JP5136103B2 - 洗浄装置及びその方法、塗布、現像装置及びその方法、並びに記憶媒体 - Google Patents

洗浄装置及びその方法、塗布、現像装置及びその方法、並びに記憶媒体 Download PDF

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Publication number
JP5136103B2
JP5136103B2 JP2008030857A JP2008030857A JP5136103B2 JP 5136103 B2 JP5136103 B2 JP 5136103B2 JP 2008030857 A JP2008030857 A JP 2008030857A JP 2008030857 A JP2008030857 A JP 2008030857A JP 5136103 B2 JP5136103 B2 JP 5136103B2
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Japan
Prior art keywords
substrate
cleaning
holding means
substrate holding
back surface
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JP2008030857A
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English (en)
Japanese (ja)
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JP2009194034A (ja
Inventor
太郎 山本
直人 吉高
修一 錦戸
容一 徳永
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Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2008030857A priority Critical patent/JP5136103B2/ja
Priority to KR1020090008423A priority patent/KR101451442B1/ko
Priority to US12/366,198 priority patent/US8851092B2/en
Priority to TW098104343A priority patent/TWI401734B/zh
Publication of JP2009194034A publication Critical patent/JP2009194034A/ja
Application granted granted Critical
Publication of JP5136103B2 publication Critical patent/JP5136103B2/ja
Priority to US14/460,020 priority patent/US9120120B2/en
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/10—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
    • B05D3/105—Intermediate treatments
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
    • B05D3/065—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/06—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP2008030857A 2008-02-12 2008-02-12 洗浄装置及びその方法、塗布、現像装置及びその方法、並びに記憶媒体 Active JP5136103B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008030857A JP5136103B2 (ja) 2008-02-12 2008-02-12 洗浄装置及びその方法、塗布、現像装置及びその方法、並びに記憶媒体
KR1020090008423A KR101451442B1 (ko) 2008-02-12 2009-02-03 세정 장치 및 그 방법, 도포 현상 장치 및 그 방법, 및 기억 매체
US12/366,198 US8851092B2 (en) 2008-02-12 2009-02-05 Cleaning apparatus and cleaning method, coater/developer and coating and developing method, and computer readable storing medium
TW098104343A TWI401734B (zh) 2008-02-12 2009-02-11 洗淨裝置及其方法，塗佈，顯像裝置及其方法，以及記憶媒體
US14/460,020 US9120120B2 (en) 2008-02-12 2014-08-14 Cleaning apparatus and cleaning method, coater/developer and coating and developing method, and computer readable storing medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008030857A JP5136103B2 (ja) 2008-02-12 2008-02-12 洗浄装置及びその方法、塗布、現像装置及びその方法、並びに記憶媒体

Publications (2)

Publication Number Publication Date
JP2009194034A JP2009194034A (ja) 2009-08-27
JP5136103B2 true JP5136103B2 (ja) 2013-02-06

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Family Applications (1)

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JP2008030857A Active JP5136103B2 (ja) 2008-02-12 2008-02-12 洗浄装置及びその方法、塗布、現像装置及びその方法、並びに記憶媒体

Country Status (4)

Country Link
US (2) US8851092B2 (zh)
JP (1) JP5136103B2 (zh)
KR (1) KR101451442B1 (zh)
TW (1) TWI401734B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220053013A (ko) 2019-09-17 2022-04-28 가부시키가이샤 스크린 홀딩스 기판 세정 장치

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JP7001400B2 (ja) * 2017-09-11 2022-01-19 東京エレクトロン株式会社 基板処理装置
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JP7160624B2 (ja) * 2018-10-17 2022-10-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
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CN111570353A (zh) * 2019-10-28 2020-08-25 湖南科技学院 一种用于计算机硬件清洁维护系统
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JP2022189627A (ja) * 2021-06-11 2022-12-22 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
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KR20220053013A (ko) 2019-09-17 2022-04-28 가부시키가이샤 스크린 홀딩스 기판 세정 장치

Also Published As

Publication number Publication date
US20140352736A1 (en) 2014-12-04
JP2009194034A (ja) 2009-08-27
KR101451442B1 (ko) 2014-10-15
US8851092B2 (en) 2014-10-07
TW200949917A (en) 2009-12-01
US9120120B2 (en) 2015-09-01
TWI401734B (zh) 2013-07-11
KR20090087412A (ko) 2009-08-17
US20090202951A1 (en) 2009-08-13

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