness P5 to position of readiness P6 with box C2, position of readiness P1 and position of readiness P5 form empty state again.Can and then carry to the position of readiness P1 of this empty state and position of readiness P5 and ensuingly send into box C1 and send and use box C2, make respectively its standby.Like this, send into side buffer gear BF1 at every turn and send the position of readiness P1 of side buffer gear BF2 and position of readiness P5 when becoming empty state, supply unit CRU sends into unit LDU from substrate and sends into and use box C1, sends from substrate discharge unit ULU and uses box C2.
As mentioned above, according to present embodiment as can be known, the box conveying device CC that is arranged at supply unit CRU sends into to send between the unit LDU at " loaded " position LP and substrate and uses box C1, and, between unloading position UP and substrate discharge unit ULU, send and use box C2, the conveying that therefore, a box conveying device CC is carried out between different delivery areas is moved.Therefore, can simplification based on the transport process of box conveying device CC, can simplify the structure of base plate processing system SYS, can shorten the processing beat.In addition, according to present embodiment as can be known, separately use to send into box C1 and use box C2 with sending, therefore, also have advantages of the pollution that can prevent substrate S.
In addition, according to present embodiment as can be known, unit LDU sent into by substrate processing unit SPU, substrate and substrate discharge unit ULU is disposed on the rectilinear direction, therefore, the transport path between each unit can be set on this rectilinear direction.Thus, the complicated of transport path can be avoided, the structure of base plate processing system SYS can be oversimplified.And according to present embodiment as can be known, substrate processing unit SPU is disposed at substrate and sends between unit LDU and the substrate discharge unit ULU, and therefore, each unit is along the direction that the flows configuration of the conveying of substrate.Thus, can improve the efficient of processing.
In addition, in the present embodiment, supply unit CRU makes box conveying device CC mobile along rectilinear direction (X-direction), therefore, and shift action that can simplification box conveying device CC.In addition, send among unit LDU and the substrate discharge unit ULU at substrate, a plurality of boxes can be distinguished standby, and these become a plurality of box standby section, therefore, can promptly process more substrate.
In addition, unit LDU sent into by substrate and substrate discharge unit ULU can utilize supply with being with 11a, 61a and reclaiming with being with 11b, 61b, make box standby section to supply unit CRU side shifting to sending into box C1, make box standby section to box gateway 60 side shiftings to sending with box C2, therefore, can effectively send into box C1 and send with the supply action of box C2 and reclaim action.
In addition, be provided with send into side buffer gear BF1 and send side buffer gear BF2 corresponding with " loaded " position LP and unloading position UP at substrate processing unit SPU, in each buffer gear, can make a plurality of box C standby, therefore, loading action and the unloading action of the substrate S among the substrate processing unit SPU can be promptly carried out, the efficient activity of processing can be realized.In addition, this buffer gear BF has the conveyer belt 20,22 that the position of readiness that makes box C moves, and can come according to the residual quantity of the substrate S in the box C position of readiness of moving box C, therefore, can realize the efficient activity of processing.These position of readiness arrange along the throughput direction (X-direction) based on box conveying device CC, and therefore, the distance of box conveying device CC and each position of readiness is constant respectively.Constant by this distance is remained, box conveying device CC easily enters each position of readiness.
In addition, substrate processing unit SPU has from sending into box C1 and lifts substrate S, and it is disposed at the substrate loader structure 21 of " loaded " position LP, therefore, can promptly carry out the loading action of substrate.Equally, substrate processing unit SPU has substrate feel trim actuator 27, therefore, also can promptly carry out about the unloading action of substrate S.
In addition, box conveying device CC have make box support plate 72 towards the rotation rotating mechanism, therefore, throughput direction and box in different situations, also can carry swimmingly the action and transfer action.In addition, be formed with holding section Cx sending into box C1 and send with box C2, conveying device has with this holding section Cx and engages, and keeps sending into box C1 and sends the box holding member 74 of usefulness box C2, therefore, can keep reliably sending into box C1 and sends and use box C2.
In addition, control unit CNU is according to the treatment situation of the substrate S among the substrate processing unit SPU, and control is sent into box C1 and sent the transfer position of using box C2, therefore, can more effectively carry action.
Technical scope of the present invention is not limited to above-mentioned execution mode, can suitably change in the scope that does not break away from aim of the present invention.
In the above-described embodiment, form control unit CNU according to the treatment situation of the substrate S among the substrate processing unit SPU, control is sent into box C1 and is sent the structure of the transfer position of usefulness box C2, but be not limited to this, for example, in the action of the integral body of base plate processing system SYS, pre-determine and send into box C1 and send also can be harmless with control under the state of the position of the conveying of box C2 and sequential.
In addition, in the above-described embodiment, be formed with holding section Cx sending into box C1 and send with box C2, box conveying device CC makes the maintaining part 74a of box holding member 74 engage with this holding section Cx, keep sending into box C1 and sending and use box C2, but be not limited to this, for example, box holding member 74 keeps sending into box C1 and sends with other parts such as bottom of box C2 also harmless.
In addition, in the above-described embodiment, box conveying device CC has the rotating mechanism towards rotation that makes box support plate 72, but is not limited to this, for example, form be fixed with box support plate 72 towards structure also harmless.In this case, in base plate processing system SYS, the long side direction that becomes the long side direction that makes box C and box support plate 72 all the time consistent state ground supply with, reclaim, mobile.Thus, the more action of simplification box conveying device CC.
In addition, in the above-described embodiment, substrate processing unit SPU has from sending into box C1 and lifts substrate S, it is disposed at the substrate loader structure 21 of " loaded " position LP, but is not limited to this, the structure of substrate loader structure 21 is formed other structures also harmless.Structure about substrate feel trim actuator 27 is also identical.
In addition, in the above-described embodiment, buffer gear BF forms the structure that the position of readiness that makes box C moves along X-direction, but is not limited to this, makes the position of readiness of box C move also harmless to other directions.In addition, the position of readiness of box C is moved, form fixing structure harmless yet.
