JP6293443B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP6293443B2 JP6293443B2 JP2013194755A JP2013194755A JP6293443B2 JP 6293443 B2 JP6293443 B2 JP 6293443B2 JP 2013194755 A JP2013194755 A JP 2013194755A JP 2013194755 A JP2013194755 A JP 2013194755A JP 6293443 B2 JP6293443 B2 JP 6293443B2
- Authority
- JP
- Japan
- Prior art keywords
- oxide
- layer
- oxide layer
- semiconductor layer
- oxide semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/751—Insulated-gate field-effect transistors [IGFET] having composition variations in the channel regions
Landscapes
- Thin Film Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Bipolar Transistors (AREA)
- Noodles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013194755A JP6293443B2 (ja) | 2012-09-24 | 2013-09-20 | 半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012210230 | 2012-09-24 | ||
| JP2012210230 | 2012-09-24 | ||
| JP2013194755A JP6293443B2 (ja) | 2012-09-24 | 2013-09-20 | 半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018023798A Division JP2018125534A (ja) | 2012-09-24 | 2018-02-14 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014078706A JP2014078706A (ja) | 2014-05-01 |
| JP2014078706A5 JP2014078706A5 (enExample) | 2016-11-10 |
| JP6293443B2 true JP6293443B2 (ja) | 2018-03-14 |
Family
ID=50337992
Family Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013194755A Expired - Fee Related JP6293443B2 (ja) | 2012-09-24 | 2013-09-20 | 半導体装置 |
| JP2018023798A Withdrawn JP2018125534A (ja) | 2012-09-24 | 2018-02-14 | 半導体装置 |
| JP2019154377A Withdrawn JP2019197937A (ja) | 2012-09-24 | 2019-08-27 | 半導体装置 |
| JP2021106274A Withdrawn JP2021153204A (ja) | 2012-09-24 | 2021-06-28 | 半導体装置 |
| JP2023195053A Withdrawn JP2024016261A (ja) | 2012-09-24 | 2023-11-16 | 半導体装置 |
Family Applications After (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018023798A Withdrawn JP2018125534A (ja) | 2012-09-24 | 2018-02-14 | 半導体装置 |
| JP2019154377A Withdrawn JP2019197937A (ja) | 2012-09-24 | 2019-08-27 | 半導体装置 |
| JP2021106274A Withdrawn JP2021153204A (ja) | 2012-09-24 | 2021-06-28 | 半導体装置 |
| JP2023195053A Withdrawn JP2024016261A (ja) | 2012-09-24 | 2023-11-16 | 半導体装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (5) | US9269821B2 (enExample) |
| JP (5) | JP6293443B2 (enExample) |
| KR (3) | KR102210578B1 (enExample) |
| CN (2) | CN104662668B (enExample) |
| DE (1) | DE112013004655T5 (enExample) |
| TW (6) | TWI671910B (enExample) |
| WO (1) | WO2014046220A1 (enExample) |
Families Citing this family (45)
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| WO2014046222A1 (en) | 2012-09-24 | 2014-03-27 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| TWI671910B (zh) | 2012-09-24 | 2019-09-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| JP6283191B2 (ja) | 2012-10-17 | 2018-02-21 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| WO2014061762A1 (en) | 2012-10-17 | 2014-04-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| KR102220279B1 (ko) | 2012-10-19 | 2021-02-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 산화물 반도체막을 포함하는 다층막 및 반도체 장치의 제작 방법 |
| JP2014135478A (ja) | 2012-12-03 | 2014-07-24 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| WO2014103901A1 (en) | 2012-12-25 | 2014-07-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP2014143410A (ja) | 2012-12-28 | 2014-08-07 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| TWI646690B (zh) | 2013-09-13 | 2019-01-01 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| KR102244460B1 (ko) | 2013-10-22 | 2021-04-23 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| TWI721409B (zh) | 2013-12-19 | 2021-03-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| WO2015115330A1 (ja) * | 2014-01-31 | 2015-08-06 | 独立行政法人物質・材料研究機構 | 薄膜トランジスタ、酸化物半導体、およびその製造方法 |
| US9929279B2 (en) * | 2014-02-05 | 2018-03-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| TWI663726B (zh) | 2014-05-30 | 2019-06-21 | Semiconductor Energy Laboratory Co., Ltd. | 半導體裝置、模組及電子裝置 |
| US20160005871A1 (en) * | 2014-07-04 | 2016-01-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR20220069118A (ko) * | 2014-07-15 | 2022-05-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치와 그 제작 방법, 및 상기 반도체 장치를 포함하는 표시 장치 |
| KR102518392B1 (ko) * | 2014-12-16 | 2023-04-06 | 엘지디스플레이 주식회사 | 박막트랜지스터 어레이 기판 |
| CN107408579B (zh) | 2015-03-03 | 2021-04-02 | 株式会社半导体能源研究所 | 半导体装置、该半导体装置的制造方法或包括该半导体装置的显示装置 |
