JP5430846B2 - 半導体装置の作製方法 - Google Patents

半導体装置の作製方法 Download PDF

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Publication number
JP5430846B2
JP5430846B2 JP2007311892A JP2007311892A JP5430846B2 JP 5430846 B2 JP5430846 B2 JP 5430846B2 JP 2007311892 A JP2007311892 A JP 2007311892A JP 2007311892 A JP2007311892 A JP 2007311892A JP 5430846 B2 JP5430846 B2 JP 5430846B2
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layer
semiconductor
film
semiconductor element
inorganic insulating
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JP2009135350A (ja
JP2009135350A5 (enrdf_load_stackoverflow
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薫 土屋
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • H10D86/423Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices

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  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
  • Thin Film Transistor (AREA)
  • Dram (AREA)
JP2007311892A 2007-12-03 2007-12-03 半導体装置の作製方法 Expired - Fee Related JP5430846B2 (ja)

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JP2007311892A JP5430846B2 (ja) 2007-12-03 2007-12-03 半導体装置の作製方法

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JP2009135350A JP2009135350A (ja) 2009-06-18
JP2009135350A5 JP2009135350A5 (enrdf_load_stackoverflow) 2011-01-20
JP5430846B2 true JP5430846B2 (ja) 2014-03-05

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Families Citing this family (154)

