CN1800443A - 基片固定盘及利用该基片固定盘的基片校正系统及其方法 - Google Patents
基片固定盘及利用该基片固定盘的基片校正系统及其方法 Download PDFInfo
- Publication number
- CN1800443A CN1800443A CNA2005101170513A CN200510117051A CN1800443A CN 1800443 A CN1800443 A CN 1800443A CN A2005101170513 A CNA2005101170513 A CN A2005101170513A CN 200510117051 A CN200510117051 A CN 200510117051A CN 1800443 A CN1800443 A CN 1800443A
- Authority
- CN
- China
- Prior art keywords
- substrate
- framework
- shaft collar
- pressurization
- dish
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 703
- 238000000034 method Methods 0.000 title abstract description 22
- 238000003780 insertion Methods 0.000 claims description 31
- 230000037431 insertion Effects 0.000 claims description 31
- 238000001704 evaporation Methods 0.000 claims description 17
- 230000008020 evaporation Effects 0.000 claims description 17
- 238000012937 correction Methods 0.000 claims description 15
- 230000001915 proofreading effect Effects 0.000 claims description 8
- 238000012546 transfer Methods 0.000 claims description 7
- 238000007740 vapor deposition Methods 0.000 abstract description 4
- 238000000151 deposition Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000005019 vapor deposition process Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 32
- 230000015572 biosynthetic process Effects 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 5
- 238000012856 packing Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
- H01J29/46—Arrangements of electrodes and associated parts for generating or controlling the ray or beam, e.g. electron-optical arrangement
- H01J29/70—Arrangements for deflecting ray or beam
- H01J29/72—Arrangements for deflecting ray or beam along one straight line or along two perpendicular straight lines
- H01J29/76—Deflecting by magnetic fields only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2229/00—Details of cathode ray tubes or electron beam tubes
- H01J2229/70—Electron beam control outside the vessel
- H01J2229/703—Electron beam control outside the vessel by magnetic fields
- H01J2229/7031—Cores for field producing elements, e.g. ferrite
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53265—Means to assemble electrical device with work-holder for assembly
Abstract
Description
Claims (33)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2005-0000956 | 2005-01-05 | ||
KR1020050000956 | 2005-01-05 | ||
KR1020050000956A KR100583522B1 (ko) | 2005-01-05 | 2005-01-05 | 기판 고정 트레이, 이를 이용한 기판 정렬 시스템 및 그방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1800443A true CN1800443A (zh) | 2006-07-12 |
CN1800443B CN1800443B (zh) | 2010-09-01 |
Family
ID=36639127
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005101170513A Active CN1800443B (zh) | 2005-01-05 | 2005-10-31 | 基片固定盘及利用该基片固定盘的基片校正系统及其方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8166641B2 (zh) |
JP (1) | JP4846285B2 (zh) |
KR (1) | KR100583522B1 (zh) |
CN (1) | CN1800443B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102212783A (zh) * | 2010-04-12 | 2011-10-12 | 鸿富锦精密工业(深圳)有限公司 | 镀膜支架及镀膜机 |
CN107686960A (zh) * | 2017-07-25 | 2018-02-13 | 武汉华星光电半导体显示技术有限公司 | 一种成膜装置 |
CN107761051A (zh) * | 2017-11-14 | 2018-03-06 | 合肥鑫晟光电科技有限公司 | 一种掩模版、掩模蒸镀组件及蒸镀装置 |
CN110205599A (zh) * | 2019-07-15 | 2019-09-06 | 云谷(固安)科技有限公司 | 基板承载台及蒸镀设备 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE602007006147D1 (de) * | 2007-02-02 | 2010-06-10 | Applied Materials Inc | Prozesskammer, Inline-Beschichtungsanlage und Verfahren zur Behandlung eines Substrats |
