JP4271268B2 - イメージセンサおよびイメージセンサ一体型アクティブマトリクス型表示装置 - Google Patents

イメージセンサおよびイメージセンサ一体型アクティブマトリクス型表示装置 Download PDF

Info

Publication number
JP4271268B2
JP4271268B2 JP27345897A JP27345897A JP4271268B2 JP 4271268 B2 JP4271268 B2 JP 4271268B2 JP 27345897 A JP27345897 A JP 27345897A JP 27345897 A JP27345897 A JP 27345897A JP 4271268 B2 JP4271268 B2 JP 4271268B2
Authority
JP
Japan
Prior art keywords
light receiving
image sensor
electrically connected
extraction
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP27345897A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1197690A (ja
JPH1197690A5 (enExample
Inventor
宏勇 張
真之 坂倉
由里香 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP27345897A priority Critical patent/JP4271268B2/ja
Priority to US09/156,461 priority patent/US7046282B1/en
Publication of JPH1197690A publication Critical patent/JPH1197690A/ja
Publication of JPH1197690A5 publication Critical patent/JPH1197690A5/ja
Priority to US11/418,279 priority patent/US7286173B2/en
Priority to US11/838,600 priority patent/US7791117B2/en
Application granted granted Critical
Publication of JP4271268B2 publication Critical patent/JP4271268B2/ja
Priority to US12/875,537 priority patent/US8564035B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/809Constructional details of image sensors of hybrid image sensors
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/13306Circuit arrangements or driving methods for the control of single liquid crystal cells
    • G02F1/13312Circuits comprising photodetectors for purposes other than feedback
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1345Conductors connecting electrodes to cell terminals
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136286Wiring, e.g. gate line, drain line
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441Interconnections, e.g. scanning lines
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Thin Film Transistor (AREA)
JP27345897A 1997-09-20 1997-09-20 イメージセンサおよびイメージセンサ一体型アクティブマトリクス型表示装置 Expired - Lifetime JP4271268B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP27345897A JP4271268B2 (ja) 1997-09-20 1997-09-20 イメージセンサおよびイメージセンサ一体型アクティブマトリクス型表示装置
US09/156,461 US7046282B1 (en) 1997-09-20 1998-09-18 Image sensor and image sensor integrated type active matrix type display device
US11/418,279 US7286173B2 (en) 1997-09-20 2006-05-04 Image sensor and image sensor integrated type active matrix type display device
US11/838,600 US7791117B2 (en) 1997-09-20 2007-08-14 Image sensor and image sensor integrated type active matrix type display device
US12/875,537 US8564035B2 (en) 1997-09-20 2010-09-03 Image sensor and image sensor integrated type active matrix type display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27345897A JP4271268B2 (ja) 1997-09-20 1997-09-20 イメージセンサおよびイメージセンサ一体型アクティブマトリクス型表示装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008212007A Division JP5025596B2 (ja) 2008-08-20 2008-08-20 イメージセンサ

Publications (3)

Publication Number Publication Date
JPH1197690A JPH1197690A (ja) 1999-04-09
JPH1197690A5 JPH1197690A5 (enExample) 2005-06-02
JP4271268B2 true JP4271268B2 (ja) 2009-06-03

Family

ID=17528204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27345897A Expired - Lifetime JP4271268B2 (ja) 1997-09-20 1997-09-20 イメージセンサおよびイメージセンサ一体型アクティブマトリクス型表示装置

Country Status (2)

Country Link
US (4) US7046282B1 (enExample)
JP (1) JP4271268B2 (enExample)

