JP4817636B2 - 半導体装置およびその作製方法 - Google Patents
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14645—Colour imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14692—Thin film technologies, e.g. amorphous, poly, micro- or nanocrystalline silicon
Description
光センサー素子と増幅回路とを同一絶縁表面上に有する基板の小片を実装した半導体装置であり、前記増幅回路は、結晶構造を有する半導体膜を有するnチャネル型TFTで構成され、前記光センサー素子は、前記nチャネル型TFTの配線上面及び側面を覆う第1の電極と、前記配線及び前記第1の電極上方に、前記第1の電極と一部接するp型の非晶質半導体層と、該p型の非晶質半導体層上に接する非晶質構造を有するi型の半導体層と、該i型の半導体層上に接するn型の非晶質半導体層と、該n型の非晶質半導体層上に接する第2の電極と、を有していることを特徴とする半導体装置である。
光センサー素子と増幅回路とを同一絶縁表面上に有する基板の小片を実装した半導体装置であり、前記増幅回路は、結晶構造を有する半導体膜を有するnチャネル型TFTで構成され、前記光センサー素子は、前記nチャネル型TFTの配線上面及び側面を覆う第1の電極と、前記配線及び前記第1の電極上方に、前記第1の電極と一部接するp型の結晶質半導体層と、該p型の結晶質半導体層上に接する非晶質構造を有するi型の半導体層と、該i型の半導体層上に接するn型の結晶質半導体層と、該n型の結晶質半導体層上に接する第2の電極と、を有していることを特徴とする半導体装置である。
図1(A)は本発明の光センサチップの実装断面を示す図である。図1(A)では、2端子の可視光センサチップ(2.0mm×1.5mm)の例を示す。図1(A)において、10はガラス基板、12は下地絶縁膜、13はゲート絶縁膜である。受光する光はガラス基板10、下地絶縁膜12、およびゲート絶縁膜13を通過するため、これらの材料は全て透光性の高い材料を用いることが望ましい。
本実施の形態においては、実施の形態1の工程の一部をスクリーン印刷により行う例である。実施の形態1と同一の工程は簡略化のため、ここでは詳細な説明を省略することとする。
本実施の形態においては、レジスト形成をスクリーン印刷により行う例である。実施の形態1または実施の形態2と同一の工程は簡略化のため、ここでは詳細な説明を省略することとする。
本実施の形態では、ガラス基板上に形成した光センサおよび増幅回路をガラス基板から剥離し、プラスチック基板に転写する作製方法を説明する。
本発明を実施して得た光センサチップを組み込むことによって様々な電子機器を作製することができる。電子機器としては、ビデオカメラ、デジタルカメラ、ゴーグル型ディスプレイ(ヘッドマウントディスプレイ)、プロジェクタ、液晶テレビなどのモニタ、ナビゲーションシステム、音響再生装置(カーオーディオ、オーディオコンポ等)、ノート型パーソナルコンピュータ、ゲーム機器、携帯情報端末(モバイルコンピュータ、携帯電話、携帯型ゲーム機または電子書籍等)、記録媒体を備えた画像再生装置(具体的にはDigital Versatile Disc(DVD)等の記録媒体を再生し、その画像を表示しうるディスプレイを備えた装置)などが挙げられる。
12:下地絶縁膜
13:ゲート絶縁膜
14:配線
15:配線
16:第2の層間絶縁膜
17:第3の層間絶縁膜
18:第1の電極
19:配線
20:接続電極
23:第2の電極
24:封止層
25:PIN型のフォトダイオード
26:端子電極
30:nチャネル型TFT
31:nチャネル型TFT
50:端子電極
51:端子電極
53:端子電極
60:プリント配線基板
61:電極
62:電極
63:半田
64:半田
Claims (14)
- 光センサー素子と増幅回路とを同一絶縁表面上に有し、
前記増幅回路は薄膜トランジスタで構成され、
前記光センサー素子は、前記薄膜トランジスタの配線上面及び側面を覆う第1の電極と、
前記配線及び前記第1の電極と重なるとともに、前記第1の電極上に一部接する光電変換層と、
前記光電変換層上に接する第2の電極と、を有していることを特徴とする半導体装置。 - 請求項1において、前記光センサー素子と前記増幅回路を有する前記半導体装置は、基板に固定されたチップであることを特徴とする半導体装置。
- 請求項2において、前記基板はガラス基板であることを特徴とする半導体装置。
- 請求項2において、前記基板はプラスチック基板であることを特徴とする半導体装置。
- 請求項2乃至請求項4のいずれか一において、前記チップに設けられた外部端子は2端子構成であることを特徴とする半導体装置。
- 請求項1乃至請求項5のいずれか一において、前記第1の電極は、Tiを含む膜であることを特徴とする半導体装置。
- 請求項1乃至請求項6のいずれか一において、前記薄膜トランジスタの前記配線は、Tiを含む第1の膜と、アルミニウムを含む膜と、Tiを含む第2の膜との三層構造を有することを特徴とする半導体装置。
- 請求項1乃至請求項7のいずれか一において、前記第2の電極は、前記光電変換層を介して前記第1の電極および前記配線と一部重なることを特徴とする半導体装置。
- 請求項1乃至請求項8のいずれか一において、前記半導体装置は、ビデオカメラ、デジタルカメラ、パーソナルコンピュータ、または携帯情報端末であることを特徴とする半導体装置。
- 光センサー素子と増幅回路とを同一絶縁表面上に有する半導体装置の作製方法であり、
増幅回路を構成する薄膜トランジスタの配線を形成する第1工程と、
前記配線の上面および側面を覆う第1の電極を形成する第2工程と、
前記配線および前記第1の電極と重なり、前記第1の電極上に一部接する光電変換層を形成する第3工程と、
前記光電変換層上に第2の電極を印刷法で形成する第4工程と、
前記第2の電極をマスクとして自己整合的に前記光電変換層をエッチングする第5工程と、を有することを特徴とする半導体装置の作製方法。 - 請求項10において、前記第5工程の後に、
前記第1の電極および前記第2の電極の端部を覆う封止層を印刷法で形成する第6工程と、
前記封止層上に前記第2の電極と接する第3の電極を印刷法で形成する第7の工程とを有することを特徴とする半導体装置の作製方法。 - 光センサー素子と増幅回路とを同一絶縁表面上に有する半導体装置の作製方法であり、
増幅回路を構成する薄膜トランジスタの配線を形成する第1工程と、
前記配線の上面および側面を覆う第1の電極を形成する第2工程と、
前記配線および前記第1の電極と重なり、前記第1の電極上に一部接する光電変換層を形成する第3工程と、
前記光電変換層上にレジストマスクを印刷法で形成する第4工程と、
前記レジストマスクをマスクとして前記光電変換層をエッチングする第5工程と、
前記レジストマスクを除去する第6工程と、
前記光電変換層上に第2の電極を印刷法で形成する第7工程と、を有することを特徴とする半導体装置の作製方法。 - 請求項12において、前記第7工程の後に、
前記第1の電極および前記第2の電極の端部を覆う封止層を印刷法で形成する第8工程と、
前記封止層上に前記第2の電極と接する第3の電極を印刷法で形成する第9の工程とを有することを特徴とする半導体装置の作製方法。 - 請求項10乃至請求項13のいずれか一において、前記第2の電極の形成は、前記光電変換層を介して前記配線および前記第1の電極と一部重なるように形成することを特徴とする半導体装置の作製方法。
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