JP4846285B2 - 基板固定トレイ及びこれを利用した基板整列システム - Google Patents
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
- H01J29/46—Arrangements of electrodes and associated parts for generating or controlling the ray or beam, e.g. electron-optical arrangement
- H01J29/70—Arrangements for deflecting ray or beam
- H01J29/72—Arrangements for deflecting ray or beam along one straight line or along two perpendicular straight lines
- H01J29/76—Deflecting by magnetic fields only
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2229/00—Details of cathode ray tubes or electron beam tubes
- H01J2229/70—Electron beam control outside the vessel
- H01J2229/703—Electron beam control outside the vessel by magnetic fields
- H01J2229/7031—Cores for field producing elements, e.g. ferrite
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53265—Means to assemble electrical device with work-holder for assembly
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Description
20 フレーム
30 シャドウマスク
50 固定部
52 磁石板
54 ゴム磁石
60 基板トレイ
62 ガイド手段
64 移送手段
66 ホルダー部材
68 付着部材
70 フレーム
71a、73a 加圧用凹溝
71b、73b 締結用凹溝
72 固定片
75 通孔
76 基準ピン
77 調整孔
78 基準孔
79 ガイド溝
80 マスクトレイ
82 マスクトレイのガイド手段
84 マスクトレイの移送手段
90 整列プレート
92 チャック
110、120、130、140 基板固定手段
111 挿入突起部
120 基板固定手段
131 挿入突起部
133 ガイド突起
134 凸部
135 引掛かり部材
136 弾性手段
410 トレイ支持手段
450 ロボットアーム
475 基板ハンドラー
477 プッシュピン
530 基板クランププッシャー
534 凹部
a 凹溝の鉛直に形成された一側
b 凹溝の所定の間隔を持つ底面
c 凹溝の鉛直に傾斜を成して形成された他の一側
F1 チャックプレートの加圧による力
F2 基板固定手段の加圧による力
Claims (30)
- 鉛直に配置した基板を固定及び支持する基板固定トレイであって、
蒸着物が蒸着される基板と、
前記基板を収容するように構成されたフレームと、
前記フレームを収容するように構成されたトレイと、
前記基板を前記フレームに固定支持する少なくとも一つ以上の基板固定手段と、
を含んでなり、
前記フレームの、前記基板に面する側の面と、前記基板の、前記フレームに面する面と、が密着状態で固定されることを特徴とする基板固定トレイ。 - 前記基板固定手段は、前記基板の少なくとも一側から弾性力によって前記基板を前記フレームに加圧密着させるための加圧密着部材を含むことを特徴とする、請求項1に記載の基板固定トレイ。
- 前記加圧密着部材は、弾性手段を具備することを特徴とする、請求項2に記載の基板固定トレイ。
- 前記加圧密着部材は、尾端に挿入突起部を具備し、
前記弾性手段によってフレームと弾性固定させ、
前記フレームには前記挿入突起部を挟持する加圧用凹溝と、解除用凹溝と、をそれぞれ形成し、
前記基板を加圧密着する際には前記挿入突起部を前記加圧用凹溝に挿入し、
前記基板を解除する際には前記挿入突起部を前記解除用凹溝に挿入することを特徴とする、請求項3に記載の基板固定トレイ。 - 前記加圧密着部材は、引掛り部材が安着される連結孔を形成し、前記引掛り部材にばね部材を係止して前記フレームと弾性連結することを特徴とする、請求項4に記載の基板固定トレイ。
- 前記基板固定手段は、前記基板の一側から前記基板の側部を支持する少なくとも一つ以上の側部支持体を含むことを特徴とする、請求項1に記載の基板固定トレイ。
- 前記基板固定手段は、前記基板の下部から前記基板を安着支持するように少なくとも一つ以上の下部支持体を含むことを特徴とする、請求項1に記載の基板固定トレイ。
- 前記下部支持体には、基板が安着される凹溝を形成し、
前記凹溝は安着される基板の遊隔が可能にするために、少なくとも一側を傾斜して形成することを特徴とする、請求項7に記載の基板固定トレイ。 - 前記下部支持体の前記基板が安着される凹溝の入口は、丸型に形成することを特徴とする、請求項8に記載の基板固定トレイ。
- 前記フレーム上に前記基板を整列させるように構成される少なくとも一つ以上の基板整列手段をさらに含んでなることを特徴とする、請求項1に記載の基板固定トレイ。
- 前記基板整列手段は、
前記フレーム上の少なくとも一辺以上に、前記基板が前記フレームに安着時の基準点を提示するように構成される基準要素と、
前記フレーム上の少なくとも一辺以上に、前記基板が前記フレームに安着時の前記基板が前記基準要素に接触されるように該基板を調整する調整要素と、