In addition, in the above-described embodiment, as buffer gear BF, form the structure that respectively configuration is sent into side buffer gear BF1 and sent side buffer gear BF2, but be not limited to this, the structure that for example forms either party among the buffer gear BF that only configures both is also harmless.Be not limited to configure the structure of a plurality of buffer gear BF, form and concentrate on a place, the structure of configuration buffer gear BF is also harmless.
In addition, in the above-described embodiment, utilize and supply with being with 11a, 61a and reclaiming with band 11b, 61b, make box standby section to supply unit CRU side shifting to sending into box C1, make box standby section to box gateway 60 side shiftings to sending with box C2, but be not limited to this, box standby section moved also harmless to the either party.
In addition, in the above-described embodiment, make a plurality of box C send into unit LDU and substrate discharge unit ULU standby at substrate respectively, but be not limited to this, for example, only make a box C also harmless in each unit standby.Thus, in the situation that base plate processing system SYS is small-sized, also can be suitable for the present invention.
In addition, in the above-described embodiment, supply unit CRU makes box conveying device CC mobile along rectilinear direction (X-direction), but is not limited to this, moves also harmlessly to different a plurality of directions, and forming can be also harmless along the structure that direction of a curve moves.
Wide cut is set transport path by letting loose like this in rectilinear direction, can enlarge the width of the design relevant with the configuration of each unit.
For example, send into the structure between unit LDU and the substrate discharge unit ULU except substrate processing unit SPU as above-mentioned execution mode is disposed at substrate, can also form substrate is sent into the structure that unit LDU and substrate discharge unit ULU and substrate processing unit SPU are disposed at different positions.
In addition, being not limited to as above-mentioned execution mode substrate processing unit SPU, substrate sends into unit LDU and substrate discharge unit ULU and is disposed at structure on the rectilinear direction, for example, can carry out configuring at the vertex position of the vertex position of equilateral triangle or right-angled triangle the design of the wide cuts such as each unit.
In addition, in the above-described embodiment, as the processing among the substrate processing unit SPU, mainly will apply film forming coating at substrate S processes to enumerate as example and is illustrated, but be not limited to this, for example, as substrate processing unit, form the structure of mainly carrying out pre-treatment that this coating processes or reprocessing also harmless.As pre-treatment, for example, can enumerate to the processing of substrate S irradiation ultraviolet radiation or the processing of cleaning base plate S etc.As reprocessing, can enumerate the processing of the Decompression of substrate S or processing of heated substrates S etc.
In addition, in the above-described embodiment, illustrated and preseted " loaded " position LP and unloading position UP, cooperate with this " loaded " position LP and unloading position UP, the situation of the structure of placement substrate loader mechanism 21 and substrate feel trim actuator 27, but in contrast, form the position of first setting substrate loader mechanism 21 and substrate top maintaining body 27, the position of substrate bottom maintaining body 24 and 26+that the Z direction is set the structure of " loaded " position LP and unloading position UP is also harmless.
In addition, in the above-described embodiment, as applying device CT, form when making substrate S rotation, structure to the aqueous body of the upper ejection of this substrate S, but be not limited to this, in the applying device of use other types, the situation such as the applying device of impregnated or the applying device of gap nozzle formula etc., also can be suitable for the present invention.In addition, as applying device CT, be not limited to the device in the film forming type of single face side of substrate S, can be for can be at the device of the film forming type in the two sides of substrate S.
In addition, according to present embodiment as can be known, attract substrate S and the maintaining part 32 that keeps be set to can be with respect to arm 31 rotations that arrange at base portion 30, therefore, can utilize maintaining part 32 to keep making this substrate S rotation under the state of substrate S.Therefore, make substrate S rotation in the situation that applying device CT or circumference are removed the processing substrate zone such as device EBR, also do not need rotating mechanism etc. is carried out the transfer of substrate S.Owing to there not being the amount of the transfer of substrate S, can correspondingly carry out rapidly the operation till the processing that is transported to substrate S of substrate S, therefore, can shorten the beat of base plate processing system SYS integral body, can boost productivity.In the present embodiment, carry the rotating mechanism 33 that makes maintaining part 32 rotations at arm 31, therefore, further miniaturization device structure.
In addition, according to present embodiment as can be known, have in the situation of processing of substrate S of peristome Sa, slot part 36c attracts along the surface of the substrate S of this peristome Sa, therefore, can be with the wide zone till from the peripheral part of substrate S to the part that is attracted by this slot part 36c as processing object.In the present embodiment, slot part 36c is configured to attract the non-processing section S2 of substrate S, therefore, can attract substrate S in situation about the processing section S1 of substrate S not being exerted an influence.
In addition, according to present embodiment as can be known, maintaining part 32 has the inaccessible parts 37 that embed peristome Sa, therefore, and by at least a portion of inaccessible parts 37 Sa of occlusion of openings section.Thus, when attracting substrate S, attract to comprise in the situation in zone of peristome Sa, also can in the situation that do not reduce attraction and attract, can keep more reliably substrate S.
According to present embodiment as can be known, inaccessible parts 37 are set to and can with respect to other part dismounting of maintaining part 32, therefore, for example, in the situation that do not need inaccessible parts 37, can unload this other parts.In addition, for example, can also separately use the different a plurality of inaccessible parts 37 of size, therefore, in the situation of the different substrate S of the size of processing peristome Sa, also can tackle.Thus, mode that can diversified attracting holding.
In addition, according to present embodiment as can be known, the thickness of the occlusive part 37a of inaccessible parts 37 is below the thickness of substrate S, therefore, can prevent that this occlusive part 37a is to the side-prominent situation of the opposing face of the adsorption plane of substrate S.Thus, can easily configure miscellaneous part at the opposition side of the adsorption plane of substrate S.
Technical scope of the present invention is not limited to above-mentioned execution mode, can apply change in the scope that does not break away from aim of the present invention.