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Publication number Priority date Publication date Assignee Title
JPWO2010140665A1 (ja) 2009-06-04 2012-11-22 三菱化学株式会社 周期表第13族金属化合物結晶の製造方法及び製造装置
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WO2011027664A1 (en) * 2009-09-04 2011-03-10 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device and method for manufacturing the same
KR102157249B1 (ko) * 2009-09-16 2020-09-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제조 방법
KR101056229B1 (ko) * 2009-10-12 2011-08-11 삼성모바일디스플레이주식회사 박막 트랜지스터, 그의 제조 방법 및 박막 트랜지스터를 구비하는 유기전계발광 표시 장치
CN102598248B (zh) * 2009-10-21 2015-09-23 株式会社半导体能源研究所 半导体器件
KR20240042555A (ko) * 2009-10-29 2024-04-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
SG10201406934WA (en) * 2009-10-29 2014-11-27 Semiconductor Energy Lab Semiconductor device
IN2012DN03080A (enrdf_load_stackoverflow) * 2009-10-30 2015-07-31 Semiconductor Energy Lab
WO2011052413A1 (en) * 2009-10-30 2011-05-05 Semiconductor Energy Laboratory Co., Ltd. Non-linear element, display device, and electronic device
MY163862A (en) * 2009-10-30 2017-10-31 Semiconductor Energy Lab Logic circuit and semiconductor device
CN102576708B (zh) * 2009-10-30 2015-09-23 株式会社半导体能源研究所 半导体装置
CN102598249B (zh) * 2009-10-30 2014-11-05 株式会社半导体能源研究所 半导体装置
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WO2011058913A1 (en) * 2009-11-13 2011-05-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
WO2011062029A1 (en) * 2009-11-18 2011-05-26 Semiconductor Energy Laboratory Co., Ltd. Memory device
KR101922849B1 (ko) * 2009-11-20 2018-11-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
CN102668077B (zh) * 2009-11-20 2015-05-13 株式会社半导体能源研究所 非易失性锁存电路和逻辑电路,以及使用其的半导体器件
KR102451852B1 (ko) 2009-11-20 2022-10-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
CN102640293B (zh) * 2009-11-27 2015-07-22 株式会社半导体能源研究所 半导体器件
CN104992962B (zh) 2009-12-04 2018-12-25 株式会社半导体能源研究所 半导体器件及其制造方法
WO2011068028A1 (en) * 2009-12-04 2011-06-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element, semiconductor device, and method for manufacturing the same
KR101945171B1 (ko) 2009-12-08 2019-02-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR101511076B1 (ko) * 2009-12-08 2015-04-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
IN2012DN04871A (enrdf_load_stackoverflow) * 2009-12-11 2015-09-25 Semiconductor Energy Laoboratory Co Ltd
KR101770976B1 (ko) * 2009-12-11 2017-08-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR101481399B1 (ko) * 2009-12-18 2015-01-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
CN102668377B (zh) * 2009-12-18 2015-04-08 株式会社半导体能源研究所 非易失性锁存电路和逻辑电路以及使用它们的半导体器件
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US8441009B2 (en) * 2009-12-25 2013-05-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
CN104716139B (zh) 2009-12-25 2018-03-30 株式会社半导体能源研究所 半导体装置
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EP2519969A4 (en) * 2009-12-28 2016-07-06 Semiconductor Energy Lab SEMICONDUCTOR COMPONENT
US8780629B2 (en) 2010-01-15 2014-07-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method thereof
MY160598A (en) 2010-01-20 2017-03-15 Semiconductor Energy Lab Semiconductor device
KR101861991B1 (ko) * 2010-01-20 2018-05-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 신호 처리 회로 및 신호 처리 회로를 구동하기 위한 방법
US8415731B2 (en) * 2010-01-20 2013-04-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor storage device with integrated capacitor and having transistor overlapping sections
WO2011093150A1 (en) * 2010-01-29 2011-08-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2011096270A1 (en) * 2010-02-05 2011-08-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CN106847816A (zh) 2010-02-05 2017-06-13 株式会社半导体能源研究所 半导体装置
KR20180028557A (ko) * 2010-02-05 2018-03-16 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제조 방법
KR101921618B1 (ko) * 2010-02-05 2018-11-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 구동 방법
KR101862823B1 (ko) * 2010-02-05 2018-05-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 구동 방법
KR101838130B1 (ko) * 2010-02-12 2018-03-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작방법
WO2011102183A1 (en) * 2010-02-19 2011-08-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR102049472B1 (ko) 2010-02-19 2019-11-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
CN102754163B (zh) * 2010-02-19 2015-11-25 株式会社半导体能源研究所 半导体器件
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WO2011114905A1 (en) 2010-03-19 2011-09-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device
WO2011114919A1 (en) 2010-03-19 2011-09-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101891065B1 (ko) * 2010-03-19 2018-08-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치 구동 방법
