CN1800443B - 基片固定盘及利用该基片固定盘的基片校正系统及其方法 - Google Patents
基片固定盘及利用该基片固定盘的基片校正系统及其方法 Download PDFInfo
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- CN1800443B CN1800443B CN2005101170513A CN200510117051A CN1800443B CN 1800443 B CN1800443 B CN 1800443B CN 2005101170513 A CN2005101170513 A CN 2005101170513A CN 200510117051 A CN200510117051 A CN 200510117051A CN 1800443 B CN1800443 B CN 1800443B
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- 239000000758 substrate Substances 0.000 title claims abstract description 652
- 238000000034 method Methods 0.000 title abstract description 22
- 238000003780 insertion Methods 0.000 claims description 26
- 230000037431 insertion Effects 0.000 claims description 26
- 238000001704 evaporation Methods 0.000 claims description 17
- 230000008020 evaporation Effects 0.000 claims description 17
- 230000001915 proofreading effect Effects 0.000 claims description 8
- 238000007740 vapor deposition Methods 0.000 abstract description 4
- 238000000151 deposition Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000005019 vapor deposition process Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 32
- 238000012937 correction Methods 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 9
- 238000012546 transfer Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000012856 packing Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
- H01J29/46—Arrangements of electrodes and associated parts for generating or controlling the ray or beam, e.g. electron-optical arrangement
- H01J29/70—Arrangements for deflecting ray or beam
- H01J29/72—Arrangements for deflecting ray or beam along one straight line or along two perpendicular straight lines
- H01J29/76—Deflecting by magnetic fields only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2229/00—Details of cathode ray tubes or electron beam tubes
- H01J2229/70—Electron beam control outside the vessel
- H01J2229/703—Electron beam control outside the vessel by magnetic fields
- H01J2229/7031—Cores for field producing elements, e.g. ferrite
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53265—Means to assemble electrical device with work-holder for assembly
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050000956A KR100583522B1 (ko) | 2005-01-05 | 2005-01-05 | 기판 고정 트레이, 이를 이용한 기판 정렬 시스템 및 그방법 |
KR1020050000956 | 2005-01-05 | ||
KR10-2005-0000956 | 2005-01-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1800443A CN1800443A (zh) | 2006-07-12 |
CN1800443B true CN1800443B (zh) | 2010-09-01 |
Family
ID=36639127
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005101170513A Active CN1800443B (zh) | 2005-01-05 | 2005-10-31 | 基片固定盘及利用该基片固定盘的基片校正系统及其方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8166641B2 (zh) |
JP (1) | JP4846285B2 (zh) |
KR (1) | KR100583522B1 (zh) |
CN (1) | CN1800443B (zh) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1953259B1 (en) * | 2007-02-02 | 2010-04-28 | Applied Materials, Inc. | Process chamber, inline coating installation and method for treating a substrate |
KR101246310B1 (ko) * | 2007-04-23 | 2013-03-21 | 가부시키가이샤 아루박 | 지지부재 및 캐리어와 지지방법 |
KR101569796B1 (ko) * | 2009-06-23 | 2015-11-20 | 주성엔지니어링(주) | 기판 정렬 장치, 이를 포함하는 기판 처리 장치 및 기판 정렬 방법 |
JP5731838B2 (ja) * | 2010-02-10 | 2015-06-10 | キヤノンアネルバ株式会社 | トレイ式基板搬送システム、成膜方法及び電子装置の製造方法 |
JP5546299B2 (ja) * | 2010-03-17 | 2014-07-09 | 株式会社アルバック | クランプ装置及び基板ホルダー |
CN102212783A (zh) * | 2010-04-12 | 2011-10-12 | 鸿富锦精密工业(深圳)有限公司 | 镀膜支架及镀膜机 |
US9837295B2 (en) | 2010-04-15 | 2017-12-05 | Suss Microtec Lithography Gmbh | Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing |
