JPH10135300A - Automatic gaas wafer sticking equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce flaws to be generated on the surface of a GaAs wafer, by unifying an equipment which carries the GaAs wafer from a wafer cassette to a sticking plate and an equipment which spreads wax on the GaAs wafer in a wax vessel, in a single body. SOLUTION: A GaAs wafer accommodated in a wafer cassette 10 is pushed out on a stage 12. After that, the wafer 11 is sucked by vacuum with a carrying machine 13, and carried to a wax vessel 18. Wax is spread on the wafer 11, which is carried to a sticking plate 19. That is, the carrying machine 13 serves as a handler 3 and an inverting chuck 8 at the same time. The carrying machine 13 continuously enables the work for carrying a wafer and the work for spreading wax.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a GaAs wafer bonding apparatus, and more particularly to an automatic GaAs wafer bonding apparatus in which a wax coating apparatus and a GaAs wafer transfer apparatus are integrated.

[0002]

2. Description of the Related Art FIG. 3 is a perspective view of a conventional automatic sticking apparatus. Gallium arsenide (Ga) stored in the wafer cassette 1
As) The wafer 2 is vacuum-adsorbed by the handler 3 and transported to the spin chuck 6 for spin-coating the wax. The GaAs wafer 2 is placed on the spin chuck 6 by the handler 3, and after the handler 3 is stored, the GaAs wafer 2 is vacuum-sucked to the spin chuck 6.

Next, while the GaAs wafer 2 is being rotated by the spin motor 7, the wax is
It flows on the upper surface of the As wafer 2. After the wax application is completed, the wafer is conveyed to the reversing chuck 8 on the stage 5. The GaAs wafer 2 is vacuum-sucked by the reversing chuck 8, the chuck is reversed, and the GaAs wafer 2 is adhered to the attaching plate 9.

FIG. 4 is an explanatory diagram for explaining the flow of the operation of the conventional automatic sticking apparatus. It is also a flow chart showing how the GaAs wafer 2 moves. Description will be made from this viewpoint. The GaAs wafer 2 stored in the wafer cassette 1 is vacuum-sucked by the handler 3 and moves to the spin chuck 6. Here, the wafer is vacuum-adsorbed again and applied with wax, and then moved to the reversing chuck 8 by the stage 5. Here, after being vacuum-sucked three times, it is moved to the attaching plate 9.

[0005]

In the conventional automatic bonding apparatus, the GaAs wafer 2 has to contact many parts until the GaAs wafer 2 stored in the wafer cassette 1 is transferred to the bonding plate 9. . That is, since there are many portions that come into contact with the GaAs wafer 2, there is a very high possibility that foreign substances such as particles existing in the surrounding atmosphere will adhere to the GaAs wafer 2. If foreign matter adheres, the characteristics of the wafer deteriorate, which causes a problem.

[0006] Further, since the number of times of vacuum suction is as large as three times before the GaAs wafer 2 is stuck on the sticking plate 9, the surface of the GaAs wafer 2 is scratched by foreign substances adhering to the surfaces of the handler 3, the spin chuck 6 and the reversing chuck 8. It was likely.

[0007] Further, since it is necessary to perform vacuum suction three more times, there is a problem that the sticking speed is low, that is, the working time is long.

[0008] With regard to wax application, since vacuum suction is performed on the spin chuck 6 and wax is applied to the surface of the GaAs wafer 2 rotated by the spin motor 7 by the wax application device 4, the excess wax that has flowed out cannot be reused. There was also a problem.

Accordingly, an object of the present invention is to solve the above-mentioned disadvantages of the prior art, to reduce the scratches generated on the GaAs wafer surface, to shorten the working time, and to reuse the wax scattered by spin coating. Is to provide.

[0010]

According to the present invention, in order to achieve the above object, an apparatus for transporting a GaAs wafer stored in a wafer cassette to an attaching plate and a spin motor for applying and rotating wax are combined. A GaAs wafer automatic sticking apparatus was used. In addition, an automatic GaAs wafer attaching apparatus that transports the GaAs wafer stored in the wafer cassette to the attaching plate by one vacuum suction was used.

[0011] Further, a GaAs wafer vacuum-adsorbed to a spin motor via a spin chuck is lowered into a container filled with a wax liquid, and wax is applied to a lower surface of the GaAs wafer. A sticking device was used.

The GaAs wafer is characterized in that the number of times of vacuum suction of the GaAs wafer is made one and the bonding speed is increased.
An automatic wafer sticking device was used.

[0013] The vacuum-adsorbed GaAs wafer is placed in a wax container, and wax is applied to the wafer surface.
An automatic GaAs wafer attaching apparatus characterized in that the wafer is rotated in the wax container.