WO2011114868A1 (en) 2010-03-19 2011-09-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101884031B1 (ko) * 2010-04-07 2018-07-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 기억 장치
WO2011132590A1 (en) * 2010-04-23 2011-10-27 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
WO2011132591A1 (en) * 2010-04-23 2011-10-27 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
TWI511236B (zh) 2010-05-14 2015-12-01 Semiconductor Energy Lab 半導體裝置
WO2011145738A1 (en) * 2010-05-20 2011-11-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for driving semiconductor device
WO2011145468A1 (en) * 2010-05-21 2011-11-24 Semiconductor Energy Laboratory Co., Ltd. Memory device and semiconductor device
WO2011152286A1 (en) * 2010-06-04 2011-12-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2012002186A1 (en) * 2010-07-02 2012-01-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8519387B2 (en) * 2010-07-26 2013-08-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing
TWI565001B (zh) * 2010-07-28 2017-01-01 半導體能源研究所股份有限公司 半導體裝置及半導體裝置的驅動方法
US8422272B2 (en) 2010-08-06 2013-04-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method thereof
KR101809105B1 (ko) 2010-08-06 2017-12-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 집적 회로
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JP2013009285A (ja) * 2010-08-26 2013-01-10 Semiconductor Energy Lab Co Ltd 信号処理回路及びその駆動方法
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US8634228B2 (en) * 2010-09-02 2014-01-21 Semiconductor Energy Laboratory Co., Ltd. Driving method of semiconductor device
WO2012029638A1 (en) * 2010-09-03 2012-03-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8766253B2 (en) * 2010-09-10 2014-07-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2012256821A (ja) 2010-09-13 2012-12-27 Semiconductor Energy Lab Co Ltd 記憶装置
US8871565B2 (en) * 2010-09-13 2014-10-28 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP5710918B2 (ja) * 2010-09-13 2015-04-30 株式会社半導体エネルギー研究所 半導体装置及びその作製方法
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WO2012060253A1 (en) * 2010-11-05 2012-05-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
TWI541981B (zh) * 2010-11-12 2016-07-11 半導體能源研究所股份有限公司 半導體裝置
JP5908263B2 (ja) * 2010-12-03 2016-04-26 株式会社半導体エネルギー研究所 Dc−dcコンバータ
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US8883556B2 (en) * 2010-12-28 2014-11-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9443984B2 (en) * 2010-12-28 2016-09-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
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US8421071B2 (en) * 2011-01-13 2013-04-16 Semiconductor Energy Laboratory Co., Ltd. Memory device
KR102026718B1 (ko) 2011-01-14 2019-09-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 기억장치, 반도체 장치, 검출 방법
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WO2012102182A1 (en) 2011-01-26 2012-08-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
TWI602303B (zh) 2011-01-26 2017-10-11 半導體能源研究所股份有限公司 半導體裝置及其製造方法
WO2012102183A1 (en) 2011-01-26 2012-08-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
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JP5798933B2 (ja) * 2011-01-26 2015-10-21 株式会社半導体エネルギー研究所 信号処理回路
WO2012102281A1 (en) * 2011-01-28 2012-08-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
DE112012000601T5 (de) * 2011-01-28 2014-01-30 Semiconductor Energy Laboratory Co., Ltd. Verfahren zum Herstellen einer Halbleitervorrichtung sowie Halbleitervorrichtung
TWI520273B (zh) * 2011-02-02 2016-02-01 半導體能源研究所股份有限公司 半導體儲存裝置
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WO2012121265A1 (en) * 2011-03-10 2012-09-13 Semiconductor Energy Laboratory Co., Ltd. Memory device and method for manufacturing the same
US8772849B2 (en) 2011-03-10 2014-07-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device
JP2012209543A (ja) * 2011-03-11 2012-10-25 Semiconductor Energy Lab Co Ltd 半導体装置
TWI582999B (zh) * 2011-03-25 2017-05-11 半導體能源研究所股份有限公司 場效電晶體及包含該場效電晶體之記憶體與半導體電路
JP5883699B2 (ja) * 2011-04-13 2016-03-15 株式会社半導体エネルギー研究所 プログラマブルlsi
JP6023453B2 (ja) * 2011-04-15 2016-11-09 株式会社半導体エネルギー研究所 記憶装置
US9111795B2 (en) 2011-04-29 2015-08-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device with capacitor connected to memory element through oxide semiconductor film
WO2012157472A1 (en) * 2011-05-13 2012-11-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101946360B1 (ko) * 2011-05-16 2019-02-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 프로그래머블 로직 디바이스
US8779799B2 (en) * 2011-05-19 2014-07-15 Semiconductor Energy Laboratory Co., Ltd. Logic circuit
US8581625B2 (en) * 2011-05-19 2013-11-12 Semiconductor Energy Laboratory Co., Ltd. Programmable logic device
JP6091083B2 (ja) * 2011-05-20 2017-03-08 株式会社半導体エネルギー研究所 記憶装置