For example, in the above-described embodiment, in applying device CT, kept under the state of substrate S by maintaining part 32, made its when rotation, only kept the one side of substrate S and make its rotation, but be not limited to this, kept the two sides of substrate S and make its rotation also harmless.
Figure 14 is that expression keeps the two sides of substrate S and makes the figure of a mode of its rotation, the structure in the expression applying device CT.As shown in the drawing, configuration the second maintaining part 81 is also harmless in applying device CT, and this second maintaining part 81 is applying when action, for example keep among the substrate S with by the opposite face of the face of maintaining part 32 maintenances (below, be labeled as the back side).In this structure, the second maintaining part 81 has abutting part 81a and axial region 81b.
Abutting part 81a has the size identical with the adsorption plane 36e of maintaining part 32, the abutting part 81c of shape.Abutting part 81c be set to can with the regional butt overlapping with adsorption plane 36e in the back side of substrate S.Axial region 81b is arranged at the central portion of abutting part 81a, utilizes not shown support unit supporting for rotating.Form the structure that is provided with separately the pressing mechanism that axial region 81b is pressed to substrate S side also harmless.
In this structure, if make substrate S rotation by the rotation of maintaining part 32, then the rotation of this substrate S is transmitted to the second maintaining part 81, and the second maintaining part 81 is rotated drivenly.Can keep identical zone in face side and the rear side of substrate S, therefore, in the situation that make substrate S rotation, also can avoid reliably substrate S to come off from maintaining part 32.In the situation of the structure that pressing mechanism is set, can from two sides supporting substrates S, therefore, can avoid more reliably coming off of substrate S.
Figure 15 is that expression keeps the two sides of substrate S and makes the figure of other modes of its rotation, the structure in the expression applying device CT.As shown in the drawing, will be at the back side that apply when action and keep substrate S, and self also the rotation maintaining part 82 of active rotation to be disposed at applying device CT also harmless.In this structure, rotation maintaining part 82 has motor apparatus 82a and rotation holding member 82b.
Abutting part 82c and abutting part 81a shown in Figure 14 possess: have the size identical with the adsorption plane 36e (with reference to Fig. 7) of maintaining part 32, the bearing surface 82e of shape in the same manner.Bearing surface 82e be set to can with the regional butt overlapping with adsorption plane 36e in the back side of substrate S.Axial region 82d is arranged at the central portion of abutting part 82c, and the end is connected with motor apparatus 82a.Be provided with separately the pressing mechanism that axial region 82d is pressed to substrate S side also harmless.
In this structure, can utilize adsorption plane 36e and bearing surface 82e to keep substrate S from the two sides, and, driving by motor apparatus 33a makes maintaining part 32 rotations, utilize motor apparatus 82a to make abutting part 82c rotation, can supply with rotary driving force from the two sides of substrate S thus, therefore, can reduce the burden of motor apparatus 33a.In the situation of the structure that is provided with pressing mechanism, from two sides supporting substrates S, and make its rotation from the two sides, therefore, further improve the precision of the rotation of substrate S.
In Figure 14 and structure shown in Figure 15, in the situation that it is effective to apply action in the applying device CT, but be not limited to this, for example form the structure identical with structure in circumference is removed device EBR and Figure 14 and structure shown in Figure 15 also harmless.Thus, also can prevent more reliably coming off of above-mentioned same substrate S about the processing of sending side conveying device SC2, and, the burden of motor apparatus 43a can be reduced.
In Figure 14 and structure shown in Figure 15, the bearing surface 82e of the adsorption plane 36e of absorption substrate S and the abutting part 81c of the second maintaining part 81 and adsorption plane 36e and rotation maintaining part 82 keeps the overlapping part of substrate S from the two sides, but be not limited to this, also harmless in the position that the back side of the surface of substrate S and substrate S keeps different.
In addition, in Figure 14 and structure shown in Figure 15, the second maintaining part 81 and rotation maintaining part 82 are disposed in the applying device CT, but are not limited to this, be disposed at the outside of applying device CT, and can enter as required in the applying device CT also harmless.
In addition, replace above-mentioned the second maintaining part 81 and rotation maintaining part 82, make and send side conveying device SC2 to carry out the structure of above-mentioned action also harmless.In this case, the action of the motor apparatus 43a by stopping to send side conveying device SC2 can access the effect identical with the situation of using above-mentioned the second maintaining part 81.In addition, the action of the motor apparatus 43a by sending side conveying device SC2 can access the effect identical with the situation of using above-mentioned rotation maintaining part 82.
In the situation that side conveying device SC2 is sent in use, need to be after the coating release of substrate S, carry out in the action of sending side conveying device SC2 maintenance substrate S, therefore, substrate S is shortened to the action of sending side conveying device SC2 transfer from sending into side conveying device SC1.Therefore, can further shorten the processing beat, can further boost productivity.
As mentioned above, according to present embodiment as can be known, can utilize the aqueous body of nozzle 52 ejections from the two sides with the substrate S of the state rotation of erectting, therefore, can make the coating environment of aqueous body in the surface of substrate S and the back side more approaching.The state of the aqueous body that applies between the back side of the surface of substrate S and substrate is approached, therefore, can prevent that the state of film of the aqueous body that applies at substrate S is different.Thus, can improve the state of the aqueous body that applies at substrate S.
About spray nozzle part NZ, form this nozzle 52 from the central portion side of substrate S when the peripheral part side spray of substrate goes out aqueous body, the emission direction of nozzle 52 is consistent with the direction of centrifugal force on acting on substrate S.Thus, can more effectively apply aqueous body.In the present embodiment, nozzle 52 forms from the side bending of central portion side direction peripheral part, therefore, need not to arrange separately the governor motion of the emission direction of regulating aqueous body etc., can utilize simple structure to regulate the emission direction of aqueous body.