JP5186491B2 (ja) * | 2007-04-23 | 2013-04-17 | 株式会社アルバック | キャリアと支持方法 |
KR101569796B1 (ko) * | 2009-06-23 | 2015-11-20 | 주성엔지니어링(주) | 기판 정렬 장치, 이를 포함하는 기판 처리 장치 및 기판 정렬 방법 |
JP5731838B2 (ja) * | 2010-02-10 | 2015-06-10 | キヤノンアネルバ株式会社 | トレイ式基板搬送システム、成膜方法及び電子装置の製造方法 |
JP5546299B2 (ja) * | 2010-03-17 | 2014-07-09 | 株式会社アルバック | クランプ装置及び基板ホルダー |
US9837295B2 (en) | 2010-04-15 | 2017-12-05 | Suss Microtec Lithography Gmbh | Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing |
US9859141B2 (en) | 2010-04-15 | 2018-01-02 | Suss Microtec Lithography Gmbh | Apparatus and method for aligning and centering wafers |
KR101366839B1 (ko) * | 2012-03-30 | 2014-02-26 | (주)에스엔텍 | 고온 공정용 트레이 |
US9082799B2 (en) * | 2012-09-20 | 2015-07-14 | Varian Semiconductor Equipment Associates, Inc. | System and method for 2D workpiece alignment |
KR101381679B1 (ko) * | 2013-03-12 | 2014-04-04 | 주식회사 선익시스템 | 기판 파손을 방지하는 기판 탈부착 장치 |
KR20150132414A (ko) * | 2013-03-15 | 2015-11-25 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판용 캐리어 및 기판 운반 방법 |
KR101458719B1 (ko) * | 2013-10-02 | 2014-11-05 | 현대중공업 주식회사 | 이송암 원점 조정장치 및 이송암 원점 조정방법 |
KR101827527B1 (ko) * | 2016-04-26 | 2018-02-08 | 제이비코프레이션 주식회사 | 스퍼터용 기판 이송 트레이 |
JP6533835B2 (ja) * | 2017-01-31 | 2019-06-19 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 基板を処理する方法、及び基板を保持するための基板キャリア |
KR102099773B1 (ko) * | 2018-03-27 | 2020-04-10 | 하명순 | 멀티마스킹 지그장치 |
JP7292913B2 (ja) * | 2019-03-26 | 2023-06-19 | 株式会社アルバック | 真空装置、運搬装置、アラインメント方法 |
JP7263082B2 (ja) * | 2019-03-29 | 2023-04-24 | 株式会社アルバック | 真空装置、運搬装置、アラインメント方法 |
KR20210091557A (ko) * | 2020-01-14 | 2021-07-22 | 한국알박(주) | 트레이용 마그넷 클램프 |
CN114908329B (zh) * | 2021-02-08 | 2024-03-08 | 台湾积体电路制造股份有限公司 | 校正方法及半导体制造设备 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01226580A (ja) * | 1988-02-26 | 1989-09-11 | Yamaichi Electric Mfg Co Ltd | Icキャリア |
JPH0499275A (ja) * | 1990-08-10 | 1992-03-31 | Ulvac Japan Ltd | スパツタリング用基板搬送キヤリア |
JPH04110466A (ja) * | 1990-08-31 | 1992-04-10 | Oki Electric Ind Co Ltd | ウエハホルダー |
US5192087A (en) * | 1990-10-02 | 1993-03-09 | Nippon Steel Corporation | Device for supporting a wafer |
JPH10302257A (ja) * | 1997-04-24 | 1998-11-13 | Fuji Electric Co Ltd | 成膜用ディスクホルダ |
US5971156A (en) * | 1997-09-05 | 1999-10-26 | Kinetrix, Inc. | Semiconductor chip tray with rolling contact retention mechanism |
JP3075228B2 (ja) * | 1997-09-29 | 2000-08-14 | 日本電気株式会社 | 基板取付治具 |
JPH11163104A (ja) * | 1997-11-27 | 1999-06-18 | Sony Corp | 薄板状基板の表面処理装置における薄板状基板の保持装置 |
US6143147A (en) * | 1998-10-30 | 2000-11-07 | Tokyo Electron Limited | Wafer holding assembly and wafer processing apparatus having said assembly |
US6258228B1 (en) * | 1999-01-08 | 2001-07-10 | Tokyo Electron Limited | Wafer holder and clamping ring therefor for use in a deposition chamber |
KR100838065B1 (ko) * | 2002-05-31 | 2008-06-16 | 삼성에스디아이 주식회사 | 박막증착기용 고정장치와 이를 이용한 고정방법 |
US6786739B2 (en) * | 2002-09-30 | 2004-09-07 | Intel Corporation | Bridge clip with reinforced stiffener |
JP4331707B2 (ja) * | 2004-12-16 | 2009-09-16 | 三星モバイルディスプレイ株式會社 | 整列システム、垂直型トレイ移送装置及びこれを具備した蒸着装置 |
JP4364196B2 (ja) * | 2005-01-05 | 2009-11-11 | 三星モバイルディスプレイ株式會社 | トレイ用整列システム |
-
2005
- 2005-01-05 KR KR1020050000956A patent/KR100583522B1/ko active IP Right Grant