JP5947099B2 (ja) 2011-05-20 2016-07-06 株式会社半導体エネルギー研究所 半導体装置
US8610482B2 (en) * 2011-05-27 2013-12-17 Semiconductor Energy Laboratory Co., Ltd. Trimming circuit and method for driving trimming circuit
US8669781B2 (en) * 2011-05-31 2014-03-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6005401B2 (ja) * 2011-06-10 2016-10-12 株式会社半導体エネルギー研究所 半導体装置の作製方法
US9166055B2 (en) * 2011-06-17 2015-10-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8962386B2 (en) * 2011-11-25 2015-02-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8981367B2 (en) * 2011-12-01 2015-03-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6081171B2 (ja) 2011-12-09 2017-02-15 株式会社半導体エネルギー研究所 記憶装置
US8907392B2 (en) * 2011-12-22 2014-12-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device including stacked sub memory cells
US20130187150A1 (en) * 2012-01-20 2013-07-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9653614B2 (en) * 2012-01-23 2017-05-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP6088253B2 (ja) * 2012-01-23 2017-03-01 株式会社半導体エネルギー研究所 半導体装置
JP6088852B2 (ja) * 2012-03-01 2017-03-01 株式会社半導体エネルギー研究所 半導体装置の作製方法、及び半導体装置
JP2013232567A (ja) * 2012-04-30 2013-11-14 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
WO2013179922A1 (en) * 2012-05-31 2013-12-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP6224931B2 (ja) * 2012-07-27 2017-11-01 株式会社半導体エネルギー研究所 半導体装置
JP5656966B2 (ja) * 2012-12-05 2015-01-21 独立行政法人科学技術振興機構 電界効果トランジスタ及びその製造方法
JP5615894B2 (ja) * 2012-12-25 2014-10-29 独立行政法人科学技術振興機構 薄膜トランジスタの製造方法、アクチュエーターの製造方法及び光学デバイスの製造方法、並びに薄膜トランジスタ及び圧電式インクジェットヘッド
US20150008428A1 (en) * 2013-07-08 2015-01-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
JP6570817B2 (ja) 2013-09-23 2019-09-04 株式会社半導体エネルギー研究所 半導体装置
JP2015084418A (ja) 2013-09-23 2015-04-30 株式会社半導体エネルギー研究所 半導体装置
KR102472875B1 (ko) * 2013-12-26 2022-12-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR102529174B1 (ko) * 2013-12-27 2023-05-08 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP6446258B2 (ja) * 2013-12-27 2018-12-26 株式会社半導体エネルギー研究所 トランジスタ
JP6305067B2 (ja) * 2014-01-09 2018-04-04 株式会社東芝 半導体装置の製造方法
KR102252213B1 (ko) 2014-03-14 2021-05-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 회로 시스템
EP3123507A4 (en) 2014-03-27 2017-12-06 Intel Corporation Multi-device flexible electronics system on a chip (soc) process integration
WO2015170220A1 (en) 2014-05-09 2015-11-12 Semiconductor Energy Laboratory Co., Ltd. Memory device and electronic device
KR20170013240A (ko) * 2014-05-30 2017-02-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 이를 제조하기 위한 방법
US9455337B2 (en) * 2014-06-18 2016-09-27 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US9461179B2 (en) * 2014-07-11 2016-10-04 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor device (TFT) comprising stacked oxide semiconductor layers and having a surrounded channel structure
TWI766298B (zh) * 2014-11-21 2022-06-01 日商半導體能源研究所股份有限公司 半導體裝置
JP6613116B2 (ja) * 2014-12-02 2019-11-27 株式会社半導体エネルギー研究所 半導体装置、及び半導体装置の作製方法
US10056497B2 (en) * 2015-04-15 2018-08-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP6583812B2 (ja) * 2015-06-24 2019-10-02 国立研究開発法人物質・材料研究機構 多層構成の薄膜トランジスタの製造方法
US9773787B2 (en) 2015-11-03 2017-09-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, memory device, electronic device, or method for driving the semiconductor device
JP2017162852A (ja) * 2016-03-07 2017-09-14 株式会社ジャパンディスプレイ 半導体装置および表示装置
EP3504738A4 (en) * 2016-08-26 2020-09-02 INTEL Corporation INTEGRATED CIRCUIT DEVICE STRUCTURES AND DOUBLE-SIDED MANUFACTURING TECHNIQUES
KR102605250B1 (ko) * 2016-08-30 2023-11-27 삼성디스플레이 주식회사 반도체 장치 및 그 제조 방법
JP6832656B2 (ja) * 2016-09-14 2021-02-24 株式会社ジャパンディスプレイ 半導体装置の製造方法
JP6448743B2 (ja) * 2017-10-30 2019-01-09 株式会社半導体エネルギー研究所 半導体装置
JP7085352B2 (ja) * 2018-01-15 2022-06-16 株式会社ジャパンディスプレイ 表示装置
CN116544246A (zh) * 2023-07-07 2023-08-04 深圳市华星光电半导体显示技术有限公司 阵列基板及显示面板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2603623B2 (ja) * 1986-11-14 1997-04-23 シャープ株式会社 三次元半導体集積回路の製造方法
DE4400985C1 (de) * 1994-01-14 1995-05-11 Siemens Ag Verfahren zur Herstellung einer dreidimensionalen Schaltungsanordnung
JP3250722B2 (ja) * 1995-12-12 2002-01-28 キヤノン株式会社 Soi基板の製造方法および製造装置
JP4085459B2 (ja) * 1998-03-02 2008-05-14 セイコーエプソン株式会社 3次元デバイスの製造方法
JP4478268B2 (ja) * 1999-12-28 2010-06-09 セイコーエプソン株式会社 薄膜デバイスの製造方法
JP2003109773A (ja) * 2001-07-27 2003-04-11 Semiconductor Energy Lab Co Ltd 発光装置、半導体装置およびそれらの作製方法
US6821826B1 (en) * 2003-09-30 2004-11-23 International Business Machines Corporation Three dimensional CMOS integrated circuits having device layers built on different crystal oriented wafers
JP2006080314A (ja) * 2004-09-09 2006-03-23 Canon Inc 結合基板の製造方法

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