In addition, the ejection face 52a of front end tilts with respect to the emission direction of aqueous body and forms in the nozzle 52, therefore, can reduce the surface tension of the aqueous body in the front end of nozzle 52.Thus, aqueous body is difficult for remaining in the front end of nozzle 52.In addition, nozzle 52 is arranged on the downside of the rotating shaft of base board delivery device SC, therefore, can make the emission direction of aqueous body consistent with gravity direction.Thus, can make the easily diffusion on substrate S of aqueous body.
In addition, when nozzle 52 is disposed at identical position in the face side of substrate S with rear side, can make the coating environment approaching with the back side of substrate on the surface of substrate S.Thus, aqueous body can be coated in equably the two sides of substrate S.In addition, be provided with when making the box travel mechanism 51 that nozzle 52 moves, can make according to the treatment situation of applying device CT the position movement of nozzle 52.Thus, can carry out the more processing of wide cut.
About the NM of nozzle management organization, the NM of nozzle management organization has by the front end with nozzle 52 and impregnated in the cleaning part 57a that cleans in the cleaning fluid, therefore, can clean the aqueous body that the front end at nozzle 52 adheres to and removes.If the front end at nozzle 52 adheres to aqueous body, then nozzle 52 stops up, and becomes the essential factor that discharge performance lowers.In the present invention, by the front end of washer jet 52, can prevent the reduction of such discharge performance.In addition, the NM of nozzle management organization has the 57b of attraction section of the front end that attracts nozzle 52, therefore, can remove at aqueous body that nozzle 52 adheres to or the cleaning fluid after cleaning this aqueous body etc. from the front end of nozzle 52.Thus, the front end of nozzle 52 can be remained the more state of cleaning.In addition, the NM of nozzle management organization has the liquid receiving portion 57c that accepts from the aqueous body of nozzle 52 preparation properties ejection, therefore, becomes the state that easily carries out the spray action of the aqueous body of preparation property.Thus, can prevent the situation of the discharge performance reduction of nozzle 52.
About the CP of cup section, the CP of cup section has the resettlement section 53 of accommodating aqueous body, therefore, the aqueous body that disperses can be concentrated on this resettlement section 53.Thus, can effectively manage the aqueous body that disperses.In addition, be set to can be with respect to other part dismounting of the CP of cup section with the opposed part 53a of the sidepiece of substrate S among the CP of cup section, and therefore, the CP of cup section becomes the state of easy maintenance.Thus, can easily carry out cleaning of glass CP of section.In addition, have the governor motion 53b of the opening size of regulating this opposed part 53a, therefore, in the different situation of the environment of the coatings such as degree of the dispersing processing of the thickness of substrate S or aqueous body, also can tackle flexibly.
In addition, the CP of cup section can have inboard cup CP1 and outside cup CP2, can be provided with at inboard cup CP1 to make this inboard cup CP1 to the rotating mechanism 53c along the direction rotation of the periphery of substrate S, in this case, can not make glass CP of a section integral-rotation, can only make inboard cup CP1 rotation.In addition, connect the output mechanism 54 of at least one party in the gas of discharging in aqueous bodies and the resettlement section 53 in resettlement section 53, therefore, the aqueous body that utilizes this output mechanism 54 to discharge in resettlement sections 53, and, can be in the resettlement section 53 interior formation gases mobile.In addition, inboard cup CP1 forms circle, when the tangential direction of the periphery of output mechanism 54 edges inboard cup CP1 arranges, can discharge aqueous body along the direction of rotation of substrate S.In addition, owing to disposing collecting mechanism 55 on the discharge path in this output mechanism 54, therefore, can easily process aqueous body.
In addition, when also possessing the cleaning fluid of the CP of Washing cup section to the remover liquid nozzle section 56 of substrate S ejection, can be by the rotation of substrate S, the cleaning fluid that is ejected on the substrate S is dispersed the resettlement section 53 in the cup CP1 to the inside.Thus, can the effective cleaning cup CP of section.
Remove device EBR about circumference, have by the peripheral part with substrate S and be immersed in the lysate, when removing the 58a of the section of removing of aqueous body, can effectively remove the aqueous body that is coated in peripheral part.In addition, when having the 58b of attraction section of the peripheral part that attracts substrate S, can promptly remove aqueous body or lysate that the peripheral part at substrate S adheres to.
Technical scope of the present invention is not limited to above-mentioned execution mode, can suitably apply change in the scope that does not break away from aim of the present invention.
For example, in the above-described embodiment, be used for the nozzle of the cleaning fluid of the CP of Washing cup section as ejection, configured remover liquid nozzle section 56, but be not limited to this, for example, as remover liquid nozzle, dual-purpose said nozzle 52 is also harmless.In this case, configuration can switch to the switching mechanism (not shown) for feeding and cleaning fluid of nozzle 52.Thus, can complicated apparatus structure, can effectively safeguard.
In addition, in the above-described embodiment, with the position configuration of spray nozzle part NZ the rotating shaft of substrate S-the Z side, spray aqueous body along gravity direction, but be not limited to this, for example, with the position configuration of spray nozzle part NZ the rotating shaft of substrate S+the Z side, spray aqueous body to the direction opposite with gravity direction also harmless.
In addition, in the above-described embodiment, nozzle 52 bending in bending part 52b, but be not limited to this, for example, nozzle 52 to the rotating shaft of substrate S-the Z side is also harmless with the structure that curve-like forms.Thus, can make the circulation of aqueous body smooth and easy.
In addition, in the above-described embodiment, nozzle 52 is disposed at identical position in the face side of substrate S with rear side, but is not limited to this, and is for example, that the position configuration of the position of the face side of nozzle 52 and rear side is also harmless in different positions.For example, about the coating position 50+the X side, nozzle 52 is configured in substrate S rotating shaft-the Z side, about the coating position 50-the X side, nozzle 52 is configured in substrate S rotating shaft+the Z side is also harmless.Certainly, make+the Z side and-configuration of Z side is also harmless on the contrary.