Families Citing this family (94)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4044187B2 (ja) * 1997-10-20 2008-02-06 株式会社半導体エネルギー研究所 アクティブマトリクス型表示装置およびその作製方法
US7289083B1 (en) * 2000-11-30 2007-10-30 Palm, Inc. Multi-sided display for portable computer
US8384674B1 (en) 2001-01-30 2013-02-26 Hewlett-Packard Development Company, L.P. Integrated enclosure/touch screen assembly
US7348964B1 (en) * 2001-05-22 2008-03-25 Palm, Inc. Single-piece top surface display layer and integrated front cover for an electronic device
JP4485087B2 (ja) * 2001-03-01 2010-06-16 株式会社半導体エネルギー研究所 半導体装置の動作方法
JP4896302B2 (ja) * 2001-04-09 2012-03-14 株式会社半導体エネルギー研究所 半導体装置
US6992659B2 (en) 2001-05-22 2006-01-31 Palmone, Inc. High transparency integrated enclosure touch screen assembly for a portable hand held device
US7142195B2 (en) 2001-06-04 2006-11-28 Palm, Inc. Interface for interaction with display visible from both sides
US7852430B1 (en) 2001-11-29 2010-12-14 Palm, Inc. Light guide spacers for backlighting a reflective display
KR100869737B1 (ko) * 2001-12-29 2008-11-21 엘지디스플레이 주식회사 표시소자 및 그 제조방법
JP4401066B2 (ja) * 2002-11-19 2010-01-20 三洋電機株式会社 半導体集積装置及びその製造方法
US7253391B2 (en) 2003-09-19 2007-08-07 Semiconductor Energy Laboratory Co., Ltd. Optical sensor device and electronic apparatus
JP4827396B2 (ja) * 2003-10-06 2011-11-30 株式会社半導体エネルギー研究所 半導体装置の作製方法
CN100477240C (zh) * 2003-10-06 2009-04-08 株式会社半导体能源研究所 半导体器件以及制造该器件的方法
KR101002332B1 (ko) * 2003-12-30 2010-12-17 엘지디스플레이 주식회사 액정표시소자 및 그 제조방법
JP2006030889A (ja) * 2004-07-21 2006-02-02 Toshiba Matsushita Display Technology Co Ltd 液晶表示装置
JP4831456B2 (ja) * 2004-09-16 2011-12-07 カシオ計算機株式会社 画像読取装置
JP4817636B2 (ja) 2004-10-04 2011-11-16 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
JP4905762B2 (ja) * 2005-08-23 2012-03-28 富士フイルム株式会社 光電変換素子、撮像素子、および該光電変換素子の製造方法
KR100736086B1 (ko) * 2005-09-06 2007-07-06 삼성전자주식회사 엔트로피 코딩의 성능 향상 방법 및 장치, 상기 방법을이용한 비디오 코딩 방법 및 장치
TW200804900A (en) * 2006-07-07 2008-01-16 Innolux Display Corp Liquid crystal display device
JP2008122659A (ja) * 2006-11-13 2008-05-29 Seiko Epson Corp 液晶表示装置及び液晶表示装置の製造方法並びに電子機器
US8749483B2 (en) * 2007-02-15 2014-06-10 Pixart Imaging Inc. Control device and control method for image display
JP4793281B2 (ja) * 2007-02-21 2011-10-12 ソニー株式会社 撮像装置および表示装置
KR101441346B1 (ko) * 2007-04-27 2014-09-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
CN101600985B (zh) * 2007-05-18 2011-02-02 夏普株式会社 显示装置
WO2008143211A1 (ja) * 2007-05-18 2008-11-27 Sharp Kabushiki Kaisha 表示装置
WO2008143213A1 (ja) * 2007-05-18 2008-11-27 Sharp Kabushiki Kaisha 表示装置
JP5298461B2 (ja) * 2007-05-29 2013-09-25 セイコーエプソン株式会社 液晶装置及び電子機器
JP2009065160A (ja) * 2007-09-06 2009-03-26 Dongbu Hitek Co Ltd イメージセンサ及びその製造方法
KR100954927B1 (ko) * 2007-12-14 2010-04-27 주식회사 동부하이텍 이미지 센서 및 그 제조방법
KR100856948B1 (ko) * 2007-12-27 2008-09-04 주식회사 동부하이텍 이미지 센서 제조방법
JP5461719B2 (ja) * 2008-01-29 2014-04-02 富士フイルム株式会社 電磁波検出素子
JP5185013B2 (ja) * 2008-01-29 2013-04-17 富士フイルム株式会社 電磁波検出素子
JP5136112B2 (ja) * 2008-02-19 2013-02-06 セイコーエプソン株式会社 光電変換装置及び電気光学装置
WO2009105539A1 (en) * 2008-02-21 2009-08-27 Wms Gaming Inc. Gaming system having displays with integrated image capture capablities
JP5185014B2 (ja) * 2008-02-29 2013-04-17 富士フイルム株式会社 電磁波検出素子
JP2009252835A (ja) * 2008-04-02 2009-10-29 Fujifilm Corp 電磁波検出素子
US7955890B2 (en) * 2008-06-24 2011-06-07 Applied Materials, Inc. Methods for forming an amorphous silicon film in display devices
JP2010087332A (ja) * 2008-10-01 2010-04-15 Seiko Epson Corp 光電変換素子、光電変換装置、及びイメージセンサ
TWI373853B (en) * 2009-03-16 2012-10-01 Au Optronics Corp Active device array substrate and method for fabricating thereof
JP2010225618A (ja) * 2009-03-19 2010-10-07 Seiko Epson Corp センシング装置および電子機器
US8456586B2 (en) 2009-06-11 2013-06-04 Apple Inc. Portable computer display structures
JP4811502B2 (ja) * 2009-07-01 2011-11-09 カシオ計算機株式会社 液晶表示パネル及びタッチパネル
TWI547845B (zh) * 2009-07-02 2016-09-01 半導體能源研究所股份有限公司 觸控面板及其驅動方法
KR101610846B1 (ko) * 2009-09-08 2016-04-11 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
US8408780B2 (en) * 2009-11-03 2013-04-02 Apple Inc. Portable computer housing with integral display
