JP4131544B2 - 電子回路 - Google Patents

電子回路 Download PDF

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Publication number
JP4131544B2
JP4131544B2 JP2004037242A JP2004037242A JP4131544B2 JP 4131544 B2 JP4131544 B2 JP 4131544B2 JP 2004037242 A JP2004037242 A JP 2004037242A JP 2004037242 A JP2004037242 A JP 2004037242A JP 4131544 B2 JP4131544 B2 JP 4131544B2
Authority
JP
Japan
Prior art keywords
coil
transmission
substrate
circuit
potential
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004037242A
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English (en)
Japanese (ja)
Other versions
JP2005228981A (ja
Inventor
忠広 黒田
大介 溝口
ビンティ ユスフ ユスミラズ
典之 三浦
貴康 櫻井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Keio University
Original Assignee
Keio University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Keio University filed Critical Keio University
Priority to JP2004037242A priority Critical patent/JP4131544B2/ja
Priority to PCT/JP2005/002117 priority patent/WO2005078795A1/ja
Priority to KR1020067017417A priority patent/KR101066128B1/ko
Priority to TW094104197A priority patent/TW200532894A/zh
Priority to US10/588,769 priority patent/US7768790B2/en
Publication of JP2005228981A publication Critical patent/JP2005228981A/ja
Application granted granted Critical
Publication of JP4131544B2 publication Critical patent/JP4131544B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00—Adaptations of transformers or inductances for specific applications or functions
    • H01F38/14—Inductive couplings
    • H01F2038/143—Inductive couplings for signals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06527—Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0239—Signal transmission by AC coupling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Near-Field Transmission Systems (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Dc Digital Transmission (AREA)
JP2004037242A 2004-02-13 2004-02-13 電子回路 Expired - Lifetime JP4131544B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004037242A JP4131544B2 (ja) 2004-02-13 2004-02-13 電子回路
PCT/JP2005/002117 WO2005078795A1 (ja) 2004-02-13 2005-02-14 電子回路
KR1020067017417A KR101066128B1 (ko) 2004-02-13 2005-02-14 전자회로
TW094104197A TW200532894A (en) 2004-02-13 2005-02-14 Electronic circuit
US10/588,769 US7768790B2 (en) 2004-02-13 2005-02-14 Electronic circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004037242A JP4131544B2 (ja) 2004-02-13 2004-02-13 電子回路

Publications (2)

Publication Number Publication Date
JP2005228981A JP2005228981A (ja) 2005-08-25
JP4131544B2 true JP4131544B2 (ja) 2008-08-13

Family

ID=34857752

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004037242A Expired - Lifetime JP4131544B2 (ja) 2004-02-13 2004-02-13 電子回路

Country Status (5)

Country Link
US (1) US7768790B2 (enExample)
JP (1) JP4131544B2 (enExample)
KR (1) KR101066128B1 (enExample)
TW (1) TW200532894A (enExample)
WO (1) WO2005078795A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012049821A1 (ja) 2010-10-13 2012-04-19 パナソニック株式会社 近接無線通信を用いた半導体装置

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JP4124365B2 (ja) 2004-08-24 2008-07-23 学校法人慶應義塾 電子回路
JP5024740B2 (ja) 2004-09-30 2012-09-12 学校法人慶應義塾 Ｌｓｉチップ試験装置
JP2006173986A (ja) 2004-12-15 2006-06-29 Keio Gijuku 電子回路
US8190086B2 (en) 2005-09-02 2012-05-29 Nec Corporation Transmission method, interface circuit, semiconductor device, semiconductor package, semiconductor module and memory module
JP4592542B2 (ja) * 2005-09-08 2010-12-01 三菱電機株式会社 半導体装置
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WO2007111036A1 (ja) * 2006-03-24 2007-10-04 Nec Corporation 半導体装置
JP4878502B2 (ja) 2006-05-29 2012-02-15 ルネサスエレクトロニクス株式会社 半導体装置
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JP5474323B2 (ja) * 2008-08-26 2014-04-16 学校法人慶應義塾 電子回路
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012049821A1 (ja) 2010-10-13 2012-04-19 パナソニック株式会社 近接無線通信を用いた半導体装置
US8952472B2 (en) 2010-10-13 2015-02-10 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device using close proximity wireless communication

Also Published As

Publication number Publication date
JP2005228981A (ja) 2005-08-25
US7768790B2 (en) 2010-08-03
KR101066128B1 (ko) 2011-09-20
TWI364106B (enExample) 2012-05-11
US20070289772A1 (en) 2007-12-20
WO2005078795A1 (ja) 2005-08-25
KR20070007089A (ko) 2007-01-12
TW200532894A (en) 2005-10-01

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