JPWO2020121857A1 - 光検出装置及び光検出装置の製造方法 - Google Patents

光検出装置及び光検出装置の製造方法 Download PDF

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Publication number
JPWO2020121857A1
JPWO2020121857A1 JP2020559152A JP2020559152A JPWO2020121857A1 JP WO2020121857 A1 JPWO2020121857 A1 JP WO2020121857A1 JP 2020559152 A JP2020559152 A JP 2020559152A JP 2020559152 A JP2020559152 A JP 2020559152A JP WO2020121857 A1 JPWO2020121857 A1 JP WO2020121857A1
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semiconductor layer
apd
main surface
semiconductor
peripheral carrier
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Japanese (ja)
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弘典 園部
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Hamamatsu Photonics KK
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Hamamatsu Photonics KK
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Publication of JPWO2020121857A1 publication Critical patent/JPWO2020121857A1/ja
Priority to JP2024071818A priority Critical patent/JP2024096235A/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/95—Circuit arrangements
    • H10F77/953—Circuit arrangements for devices having potential barriers
    • H10F77/959—Circuit arrangements for devices having potential barriers for devices working in avalanche mode
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J1/44—Electric circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
    • H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
    • H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
    • H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
    • H10F30/225—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier working in avalanche mode, e.g. avalanche photodiodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/103—Integrated devices the at least one element covered by H10F30/00 having potential barriers, e.g. integrated devices comprising photodiodes or phototransistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/107—Integrated devices having multiple elements covered by H10F30/00 in a repetitive configuration, e.g. radiation detectors comprising photodiode arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/10—Semiconductor bodies
    • H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
    • H10F77/148—Shapes of potential barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H10F77/241—Electrodes for devices having potential barriers comprising ring electrodes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J1/44—Electric circuits
    • G01J2001/444—Compensating; Calibrating, e.g. dark current, temperature drift, noise reduction or baseline correction; Adjusting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J1/44—Electric circuits
    • G01J2001/4446—Type of detector
    • G01J2001/446—Photodiode
    • G01J2001/4466—Avalanche

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Light Receiving Elements (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2020559152A 2018-12-12 2019-11-29 光検出装置及び光検出装置の製造方法 Pending JPWO2020121857A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024071818A JP2024096235A (ja) 2018-12-12 2024-04-25 光検出装置及び光検出装置の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018232895 2018-12-12
JP2018232895 2018-12-12
PCT/JP2019/046907 WO2020121857A1 (ja) 2018-12-12 2019-11-29 光検出装置及び光検出装置の製造方法

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JP2024071818A Pending JP2024096235A (ja) 2018-12-12 2024-04-25 光検出装置及び光検出装置の製造方法

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US (1) US12322744B2 (enExample)
EP (1) EP3896411B1 (enExample)
JP (2) JPWO2020121857A1 (enExample)
CN (1) CN113167643B (enExample)
WO (1) WO2020121857A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11901379B2 (en) * 2018-12-12 2024-02-13 Hamamatsu Photonics K.K. Photodetector
JP7455520B2 (ja) 2018-12-12 2024-03-26 浜松ホトニクス株式会社 光検出装置
US12080822B2 (en) * 2018-12-12 2024-09-03 Hamamatsu Photonics K.K. Photodetector and method for manufacturing photodetector
US12322744B2 (en) 2018-12-12 2025-06-03 Hamamatsu Photonics K.K. Photodetector and method for manufacturing photodetector
WO2020121851A1 (ja) 2018-12-12 2020-06-18 浜松ホトニクス株式会社 光検出装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5062389A (enExample) * 1973-10-01 1975-05-28
JPS60178673A (ja) * 1984-02-24 1985-09-12 Nec Corp アバランシフオトダイオ−ド
JPS61289677A (ja) * 1985-06-18 1986-12-19 Nippon Kogaku Kk <Nikon> 半導体光検出装置
JPS62239727A (ja) * 1986-04-11 1987-10-20 Nec Corp アバランシエホトダイオ−ドの利得制御方式
US4948989A (en) * 1989-01-31 1990-08-14 Science Applications International Corporation Radiation-hardened temperature-compensated voltage reference
JPH04256376A (ja) * 1991-02-08 1992-09-11 Hamamatsu Photonics Kk アバランシェホトダイオード及びその製造方法
JPH06224463A (ja) * 1993-01-22 1994-08-12 Mitsubishi Electric Corp 半導体受光装置
JP2004303878A (ja) * 2003-03-31 2004-10-28 Nippon Sheet Glass Co Ltd 受光素子アレイ