In addition, in the above-described embodiment, with the NM of nozzle management organization be disposed at respectively each spray nozzle part NZ+position of Y side, but be not limited to this, so long as can carry out the scope of the movement of spray nozzle part NZ, just can be disposed at other positions.
In addition, in the above-described embodiment, in the time of in the CP of Washing cup section, use remover liquid nozzle section 56 to substrate S ejection cleaning fluid, by being not limited to this, for example, the substrate of cleaning fluid ejection usefulness that will be different from substrate S is disposed at coating position 50, and is also harmless to the substrate ejection cleaning fluid of this cleaning fluid ejection usefulness.Thus, can suppress the consumption that film forms the substrate S that uses in addition.
In addition, in the above-described embodiment, remove in the structure of device EBR at circumference, be disposed at the direction vertical with respect to the real estate of substrate S with removing the 58a of section with the 58b of attraction section, but be not limited to this, for example, as shown in figure 23, alignment arrangements is also harmless on real estate.In this structure, the circumference of a substrate S can be disposed at simultaneously remove in the 58a of section and the 58b of attraction section in.Thus, by making substrate S rotation, can when removing, attract circumference, can shorten the processing beat.
In addition, in the above-described embodiment, the arm 31,41 of base board delivery device SC can moved with the parallel plane direction of XY, but be not limited to this, for example, make arm 31,41 move also harmless in Z-direction.This structure realizes by driving mechanism is set in arm 31,41 separately.Thus, arm 31,41 the expanded range that can move, therefore, maintaining part 32,42 the zone that can enter enlarge.Thus, can carry out more various action.
In addition, in the above-described embodiment, illustrated to make the travel mechanism 35 that arm 31,41 moves or make the rotating mechanisms 33 of maintaining part 32,42 rotations be configured in arm 31,41 inside, but be not limited to this, be disposed at arm 31,41 the outside is also harmless.Thus, can make arm 31,41 elongated, the burden in the time of can alleviating substrate and carry.
In addition, in the above-described embodiment, the thin thickness of the Thickness Ratio substrate S of inaccessible parts 37, but be not limited to this is so that the thickness of inaccessible parts 37 mode identical with the thickness of substrate S forms inaccessible parts 37 is also harmless.Also can access in this case the effect identical with above-mentioned execution mode.
In addition, in the above-described embodiment, inaccessible parts 37 are set to can be with respect to attracting parts 36 dismounting, but be not limited to this, for example inaccessible parts 37 and attract parts 36 integrated also harmless.In this case, do not need inaccessible parts 37 with respect to the operation that attracts parts 36 dismounting.In addition, form the structure that inaccessible parts 37 are not set also harmless.
In addition, in the above-described embodiment, as the shape of the slot part 36c that arranges at the adsorption plane 36e of adsorption section 36a, this slot part 36c has been described at the main example of looking lower form+shape, but has been not limited to this, can be other shapes.In this case, preferred disposition is that slot part 36c and substrate S's is surperficial overlapping under the state of adsorption plane 36e and substrate S butt.Thus, the surface of substrate S can be attracted reliably, therefore, the precision of absorption can be improved.
In addition, in the above-described embodiment, base board delivery device SC is disposed at two places in the substrate processing unit SPU, but is not limited to this, and for example to be disposed at a place also harmless for base board delivery device SC, is disposed at more than three places also harmless.
In addition, in the above-described embodiment, substrate is sent into unit LDU have belt transport mechanism and be illustrated as the example of box travel mechanism 11, but be not limited to this, except belt transport mechanism, for example, has a fork part that keeps sending into the holding section Cx of box C1 also harmless.As this fork part, for example, can form the structure identical with the box holding member 74 of box conveying device CC.Can utilize the fork part, keep sending into the holding section Cx with box C1, make it mobile in substrate is sent into unit LDU.This fork part can also be as the box travel mechanism 61 of substrate discharge unit ULU.Except the fork part, certainly can example such as, other conveying mechanisms such as track component or linear motor, cylinder etc.
In addition, in the above-described embodiment, sending into side buffer gear BF1 and sending among the side buffer gear BF2, send into box C1 and send the mechanism that the position of readiness with box C2 moves as making, be that example describes with conveyer belt 20a, 20b, 22a and 22b, but be not limited to this, for example, in sending into side buffer gear BF1, arrange make send into box C1 also harmless to the travel mechanism that position of readiness P1, position of readiness P2, position of readiness P4, position of readiness P2, position of readiness P3 move successively.In sending side buffer gear BF2 same arrange make send with box C2 also harmless to the travel mechanism that position of readiness P5, position of readiness P6, position of readiness P8, position of readiness P6, position of readiness P7 move successively.
As such travel mechanism, for example, can enumerate to have and keep sending into box C1, send the structure etc. of fork part of the holding section Cx of usefulness box C2.As this fork part, in the same manner as described above, for example, can form the structure identical with the box holding member 74 of box conveying device CC.
In addition, in the above-described embodiment, base board delivery device SC is disposed at two places in the substrate processing unit SPU, but is not limited to this, and for example, it is also harmless that base board delivery device SC is disposed at a place, is disposed at more than three places also harmless.
In addition, in the above-described embodiment, box C can accommodate with the state that substrate S is erect in Z-direction, to directly carry under the state of substrate S setting, but being not limited to this, also can be that box C can accommodate the real estate of substrate S along the parallel plane state of XY, directly carries under this state.
In addition, in the above-described embodiment, send into side conveying device SC1 and send side conveying device SC2 and keep separately substrate S respectively and make its rotation, but be not limited to this, for example, keep privately with the table of sending into side conveying device SC1 and send a substrate S of side conveying device SC2 double team and make its rotation also harmless.In this case, make and send into side conveying device SC1 and send that a side rotates on one's own initiative among the side conveying device SC2, the opposing party is rotated also harmless drivenly, two sides are rotated on one's own initiative also harmless.By with sending into side conveying device SC1 and sending the table back of the body that side conveying device SC2 keeps substrate S, can make the state of the face side of substrate S and the air-flow of rear side etc. do one's utmost to equate.The state of the two sides side by regulating substrate S can prevent the membranous different situation in the coating of the two sides of substrate S.