US8743309B2 (en) 2009-11-10 2014-06-03 Apple Inc. Methods for fabricating display structures
KR101874784B1 (ko) * 2010-03-08 2018-07-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR101048918B1 (ko) * 2010-04-28 2011-07-12 삼성모바일디스플레이주식회사 터치 스크린 패널 및 이를 구비한 영상표시장치
JP5275515B2 (ja) * 2010-04-30 2013-08-28 シャープ株式会社 回路基板および表示装置
JP5530839B2 (ja) * 2010-07-09 2014-06-25 パナソニック株式会社 固体撮像装置
US9143668B2 (en) 2010-10-29 2015-09-22 Apple Inc. Camera lens structures and display structures for electronic devices
US8467177B2 (en) 2010-10-29 2013-06-18 Apple Inc. Displays with polarizer windows and opaque masking layers for electronic devices
US8753917B2 (en) * 2010-12-14 2014-06-17 International Business Machines Corporation Method of fabricating photoconductor-on-active pixel device
US8446514B2 (en) * 2011-05-09 2013-05-21 Intellectual Ventures Fund 83 Llc Capturing images using a switchable imaging apparatus
JP5978577B2 (ja) * 2011-09-16 2016-08-24 株式会社リコー 多層配線基板
JP5876265B2 (ja) * 2011-10-11 2016-03-02 富士フイルム株式会社 有機撮像素子
US9158113B2 (en) * 2012-03-14 2015-10-13 Google Inc. Integrated display and photosensor
JP5737358B2 (ja) * 2013-10-22 2015-06-17 セイコーエプソン株式会社 光電変換装置
KR20150073539A (ko) * 2013-12-23 2015-07-01 삼성전자주식회사 전자장치의 입력 감지장치 및 방법
CN103941452A (zh) * 2014-03-17 2014-07-23 京东方科技集团股份有限公司 阵列基板及显示装置
US9985061B2 (en) * 2014-03-20 2018-05-29 Sharp Kabushiki Kaisha Light detection device with integrated photodiode and thin film transistor
TWI656631B (zh) * 2014-03-28 2019-04-11 日商半導體能源研究所股份有限公司 攝像裝置
KR20150120730A (ko) * 2014-04-18 2015-10-28 삼성전자주식회사 물리적 버튼과 이미지 센서를 내장한 디스플레이 모듈과 이의 제조 방법
US9638950B2 (en) 2014-05-15 2017-05-02 Apple Inc. Display with opaque border resistant to electrostatic discharge
JP6612056B2 (ja) 2014-05-16 2019-11-27 株式会社半導体エネルギー研究所 撮像装置、及び監視装置
WO2015189732A1 (ja) 2014-06-09 2015-12-17 株式会社半導体エネルギー研究所 撮像装置
JP6545541B2 (ja) 2014-06-25 2019-07-17 株式会社半導体エネルギー研究所 撮像装置、監視装置、及び電子機器
TWI757788B (zh) 2014-06-27 2022-03-11 日商半導體能源研究所股份有限公司 攝像裝置及電子裝置
JP6389685B2 (ja) * 2014-07-30 2018-09-12 キヤノン株式会社 撮像装置、および、撮像システム
JP6555956B2 (ja) 2014-07-31 2019-08-07 株式会社半導体エネルギー研究所 撮像装置、監視装置、及び電子機器
KR101640192B1 (ko) 2014-08-05 2016-07-18 삼성디스플레이 주식회사 디스플레이 장치
JP6552336B2 (ja) 2014-08-29 2019-07-31 株式会社半導体エネルギー研究所 半導体装置
KR102509203B1 (ko) 2014-08-29 2023-03-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 촬상 장치 및 전자 기기
KR102731987B1 (ko) 2014-09-02 2024-11-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 촬상 장치 및 전자 기기
WO2016046685A1 (en) * 2014-09-26 2016-03-31 Semiconductor Energy Laboratory Co., Ltd. Imaging device
JP6570417B2 (ja) * 2014-10-24 2019-09-04 株式会社半導体エネルギー研究所 撮像装置および電子機器
US10170565B2 (en) * 2015-04-22 2019-01-01 Semiconductor Energy Laboratory Co., Ltd. Imaging device, method for driving imaging device, and electronic device
JP6777421B2 (ja) 2015-05-04 2020-10-28 株式会社半導体エネルギー研究所 半導体装置
US11728356B2 (en) 2015-05-14 2023-08-15 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion element and imaging device
US9860465B2 (en) 2015-06-23 2018-01-02 Semiconductor Energy Laboratory Co., Ltd. Imaging device and electronic device
US9754980B2 (en) 2015-06-30 2017-09-05 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion element and imaging device
HUE058890T2 (hu) * 2015-09-24 2022-09-28 Sicpa Holding Sa A dokumentumok újboli hitelesítése
JP6796461B2 (ja) 2015-11-18 2020-12-09 株式会社半導体エネルギー研究所 半導体装置、コンピュータ及び電子機器
JP2017152656A (ja) * 2016-02-26 2017-08-31 Tianma Japan株式会社 イメージセンサおよびその製造方法
US10868082B2 (en) * 2016-12-27 2020-12-15 Sharp Kabushiki Kaisha Imaging panel and method for producing same
CN106527004B (zh) * 2016-12-29 2019-07-05 深圳市华星光电技术有限公司 阵列基板、液晶显示面板及阵列基板制造方法
TWI622844B (zh) * 2017-03-29 2018-05-01 友達光電股份有限公司 畫素單元與其製造方法
US11632448B2 (en) 2019-12-03 2023-04-18 Apple Inc. Handheld electronic device
US11637919B2 (en) 2019-12-03 2023-04-25 Apple Inc. Handheld electronic device
CN112713161B (zh) * 2020-12-30 2023-10-31 武汉华星光电技术有限公司 一种阵列基板及其制备方法
US12003657B2 (en) 2021-03-02 2024-06-04 Apple Inc. Handheld electronic device
US12267449B2 (en) 2022-03-03 2025-04-01 Apple Inc. Handheld electronic device