Family Cites Families (79)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1582850A (enExample) 1968-03-29 1969-10-10
GB1535824A (en) 1976-02-11 1978-12-13 Standard Telephones Cables Ltd Avalanche photodetector biassing system
US4181863A (en) 1976-04-03 1980-01-01 Ferranti Limited Photodiode circuit arrangements
GB1532262A (en) 1976-04-03 1978-11-15 Ferranti Ltd Photodiode circuit arrangements
GB1503088A (en) * 1976-07-22 1978-03-08 Standard Telephones Cables Ltd Avalanche photodetector
JPS5341280A (en) 1976-09-27 1978-04-14 Nippon Telegr & Teleph Corp <Ntt> Photodetecting system of multiplication constant control
JPS5916812Y2 (ja) 1978-06-27 1984-05-17 キヤノン株式会社 カメラの測光回路
JPS6017051B2 (ja) 1978-11-20 1985-04-30 東京光学機械株式会社 アバランシェ・ダイオ−ドの温度補償方法
JPS55127082A (en) 1979-03-23 1980-10-01 Nec Corp Bias voltage generating circuit of avalanche photodiode
SE417145B (sv) * 1979-05-30 1981-02-23 Asea Ab Lavinfotodiodanordning med en lavindiod och med organ for styrning av diodens multiplikationsfaktor
US4464048A (en) 1981-03-25 1984-08-07 Barr & Stroud Limited Laser rangefinders
JPS60180347A (ja) 1984-02-28 1985-09-14 Fujitsu Ltd アバランシエフオトダイオ−ドの温度補償回路
JPS60211886A (ja) 1984-04-05 1985-10-24 Nec Corp アバランシフオトダイオ−ドの製造方法
JPS6138975U (ja) 1984-08-09 1986-03-11 株式会社東芝 印刷配線板
JPS62279671A (ja) 1986-05-28 1987-12-04 Mitsubishi Electric Corp 固体撮像装置
JPH0828488B2 (ja) 1987-07-07 1996-03-21 富士通株式会社 半導体装置
JPH01118714A (ja) 1987-10-30 1989-05-11 Omron Tateisi Electron Co 光学式位置検出センサ
JPH0321082A (ja) 1989-06-19 1991-01-29 Fujitsu Ltd 光受信回路
JPH04111477A (ja) 1990-08-31 1992-04-13 Sumitomo Electric Ind Ltd 受光素子
JPH05235396A (ja) 1992-02-24 1993-09-10 Sumitomo Electric Ind Ltd 半導体受光装置
JP3121100B2 (ja) 1992-03-25 2000-12-25 株式会社日立製作所 固体撮像装置
JPH0763854A (ja) 1993-06-16 1995-03-10 Kansei Corp レーザー送受光装置
JP2686036B2 (ja) 1993-07-09 1997-12-08 浜松ホトニクス株式会社 アバランシェフォトダイオードのバイアス回路
JP3421103B2 (ja) 1993-12-20 2003-06-30 浜松ホトニクス株式会社 アバランシェフォトダイオードを用いた光検出回路
JPH07263653A (ja) 1994-03-17 1995-10-13 Hamamatsu Photonics Kk 固体撮像装置
JPH08207281A (ja) 1995-02-06 1996-08-13 Canon Inc インクジェット記録ヘッド
JPH10247717A (ja) 1997-03-04 1998-09-14 Matsushita Electron Corp 半導体装置
JP3479966B2 (ja) 1998-01-30 2003-12-15 住友電気工業株式会社 光電流モニタ回路及び光受信器
JPH11275755A (ja) 1998-03-19 1999-10-08 Fujitsu Ltd アバランシェフォトダイオード保護回路を有する光受信回路
JP2000171295A (ja) 1998-12-03 2000-06-23 Nec Corp Apdバイアス回路
JP3668926B2 (ja) 1999-08-27 2005-07-06 株式会社ルネサステクノロジ 光インタコネクション受信モジュール
US6313459B1 (en) 2000-05-31 2001-11-06 Nortel Networks Limited Method for calibrating and operating an uncooled avalanche photodiode optical receiver
JP3509851B2 (ja) 2000-12-28 2004-03-22 サンケン電気株式会社 電子回路装置及びこれを使用したスィチング回路装置
US20030117121A1 (en) 2001-12-20 2003-06-26 Prescott Daniel C. High-side current-sense circuit for precision application
KR100566197B1 (ko) 2003-01-02 2006-03-29 삼성전자주식회사 Apd 광수신기의 온도 보상 장치
JP2004281488A (ja) 2003-03-13 2004-10-07 Renesas Technology Corp 半導体装置及びその製造方法
JP4223304B2 (ja) 2003-03-19 2009-02-12 三菱電機株式会社 光受信器
JP3956923B2 (ja) 2003-09-19 2007-08-08 住友電気工業株式会社 アバランシェフォトダイオードのバイアス電圧制御回路
JP4399337B2 (ja) 2004-09-13 2010-01-13 株式会社フューチャービジョン 平面パターンを有する基板およびそれを用いた表示装置
JP2007266251A (ja) 2006-03-28 2007-10-11 Nippon Telegr & Teleph Corp <Ntt> 光半導体装置
CN101484999B (zh) 2006-07-03 2011-09-14 浜松光子学株式会社 光电二极管阵列
CN200950235Y (zh) 2006-09-25 2007-09-19 深圳飞通光电子技术有限公司 雪崩光电二极管的温度补偿偏压电路
CN200959101Y (zh) 2006-10-12 2007-10-10 宁波中科集成电路设计中心有限公司 一种雪崩光电二极管的温度补偿装置
JP4791334B2 (ja) 2006-12-11 2011-10-12 富士通オプティカルコンポーネンツ株式会社 光受信装置および光受信装置のバイアス電圧制御方法