| JP6705663B2 (ja) * | 2015-03-06 | 2020-06-03 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
| KR20160114511A (ko) | 2015-03-24 | 2016-10-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치의 제작 방법 |
| US9806200B2 (en) | 2015-03-27 | 2017-10-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| WO2016199680A1 (ja) * | 2015-06-08 | 2016-12-15 | シャープ株式会社 | 半導体装置およびその製造方法 |
| US10714633B2 (en) | 2015-12-15 | 2020-07-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device |
| KR20240132126A (ko) | 2016-01-18 | 2024-09-02 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 금속 산화물막, 반도체 장치, 및 표시 장치 |
| WO2017149413A1 (en) * | 2016-03-04 | 2017-09-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US10516060B2 (en) * | 2016-03-11 | 2019-12-24 | Semiconductor Energy Laboratory Co., Ltd. | Composite and transistor |
| KR20180123028A (ko) | 2016-03-11 | 2018-11-14 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장비, 상기 반도체 장치의 제작 방법, 및 상기 반도체 장치를 포함하는 표시 장치 |
| KR102640383B1 (ko) | 2016-03-22 | 2024-02-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 및 상기 반도체 장치를 포함하는 표시 장치 |
| JP6668455B2 (ja) | 2016-04-01 | 2020-03-18 | 株式会社半導体エネルギー研究所 | 酸化物半導体膜の作製方法 |
| US20170338252A1 (en) * | 2016-05-17 | 2017-11-23 | Innolux Corporation | Display device |
| WO2017208109A1 (en) | 2016-06-03 | 2017-12-07 | Semiconductor Energy Laboratory Co., Ltd. | Sputtering target, oxide semiconductor, oxynitride semiconductor, and transistor |
| TWI726026B (zh) * | 2016-06-27 | 2021-05-01 | 日商半導體能源硏究所股份有限公司 | 電晶體以及半導體裝置 |
| TWI602306B (zh) * | 2016-07-05 | 2017-10-11 | 群創光電股份有限公司 | 陣列基板結構與顯示裝置 |
| CN109643735B (zh) | 2016-09-12 | 2022-12-16 | 株式会社半导体能源研究所 | 显示装置及电子设备 |
| JP2018129430A (ja) * | 2017-02-09 | 2018-08-16 | 株式会社ジャパンディスプレイ | 半導体装置 |
| US11530134B2 (en) | 2017-03-13 | 2022-12-20 | Semiconductor Energy Laboratory Co., Ltd. | Composite oxide comprising In and Zn, and transistor |
| US20180298520A1 (en) * | 2017-04-17 | 2018-10-18 | Nanjing University | Self-limited organic molecular beam epitaxy for precisely growing ultrathin C8-BTBT, PTCDA and their heterojunctions on surface |
| US11152513B2 (en) | 2017-09-05 | 2021-10-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| KR102393552B1 (ko) * | 2017-11-09 | 2022-05-02 | 엘지디스플레이 주식회사 | 수소 차단막을 갖는 박막 트랜지스터 및 이를 포함하는 표시장치 |
| JP6706638B2 (ja) * | 2018-03-07 | 2020-06-10 | シャープ株式会社 | 半導体装置およびその製造方法 |
| CN109103223B (zh) * | 2018-08-17 | 2021-03-02 | 京东方科技集团股份有限公司 | 一种oled发光器件及其制备方法 |
| US11031506B2 (en) | 2018-08-31 | 2021-06-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including transistor using oxide semiconductor |
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| KR102743089B1 (ko) * | 2023-08-10 | 2024-12-16 | 경북대학교 산학협력단 | 캐리어 농도가 수직적으로 제어된 전자소자 및 그 제조방법 |
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| TWI562361B (en) | 2012-02-02 | 2016-12-11 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
| CN107591316B (zh) | 2012-05-31 | 2021-06-08 | 株式会社半导体能源研究所 | 半导体装置 |
| WO2013179922A1 (en) | 2012-05-31 | 2013-12-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
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| KR102161077B1 (ko) | 2012-06-29 | 2020-09-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| JP6310194B2 (ja) | 2012-07-06 | 2018-04-11 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| KR20140009023A (ko) | 2012-07-13 | 2014-01-22 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| US20140027762A1 (en) | 2012-07-27 | 2014-01-30 | Semiconductor Energy Laboratory Co. Ltd. | Semiconductor device |
| JP6220597B2 (ja) | 2012-08-10 | 2017-10-25 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US9929276B2 (en) | 2012-08-10 | 2018-03-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| WO2014024808A1 (en) | 2012-08-10 | 2014-02-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| CN104584229B (zh) | 2012-08-10 | 2018-05-15 | 株式会社半导体能源研究所 | 半导体装置及其制造方法 |
| US9245958B2 (en) | 2012-08-10 | 2016-01-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| KR102171650B1 (ko) | 2012-08-10 | 2020-10-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| TWI671910B (zh) * | 2012-09-24 | 2019-09-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| WO2014046222A1 (en) | 2012-09-24 | 2014-03-27 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
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