TWI345284B - Substrate processing apparatus - Google Patents

Substrate processing apparatus Download PDF

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Publication number
TWI345284B
TWI345284B TW096103632A TW96103632A TWI345284B TW I345284 B TWI345284 B TW I345284B TW 096103632 A TW096103632 A TW 096103632A TW 96103632 A TW96103632 A TW 96103632A TW I345284 B TWI345284 B TW I345284B
Authority
TW
Taiwan
Prior art keywords
substrate
unit
transport
coating
processing apparatus
Prior art date
Application number
TW096103632A
Other languages
English (en)
Chinese (zh)
Other versions
TW200810004A (en
Inventor
Hiroki Mizuno
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200810004A publication Critical patent/TW200810004A/zh
Application granted granted Critical
Publication of TWI345284B publication Critical patent/TWI345284B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00Manipulators not otherwise provided for
    • B25J11/0095Manipulators transporting wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00Programme-controlled manipulators
    • B25J9/02Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041Cylindrical coordinate type
    • B25J9/042Cylindrical coordinate type comprising an articulated arm
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00Programme-controlled manipulators
    • B25J9/10Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063Transporting devices for sheet glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
TW096103632A 2006-04-17 2007-02-01 Substrate processing apparatus TWI345284B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006113415A JP4969138B2 (ja) 2006-04-17 2006-04-17 基板処理装置

Publications (2)

Publication Number Publication Date
TW200810004A TW200810004A (en) 2008-02-16
TWI345284B true TWI345284B (en) 2011-07-11

Family

ID=38759402

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096103632A TWI345284B (en) 2006-04-17 2007-02-01 Substrate processing apparatus

Country Status (4)

Country Link
JP (1) JP4969138B2 (ja)
KR (1) KR100795657B1 (ja)
CN (1) CN101060066B (ja)
TW (1) TWI345284B (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101520939B1 (ko) * 2008-09-12 2015-05-18 주식회사 디엠에스 슬릿코터
JP5537380B2 (ja) * 2009-11-16 2014-07-02 キヤノン株式会社 露光装置及びデバイス製造方法
KR101081883B1 (ko) 2009-12-21 2011-11-09 주식회사 케이씨텍 노즐 간극의 정밀제어가 가능한 기판 코터 장치
JP5417186B2 (ja) * 2010-01-08 2014-02-12 大日本スクリーン製造株式会社 基板処理装置
CN102320753A (zh) * 2011-08-09 2012-01-18 深圳市华星光电技术有限公司 玻璃基板的涂布设备及其涂布方法
KR102126421B1 (ko) * 2012-04-13 2020-06-24 가부시키가이샤 니콘 롤용 카세트 장치
CN102931120B (zh) * 2012-10-25 2017-09-29 上海集成电路研发中心有限公司 工件传输系统
KR101456471B1 (ko) * 2013-03-06 2014-10-31 (주) 티에이에스 이송 시스템
JP5735161B1 (ja) * 2014-07-08 2015-06-17 中外炉工業株式会社 塗布装置及びその改良方法
CN105363627A (zh) * 2015-10-09 2016-03-02 昆山希盟自动化科技有限公司 Ccd对位的loca贴合机
CN106585067A (zh) * 2015-10-19 2017-04-26 深圳莱宝高科技股份有限公司 一种面板处理装置及其处理方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2838345B2 (ja) * 1992-10-28 1998-12-16 東京エレクトロン株式会社 基板搬送装置
JP3094055B2 (ja) * 1993-05-18 2000-10-03 東京エレクトロン株式会社 フィルタ装置及びレジスト処理システム
JPH07297258A (ja) * 1994-04-26 1995-11-10 Tokyo Electron Ltd 板状体の搬送装置
JPH1022358A (ja) * 1996-06-28 1998-01-23 Dainippon Screen Mfg Co Ltd 基板処理装置
JP3571471B2 (ja) * 1996-09-03 2004-09-29 東京エレクトロン株式会社 処理方法,塗布現像処理システム及び処理システム
JP3622842B2 (ja) * 2000-12-11 2005-02-23 住友精密工業株式会社 搬送式基板処理装置
JP4003611B2 (ja) * 2002-10-28 2007-11-07 トヨタ自動車株式会社 発電電動装置
JP4080349B2 (ja) * 2003-02-21 2008-04-23 大日本スクリーン製造株式会社 減圧乾燥装置および被膜形成装置
JP2005142372A (ja) * 2003-11-06 2005-06-02 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP2005270932A (ja) * 2004-03-26 2005-10-06 Tokyo Electron Ltd 塗布膜形成装置

Also Published As

Publication number Publication date
KR100795657B1 (ko) 2008-01-21
JP4969138B2 (ja) 2012-07-04
CN101060066A (zh) 2007-10-24
TW200810004A (en) 2008-02-16
KR20070102933A (ko) 2007-10-22
JP2007287914A (ja) 2007-11-01
CN101060066B (zh) 2010-09-15

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