JP4642047B2 (ja) 2007-06-15 2011-03-02 三洋電機株式会社 半導体装置
JP2009038157A (ja) 2007-07-31 2009-02-19 Sumitomo Electric Ind Ltd 受光素子アレイ、一次元受光素子アレイおよび二次元受光素子アレイ
CN102246058B (zh) * 2008-12-15 2014-06-11 皇家飞利浦电子股份有限公司 用于硅光电倍增管和其他单光子计数器的温度补偿电路
JP5483544B2 (ja) 2009-10-21 2014-05-07 住友電工デバイス・イノベーション株式会社 半導体受光装置
CN201601136U (zh) 2010-01-13 2010-10-06 山东交通职业学院 一种用于激光接收电路的温度补偿电路
US20120101614A1 (en) 2010-10-22 2012-04-26 Allan Ghaemi System and Method for Manufacturing Optical Network Components
JP5844580B2 (ja) 2011-09-05 2016-01-20 浜松ホトニクス株式会社 固体撮像素子及び固体撮像素子の実装構造
JP5926921B2 (ja) 2011-10-21 2016-05-25 浜松ホトニクス株式会社 光検出装置
JP5791461B2 (ja) 2011-10-21 2015-10-07 浜松ホトニクス株式会社 光検出装置
JP2013164263A (ja) 2012-02-09 2013-08-22 Mitsubishi Electric Corp 受光装置及び距離測定装置及び形状測定装置
JP5984617B2 (ja) 2012-10-18 2016-09-06 浜松ホトニクス株式会社 フォトダイオードアレイ
DE102013100696B3 (de) 2013-01-24 2013-11-07 Sick Ag Optoelektronischer Sensor und Verfahren zur Erfassung von Objekten in einem Überwachungsbereich
KR101448393B1 (ko) 2013-06-27 2014-10-08 단국대학교 천안캠퍼스 산학협력단 의료용 레이저 수신단의 apd 이득 안정화 방법
US9541656B2 (en) 2013-12-20 2017-01-10 General Electric Company System and method for compensating temperature gain variation in radiation detectors
CN103728030A (zh) 2013-12-20 2014-04-16 中国科学院合肥物质科学研究院 Apd温度自适应近红外单光子探测装置
JP2016061729A (ja) 2014-09-19 2016-04-25 株式会社東芝 光子検出素子、光子検出装置、及び放射線分析装置
CN106033225B (zh) 2015-03-16 2017-08-25 苏州旭创科技有限公司 低功耗apd偏压控制器与偏压控制方法及光电接收器
US10203400B2 (en) 2015-07-31 2019-02-12 Avago Technologies International Sales Pte. Limited Optical measurement system incorporating ambient light component nullification
US9954124B1 (en) 2016-01-08 2018-04-24 Board Of Trustees Of The University Of Alabama, For And On Behalf Of The University Of Alabama In Huntsville Thermo-compensated silicon photo-multiplier with on-chip temperature sensor
EP3493275B1 (en) 2016-07-27 2022-03-23 Hamamatsu Photonics K.K. Light detection device
SG11201906938WA (en) 2017-01-30 2019-08-27 Medibeacon Inc Method for non-invasive monitoring of fluorescent tracer agent with diffuse reflection corrections
JP6696695B2 (ja) 2017-03-16 2020-05-20 株式会社東芝 光検出装置およびこれを用いた被写体検知システム
JP6741703B2 (ja) 2017-03-31 2020-08-19 株式会社デンソー 光検出器
WO2019199796A1 (en) * 2018-04-09 2019-10-17 Innovusion Ireland Limited Compensation circuitry for lidar receiver systems and method of use thereof
JP2020043229A (ja) * 2018-09-11 2020-03-19 ソニーセミコンダクタソリューションズ株式会社 光源装置、センシングモジュール
KR102544296B1 (ko) 2018-09-13 2023-06-16 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 표면발광레이저 소자 및 이를 구비한 표면발광레이저 장치
US11901379B2 (en) * 2018-12-12 2024-02-13 Hamamatsu Photonics K.K. Photodetector
WO2020121851A1 (ja) * 2018-12-12 2020-06-18 浜松ホトニクス株式会社 光検出装置
US12080822B2 (en) * 2018-12-12 2024-09-03 Hamamatsu Photonics K.K. Photodetector and method for manufacturing photodetector
US11513002B2 (en) * 2018-12-12 2022-11-29 Hamamatsu Photonics K.K. Light detection device having temperature compensated gain in avalanche photodiode
JP7455520B2 (ja) * 2018-12-12 2024-03-26 浜松ホトニクス株式会社 光検出装置
US12322744B2 (en) 2018-12-12 2025-06-03 Hamamatsu Photonics K.K. Photodetector and method for manufacturing photodetector
WO2021084840A1 (ja) * 2019-10-29 2021-05-06 パナソニックIpマネジメント株式会社 フォトセンサ及びそれを用いた距離測定システム
JP7403386B2 (ja) * 2020-05-27 2023-12-22 三菱電機株式会社 半導体装置
US20230083263A1 (en) 2021-09-15 2023-03-16 Kabushiki Kaisha Toshiba Light detector, light detection system, lidar device, and mobile body