- 2005-07-11 JP JP2005202322A patent/JP4846285B2/ja active Active
- 2005-10-31 CN CN2005101170513A patent/CN1800443B/zh active Active
-
2006
- 2006-01-05 US US11/325,575 patent/US8166641B2/en active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102212783A (zh) * | 2010-04-12 | 2011-10-12 | 鸿富锦精密工业(深圳)有限公司 | 镀膜支架及镀膜机 |
CN107686960A (zh) * | 2017-07-25 | 2018-02-13 | 武汉华星光电半导体显示技术有限公司 | 一种成膜装置 |
CN107686960B (zh) * | 2017-07-25 | 2019-12-17 | 武汉华星光电半导体显示技术有限公司 | 一种成膜装置 |
CN107761051A (zh) * | 2017-11-14 | 2018-03-06 | 合肥鑫晟光电科技有限公司 | 一种掩模版、掩模蒸镀组件及蒸镀装置 |
CN107761051B (zh) * | 2017-11-14 | 2019-08-27 | 合肥鑫晟光电科技有限公司 | 一种掩模版、掩模蒸镀组件及蒸镀装置 |
CN110205599A (zh) * | 2019-07-15 | 2019-09-06 | 云谷(固安)科技有限公司 | 基板承载台及蒸镀设备 |
Also Published As
Publication number | Publication date |
---|---|
KR100583522B1 (ko) | 2006-05-25 |
JP4846285B2 (ja) | 2011-12-28 |
CN1800443B (zh) | 2010-09-01 |
US20060144738A1 (en) | 2006-07-06 |
JP2006188747A (ja) | 2006-07-20 |
US8166641B2 (en) | 2012-05-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1800443A (zh) | 基片固定盘及利用该基片固定盘的基片校正系统及其方法 | |
CN1088008C (zh) | 压层板的方法和设备 | |
CN1061929C (zh) | 使用分离薄膜的树脂模制装置 | |
CN1908780A (zh) | 用于制造接合基片的装置和方法 | |
CN1234111C (zh) | 装配磁头臂组件的方法和装置 | |
CN1655924A (zh) | 加热型真空压力加工装置 | |
CN1823399A (zh) | 元件安装设备和元件安装方法 | |
CN1422791A (zh) | 半导体晶片传输方法及采用该方法的半导体晶片传输装置 | |
CN1152811C (zh) | 集成电路组件处理器的托板搬运装置及其搬运方法 | |
CN101075037A (zh) | 显示装置 | |
CN1820357A (zh) | 晶片扩展装置、部件供给装置及晶片带的扩展方法 | |
CN1846994A (zh) | 印刷装置 | |
CN1720612A (zh) | 零件供给头装置、零件供给装置、零件安装装置、以及安装头部的移动方法 | |
CN1876393A (zh) | 用于生产芯片的加工设备、加工方法和工艺 | |
CN1742526A (zh) | 电路基板用部件、电路基板的制造方法及电路基板的制造装置 | |
CN1599047A (zh) | 半导体集成电路器件的制造方法 | |
CN1789484A (zh) | 校正系统、垂直型盘移送装置和具有该装置的蒸镀装置 | |
CN1796062A (zh) | 切断加工方法、切断加工装置及用于该切断加工装置的工件支撑结构 | |
CN1738516A (zh) | 基准位置决定方法及装置、印刷方法及装置、安装及处理方法 | |
CN1873423A (zh) | 电子元件自动移载装置 | |
CN1575124A (zh) | 基底保持器 | |
CN1991592A (zh) | 载物台装置 | |
CN1379249A (zh) | 半导体设备自动检查装置 | |
CN1717970A (zh) | 基板输送装置、零件装配装置、以及零件装配的基板输送方法 | |
CN1928475A (zh) | 减压干燥装置及基板干燥方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20090116 Address after: Gyeonggi Do Korea Suwon Applicant after: Samsung Mobile Display Co., Ltd. Address before: Gyeonggi Do, South Korea Applicant before: Samsung SDI Co., Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: SAMSUNG MOBILE DISPLAY CO., LTD. Free format text: FORMER OWNER: SAMSUNG SDI CO., LTD. Effective date: 20090116 |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CI01 | Publication of corrected invention patent application |
Correction item: Manual 11 Correct: Correct serial number False: Serial error Number: 35 Volume: 26 |
|
CI03 | Correction of invention patent |
Correction item: Manual 11 Correct: Correct serial number False: Serial error Number: 35 Page: Description Volume: 26 |
|
ERR | Gazette correction |
Free format text: CORRECT: FIGURE OF DESCRIPTION 11; FROM: SEQUENCE NUMBER IS WRONG TO: SEQUENCE NUMBER IS CORRECT |
|
ASS | Succession or assignment of patent right |
Owner name: SAMSUNG DISPLAY CO., LTD. Free format text: FORMER OWNER: SAMSUNG MOBILE DISPLAY CO., LTD. Effective date: 20121108 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20121108 Address after: South Korea Gyeonggi Do Yongin Patentee after: Samsung Display Co., Ltd. Address before: Gyeonggi Do Korea Suwon Patentee before: Samsung Mobile Display Co., Ltd. |