Family Cites Families (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5722251A (en) 1980-06-02 1982-02-05 Xerox Corp Electrostatic developing method and device
JPS5722251U (enExample) * 1980-07-11 1982-02-04
US4517733A (en) 1981-01-06 1985-05-21 Fuji Xerox Co., Ltd. Process for fabricating thin film image pick-up element
US5650637A (en) 1982-04-30 1997-07-22 Seiko Epson Corporation Active matrix assembly
JPS59115668A (ja) 1982-12-22 1984-07-04 Fuji Xerox Co Ltd 読取印字複写装置
JPS60213062A (ja) 1984-04-09 1985-10-25 Hosiden Electronics Co Ltd 薄膜トランジスタの製造方法
JPS6255961A (ja) 1985-09-05 1987-03-11 Mitsubishi Electric Corp 固体撮像装置
JPH069242B2 (ja) * 1985-10-14 1994-02-02 富士写真フイルム株式会社 固体撮像素子およびその製造方法
JPS6286855A (ja) * 1985-10-14 1987-04-21 Fuji Photo Film Co Ltd 放射線用固体撮像素子
JPS62125329A (ja) 1985-11-27 1987-06-06 Hosiden Electronics Co Ltd 透過形表示装置
JPH01220862A (ja) * 1988-02-29 1989-09-04 Seiko Epson Corp 固体撮像素子
JPH0229623A (ja) 1988-07-19 1990-01-31 Semiconductor Energy Lab Co Ltd 液晶表示装置
JPH02128468A (ja) 1988-11-08 1990-05-16 Fujitsu Ltd 固体撮像装置及びその製造方法
JPH02262369A (ja) * 1989-03-31 1990-10-25 Toshiba Corp 固体撮像装置及びその製造方法
JPH02265274A (ja) * 1989-04-06 1990-10-30 Toshiba Corp 固体撮像装置
JPH02280374A (ja) * 1989-04-21 1990-11-16 Toshiba Corp 固体撮像装置の電極接続方法
JP2617798B2 (ja) 1989-09-22 1997-06-04 三菱電機株式会社 積層型半導体装置およびその製造方法
JPH0734467B2 (ja) * 1989-11-16 1995-04-12 富士ゼロックス株式会社 イメージセンサ製造方法
JPH03187267A (ja) 1989-12-15 1991-08-15 Mitsubishi Electric Corp 固体撮像装置
JP2714993B2 (ja) 1989-12-15 1998-02-16 セイコーエプソン株式会社 液晶表示装置
JPH0423470A (ja) * 1990-05-18 1992-01-27 Fuji Xerox Co Ltd イメージセンサ
US5182624A (en) * 1990-08-08 1993-01-26 Minnesota Mining And Manufacturing Company Solid state electromagnetic radiation detector fet array
US5273910A (en) * 1990-08-08 1993-12-28 Minnesota Mining And Manufacturing Company Method of making a solid state electromagnetic radiation detector
US5589847A (en) 1991-09-23 1996-12-31 Xerox Corporation Switched capacitor analog circuits using polysilicon thin film technology
US5313055A (en) * 1991-09-30 1994-05-17 Fuji Xerox Co., Ltd. Two-dimensional image read/display device
KR0125454B1 (ko) 1992-02-03 1997-12-26 쯔지 하루오 광투과율 조정 장치
GB9202693D0 (en) 1992-02-08 1992-03-25 Philips Electronics Uk Ltd A method of manufacturing a large area active matrix array
US5424244A (en) 1992-03-26 1995-06-13 Semiconductor Energy Laboratory Co., Ltd. Process for laser processing and apparatus for use in the same
TW223178B (en) 1992-03-27 1994-05-01 Semiconductor Energy Res Co Ltd Semiconductor device and its production method
GB9209734D0 (en) 1992-05-06 1992-06-17 Philips Electronics Uk Ltd An image sensor
JP3223383B2 (ja) 1992-06-30 2001-10-29 カシオ計算機株式会社 液晶表示装置およびそれを用いた機器
JPH0618845A (ja) 1992-07-03 1994-01-28 Casio Comput Co Ltd 液晶表示装置およびそれを用いた機器
US5491566A (en) * 1992-11-27 1996-02-13 Goldstar Co., Ltd. Integrated input-output device having a reading and a printing section on a single substrate
TW226478B (en) 1992-12-04 1994-07-11 Semiconductor Energy Res Co Ltd Semiconductor device and method for manufacturing the same
JPH06342146A (ja) 1992-12-11 1994-12-13 Canon Inc 画像表示装置、半導体装置及び光学機器