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5062389A (enExample) * 1973-10-01 1975-05-28
JPS60178673A (ja) * 1984-02-24 1985-09-12 Nec Corp アバランシフオトダイオ−ド
JPS61289677A (ja) * 1985-06-18 1986-12-19 Nippon Kogaku Kk <Nikon> 半導体光検出装置
JPS62239727A (ja) * 1986-04-11 1987-10-20 Nec Corp アバランシエホトダイオ−ドの利得制御方式
US4948989A (en) * 1989-01-31 1990-08-14 Science Applications International Corporation Radiation-hardened temperature-compensated voltage reference
JPH04256376A (ja) * 1991-02-08 1992-09-11 Hamamatsu Photonics Kk アバランシェホトダイオード及びその製造方法
JPH06224463A (ja) * 1993-01-22 1994-08-12 Mitsubishi Electric Corp 半導体受光装置
JP2004303878A (ja) * 2003-03-31 2004-10-28 Nippon Sheet Glass Co Ltd 受光素子アレイ

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WO2020121857A1 (ja) 2020-06-18
CN113167643A (zh) 2021-07-23
CN113167643B (zh) 2024-05-28
JP2024096235A (ja) 2024-07-12
US12322744B2 (en) 2025-06-03
EP3896411A4 (en) 2022-10-05
US20220020786A1 (en) 2022-01-20

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