JP5317712B2 - 半導体装置及び半導体装置の作製方法 - Google Patents
半導体装置及び半導体装置の作製方法 Download PDFInfo
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- JP5317712B2 JP5317712B2 JP2009004432A JP2009004432A JP5317712B2 JP 5317712 B2 JP5317712 B2 JP 5317712B2 JP 2009004432 A JP2009004432 A JP 2009004432A JP 2009004432 A JP2009004432 A JP 2009004432A JP 5317712 B2 JP5317712 B2 JP 5317712B2
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Description
本実施の形態では、より薄型化、及び小型化を付与することを目的とした半導体装置、及びその半導体装置を歩留まり良く作製する方法を、図1乃至図6を用いて詳細に説明する。
本明細書に開示する半導体装置において、半導体素子層に含まれる半導体素子として様々な形態の電界効果トランジスタを用いることができる。本実施の形態では、適用することができる半導体素子として、単結晶半導体層を有する電界効果トランジスタについて詳細に説明する。
本実施の形態では、実施の形態2において、単結晶半導体基板より透光性基板へ単結晶半導体層を接合する工程の異なる例を示す。従って、実施の形態2と同一部分又は同様な機能を有する部分の繰り返しの説明は省略する。
本実施の形態では、半導体装置に筐体を形成して光の入射する方向を制御した例を、図7及び図8を用いて説明する。
本実施の形態では、本明細書に開示する発明により得られたセンサを含む様々な電子機器の例について説明する。本明細書に開示する発明が適用される電子機器として、コンピュータ、ディスプレイ、携帯電話、テレビジョン装置などが挙げられる。それらの電子機器の具体例を図10(A)乃至(C)、図11(A)(B)、図12、図13(A)(B)、及び図14に示す。
Claims (18)
- 側面に段差を有し、幅寸法は前記段差よりも一方の面に向かう先の部分が小さい透光性基板と、
前記透光性基板の他方の面に設けられた半導体素子層と、
前記透光性基板の一方の面及び側面の一部を覆う第1の透光性樹脂層及び第2の透光性樹脂層の積層とを有し、
前記第1の透光性樹脂層及び前記第2の透光性樹脂層の一方は有彩色であることを特徴とする半導体装置。 - 請求項1において、前記透光性基板の断面は凸字形状であることを特徴とする半導体装置。
- 一方の面を上底面とする断面において、側面が上段の厚さが下段の厚さより厚い階段状の台形である透光性基板と、
前記透光性基板の他方の面に設けられた半導体素子層と、
前記透光性基板の一方の面及び側面の一部を覆う第1の透光性樹脂層及び第2の透光性樹脂層の積層とを有し、
前記第1の透光性樹脂層及び前記第2の透光性樹脂層の一方は有彩色であることを特徴とする半導体装置。 - 請求項3において、前記台形の前記上段は前記下段に向かって湾曲していることを特徴とする半導体装置。
- 請求項1乃至4のいずれか一項において、前記第1の透光性樹脂層が有彩色であることを特徴とする半導体装置。
- 請求項5において、前記第2の透光性樹脂層の膜厚が、前記第1の透光性樹脂層の膜厚より厚いことを特徴とする半導体装置。
- 請求項1乃至6のいずれか一項において、前記第1の透光性樹脂が接している前記透光性基板の側面は、裾広がりの曲面を有することを特徴とする半導体装置。
- 請求項1乃至7のいずれか一項において、前記透光性基板の下底面及び上底面は四角形であり、前記下底面の面積の方が前記上底面の面積より大きいことを特徴とする半導体装置。
- 請求項1乃至8のいずれか一項において、前記半導体素子層は光電変換素子と、前記光電変換素子の出力を増幅する増幅回路とを有し、
前記光電変換素子はp型半導体層と、i型半導体層と、n型半導体層が積層された構造を含むことを特徴とする半導体装置。 - 請求項1乃至9のいずれか一項において、前記有彩色は赤色であることを特徴とする半導体装置。
- 請求項1乃至9のいずれか一項において、前記有彩色は緑色であることを特徴とする半導体装置。
- 請求項1乃至9のいずれか一項において、前記有彩色は青色であることを特徴とする半導体装置。
- 請求項1乃至12のいずれか一項において、前記透光性基板はガラス基板であることを特徴とする半導体装置。
- 透光性基板上に複数の半導体素子層を形成し、
前記透光性基板の厚さを薄くし、
前記透光性基板の前記複数の半導体素子層同士の間に溝を形成し、
前記溝を形成された透光性基板上に第1の透光性樹脂層を形成し、
前記第1の透光性樹脂層上に第2の透光性樹脂層を形成し、
前記透光性基板の溝、前記第1の透光性樹脂層及び前記第2の透光性樹脂層を切断し、
前記第1の透光性樹脂層及び前記第2の透光性樹脂層の一方は有彩色の着色材料を含ませて形成することを特徴とする半導体装置の作製方法。 - 透光性基板上に複数の半導体素子層を形成し、
前記透光性基板の厚さを薄くし、
前記透光性基板の前記複数の半導体素子層同士の間に溝を形成し、
前記溝を形成された透光性基板上に第1の透光性樹脂層を形成し、
前記第1の透光性樹脂層上に第2の透光性樹脂層を形成し、
前記透光性基板の溝、前記第1の透光性樹脂層及び前記第2の透光性樹脂層を、前記透光性基板側より切断し、
前記第1の透光性樹脂層及び前記第2の透光性樹脂層の一方は有彩色の着色材料を含ませて形成することを特徴とする半導体装置の作製方法。 - 請求項14又は請求項15において、前記第1の透光性樹脂層を有彩色の着色材料を含ませて形成することを特徴とする半導体装置の作製方法。
- 請求項14乃至16のいずれか一項において、前記透光性基板の溝、前記第1の透光性樹脂層及び前記第2の透光性樹脂層を切断する切断面の幅は、前記溝の幅より狭いことを特徴とする半導体装置の作製方法。
- 請求項14乃至17のいずれか一項において、前記溝はダイサーを用いて形成することを特徴とする半導体装置の作製方法。
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JP2009004432A JP5317712B2 (ja) | 2008-01-22 | 2009-01-13 | 半導体装置及び半導体装置の作製方法 |
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2009
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009206504A (ja) * | 2008-02-01 | 2009-09-10 | Semiconductor Energy Lab Co Ltd | 半導体装置及び半導体装置の作製方法 |
TWI759441B (zh) * | 2018-03-07 | 2022-04-01 | 優顯科技股份有限公司 | 光電半導體裝置的製造方法 |
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TWI427777B (zh) | 2014-02-21 |
US20090183766A1 (en) | 2009-07-23 |
CN101919057B (zh) | 2012-07-04 |
US8610152B2 (en) | 2013-12-17 |
WO2009093623A1 (en) | 2009-07-30 |
JP2009200477A (ja) | 2009-09-03 |
TW200950068A (en) | 2009-12-01 |
US20130087876A1 (en) | 2013-04-11 |
CN101919057A (zh) | 2010-12-15 |
US8324079B2 (en) | 2012-12-04 |
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