US9859141B2 (en) | 2010-04-15 | 2018-01-02 | Suss Microtec Lithography Gmbh | Apparatus and method for aligning and centering wafers |
KR101366839B1 (ko) * | 2012-03-30 | 2014-02-26 | (주)에스엔텍 | 고온 공정용 트레이 |
US9082799B2 (en) * | 2012-09-20 | 2015-07-14 | Varian Semiconductor Equipment Associates, Inc. | System and method for 2D workpiece alignment |
KR101381679B1 (ko) * | 2013-03-12 | 2014-04-04 | 주식회사 선익시스템 | 기판 파손을 방지하는 기판 탈부착 장치 |
CN105189811B (zh) * | 2013-03-15 | 2017-06-09 | 应用材料公司 | 用于基板的运送器及运送基板的方法 |
KR101458719B1 (ko) * | 2013-10-02 | 2014-11-05 | 현대중공업 주식회사 | 이송암 원점 조정장치 및 이송암 원점 조정방법 |
KR101827527B1 (ko) * | 2016-04-26 | 2018-02-08 | 제이비코프레이션 주식회사 | 스퍼터용 기판 이송 트레이 |
KR101952718B1 (ko) * | 2017-01-31 | 2019-02-27 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판을 프로세싱하는 방법 및 기판을 홀딩하기 위한 기판 캐리어 |
CN107686960B (zh) * | 2017-07-25 | 2019-12-17 | 武汉华星光电半导体显示技术有限公司 | 一种成膜装置 |
CN107761051B (zh) * | 2017-11-14 | 2019-08-27 | 合肥鑫晟光电科技有限公司 | 一种掩模版、掩模蒸镀组件及蒸镀装置 |
KR102099773B1 (ko) * | 2018-03-27 | 2020-04-10 | 하명순 | 멀티마스킹 지그장치 |
JP7292913B2 (ja) * | 2019-03-26 | 2023-06-19 | 株式会社アルバック | 真空装置、運搬装置、アラインメント方法 |
JP7263082B2 (ja) * | 2019-03-29 | 2023-04-24 | 株式会社アルバック | 真空装置、運搬装置、アラインメント方法 |
CN110205599A (zh) * | 2019-07-15 | 2019-09-06 | 云谷(固安)科技有限公司 | 基板承载台及蒸镀设备 |
KR20210091557A (ko) * | 2020-01-14 | 2021-07-22 | 한국알박(주) | 트레이용 마그넷 클램프 |
CN114908329B (zh) * | 2021-02-08 | 2024-03-08 | 台湾积体电路制造股份有限公司 | 校正方法及半导体制造设备 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6143147A (en) * | 1998-10-30 | 2000-11-07 | Tokyo Electron Limited | Wafer holding assembly and wafer processing apparatus having said assembly |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01226580A (ja) * | 1988-02-26 | 1989-09-11 | Yamaichi Electric Mfg Co Ltd | Icキャリア |
JPH0499275A (ja) * | 1990-08-10 | 1992-03-31 | Ulvac Japan Ltd | スパツタリング用基板搬送キヤリア |
JPH04110466A (ja) * | 1990-08-31 | 1992-04-10 | Oki Electric Ind Co Ltd | ウエハホルダー |
US5192087A (en) * | 1990-10-02 | 1993-03-09 | Nippon Steel Corporation | Device for supporting a wafer |
JPH10302257A (ja) * | 1997-04-24 | 1998-11-13 | Fuji Electric Co Ltd | 成膜用ディスクホルダ |
US5971156A (en) * | 1997-09-05 | 1999-10-26 | Kinetrix, Inc. | Semiconductor chip tray with rolling contact retention mechanism |
JP3075228B2 (ja) * | 1997-09-29 | 2000-08-14 | 日本電気株式会社 | 基板取付治具 |
JPH11163104A (ja) * | 1997-11-27 | 1999-06-18 | Sony Corp | 薄板状基板の表面処理装置における薄板状基板の保持装置 |
US6258228B1 (en) * | 1999-01-08 | 2001-07-10 | Tokyo Electron Limited | Wafer holder and clamping ring therefor for use in a deposition chamber |
KR100838065B1 (ko) * | 2002-05-31 | 2008-06-16 | 삼성에스디아이 주식회사 | 박막증착기용 고정장치와 이를 이용한 고정방법 |
US6786739B2 (en) * | 2002-09-30 | 2004-09-07 | Intel Corporation | Bridge clip with reinforced stiffener |
JP4331707B2 (ja) * | 2004-12-16 | 2009-09-16 | 三星モバイルディスプレイ株式會社 | 整列システム、垂直型トレイ移送装置及びこれを具備した蒸着装置 |
JP4364196B2 (ja) * | 2005-01-05 | 2009-11-11 | 三星モバイルディスプレイ株式會社 | トレイ用整列システム |
-
2005
- 2005-01-05 KR KR1020050000956A patent/KR100583522B1/ko active IP Right Grant
- 2005-07-11 JP JP2005202322A patent/JP4846285B2/ja active Active
- 2005-10-31 CN CN2005101170513A patent/CN1800443B/zh active Active
-
2006
- 2006-01-05 US US11/325,575 patent/US8166641B2/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6143147A (en) * | 1998-10-30 | 2000-11-07 | Tokyo Electron Limited | Wafer holding assembly and wafer processing apparatus having said assembly |
Also Published As
Publication number | Publication date |
---|---|
US8166641B2 (en) | 2012-05-01 |
CN1800443A (zh) | 2006-07-12 |
KR100583522B1 (ko) | 2006-05-25 |
JP4846285B2 (ja) | 2011-12-28 |
JP2006188747A (ja) | 2006-07-20 |
US20060144738A1 (en) | 2006-07-06 |
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