JP5024740B2 - Lsiチップ試験装置 - Google Patents
Lsiチップ試験装置 Download PDFInfo
- Publication number
- JP5024740B2 JP5024740B2 JP2004289268A JP2004289268A JP5024740B2 JP 5024740 B2 JP5024740 B2 JP 5024740B2 JP 2004289268 A JP2004289268 A JP 2004289268A JP 2004289268 A JP2004289268 A JP 2004289268A JP 5024740 B2 JP5024740 B2 JP 5024740B2
- Authority
- JP
- Japan
- Prior art keywords
- lsi chip
- lsi
- coil
- probe
- test apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000012360 testing method Methods 0.000 title claims description 65
- 230000005540 biological transmission Effects 0.000 claims description 29
- 239000000523 sample Substances 0.000 claims description 28
- 238000001514 detection method Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 4
- 239000000872 buffer Substances 0.000 description 13
- 238000004891 communication Methods 0.000 description 12
- 230000008878 coupling Effects 0.000 description 10
- 238000010168 coupling process Methods 0.000 description 10
- 238000005859 coupling reaction Methods 0.000 description 10
- 230000001939 inductive effect Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/315—Contactless testing by inductive methods
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/3025—Wireless interface with the DUT
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Networks & Wireless Communication (AREA)
- Tests Of Electronic Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
12、13 バッファ
14 Tx/Rxスイッチ
20 LSIチップ
21 送信コイル
22 送信回路
23 受信コイル
24 受信回路
25 パッド
26、27 リード
31 LSIチップ
32 送信回路
33 送信コイル
34 受信回路
35 受信コイル
Txdata 送信データ
Rxdata 受信データ
Clk クロック
Claims (6)
- LSIチップに対して誘導的に試験信号を送信し、前記LSIチップから誘導的に検出信号を受信するコイルを有するプローブを備え、前記検出信号によって前記LSIチップの合否を判断し決定することによって本LSIチップ試験装置自体が前記LSIチップを試験することを特徴とするLSIチップ試験装置。
- 前記プローブは、2次元上で移動可能であることを特徴とする請求項1記載のLSIチップ試験装置。
- 前記プローブを複数備えることを特徴とする請求項1又は2記載のLSIチップ試験装置。
- LSIチップに対して誘導的に試験信号を送信する送信コイルと、
前記LSIチップから誘導的に検出信号を受信する受信コイルと
を有するプローブを備え、前記検出信号によって前記LSIチップの合否を判断し決定することによって本LSIチップ試験装置自体が前記LSIチップを試験することを特徴とするLSIチップ試験装置。 - 前記送信コイル及び受信コイルは、1つの基板上の配線により形成されていることを特徴とする請求項4記載のLSIチップ試験装置。
- 前記送信コイル及び対応する受信コイルは、同軸に配設されていることを特徴とする請求項5記載のLSIチップ試験装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004289268A JP5024740B2 (ja) | 2004-09-30 | 2004-09-30 | Lsiチップ試験装置 |
US11/664,262 US8648614B2 (en) | 2004-09-30 | 2005-09-21 | Electronic circuit testing apparatus |
PCT/JP2005/017364 WO2006035644A1 (ja) | 2004-09-30 | 2005-09-21 | 電子回路試験装置 |
KR1020077009061A KR101212042B1 (ko) | 2004-09-30 | 2005-09-21 | 전자 회로 시험 장치 |
TW094133825A TW200619652A (en) | 2004-09-30 | 2005-09-28 | Electronic circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004289268A JP5024740B2 (ja) | 2004-09-30 | 2004-09-30 | Lsiチップ試験装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006105630A JP2006105630A (ja) | 2006-04-20 |