In addition, in the above-described embodiment, circumference is removed device EBR only be configured in and send side conveying device SC2 side, but be not limited to this, for example, also sending into side conveying device SC1 side configuration also harmless (the single-point line part of Fig. 1).By formation like this, for example, can make send into side conveying device SC1 and send side conveying device SC2 the two apply respectively the action and circumference remove action.
For example, utilization send into side conveying device SC1 apply action during, can utilize and send side conveying device SC2 and carry out circumference and remove action, on the contrary make send into side conveying device SC1 carry out circumference remove action during, can utilize and send side conveying device SC2 and apply action.Like this, alternately enter applying device CT by making two base board delivery device SC, can carry out parallel processing, therefore, can effectively process, can realize processing the further shortening of beat.
In addition, keep simultaneously a substrate S and make in the situation of its rotation with sending into side conveying device SC1 and sending side conveying device SC2 as described above, with circumference remove be arranged in the device EBR in the applying device CT also harmless.By this structure, with sending into side conveying device SC1 and sending that side conveying device SC2 keeps substrate S and apply action when making its rotation, after the coating action, can be with this coating action continuous and carry out circumference and remove action.Thus, can in a device, apply action and circumference and remove action, therefore, can realize the efficient activity of processing.In addition, remove action by in an applying device CT, applying action and circumference, for example, can be after having carried out that the coating action of a substrate S and circumference removed action, when utilization is sent side conveying device SC2 and sent this substrate S, utilize and send into side conveying device SC1 and send into the substrate S that next processes.Can carry out simultaneously therefore, can effectively processing based on the mounting action of sending into side conveying device SC1 with based on the unloading action of sending side conveying device SC2.
In addition, base plate processing system SYS is except the structure of above-mentioned execution mode, and also possessing on the substrate S that for example detects after coating is processed has the foreign matter detecting unit of foreign also harmless.If the substrate S after coating is processed is attached with foreign matter, then the processing after carrying out is for example impressed when processing, and substrate S may be damaged at the attachment position of this foreign matter.For this, by also possessing the foreign matter detecting unit that foreign is arranged on the substrate S after the coating of detecting is processed, can detect the substrate S that adheres to of such foreign matter, therefore the situation in the processing of impressing after can preventing from being used in, can avoid the breakage of substrate S.
In addition, in the situation that base plate processing system SYS possesses the foreign matter detecting unit, configure also harmless as the unit that is independent of above-mentioned objective table cell S TU, substrate processing unit SPU, substrate and sends into unit LDU, substrate discharge unit ULU, supply unit CRU this foreign matter detecting unit, for example, be disposed at the inside of substrate processing unit SPU also harmless.Preferably can be contained at the substrate S after the coating processing structure of carrying out the foreign matter detection before sending with box C2, but certainly can be for carrying out the structure that foreign matter detects to send the state of accommodating with box C2 at this.Form substrate S and be contained in and send with in the situation of carrying out the structure that foreign matter detects before the box C2, for example, can be contained in to send and use box C2 for possessing the substrate S that will not detect foreign matter, separately the structure of the recovering mechanism of recovery.
In the situation that being removed device EBR, circumference is disposed in the applying device CT, as its mode, for example, can enumerate the circumference of the shape identical with the nozzle that uses in the application being coated with of aqueous body removed with nozzle and be disposed at separately in the applying device CT, remove the structure etc. that sprays the lysate of aqueous body with nozzle from this circumference.In addition, be that remover liquid nozzle section 56 is also harmless with this lysate nozzle dual-purpose.In this case, the supply source of lysate is connected with remover liquid nozzle section 56, switches the supply source of the supply source of cleaning fluid and lysate and spray, thus, can from same remover liquid nozzle section's 56 ejection cleaning fluids and lysate the two.
In the situation that from remover liquid nozzle section 56 ejection lysates, for example, at first shown in Figure 24 A, the position T1 lysate does not contact with substrate S sprays lysates from remover liquid nozzle section 56 to control unit CNU.Then, shown in Figure 24 B, control unit CNU makes remover liquid nozzle section 56 move to the ejection position T2 to substrate S ejection with the state that has sprayed this lysate, in ejection position T2 the circumference of lysate to substrate S is sprayed.By such action, can prevent from dispersing from the lysate of remover liquid nozzle section 56 central portion to substrate S, can improve the degree of regulation of coating state of the peripheral part of substrate S.
In addition, keep privately and make in the situation of its rotation with the table of sending into side conveying device SC1 and send a substrate S of side conveying device SC2 double team, for example, can in sending into side conveying device SC1, attract substrate S, in sending side conveying device SC2, press substrate S.
Figure 16～Figure 18 is the figure of the structure of expression applying device CT.Applying device CT has: spray nozzle part NZ, the CP of cup section and the NM of nozzle management organization.
Spray nozzle part NZ is set to utilize box travel mechanism 51 to enter the central portion of the Y direction of coating position 50.Spray nozzle part NZ clip the coating position 50 be disposed at respectively+the X side and-the X side.Spray nozzle part NZ has as the aqueous body of the constituent material of this film nozzle 52 to the upper ejection of substrate S.Nozzle 52 is entering coating during the position, goes out the bending and forming among bending part 52b of aqueous body ground from the central portion side direction peripheral part side spray of substrate S.Nozzle 52 is disposed at-the Z side with respect to the rotating shaft of substrate S.Nozzle 52 is disposed at identical position in the face side (+X side) of substrate S with rear side (X side) take coating position 50 as benchmark, is configured to symmetry on X-direction.
The CP of cup section has inboard cup CP1 and outside cup CP2.Inboard cup CP1 forms circle in the situation that X-direction is observed, and the mode that is disposed at the side of the substrate S that applies position 50 with encirclement configures.Outside cup CP2 forms roughly square in the situation that X-direction is observed, and configures in the mode from the inboard cup of outside supporting CP1.Cup CP2 in the outside is such as the upper surface that is fixed in objective table cell S TU via support unit etc.