DE69330709T2 (de) 1992-12-28 2002-07-11 Canon K.K., Tokio/Tokyo Blickrichtungsdetektor und Kamera mit diesem Detektor
JP3382300B2 (ja) 1993-05-21 2003-03-04 キヤノン株式会社 画像表示装置
JP3347423B2 (ja) * 1993-08-31 2002-11-20 キヤノン株式会社 液晶表示装置
EP0923134B1 (en) 1993-02-10 2005-01-12 Seiko Epson Corporation Active matrix circuit board and method of manufacturing it
JPH06334920A (ja) 1993-03-23 1994-12-02 Nippon Hoso Kyokai <Nhk> 固体撮像素子とその駆動方法
JPH0762865B2 (ja) 1993-05-13 1995-07-05 日本電気株式会社 指紋画像入力装置
GB9311129D0 (en) 1993-05-28 1993-07-14 Philips Electronics Uk Ltd Electronic devices with-film circuit elements forming a sampling circuit
KR100294026B1 (ko) 1993-06-24 2001-09-17 야마자끼 순페이 전기광학장치
JP3030368B2 (ja) 1993-10-01 2000-04-10 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
JP3187267B2 (ja) 1993-11-10 2001-07-11 寳酒造株式会社 加工食品の製造方法
JPH07302912A (ja) 1994-04-29 1995-11-14 Semiconductor Energy Lab Co Ltd 半導体装置
JP3715996B2 (ja) 1994-07-29 2005-11-16 株式会社日立製作所 液晶表示装置
US5812109A (en) * 1994-08-23 1998-09-22 Canon Kabushiki Kaisha Image input/output apparatus
JP3565453B2 (ja) * 1994-08-23 2004-09-15 キヤノン株式会社 画像入出力装置
JP2953321B2 (ja) 1994-08-31 1999-09-27 日本電気株式会社 原稿読取装置における密着型イメージセンサ
JPH08186241A (ja) 1995-01-06 1996-07-16 Canon Inc 撮像素子と固体撮像装置
JP3675886B2 (ja) 1995-03-17 2005-07-27 株式会社半導体エネルギー研究所 薄膜半導体デバイスの作製方法
US5760760A (en) 1995-07-17 1998-06-02 Dell Usa, L.P. Intelligent LCD brightness control system
JP3744980B2 (ja) 1995-07-27 2006-02-15 株式会社半導体エネルギー研究所 半導体装置
US6091382A (en) 1995-12-30 2000-07-18 Casio Computer Co., Ltd. Display device for performing display operation in accordance with signal light and driving method therefor
US5831699A (en) 1996-04-29 1998-11-03 Motorola, Inc. Display with inactive portions and active portions, and having drivers in the inactive portions
US6005648A (en) 1996-06-25 1999-12-21 Semiconductor Energy Laboratory Co., Ltd. Display device
JP3708637B2 (ja) 1996-07-15 2005-10-19 株式会社半導体エネルギー研究所 液晶表示装置
JP3473658B2 (ja) 1996-07-18 2003-12-08 アルプス電気株式会社 指紋読取り装置
US5831258A (en) 1996-08-20 1998-11-03 Xerox Corporation Pixel circuit with integrated amplifer
US6233027B1 (en) 1997-01-07 2001-05-15 Canon Kabushiki Kaisha Liquid crystal device and process for production thereof
JP4027465B2 (ja) 1997-07-01 2007-12-26 株式会社半導体エネルギー研究所 アクティブマトリクス型表示装置およびその製造方法
US6388652B1 (en) 1997-08-20 2002-05-14 Semiconductor Energy Laboratory Co., Ltd. Electrooptical device
JP3838393B2 (ja) 1997-09-02 2006-10-25 株式会社半導体エネルギー研究所 イメージセンサを内蔵した表示装置
US6031655A (en) 1997-09-12 2000-02-29 Canon Kabushiki Kaisha Spatial light modulator and picture-forming apparatus including same
JP4294745B2 (ja) 1997-09-26 2009-07-15 株式会社半導体エネルギー研究所 光電変換装置の作製方法
JP4044187B2 (ja) 1997-10-20 2008-02-06 株式会社半導体エネルギー研究所 アクティブマトリクス型表示装置およびその作製方法
US6028581A (en) 1997-10-21 2000-02-22 Sony Corporation Method and apparatus for a liquid crystal display (LCD) having an input function
JPH11326954A (ja) 1998-05-15 1999-11-26 Semiconductor Energy Lab Co Ltd 半導体装置
US6277679B1 (en) 1998-11-25 2001-08-21 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing thin film transistor