[0014]

FIG. 1 is a perspective view of an automatic GaAs wafer bonding apparatus according to the present invention. The GaAs wafer 11 stored in the wafer cassette 10 is pushed out to the stage 12. Then, the transporter 13 moves to just above the stage 12, the cylinder 17 descends, and the spin chuck 14
The aAs wafer 11 is vacuum-sucked. GaAs wafer 11
After the adsorption, the cylinder 17 rises. The adsorbed GaAs wafer 16 is transported to the wax container 18 containing the wax liquid, and then the cylinder 17 is lowered again to immerse the GaAs wafer surface in the wax liquid surface. When the wax adheres, the cylinder 17 is raised from the wax liquid level, and the GaAs wafer 16 is rotated by the spin motor 15 to scatter excess wax. The scattered wax is stored in the wax container 18. Thereafter, the GaAs wafer 16 is transferred to the attachment plate 19 and stamped on the attachment plate, and the operation is completed.

FIG. 2 is an explanatory diagram for explaining the flow of the operation of the GaAs wafer automatic bonding apparatus according to the present invention. 4 is a flowchart showing how the GaAs wafer moves as in FIG. To explain from this point of view, the GaAs wafer 11 stored in the wafer cassette 10 is pushed out to the stage 12, then is vacuum-sucked by the transfer device 13 and transferred to the wax container 18, where the wax is attached and transferred to the attaching plate 19. You. That is, the transporter 13 of the present invention plays the role of the handler 3 and the reversing chuck 8 of the conventional apparatus at the same time. Further, the transfer device 13 is designed so that the transfer of the GaAs wafer and the application of the wax can be performed continuously.
They are put together.

Compared with the conventional apparatus, the number of times of vacuum suction is drastically reduced from three times to one time, so that scratches on the GaAs wafer surface can be greatly reduced. Work time is about 1
/ 3, and foreign substances such as particles adhering during the work could be reduced.

Further, in addition to the above effects, the wax can be used effectively, so that the cost of the wafer can be reduced.

[0018]

According to the present invention, a device for transferring a GaAs wafer from a wafer cassette to a bonding plate and a device for applying wax to a GaAs wafer in a wax container are combined into one, and only one vacuum suction is performed. The following excellent effects are exhibited by using the GaAs wafer automatic sticking apparatus capable of performing all operations.

(1) Scratches and foreign substances adhering to the surface of the GaAs wafer can be significantly reduced. Thereby, the reliability of the wafer can be greatly improved.

(2) The sticking speed can be increased, that is, the working time can be shortened.

(3) When the wax is applied, the scattered wax can be reused.

(4) The cost of the wafer can be reduced by the above effect.

[Brief description of the drawings]

FIG. 1 is a perspective view of an automatic GaAs wafer bonding apparatus according to one embodiment of the present invention.

FIG. 2 is an explanatory diagram illustrating a flow of a work performed when a bonding operation is performed using the GaAs wafer automatic bonding apparatus according to one embodiment of the present invention.

FIG. 3 is a perspective view of a conventional GaAs wafer automatic attachment device.

FIG. 4 is an explanatory diagram for explaining a flow of work when performing a sticking operation using a conventional GaAs wafer automatic sticking apparatus.

[Explanation of symbols]

 Reference Signs List 1 wafer cassette 2 GaAs wafer 3 handler 4 wax coating device 5 stage 6 spin chuck 7 spin motor 8 reversing chuck 9 sticking plate 10 wafer cassette 11 GaAs wafer 12 stage 13 transfer machine 14 spin chuck 15 spin motor 16 GaAs wafer 17 cylinder 18 wax Container 19 Adhering plate

Claims (5)

[Claims] 1. An automatic GaAs wafer bonding apparatus comprising: a device for transporting a GaAs wafer stored in a wafer cassette to a bonding plate; and a spin motor for applying and rotating wax. 2. The GaAs wafer automatic bonding apparatus according to claim 1, wherein the GaAs wafer stored in the wafer cassette is transferred to the bonding plate by a single vacuum suction. 3. The method according to claim 1, wherein the GaAs wafer vacuum-adsorbed to the spin motor via a spin chuck is lowered into a container filled with a wax liquid, and wax is applied to a lower surface of the GaAs wafer. The GaAs wafer automatic attachment device according to the above. 4. The automatic GaAs wafer bonding apparatus according to claim 1, wherein the bonding speed is increased by making the number of vacuum suctions of the GaAs wafer one. 5. The GaAs wafer automatic attachment according to claim 1, wherein the vacuum-adsorbed GaAs wafer is placed in a wax container, wax is applied to the wafer surface, and the wafer is rotated in the wax container. apparatus.