Inboard cup CP1 and outside cup CP2 form in the present embodiment, but certainly can be for separating the structure that forms.
Inboard cup CP1 has the resettlement section 53 of accommodating aqueous body.Be provided with the output mechanism 54 of at least one party in the gas of discharging in aqueous body and the resettlement section 53 in resettlement section 53.Output mechanism 54 is along the tangential direction setting of the periphery that forms circular inboard cup CP1.Output mechanism 54 is via resettlement section 53 interior are connected of outside cup CP2 with inboard cup CP1.As shown in figure 17, output mechanism 54 for example is provided with four altogether on each ground, each limit of outside cup CP2.As shown in figure 17, each output mechanism 54 is connected with discharge path respectively.Has collecting mechanism 55 as the gas-liquid separation mechanism of divided gas flow and liquid at each discharge path.Also have, to other output mechanisms 54 of Figure 16～Figure 18, omit the diagram of discharge path and collecting mechanism 55.
Namely be set to can be with respect to other part dismounting of inboard cup CP1 with the opposed part 53a of the sidepiece of substrate S among the inboard cup CP1 for the entrance of resettlement section 53.Inboard cup CP1 has the governor motion 53b of the opening size of regulating this opposed part 53a as shown in figure 20.Utilize this governor motion 53b, for example, can be according to the thickness of substrate S, regulate opening size or regulate according to the state that splashes of coating liquid.Inboard cup CP1 is provided with X-axis as shown in figure 17 as rotating shaft, makes this inboard cup CP1 to rotating mechanism (the second rotating mechanism) 53c along the direction rotation of the periphery of substrate S.Nozzle 52-the Y side is respectively arranged with the cleaning fluid of the CP of the cup section remover liquid nozzle section 56 to substrate S ejection.
The NM of nozzle management organization is constant with the ejection condition managing of nozzle 52.The NM of nozzle management organization has as shown in figure 21: cleaning part 57a, the 57b of attraction section and liquid receiving portion 57c.Cleaning part 57a impregnated in the cleaning fluid by the front end with nozzle 52 and cleans.The 57b of attraction section has the attracting pad 75d of the front end that attracts nozzle 52.Attracting pad 75d is connected with not shown suction pump etc.Liquid receiving portion 57c is the part of accepting from the aqueous body of nozzle 52 preparation properties ejection.
Circumference remove device EBR be arranged at applying device CT+the X side namely along substrate processing unit SPU-position on the end limit of Y side.It is the device of removing the film that forms at the circumference of substrate S that circumference is removed device EBR.Being preferably based on circumference, to remove that removing of device EBR process be to carry out during the film that substrate S forms is undried.Therefore, preferred circumference remove that device EBR is disposed at can be from the position of applying device CT with short time conveying substrate S.Circumference is removed device EBR as shown in figure 22, has the 58a of the section of removing and the 58b of attraction section.The section 58a of removing is for example by making substrate S rotation time, the circumference of this substrate S be impregnated in be dissolved in the film that substrate S circumference forms in the lysate and the part of removing.The 58b of attraction section has: the attracting pad 58c that attracts the circumference of substrate S.Attracting pad 58c is connected with not shown suction pump etc.
Spinning solution as the substrate S in the situation shown in Figure 16, for example, substrate processing unit SPU makes when the substrate S that the maintaining part 32 of sending into side conveying device SC1 keeps inserts in the cup CP of section, makes the maintaining part 42 of sending side conveying device SC2 press substrate S from the opposition side of maintaining part 32.Specifically, make the front end of maintaining part 42 to substrate S side shifting.Substrate processing unit SPU is judged as maintaining part 42 when the stroke of maintaining part 42 reaches the threshold value of regulation front end contacts with substrate S.
After this was judged, substrate processing unit SPU for example kept from the absorption of removing the substrate S of maintaining part 32 sides under the state of the pressing force of maintaining part 42 sides.After absorption was removed, substrate processing unit SPU inserted in the cup CP of section nozzle 52, makes substrate S rotation, begins the coating action.Like this, the absorption of releasing maintaining part 32 sides is also harmless before the rotation of substrate S.
In addition, after above-mentioned judgement, substrate processing unit SPU presses under the state of substrate S from maintaining part 42 sides at maintaining part 32 absorption substrate S, and S gives revolving force to substrate.After the rotation of substrate S became stable rotation from the acceleration rotation, substrate processing unit SPU removed the absorption of the substrate S of maintaining part 32 sides.Like this, the absorption of releasing maintaining part 32 sides is also harmless in the rotation of substrate S.
In addition, after above-mentioned judgement, substrate processing unit SPU makes maintaining part 32 and maintaining part 42 rotations under the state of maintaining part 32 absorption substrate S, begin the coating action.After the coating release, substrate processing unit SPU makes under the state of substrate S rotation, removes the absorption of the substrate S of maintaining part 32 sides.After the releasing of this absorption, substrate processing unit SPU carries out the rotation of the substrate S of certain hour.Like this, the absorption of removing maintaining part 32 sides after namely coating is processed in the rotation of substrate S is also harmless.
In these cases, the maintaining part 32 absorption substrate S that sending into side conveying device SC1, substrate S is pressed send the maintaining part 42 of side conveying device SC2, but be not limited to this, for example, substrate S is pressed send into the maintaining part 32 of side conveying device SC1, also harmless at the maintaining part 42 absorption substrate S that send side conveying device SC2.In addition, in the maintaining part 32 of sending into side conveying device SC1 and to send this two sides absorption substrate of maintaining part 42 S of side conveying device SC2 also harmless, substrate S is pressed also harmless from two sides.In addition, when using the second maintaining part 81 shown in Figure 14 or rotation maintaining part 82 shown in Figure 15 to keep substrate S, utilize above-mentioned spinning solution to make substrate S rotation also harmless.