Also Published As

Publication number Publication date
US7791117B2 (en) 2010-09-07
US20070290246A1 (en) 2007-12-20
US7046282B1 (en) 2006-05-16
US8564035B2 (en) 2013-10-22
US20060227232A1 (en) 2006-10-12
US7286173B2 (en) 2007-10-23
JPH1197690A (ja) 1999-04-09
US20100321357A1 (en) 2010-12-23

Similar Documents

Publication Publication Date Title
JP4271268B2 (ja) イメージセンサおよびイメージセンサ一体型アクティブマトリクス型表示装置
JP4044187B2 (ja) アクティブマトリクス型表示装置およびその作製方法
JP4027465B2 (ja) アクティブマトリクス型表示装置およびその製造方法
JP4255527B2 (ja) 半導体装置
JP4183784B2 (ja) 液晶パネルの作製方法
JPH1197664A (ja) 電子機器およびその作製方法
JP5025596B2 (ja) イメージセンサ
JP4700659B2 (ja) 液晶表示装置
JP5138107B2 (ja) イメージセンサ、電子機器
JP5312442B2 (ja) 半導体装置、イメージセンサ及び撮影機器
JP4986923B2 (ja) イメージセンサの作製方法
JP4163156B2 (ja) 表示装置
JP5100799B2 (ja) 液晶表示装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040806

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040806

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070831

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080513

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080620

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20080620

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080722

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080908

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20081111

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081225

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090224

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090225

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120306

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120306

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120306

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120306

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130306

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130306

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140306

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term