JP2006105630A5 JP2006105630A5 (ja) | 2008-10-23 |
JP5024740B2 true JP5024740B2 (ja) | 2012-09-12 |
Family
ID=36118793
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004289268A Active JP5024740B2 (ja) | 2004-09-30 | 2004-09-30 | Lsiチップ試験装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8648614B2 (ja) |
JP (1) | JP5024740B2 (ja) |
KR (1) | KR101212042B1 (ja) |
TW (1) | TW200619652A (ja) |
WO (1) | WO2006035644A1 (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7999383B2 (en) * | 2006-07-21 | 2011-08-16 | Bae Systems Information And Electronic Systems Integration Inc. | High speed, high density, low power die interconnect system |
DE102007030745A1 (de) * | 2007-07-02 | 2009-01-08 | Siemens Medical Instruments Pte. Ltd. | Mehrkomponentiges Hörgerätesystem und ein Verfahren zu seinem Betrieb |
KR101495823B1 (ko) | 2007-11-26 | 2015-02-25 | 각고호우징 게이오기주크 | 전자회로 |
JP5600237B2 (ja) | 2008-02-02 | 2014-10-01 | 学校法人慶應義塾 | 集積回路 |
JP5475962B2 (ja) | 2008-04-28 | 2014-04-16 | 学校法人慶應義塾 | 電子回路 |
JP5252486B2 (ja) | 2008-05-14 | 2013-07-31 | 学校法人慶應義塾 | インダクタ素子、集積回路装置、及び、三次元実装回路装置 |
JP5671200B2 (ja) | 2008-06-03 | 2015-02-18 | 学校法人慶應義塾 | 電子回路 |
JP4982778B2 (ja) | 2008-07-04 | 2012-07-25 | 学校法人慶應義塾 | 電子回路装置 |
KR20100015206A (ko) * | 2008-08-04 | 2010-02-12 | 삼성전자주식회사 | 무선 테스트용 인터페이스 장치, 그것을 포함하는 반도체소자와 반도체 패키지 및 그것을 이용한 무선 테스트 방법 |
JP5325495B2 (ja) | 2008-08-12 | 2013-10-23 | 学校法人慶應義塾 | 半導体装置及びその製造方法 |
JP5433199B2 (ja) | 2008-10-21 | 2014-03-05 | 学校法人慶應義塾 | 電子回路 |
JP5326088B2 (ja) | 2008-10-21 | 2013-10-30 | 学校法人慶應義塾 | 電子回路と通信機能検査方法 |
US7935549B2 (en) * | 2008-12-09 | 2011-05-03 | Renesas Electronics Corporation | Seminconductor device |
JP5283075B2 (ja) | 2008-12-26 | 2013-09-04 | 学校法人慶應義塾 | 電子回路 |
JP5395458B2 (ja) | 2009-02-25 | 2014-01-22 | 学校法人慶應義塾 | インダクタ素子及び集積回路装置 |
JP5554937B2 (ja) * | 2009-04-22 | 2014-07-23 | パナソニック株式会社 | 非接触給電システム |
JP5374246B2 (ja) | 2009-06-12 | 2013-12-25 | 学校法人慶應義塾 | 密封型半導体記録媒体及び密封型半導体記録装置 |
JP5635759B2 (ja) | 2009-10-15 | 2014-12-03 | 学校法人慶應義塾 | 積層半導体集積回路装置 |
JP5750031B2 (ja) | 2010-11-19 | 2015-07-15 | 株式会社半導体エネルギー研究所 | 電子回路及び半導体装置 |
KR101313555B1 (ko) * | 2011-11-10 | 2013-10-01 | 삼성중공업 주식회사 | 인쇄 회로 기판에 실장된 아이솔레이터의 검사 장치 |
JP2013197988A (ja) | 2012-03-21 | 2013-09-30 | Advantest Corp | 無線通信装置および無線通信システム |
TWI482971B (zh) * | 2013-09-13 | 2015-05-01 | Nat University Of Kaohsuing | Inductive three - dimensional double - sided electrical measurement fixture |
CN105676109B (zh) * | 2016-01-08 | 2019-08-02 | 青岛海信电器股份有限公司 | 一种主板测试方法及设备 |
US10612992B2 (en) * | 2017-11-03 | 2020-04-07 | Lockheed Martin Corporation | Strain gauge detection and orientation system |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH022967A (ja) * | 1988-06-17 | 1990-01-08 | Nec Corp | ブロービング装置 |