In addition, in these cases, make substrate S when rotation, only drive send into side conveying device SC1 and send among the side conveying device SC2 side also can, driven in synchronism two sides also can.In the situation that driven in synchronism two sides are difficult to skid between substrate S and each maintaining part 32 and 42, can correspondingly reduce to the pressing force of substrate S.
Claims (28)
1. applying device wherein, has:
Rotating mechanism, its state of erectting with substrate make described substrate rotation;
Applying mechanism, it has in the rotation of described substrate the nozzle that sprays respectively aqueous body to surface and the back side of described substrate.
2. applying device according to claim 1, wherein,
Described rotating mechanism is to make described substrate rotation more than 70 ° and under the state of the angle below 90 ° described substrate is with respect to the horizontal plane erect.
3. applying device according to claim 1, wherein,
Described nozzle forms from the peripheral part side spray of the described substrate of central portion side direction of described substrate and goes out described aqueous body.
4. applying device according to claim 3, wherein,
Described nozzle forms from described central portion side direction described peripheral part side bending.
5. applying device according to claim 1, wherein,
The ejection face of the front end of described nozzle tilts with respect to the emission direction of aqueous body and forms.
6. applying device according to claim 1, wherein,
Described nozzle is arranged at downside with respect to the rotating shaft of described rotating mechanism.
7. applying device according to claim 1, wherein,
Described nozzle is disposed at same position in face side and the rear side of described substrate.
8. applying device according to claim 1, wherein,
Described applying mechanism has the travel mechanism that described nozzle is moved.
9. applying device according to claim 1, wherein,
Also possesses nozzle management organization, the state of the described nozzle of described nozzle management organization management.
10. applying device according to claim 9, wherein,
Described nozzle management organization has cleaning part, and described cleaning part impregnated in the cleaning fluid by the front end with described nozzle and cleans.
11. applying device according to claim 9, wherein,
Described nozzle management organization has the attraction section of the front end that attracts described nozzle.
12. applying device according to claim 9, wherein,
Described nozzle management organization has the liquid receiving portion of accepting from the described aqueous body of described nozzle preparation property ejection.
13. applying device according to claim 1, wherein,
Also possess a glass section, described cup section configures in the mode of the side that surrounds described substrate.
14. applying device according to claim 13, wherein,
Described cup section has the resettlement section of accommodating described aqueous body.
15. applying device according to claim 13, wherein,
Be set to can be with respect to other part dismounting of described cup section with the opposed part of the sidepiece of described substrate in the described cup section.
16. applying device according to claim 15, wherein,
Described cup section has the governor motion of the opening size of regulating described opposed part.
17. applying device according to claim 13, wherein,
Described cup section has inboard cup and outside cup,
Be provided with at described inboard cup and make this inboard cup at the second rotating mechanism that rotates along the direction of the periphery of described substrate.
18. applying device according to claim 14, wherein,
Described resettlement section has output mechanism, and described output mechanism is discharged at least a in the gas in described aqueous body and the described resettlement section.
19. applying device according to claim 18, wherein,
Described cup section forms circle,
Described output mechanism is along the tangential direction setting of the periphery of described cup section.
20. applying device according to claim 18, wherein,
Described output mechanism has gas-liquid separation mechanism at discharge path.
21. applying device according to claim 13, wherein,
Also possess remover liquid nozzle, described remover liquid nozzle sprays the cleaning fluid of described cup section to described substrate.
22. applying device according to claim 21, wherein,
As described remover liquid nozzle, use described nozzle.
23. applying device according to claim 1, wherein,
The adjustment part that also possesses the coating state of the peripheral part of adjusting described substrate.
24. applying device according to claim 23, wherein,
Described adjustment part has the section of removing, and the described section of removing impregnated in by the peripheral part with described substrate removes described aqueous body in the lysate.
25. applying device according to claim 24, wherein,
The described section of removing has the lysate nozzle of described lysate to the circumference ejection of described substrate.
26. applying device according to claim 25, wherein,
Described lysate nozzle can spray the cleaning fluid of described cup section.
27. applying device according to claim 25, wherein,
The described section of removing has control part, described control part does not spray described lysate with the position of described substrate contacts from described lysate nozzle at described lysate, and, under the state that has sprayed described lysate, make this lysate nozzle to the ejection position movement to described substrate ejection.
28. applying device according to claim 23, wherein,
Described adjustment part has the second attraction section of the peripheral part that attracts described substrate.
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008219562A JP5227701B2 (en) | 2008-08-28 | 2008-08-28 | Substrate processing system |
| JP2008-219562 | 2008-08-28 | ||
| JP2008219563A JP5425426B2 (en) | 2008-08-28 | 2008-08-28 | Coating device |
| JP2008-219563 | 2008-08-28 | ||
| JP2008-219561 | 2008-08-28 | ||
| JP2008219561 | 2008-08-28 | ||
| JP2009-143632 | 2009-06-16 | ||
| JP2009143632A JP5449876B2 (en) | 2008-08-28 | 2009-06-16 | Transport device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910167447 Division CN101661873B (en) | 2008-08-28 | 2009-08-25 | Substrate processing system, carrying device and coating device |
Publications (1)
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| CN103077911A true CN103077911A (en) | 2013-05-01 |
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| CN2012105800199A Pending CN103077911A (en) | 2008-08-28 | 2009-08-25 | Coating device |
| CN2012105803182A Pending CN103021918A (en) | 2008-08-28 | 2009-08-25 | A carrying device |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012105803182A Pending CN103021918A (en) | 2008-08-28 | 2009-08-25 | A carrying device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108855792B (en) * | 2018-08-20 | 2019-10-18 | 苏州贝爱特自动化科技有限公司 | Resin is coated with dry automatic machine in a kind of table |
| CN114007761A (en) * | 2019-08-22 | 2022-02-01 | 川崎重工业株式会社 | Sealing robot |
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| CN103021918A (en) | 2013-04-03 |
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Application publication date: 20130501 |