を含んでなることを特徴とする、請求項10に記載の基板固定トレイ。 - 前記基準要素は、前記フレーム上の少なくとも一辺以上の基準点に形成された基準ピンであることを特徴とする、請求項11に記載の基板固定トレイ。
- 前記基準要素は、前記フレーム上の少なくとも一辺以上の基準点を通って基準棒が通過するように形成された基準孔であることを特徴とする、請求項11に記載の基板固定トレイ。
- 前記調整要素は、前記フレーム上の少なくとも一辺以上を通って調整棒が通過するように形成された調整孔であることを特徴とする、請求項11に記載の基板固定トレイ。
- 前記基板整列手段は、前記フレーム上の少なくとも2ケ所以上を通って基板ハンドラーが通過するように構成された通孔を含んでなることを特徴とする、請求項10に記載の基板固定トレイ。
- 前記基板固定手段は、前記フレーム上のいずれか一辺以上に、前記フレーム上に安着された前記基板を固定させることができるように構成されたクランプからなることを特徴とする、請求項10に記載の基板固定トレイ。
- 前記クランプは、前記基板の少なくとも一側で弾性力によって前記基板を前記フレームに加圧密着させるための加圧密着部材であることを特徴とする、請求項16に記載の基板固定トレイ。
- 前記加圧密着部材は、弾性手段を具備することを特徴とする、請求項17に記載の基板固定トレイ。
- 前記加圧密着部材は、尾端に挿入突起部を具備し、前記弾性手段によってフレームと弾性固定させ、
前記フレームには前記挿入突起部を挟持する溝が形成されることを特徴とする、請求項18に記載の基板固定トレイ。 - 前記加圧密着部材は、引っ掛かり部材が安着される連結孔を形成し、
前記引っ掛かり部材にばね部材を係止して前記フレームと弾性連結するように構成されることを特徴とする、請求項19に記載の基板固定トレイ。 - 前記加圧密着部材は、前記基板を加圧する第1位置及び前記基板引入時に指向される第2位置で相互連係動作されるように構成されることを特徴とする、請求項19に記載の基板固定トレイ。
- 前記加圧密着部材の相互連係動作は、連係基板クランププッシャーによってなされることを特徴とする、請求項21に記載の基板固定トレイ。
- 前記加圧密着部材の相互連係動作は、ガイド方式でなされることを特徴とする、請求項21に記載の基板固定トレイ。
- 前記ガイド方式は、
前記加圧密着部材の前記フレーム内に収納される前記挿入突起部上の少なくとも一つ以上に形成されたガイド突起と、
前記ガイド突起に係合するように前記フレーム内に形成されるガイド溝と、
からなることを特徴とする、請求項23に記載の基板固定トレイ。 - 前記ガイド方式は、
前記加圧密着部材の前記フレーム内に収納される前記挿入突起部上のいずれか一部位以上に形成されたガイド溝と、
前記ガイド溝に係合するように前記フレーム内に形成されるガイド突起と、
からなることを特徴とする、請求項23に記載の基板固定トレイ。 - 前記加圧密着部材の相互連係動作は、前記基板クランププッシャーで前記加圧密着部材を上下及び回転運動させることによってなされることを特徴とする、請求項22に記載の基板固定トレイ。
- 前記フレームを前記トレイに固定させるためのフレーム固定片をさらに含むことを特徴とする、請求項1から請求項26までのいずれか1項に記載の基板固定トレイ。
- 前記トレイは、移送手段をさらに含むことを特徴とする、請求項1から請求項26までのいずれか1項に記載の基板固定トレイ。
- 前記トレイの上部は、ガイド手段をさらに含むことを特徴とする、請求項1から請求項26までのいずれか1項に記載の基板固定トレイ。
- 請求項1から請求項26までのいずれか1項に記載の基板固定トレイと、
前記基板固定トレイに固定された前記基板のいずれか一面に圧着されるマスクと、
前記基板を加圧するように構成された平板チャック及び前記平板チャックに連結されて前記平板チャックを移動させるように構成された駆動手段と、を含み、
前記基板固定トレイを支持及び固定して整列させるための整列プレートと、を含んでなることを特徴とする基板整列システム。
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KR1020050000956A KR100583522B1 (ko) | 2005-01-05 | 2005-01-05 | 기판 고정 트레이, 이를 이용한 기판 정렬 시스템 및 그방법 |
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EP1953259B1 (en) * | 2007-02-02 | 2010-04-28 | Applied Materials, Inc. | Process chamber, inline coating installation and method for treating a substrate |
KR101246310B1 (ko) * | 2007-04-23 | 2013-03-21 | 가부시키가이샤 아루박 | 지지부재 및 캐리어와 지지방법 |
KR101569796B1 (ko) * | 2009-06-23 | 2015-11-20 | 주성엔지니어링(주) | 기판 정렬 장치, 이를 포함하는 기판 처리 장치 및 기판 정렬 방법 |
JP5731838B2 (ja) * | 2010-02-10 | 2015-06-10 | キヤノンアネルバ株式会社 | トレイ式基板搬送システム、成膜方法及び電子装置の製造方法 |
JP5546299B2 (ja) * | 2010-03-17 | 2014-07-09 | 株式会社アルバック | クランプ装置及び基板ホルダー |
CN102212783A (zh) * | 2010-04-12 | 2011-10-12 | 鸿富锦精密工业(深圳)有限公司 | 镀膜支架及镀膜机 |
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