US5701037A (en) | 1994-11-15 | 1997-12-23 | Siemens Aktiengesellschaft | Arrangement for inductive signal transmission between the chip layers of a vertically integrated circuit |
DE19503329C2 (de) * | 1995-02-02 | 2000-05-18 | Ita Ingb Testaufgaben Gmbh | Testvorrichtung für elektronische Flachbaugruppen |
JPH08334541A (ja) * | 1995-06-05 | 1996-12-17 | Mitsubishi Electric Corp | 電流検出器及びそれを利用したプリント板配線の接触部検出方法 |
JP3528367B2 (ja) * | 1995-09-30 | 2004-05-17 | ソニーケミカル株式会社 | リーダ・ライタ用アンテナ |
JP3634074B2 (ja) * | 1996-06-28 | 2005-03-30 | 日本発条株式会社 | 導電性接触子 |
US6242923B1 (en) | 1997-02-27 | 2001-06-05 | International Business Machines Corporation | Method for detecting power plane-to-power plane shorts and I/O net-to power plane shorts in modules and printed circuit boards |
US6154043A (en) * | 1997-05-07 | 2000-11-28 | Advanced Micro Devices, Inc. | Method and apparatus for identifying the position of a selected semiconductor die relative to other dice formed from the same semiconductor wafer |
US6236223B1 (en) * | 1998-11-09 | 2001-05-22 | Intermec Ip Corp. | Method and apparatus for wireless radio frequency testing of RFID integrated circuits |
JP3603996B2 (ja) | 1999-04-28 | 2004-12-22 | シャープ株式会社 | シート抵抗測定器 |
TW536627B (en) | 2000-07-24 | 2003-06-11 | Sentec Ltd | Current sensor |
WO2002063675A1 (fr) * | 2001-02-02 | 2002-08-15 | Hitachi, Ltd. | Circuit integre, procede de test et de fabrication d'un circuit integre |
US6693426B1 (en) * | 2002-02-09 | 2004-02-17 | Intematix Corporation | Spatially resolved spin resonance detection |
JP2004037213A (ja) * | 2002-07-02 | 2004-02-05 | Konica Minolta Holdings Inc | 半導体パッケージ及びその製造方法並びに半導体パッケージの検査方法 |
CA2404183C (en) * | 2002-09-19 | 2008-09-02 | Scanimetrics Inc. | Non-contact tester for integrated circuits |
US6958616B1 (en) * | 2003-11-07 | 2005-10-25 | Xilinx, Inc. | Hybrid interface apparatus for testing integrated circuits having both low-speed and high-speed input/output pins |
JP4131544B2 (ja) | 2004-02-13 | 2008-08-13 | 学校法人慶應義塾 | 電子回路 |
JP4286182B2 (ja) | 2004-05-13 | 2009-06-24 | 富士通マイクロエレクトロニクス株式会社 | 電気的接続方法 |
-
2004
- 2004-09-30 JP JP2004289268A patent/JP5024740B2/ja active Active
-
2005
- 2005-09-21 WO PCT/JP2005/017364 patent/WO2006035644A1/ja active Application Filing
- 2005-09-21 US US11/664,262 patent/US8648614B2/en active Active
- 2005-09-21 KR KR1020077009061A patent/KR101212042B1/ko active IP Right Grant
- 2005-09-28 TW TW094133825A patent/TW200619652A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP2006105630A (ja) | 2006-04-20 |
WO2006035644A1 (ja) | 2006-04-06 |
TWI377352B (ja) | 2012-11-21 |
KR20070067160A (ko) | 2007-06-27 |
US20080258744A1 (en) | 2008-10-23 |
TW200619652A (en) | 2006-06-16 |
US8648614B2 (en) | 2014-02-11 |
KR101212042B1 (ko) | 2012-12-13 |
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